CN109719279B - Convex array type ultrasonic transducer manufacturing method and equipment - Google Patents
Convex array type ultrasonic transducer manufacturing method and equipment Download PDFInfo
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- CN109719279B CN109719279B CN201811621626.9A CN201811621626A CN109719279B CN 109719279 B CN109719279 B CN 109719279B CN 201811621626 A CN201811621626 A CN 201811621626A CN 109719279 B CN109719279 B CN 109719279B
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Abstract
The invention relates to a method and equipment for manufacturing a convex array type ultrasonic transducer. When the manufacturing method and the manufacturing equipment of the convex array type ultrasonic transducer are used, firstly, the lamination is installed in the shaping groove to realize the bending shaping of the lamination, then the first circuit board and