CN110309820A - The device and electronic equipment of fingerprint detection - Google Patents
The device and electronic equipment of fingerprint detection Download PDFInfo
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- CN110309820A CN110309820A CN201910800276.0A CN201910800276A CN110309820A CN 110309820 A CN110309820 A CN 110309820A CN 201910800276 A CN201910800276 A CN 201910800276A CN 110309820 A CN110309820 A CN 110309820A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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Abstract
A kind of device of fingerprint detection, it is set to below the display screen of electronic equipment, described device includes sensor core chip arrays and MCU, the sensor core chip arrays include the first chipset and the second chipset, chip in first chipset is multiplexed the first signal wire, chip in second chipset is multiplexed second signal line, wherein, in any row and column of the sensor core chip arrays, the chip in chip and second chipset in first chipset is arranged alternately, the MCU is used for: a moment, first chip controlled in first chipset carries out fingerprint detection to the finger above the display screen, wherein, first chip is communicated using between first signal wire and the MCU；And/or at the moment, second chip controlled in second chipset carries out fingerprint detection to the finger, wherein second chip is communicated using between the second signal line and the MCU.
Description
Technical field
This application involves fingerprint recognition fields, and more particularly, to the device and electronic equipment of a kind of fingerprint detection.
Background technique
Fingerprint identification technology is to acquire light by optical finger print mould group reflection or transmission occurs in finger under optical panel
At optical signal, the finger print information of finger is carried in the optical signal, to realize the lower fingerprint recognition of screen.It can in optical finger print mould group
It can include multiple sensor chips, to realize large area fingerprint detection, still, which results in the increasings of corresponding device and cabling
It is more, the structure complexity of optical finger print mould group is increased, power consumption is also increased.
Summary of the invention
The embodiment of the present application provides the device and electronic equipment of a kind of fingerprint detection, and described device is multiple with lower structure
Miscellaneous degree.
In a first aspect, providing a kind of device of fingerprint detection, described device is set to below the display screen of electronic equipment,
Shield lower optical finger print detection to realize, described device includes sensor core chip arrays and MCU, and the sensor core chip arrays include
First chipset and the second chipset, the chip in first chipset are multiplexed the first signal wire, in second chipset
Chip be multiplexed second signal line, wherein in any row and either rank of the sensor core chip arrays, first chip
The chip in chip and second chipset in group is arranged alternately, and the MCU is used for: a moment, controlling described the
First chip in one chipset carries out fingerprint detection to the finger above the display screen, wherein first chip
It is communicated using between first signal wire and the MCU；And/or it at the moment, controls in second chipset
Second chip to the finger carry out fingerprint detection, wherein second chip use the second signal line and institute
It states and is communicated between MCU.
In this scenario, the fingerprint sensor chip array in finger print detection device is divided into two chipsets, wherein
In any row and either rank of sensor core chip arrays, the chip in two chipsets is arranged alternately.In this way, finger is pressed simultaneously
The probability being pressed in above two chips in same chip group is lower.Therefore, each chip by being arranged in each chipset
It is multiplexed a signal wire, and a moment only controls a chip in same chip group and carries out fingerprint detection, so as to subtract
Cabling in few finger print detection device, keeps the structure of finger print detection device more compact, and due to avoiding a large amount of sensor cores
Piece works at the same time, therefore also saves power consumption.
In one possible implementation, first signal wire and the second signal line are used for transmission fingerprint number
According at least one of, clock signal and reset signal.
In one possible implementation, first chipset and second chipset by it is following any one
Communicated between communication mode and the MCU: serial peripheral interface (Serial Peripheral Interface, SPI) is logical
Letter, universal asynchronous receiving-transmitting transmitter (Universal Asynchronous Transceiver and Transmitter,
UART) communication, internal integrated circuit (Inter Integrated Circuit, I2C) communication.
In one possible implementation, each chip in the sensor core chip arrays uses letter independent
The transmission that piece selects CS signal and interrupt INT signal is carried out number between line and the MCU.
In one possible implementation, the MCU is specifically used for: receiving the processor transmission of the electronic equipment
Instruction, and it is based on described instruction, first chip is controlled at the moment and/or second chip carries out fingerprint detection.
In one possible implementation, the power supply of each chip shares a power supply in first chipset
One power capacitor of power sharing for identical function module of capacitor and/or each chip, it is each in second chipset
The power supply of a chip shares power sharing one for identical function module of a power capacitor and/or each chip
Power capacitor.
In one possible implementation, the power supply for identical function module includes: for identical function mould
The analog power of block and/or digital power for identical function module.
In one possible implementation, the power capacitor is decoupling capacitor.
Second aspect provides a kind of device of fingerprint detection, and described device is set to below the display screen of electronic equipment,
Shield lower optical finger print detection to realize, described device includes sensor core chip arrays and mini program controlling unit MCU, the sensing
Device chip array includes the first chipset and the second chipset, and the power supply of each chip shares one in first chipset
One power capacitor of power sharing for identical function module of a power capacitor and/or each chip, second chip
The power supply of each chip shares a power capacitor in group and/or the power supply for identical function module of each chip is total
With a power capacitor, wherein in any row and either rank of the sensor core chip arrays, in first chipset
Sensor chip in sensor chip and second chipset is arranged alternately, and the MCU is used for: a moment, control
A chip in first chipset carries out fingerprint detection to the finger above the display screen；And/or when described
It carves, the chip controlled in second chipset carries out fingerprint detection to the finger.
In this scenario, the fingerprint sensor chip array in finger print detection device is divided into two chipsets, wherein
In any row and either rank of sensor core chip arrays, the chip in two chipsets is arranged alternately.In this way, finger is pressed simultaneously
The probability being pressed in above two chips in same chip group is lower.Therefore, pass through multiple chips in one chipset of setting
A power capacitor is shared, and a moment only controls a chip in same chip group and carries out fingerprint detection, can reduce
Capacitor quantity in finger print detection device, keeps the structure of finger print detection device more compact, and due to avoiding big quantity sensor
Chip works at the same time, therefore also saves power consumption.
In one possible implementation, the power supply for identical function module includes: for identical function mould
The analog power of block and/or digital power for identical function module.
In one possible implementation, the power capacitor is decoupling capacitor.
The third aspect provides a kind of electronic equipment, comprising: display screen；Processor；And first aspect or first party
The device or second aspect of fingerprint detection in any possible implementation in face or any possible reality of second aspect
The device of fingerprint detection in existing mode.
Wherein, the processor is connect with MCU, to control the sensor core chip arrays in described device by the MCU
Carry out fingerprint detection.
Detailed description of the invention
Fig. 1 and Fig. 3 is the schematic diagram for the electronic equipment that the application can be applicable in.
Fig. 2 and Fig. 4 is the diagrammatic cross-section of Fig. 1 and electronic equipment shown in Fig. 3 along the direction A-A ' respectively.
Fig. 5 is the schematic block diagram of the device of the fingerprint detection of the embodiment of the present application.
Fig. 6 is first chipset of the embodiment of the present application and the schematic diagram of the second chipset.
Fig. 7 is the schematic diagram of the chipset multiplexed signals line of the embodiment of the present application.
Fig. 8 is that the chipset of the embodiment of the present application shares the schematic diagram of capacitor.
Specific embodiment
Below in conjunction with attached drawing, the technical solution in the application is described.
It should be understood that the embodiment of the present application can be applied to system of fingerprints, including but not limited to optics, ultrasonic wave or other refer to
Line identifying system and medical diagnostic products based on optics, ultrasonic wave or other fingerprint imagings, the embodiment of the present application is only with optics
It is illustrated for system of fingerprints, but any restriction should not be constituted to the embodiment of the present application, the embodiment of the present application is equally applicable to
Other are using optics, ultrasonic wave or system of other imaging techniques etc..
As a kind of common application scenarios, optical fingerprint systems provided by the embodiments of the present application can be applied in intelligent hand
Machine, tablet computer and other with the mobile terminal of display screen or other electronic equipments；More specifically, being set in above-mentioned electronics
In standby, regional area or whole region below display screen is can be set in optical finger print mould group, to be formed under screen
(Under-display or Under-screen) optical fingerprint systems.Alternatively, the optical finger print mould group can also part or
It is fully integrated to the display screen of the electronic equipment, refers to form (In-display or In-screen) optics in screen
Line system.
Under optical panel fingerprint identification technology carried out using the light returned from the top surface of equipment display component fingerprint induction and
Other inductive operations.The light of the return carries the object contacted with the top surface, such as the information of finger, by acquiring and detecting this
The light that finger returns realizes the optical finger print detection for the particular optical sensor module being located at below display screen.Optical sensor
The design of module can be to realize desired light by being properly configured to acquire and detect the optical element of the light returned
Study picture.
Fig. 1 and Fig. 3 shows the schematic diagram for the electronic equipment that the embodiment of the present application can be applicable in.Wherein, Fig. 1 and Fig. 3 are
The orientation schematic diagram of electronic equipment 10, Fig. 2 and Fig. 4 are respectively the part of Fig. 1 and electronic equipment shown in Fig. 3 10 along the direction A-A '
Diagrammatic cross-section.
The electronic equipment 10 includes display screen 120 and optical finger print mould group 130.Wherein, the optical finger print mould group 130
Regional area below the display screen 120 is set.The optical finger print mould group 130 includes optical fingerprint sensor, described
Optical fingerprint sensor includes that there are multiple optical sensor unit 131(to be referred to as pixel, photosensitive pixel, pixel unit etc.)
Induction arrays 133.133 region of induction arrays or its induction region are the finger of the optical finger print mould group 130
Line detection zone 103.As shown in Figure 1, the fingerprint detection region 103 is located among the display area of the display screen 120.?
In a kind of alternate embodiment, other positions can also be arranged in the optical finger print mould group 130, for example are arranged in the display screen
The non-transparent region in 120 side or the edge of the electronic equipment 10, and the display screen will be come from by light path design
The optical signal of 120 at least partly display area directs into the optical finger print mould group 130, so that the fingerprint detection area
Domain 103 is physically located the display area of the display screen 120.
It should be understood that the area in the fingerprint detection region 103 can be with the induction arrays of the optical finger print mould group 130
133 area is different, for example, by the light path design of lens imaging, reflective folding light path design or other convergences of rays or
The light path designs such as person's reflection, so that the area in the fingerprint detection region 103 of the optical finger print mould group 130 is greater than the optics and refers to
The area of the induction arrays 133 of line mould group 130.In other substitution implementations, if by the way of such as light collimation
Optical path guidance is carried out, the fingerprint detection region 103 of the optical finger print mould group 130 can also be designed to and the optical finger print mould
The area of the induction arrays 133 of group 130 is almost the same.
Therefore, user is when needing to be unlocked the electronic equipment 10 or other fingerprint authentications, it is only necessary to
By finger pressing in the fingerprint detection region 103 for being located at the display screen 120, it can realize that fingerprint inputs.Since fingerprint is examined
Surveying can realize in screen, therefore fingerprint is arranged without the special reserved space in its front in electronic equipment 10 using the above structure
Key (such as Home key), so as to which using screen scheme comprehensively, i.e., the display area of the described display screen 120 can extend substantially
To the front of entire electronic equipment 10.
As a kind of optional implementation, as shown in Fig. 2, the optical finger print mould group 130 includes light detecting portion 134
With optical module 132.The light detecting portion 134 includes the induction arrays 133 and electrically connects with the induction arrays 133
The reading circuit connect and other auxiliary circuits can be produced on a chip (Die) by semiconductor technology, form optics
Fingerprint chip or optical fingerprint sensor, also referred to as sensor chip or chip etc..The induction arrays 133 are specially that light is visited
Survey device (Photo detector) array comprising multiple optical detectors in array distribution, the optical detector can be made
For optical sensor unit as described above.The induction arrays in the light detecting portion 134 can be set in the optical module 132
133 top can specifically include filter layer (Filter), optical waveguide layer or optical path guide structure and other optical elements,
The filter layer can be used for filtering out the environment light for penetrating finger, and the optical waveguide layer is mainly used for reflecting from finger surface
Reflected light be directed to the induction arrays 133 and carry out optical detection.
In specific implementation, the optical module 132 can be encapsulated in the same optics with the light detecting portion 134 and refer to
Line component.For example, the optical module 132 can be encapsulated in the same optical finger print chip with the optical detecting parts 134,
The optical module 132 can also be arranged in the chip exterior where the light detecting portion 134, than optics group as will be described
Part 132 is fitted in above the chip, or the subelement of the optical module 132 is integrated in said chip.
Wherein, there are many implementations for the optical waveguide layer of the optical module 132.For example, the optical waveguide layer can be specially
In collimator (Collimator) layer that semi-conductor silicon chip is made, with multiple collimation units or microwell array, institute
Stating collimation unit can be specially aperture, from the reflected reflected light of finger, impinge perpendicularly on the light of the collimation unit
Line can be passed through and be received by optical sensor unit below, and the excessive light of incident angle is inside the collimation unit
It is attenuated by multiple reflections, therefore the fingerprint lines that each optical sensor unit can only be received substantially right above it is anti-
It is emitted back towards the reflected light come, so that the induction arrays 133 can detect the fingerprint image of finger.
In another implementation, the optical waveguide layer may be optical lens (Lens) layer, have one or more
A lens unit, such as the lens group being made of one or more non-spherical lenses, being used for will be reflected anti-from finger
The induction arrays 133 for penetrating the light detecting portion 134 that light converges to below are based on the induction arrays 133 described
Reflected light is imaged, to obtain the fingerprint image of the finger.Optionally, the optical lens mirror layer is in the lens unit
Optical path in can also be formed with pin hole, the pin hole can cooperate the optical lens mirror layer to expand the optical finger print mould group
130 visual field, to improve the fingerprint imaging effect of the optical finger print mould group 130.
In other implementations, the optical waveguide layer can also specifically use lenticule (Micro-Lens) layer, described micro-
Lens jacket has the microlens array formed by multiple lenticules, can pass through semiconductor growing process or other technique shapes
At above the induction arrays 133 of the light detecting portion 134, and each lenticule can correspond respectively to the induction
One of sensing unit of array 133.Other optical films can also be formed between the microlens layer and the sensing unit
Layer, such as dielectric layer or passivation layer.It further, can also include having between the microlens layer and the sensing unit
The light blocking layer (or being light shield layer, shading layer etc.) of micropore, wherein the micropore is formed in its corresponding lenticule and induction is single
Between member, the light blocking layer can stop the optical interference between contiguous microlens and sensing unit, and make the induction single
Light corresponding to member is converged to inside the micropore by the lenticule, and is transferred to the induction list via the micropore
Member is to carry out optical finger print imaging.
It should be understood that several implementations of above-mentioned optical waveguide layer can be used alone and can also be used in combination.For example, can be
Microlens layer is further set above or below the collimator layer or the optical lens mirror layer.Certainly, in the collimation
Device layer when perhaps the optical lens mirror layer is used in combination with the microlens layer its specific laminated construction or optical path may need
It is adjusted according to actual needs.
As a kind of optional implementation, the display screen 120 can be using the display with spontaneous light display unit
Screen, such as Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display screen or miniature luminous two
Pole pipe (Micro-LED) display screen.For using OLED display screen, the optical finger print mould group 130 can use described
What the display unit (i.e. OLED light source) that OLED display screen 120 is located at the fingerprint detection region 103 was detected as optical finger print
Motivate light source.When the pressing of finger 140 is at the fingerprint detection region 103, the display screen 120 is to the fingerprint detection region
The finger 140 of 103 tops issues light beam 111, and light 111 reflects to form reflected light or process on the surface of finger 140
140 scattering-in of finger and form scattering light.In the related patent applications, for ease of description, also by above-mentioned reflected light and
Scattering light is referred to as reflected light.Since the ridge (ridge) 141 of fingerprint and paddy (valley) 142 are different for the albedo of light,
Therefore, the reflected light 151 from fingerprint ridge and the reflected light from fingerprint valley 152 have different light intensity, and reflected light passes through light
After learning component 132, it is received and converted to corresponding electric signal by the induction arrays 133 in the optical finger print mould group 130, that is, is referred to
Line detects signal.Fingerprint image data can be obtained based on the fingerprint detection signal, and can be with further progress fingerprint
Matching verifying, to realize optical finger print identification function in the electronic equipment 10.
In other implementations, the optical finger print mould group 130 can also using built-in light source or external light source come
Optical signal for carrying out fingerprint detection is provided.In this case, the optical finger print mould group 130 can be adapted for non-spontaneous
Light display screen, such as liquid crystal display or other passive light emitting displays.To apply with backlight module and liquid crystal surface
For the liquid crystal display of plate, fingerprint detection under the screen to support liquid crystal display, the optical finger print system of the electronic equipment 10
System can also include the excitation light source for optical finger print detection, and the excitation light source can be specially infrared light supply or specific
The light source of wavelength non-visible light can be set below the backlight module of the liquid crystal display or be arranged in the electronics
Fringe region below the cover sheet of equipment 10, and liquid crystal display panel or protection can be set in the optical finger print mould group 130
It guides below the fringe region of cover board and by optical path so that fingerprint detection light can reach the optical finger print mould group 130；
Alternatively, the optical finger print mould group 130 also can be set below the backlight module, and the backlight module passes through to diffusion
The film layers such as piece, blast piece, reflector plate carry out aperture or other optical designs with allow fingerprint detection light pass through liquid crystal display panel and
Backlight module simultaneously reaches the optical finger print mould group 130.When the use optical finger print mould group 130 use built-in light source or outside
Light source is set come when providing the optical signal for carrying out fingerprint detection, testing principle is consistent with content is described above.
It should be understood that in specific implementation, the electronic equipment 10 can also include transparency protected cover board, and the cover board can be with
For glass cover-plate or sapphire cover board, it is located at the top of the display screen 120 and covers the front of the electronic equipment 10.
Therefore, in the embodiment of the present application, so-called finger pressing actually refers to pressing in the display screen in the display screen 120
The cover board of 120 tops or the protective layer of the covering cover board.
The electronic equipment 10 can also include circuit board 150, and circuit board 150 is arranged in the optical finger print mould group 130
Lower section.Optical finger print mould group 130 can be bonded on circuit board 150 by gum, and by pad and metal wire bonding with
Circuit board 150, which is realized, to be electrically connected.Optical finger print mould group 130 can by circuit board 150 realize with other peripheral circuits or
The electrical interconnection and signal transmission of the other elements of electronic equipment 10.For example, optical finger print mould group 130 can pass through circuit board
150 receive the control signal of the processing unit of electronic equipment 10, and can also will come from optical finger print mould by circuit board 150
The fingerprint detection signal of group 130 is exported to the processing unit of terminal device 10 or control unit etc..
In some implementations, the optical finger print mould group 130 can only include an optical fingerprint sensor, at this time
The area in the fingerprint detection region 103 of optical finger print mould group 130 is smaller and position is fixed, therefore user is when carrying out fingerprint input
Need for finger to be pressed into the specific position in the fingerprint detection region 103, otherwise optical finger print mould group 130 possibly can not acquire
Cause user experience bad to fingerprint image.In other alternate embodiments, the optical finger print mould group 130 may include more
A optical fingerprint sensor.The multiple optical fingerprint sensor can be disposed side by side on the display screen by way of splicing
120 lower section, and the induction region of the multiple optical fingerprint sensor collectively forms the fingerprint of the optical finger print mould group 130
Detection zone 103.To which the fingerprint detection region 103 of the optical finger print mould group 130 can extend under the display screen
The main region of half part expands to the usual pressing area of finger, to realize that blind input by formula fingerprint operates.Further
Ground, when the optical fingerprint sensor quantity is enough, the fingerprint detection region 103 can be extended to half of display area
Even entire display area, to realize half screen or full frame fingerprint detection.
For example, electronic equipment 10 as shown in Figure 3 and Figure 4, the optical finger print mould group 130 in the electronic equipment 10 includes
Multiple optical fingerprint sensors, the multiple optical fingerprint sensor can be disposed side by side on described for example, by modes such as splicings
The lower section of display screen 120, and the induction region of the multiple optical fingerprint sensor collectively forms the optical finger print mould group 130
Fingerprint detection region 103.
Optionally, corresponding with multiple optical fingerprint sensors of the optical finger print mould group 130, the optical module
It may include multiple optical waveguide layers in 132, each optical waveguide layer respectively corresponds an optical fingerprint sensor, and fitting setting exists respectively
The top of its corresponding optical fingerprint sensor.Alternatively, the multiple optical fingerprint sensor can also share an entirety
Optical waveguide layer, i.e., the described optical waveguide layer have a sufficiently large area to cover the induction battle array of the multiple optical fingerprint sensor
Column.
In addition, the optical module 132 can also include other optical elements, such as filter layer (Filter) or other light
Diaphragm is learned, can be set between the optical waveguide layer and the optical fingerprint sensor, or is arranged in the display screen 120
Between the optical waveguide layer, it is mainly used for isolating the influence that external interference light detects optical finger print.Wherein, the optical filter can
For filtering out the environment light for penetrating finger and entering the optical fingerprint sensor by the display screen 120.It is led with described
Photosphere is similar, and the optical filter can be respectively set for each optical fingerprint sensor to filter out interference light, or can also
To cover the multiple optical fingerprint sensor simultaneously using the optical filter of a large area.
The optical waveguide layer can also be replaced using optical lens (Lens), can pass through shading above the optical lens
Material forms aperture and cooperates the optical lens that fingerprint detection light is converged to the optical fingerprint sensor of lower section to realize fingerprint
Imaging.Similarly, an optical lens can be respectively configured to carry out fingerprint imaging in each optical fingerprint sensor, alternatively,
The multiple optical fingerprint sensor can use the same optical lens also to realize convergence of rays and fingerprint imaging.At other
In alternate embodiment, each optical fingerprint sensor can also even have there are two induction arrays (Dual Array) or more
A induction arrays (Multi-Array), and configure two or more optical lens simultaneously and cooperate described two or multiple induction battle arrays
Column carry out optical imagery, to reduce image-forming range and enhance imaging effect.
When carrying out fingerprint recognition using multiple optical fingerprint sensors for example shown in Fig. 3, since optical finger print senses
The quantity of device increases, and communication line relevant to optical fingerprint sensor and capacitor etc. also increase, to increase optical finger print
The complexity of the structure of mould group.
The embodiment of the present application proposes a kind of fingerprint detection scheme, and optical finger print mould group can be made to have overall compact knot
Structure.
Hereinafter, the optical fingerprint sensor in above-mentioned optical finger print mould group 130 is also referred to as sensor chip or chip.
Fig. 5 is the schematic block diagram of the device 300 of the fingerprint detection of the embodiment of the present application.Described device 300 is set to electricity
Below the display screen of sub- equipment, shield lower optical finger print detection to realize.As shown in figure 5, described device 300 includes sensor chip
Array 310 and mini program controlling unit (Micro-programmed Control Unit, MCU) 320.The sensor chip
Array 310 includes the first chipset 311 and the second chipset 312.
Wherein, in any row and either rank of the sensor core chip arrays 310, in first chipset 311
Chip in chip and second chipset 312 is arranged alternately.
In a kind of implementation of the application, the chip in first chipset 311 is multiplexed the first signal wire 321,
Chip in second chipset 312 is multiplexed second signal line 322.
Wherein, the MCU 320 is used for:
A moment, control first chip in first chipset 311 to the finger above the display screen into
Row fingerprint detection, wherein first chip is communicated using between first signal wire and the MCU；And/or
At the moment, second chip controlled in second chipset 322 carries out fingerprint detection to the finger,
In, second chip is communicated using between the second signal line and the MCU.
In the embodiment, the fingerprint sensor chip array in finger print detection device is divided into two chipsets, i.e., and
One chipset and the second chipset.Wherein, the core in any row and either rank of sensor core chip arrays, in two chipsets
Piece is arranged alternately.In this way, the probability that finger is pressed simultaneously above two chips in same chip group is lower.Therefore, pass through
The each chip being arranged in each chipset is multiplexed a signal wire, and a moment only controls a core in same chip group
Piece carries out fingerprint detection keeps the structure of finger print detection device more compact so as to reduce the cabling in finger print detection device,
And worked at the same time due to avoiding a large amount of sensor chips, also save power consumption.
It should be understood that the sensor core chip arrays 310 may include a line perhaps multi-row transducer chip or including one
Column or multiple row sensor chip.Wherein, when the sensor core chip arrays 310 only include a line sensor chip, in the row
In sensor chip, the chip in chip and the second chipset 312 in the first chipset 311 is arranged alternately.The sensor
When chip array 310 only includes a sensor chip, in the sensor chip, chip in the first chipset 311 and
Chip in second chipset 312 is arranged alternately.
Fig. 6 shows several possible fingerprint detection regions, wherein the fingerprint detection region includes multiple subregions, point
Not Dui Yingyu multiple sensor chips in sensor core chip arrays 310, wherein each sensor chip is for detecting its correspondence
Subregion in fingerprint.
As shown in (a) in Fig. 6, sensor core chip arrays 310 include 2 chips, wherein the first chipset 311 includes core
Piece 1, the second chipset 312 include chip 2.As shown in (b) in Fig. 6, sensor core chip arrays 310 include 3 chips, wherein
First chipset 311 includes chip 1 and chip 3, and the second chipset 312 includes chip 2.As shown in (c) and (d) in Fig. 6, pass
Sensor chip array 310 includes 4 chips, wherein the first chipset 311 includes chip 1 and chip 3, the second chipset 312 packet
Include chip 2 and chip 4.As shown in (e) in Fig. 6, sensor core chip arrays 310 include 6 chips, wherein the first chipset
311 include chip 1, chip 3 and chip 5, and the second chipset 312 includes chip 2, chip 4 and chip 6.Such as (f) institute in Fig. 6
Show, sensor core chip arrays 310 include 8 chips, wherein the first chipset 311 includes chip 1, chip 3, chip 6 and chip
8, the second chipset 312 includes chip 2, chip 4, chip 5 and chip 7.
As can be seen that the chip of non-adjacent chip or diagonal position belongs to the same chipset in Fig. 6.For example,
As shown in (c) in Fig. 6, due to the pressing limited area of finger, will not usually arrive greatly can cover chip 1 and chip 3 simultaneously,
Or chip 2 and chip 4 are covered simultaneously, therefore regard non-adjacent chip 1 and chip 3 as the first chipset 311, it will be non-adjacent
Chip 2 and chip 4 be used as the second chipset 312.First chipset 311 and the second chipset 312 can be with concurrent workings, still
A chip is only controlled in the same chipset every time and carries out fingerprint detection.For example finger pressing is in the core of the first chipset 311
When the region of 2 top of chip of piece 1 and the second chipset 312, chip 1 and chip 2 can simultaneously believe the light that the finger returns
It number is detected, but the chip 4 of the chip 3 in the first chipset 311 and the second chipset does not work at this time.
In another example as shown in (e) in Fig. 6, when finger presses the region above chip 2 and chip 3, chip 2 and core
The optical signal that piece 3 can simultaneously return to the finger detects, but while chip 2 and chip 3 work, the first chip
Remaining chip in group 311 and the second chipset 312 does not work.When finger presses the region above chip 5 and chip 6, core
The optical signal that piece 5 and chip 6 can simultaneously return to the finger detects, but while chip 5 and chip 6 work,
Remaining chip in first chipset 311 and the second chipset 312 does not work.
The quantity of fingerprint sensor chip illustrated above, size and arrangement situation are merely illustrative, can be according to practical need
It asks and is adjusted.For example, number of chips in sensor core chip arrays can also be other values, which can be with
It is square or round.
In the embodiment, MCU 320 can be connected with host (Host), which includes the processor of electronic equipment, should
Processor is, for example, the master control of electronic equipment.Wherein, MCU 320 can receive the instruction that the master control of electronic equipment is sent, and root
According to the instruction, in first chip and/or the second chipset 312 that the moment controls in the first chipset 311 one
A second chip carries out fingerprint detection to the finger.
In other words, host is bridged by MCU 320, to manage the communication of the sensor core chip arrays 310.
The master control of electronic equipment can get the pressing information of finger from touch panel, for example, finger pressing area and
Pressing position etc. presses information, and is needed according to these pressing information determinations using which sensor chip in which chipset
Fingerprint detection is carried out to the finger.The master control of electronic equipment can send to MCU 320 and instruct, and indicate by some sensor chip
Fingerprint detection is carried out to the finger.After MCU 320 receives the instruction, sent by corresponding signal wire to the sensor chip
The instruction, so that the sensor chip carries out fingerprint detection to the finger after receiving the instruction.
Chip in first chipset 311 is multiplexed the first signal wire 321, the chip multiplexing second in the second chipset 312
Signal wire 322.First signal wire 321 and second signal line 322 for example can be used for transmission fingerprint data (DATA), clock signal
(CLOCK) and at least one of signals such as reset signal (RESET).Wherein, the clock signal is synchronous for signal transmitting and receiving,
For example, sensor chip needs that collected finger print data is sent to MCU 320 according to the clock signal received, to avoid
Error code.The number that the optical signal that the collected finger of finger print data, that is, sensor chip returns obtains after simple process
According to the data carry the finger print information of the finger.The reset signal is for restoring sensor chip to original state.
And for other signals, such as piece choosing (Chip Selection, CS) signal and interruption (Interrupt, INT)
Signal etc., each chip in the sensor core chip arrays 310 can be used between signal wire and MCU 320 independent
Carry out the transmission of CS signal and INT signal.The chip selection signal can be used in each chipset select certain chip with into
Row fingerprint detection.
First signal wire 321 is only used for first chip in the first chipset 311 and between MCU 320 every time
It is communicated.The second signal line 322 be only used for every time second chip in the second chipset 312 and MCU 320 it
Between communicated.That is, first chip and second chip can use the first signal wire 321 and second respectively
Signal wire 322 is communicated with MCU 320 simultaneously, and still, other chips in the first chipset 311 will not be with first chip
It is communicated simultaneously using the first signal wire 321 with MCU 320, other chips in the second chipset 312 will not be with second chip
It is communicated simultaneously using second signal line 322 with MCU 320.
By taking Fig. 7 as an example, host 100 is bridged by MCU 320, by 320 management of sensor chip array 310 of MCU
Each chip.MCU 320 is non-conterminous or right by the first signal wire 321 and chip 1, chip 3 in the first chipset 311 etc.
The chip of Angle Position connects, and MCU 320 passes through the not phase such as second signal line 322 and chip 2, chip 4 in the second chipset 312
Adjacent or diagonal position chip connection.First signal wire 321 and second signal line 322 are respectively used to the core of transmission respective chip group
Finger print data, clock signal and the reset signal etc. that piece obtains.MCU 320 by signal wire 1., signal wire 2., signal wire 3.,
Signal wire 4. ..., signal wireBe separately connected chip 1, chip 2, chip 3, chip 4 ..., chip N, and signal wire
1., signal wire 2., signal wire 3., signal wire 4. ..., signal wireIt is respectively used to transmission chip 1, chip 2, chip 3, chip
4 ..., the chip selection signal and interrupt signal of chip N.
Only have a chip in a moment, the first chipset 311 working, with use the first signal wire 321 with
Signal transmission between MCU320.Only have a chip in a moment, the second chipset 312 working, to use second
Signal transmission between signal wire 322 and MCU 320.
For example, when the pressing area of finger is located at 2 top of chip 1 and chip, host 100 passes through MCU in Fig. 7
Piece choosing (CS) signal is sent to chip 1 and chip 2 by 320, the chip selection signal of chip 1 and chip 2 pass through respectively signal wire 1. and
2. signal wire is transmitted to chip 1 and chip 2.Chip 1 and chip 2 are opened, and carry out fingerprint detection to the finger, are referred to obtain
Line data, and respectively 2. (INT) 1. will be interrupted with signal wire by signal wire and host 100 is sent to by MCU 320, with notice
Host 100 is come finger print data of taking.The finger print data that chip 1 and chip 2 obtain can pass through the first signal wire 321 and the respectively
Binary signal line 322 is transmitted to MCU 320, and is further transmitted to host 100.After host 100 receives finger print data, it can pass through
MCU 320 will reset that (RESET) signal passes through the first signal wire 321 respectively and second signal line 322 is sent to chip 1 and chip
2, so that chip 1 and chip 2 restore to original state.
It is illustrated by taking SPI communication as an example in Fig. 7, shows the connection type under SPI communication.In practical applications,
Fingerprint detection, such as UART communication and I2C communication can be carried out using other communication modes control sensor core chip arrays 310.
By the way of multiplexed signals line shown in Fig. 7, the scene downward cabling of multi-sensor chip on the one hand can solve
Problem on the high side substantially reduces the quantity of signal wire；On the other hand due to only having a sensor in each chipset every time
Chip operation, thus be conducive to save power consumption.
In another implementation of the application, the power sharing of each chip one in first chipset 311
Power capacitor, one power capacitor of power sharing of each chip in second chipset 312.Wherein, the MCU 320 is used
In:
A moment, the chip controlled in first chipset 311 refers to the finger above the display screen
Line detection；And/or
At the moment, the chip controlled in second chipset 312 carries out fingerprint detection to the finger.
In the embodiment, a power capacitor, and a moment are shared by multiple chips in one chipset of setting
The chip only controlled in same chip group carries out fingerprint detection, can reduce the capacitor quantity in finger print detection device, make
The structure of finger print detection device is more compact, and works at the same time due to avoiding a large amount of sensor chips, also saves function
Consumption.
The power capacitor for example can be decoupling capacitor, or be decoupling capacitance, power supply of the capacitance connection in chip
Between ground, can be used to implement storing electrical energy, decoupling, noise reduction, stabilization, buffering the effects of.The application is to the power capacitor
Without limitation, such as it is also possible to a chipset and shares other shunt capacitances.
One power capacitor of the power sharing of each chip, the power capacitor only supply every time in first chipset 311
A chip in first chipset 311 uses, without being connected between multiple chips in the first chipset 311 simultaneously.
One power capacitor of the power sharing of each chip in second chipset 312, the power capacitor only supply the second chip every time
A chip in group 312 uses, without being connected between multiple chips in the second chipset 312 simultaneously.
The power supply of each chip in same chip group above-mentioned, such as may include at least one of following power supply: it is same
The power supply of each chip in one chipset, in same chip group each chip the simulation electricity for identical function module
The digital power for identical function module of each chip in source, same chip group.
That is, the power supply of each chip can share a power capacitor in each chipset, and/or, often
The power supply for identical function module of each chip can also share a power capacitor in a chipset.
Wherein, the power supply of each chip shares a power capacitor and/or each chip in first chipset
One power capacitor of power sharing for identical function module, the power supply of each chip is total in second chipset
With a power capacitor and/or one power capacitor of power sharing for identical function module of each chip.
The power supply of one chip is, for example, AVDD, and AVDD is used to provide total voltage for the chip.For same model
Chip, the AVDD of each chip is identical in each chipset, and the AVDD of each chip can be shared same in each chipset
A power capacitor.
Voltage needed for different function module on one chip may be different, therefore the chip is used for different function mould
The power supply of block is different.Different function module on the chip for example, analog to digital conversion circuit (Analog to
Digital Converter, ADC), field-programmable gain amplifier (Field Programmable Gain
Amplifier, FPGA), the functional modules such as photodiode (Photodiode, PD).
Different function module on one chip has different demands, corresponding analog power sum number to voltage at work
Word power supply is different.But the identical function module on the different chips of same chip group at work needed for voltage be usually
Identical, therefore, the power supply for identical function module on the different chips of same chip group can share the same power supply
Capacitor.For example, the power supply for ADC module of each chip can share a capacitor, same chip group in same chip group
In the power supply for PD module of each chip can share capacitor, etc..
By taking Fig. 8 as an example, the first chipset 311 include chip 1, chip 3 ..., chip N-1, the second chipset 312 includes
Chip 2, chip 4 ..., chip N.Wherein, the AVDD power supply of each chip in the first chipset 311 is all connected with capacitor C1,
And the AVDD of each chip in the second chipset 312 is all connected with capacitor C2.It is available to voltage after handling AVDD
There are the analog power (Analog Power) of each functional module of different demands, such as the functional modules such as ADC, FPGA, PD.Its
In, in the embodiment of the present application, in a chipset, each chip is used for identical function module and provides the mould of identical voltage
Quasi- one capacitor of power sharing.For sake of simplicity, only showing an analog power in each chip in Fig. 8, the first chipset 311
The analog power in each chip is all connected with capacitor C3, and the analog power in each chip of the second chipset 312 is equal
Connect capacitor C4.
Similarly, in fig. 8, the digital power in each chip of the first chipset 311 is all connected with capacitor C5, and second
Digital power in each chip of chipset 312 is all connected with capacitor C6.The digital power is used for as each Digital Logic and defeated
Enter output (Input/Output, I/O) interface etc. to be powered.
Each power supply of chip is usually managed by Power Management Unit (Power Management Unit, PMU),
After closing the PMU of the chip, which stops working.In the sensor chip for sharing capacitor, only opened in synchronization
The PMU of the PMU of one of sensor chip, other sensors chip interior are turned off.For example, when in the first chipset 311
A chip PMU open when, which can be communicated by the first signal line 321 with MCU 320, to carry out
Fingerprint detection；When the PMU of a chip in the second chipset 312 is opened, which can pass through second signal route 322
It is communicated with MCU 320, to carry out fingerprint detection.
By the way of power capacitor altogether shown in Fig. 8, the number of power capacitor on the one hand can be reduced, cost is reduced,
Keep the structure of finger print detection device 300 more compact；On the other hand due to only having a sensor core in each chipset every time
Piece work, thus be conducive to save power consumption.
Above-mentioned various implementations in the embodiment of the present application can be implemented separately, or be combined together realization.This Shen
It please not limit this.For example, the device 300 can use the connection type of multiplexed signals line for example shown in Fig. 7 simultaneously, with
And the connection type of power capacitor altogether for example shown in Fig. 8.For example, when a chip in each chipset is opened, the chip
Shared capacitor and signal wire can be used, so that fingerprint detection is carried out, and other chip differences in the chipset use
The capacitor and the signal wire.
The embodiment of the present application also provides a kind of electronic equipment, which includes: display screen, processor, Yi Jishang
State the device 300 of the fingerprint detection in the various embodiments of the application.
Wherein, the processor is connect with MCU, to control the sensor chip battle array in described device 300 by the MCU
Column 310 carry out fingerprint detection.The processor is, for example, the master control of electronic equipment, MCU MCU 320 for example above-mentioned.
The display screen can be common non-collapsible display screen, or foldable display screen or be Flexible Displays
Screen.
Non-limiting as example, the electronic equipment in the embodiment of the present application can be terminal device, mobile phone, plate electricity
The portable or mobiles such as brain, laptop, desktop computer, game station, vehicle electronic device or wearable intelligent equipment
Calculate equipment and electronic databank, automobile, ATM (automatic teller machine) (Automated Teller Machine, ATM) etc. its
His electronic equipment.The wearable intelligent equipment includes that function is complete, size is big, it is complete or partial not depend on smart phone realization
Function, such as: smartwatch or intelligent glasses etc., and only it is absorbed in certain a kind of application function, it needs and other equipment such as intelligence
Energy mobile phone is used cooperatively, such as Intelligent bracelet, the intelligent jewellery equipment of all kinds of carry out sign monitorings.
It should be noted that under the premise of not conflicting, in each embodiment described herein and/or each embodiment
Technical characteristic can arbitrarily be combined with each other, obtained technical solution should also fall into the protection scope of the application after combination.
It should be understood that the specific example in the embodiment of the present application is intended merely to that those skilled in the art is helped to more fully understand
The embodiment of the present application, rather than the range of the embodiment of the present application is limited, those skilled in the art can be on the basis of above-described embodiment
It is upper to carry out various improvement and deformations, and these are improved or deformation is all fallen in the protection scope of the application.
The above, the only specific embodiment of the application, but the protection scope of the application is not limited thereto, it is any
Those familiar with the art within the technical scope of the present application, can easily think of the change or the replacement, and should all contain
Lid is within the scope of protection of this application.Therefore, the protection scope of the application should be based on the protection scope of the described claims.
Claims (12)
1. a kind of device of fingerprint detection, which is characterized in that described device is set to below the display screen of electronic equipment, to realize
Shield lower optical finger print detection, described device includes sensor core chip arrays and mini program controlling unit MCU, the sensor chip
Array includes the first chipset and the second chipset, chip the first signal wire of multiplexing in first chipset, and described second
Chip in chipset is multiplexed second signal line, wherein described in any row and either rank of the sensor core chip arrays
The chip in chip and second chipset in first chipset is arranged alternately, and the MCU is used for:
A moment, first chip controlled in first chipset refers to the finger above the display screen
Line detection, wherein first chip is communicated using between first signal wire and the MCU；And/or
At the moment, second chip controlled in second chipset carries out fingerprint detection to the finger, wherein
Second chip is communicated using between the second signal line and the MCU.
2. the apparatus according to claim 1, which is characterized in that first signal wire and the second signal line are for passing
At least one of defeated finger print data, clock signal and reset signal.
3. the apparatus according to claim 1, which is characterized in that first chipset and second chipset by with
It is communicated between any one lower communication mode and the MCU:
Serial peripheral interface communication, universal asynchronous receiving-transmitting transmitter UART communication, internal integrated circuit I2C communication.
4. device according to any one of claim 1 to 3, which is characterized in that every in the sensor core chip arrays
The transmission that a chip selects CS signal and interrupt INT signal using piece is carried out between signal wire independent and the MCU.
5. device according to any one of claim 1 to 3, which is characterized in that the MCU is specifically used for:
The instruction that the processor of the electronic equipment is sent is received, and is based on described instruction, controls described first at the moment
Chip and/or second chip carry out fingerprint detection.
6. device according to any one of claim 1 to 3, which is characterized in that each chip in first chipset
Power supply share one power supply electricity of power sharing for identical function module of a power capacitor and/or each chip
Hold, in second chipset power supply of each chip share a power capacitor and/or each chip for identical
One power capacitor of power sharing of functional module.
7. device according to claim 6, which is characterized in that the power supply for identical function module includes:
Analog power for identical function module and/or the digital power for identical function module.
8. device according to claim 6, which is characterized in that the power capacitor is decoupling capacitor.
9. a kind of device of fingerprint detection, which is characterized in that described device is set to below the display screen of electronic equipment, to realize
Shield lower optical finger print detection, described device includes sensor core chip arrays and mini program controlling unit MCU, the sensor chip
Array includes the first chipset and the second chipset, and the power supply of each chip shares a power supply in first chipset
One power capacitor of power sharing for identical function module of capacitor and/or each chip, it is each in second chipset
The power supply of a chip shares power sharing one for identical function module of a power capacitor and/or each chip
Power capacitor, wherein the sensor in any row and either rank of the sensor core chip arrays, in first chipset
Sensor chip in chip and second chipset is arranged alternately, and the MCU is used for:
A moment, the chip controlled in first chipset carries out fingerprint inspection to the finger above the display screen
It surveys；And/or
At the moment, the chip controlled in second chipset carries out fingerprint detection to the finger.
10. device according to claim 9, which is characterized in that the power supply for identical function module includes:
Analog power for identical function module and/or the digital power for identical function module.
11. device according to claim 9 or 10, which is characterized in that the power capacitor is decoupling capacitor.
12. a kind of electronic equipment, which is characterized in that including display screen, processor and according to claim 1 to any in 11
The device of fingerprint detection described in, wherein the processor is connect with mini program controlling unit MCU, to be controlled by the MCU
Sensor core chip arrays in described device processed carry out fingerprint detection.
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| US11521542B2 (en) | 2019-11-20 | 2022-12-06 | Novatek Microelectronics Corp. | Method for display driver system and display driver system |
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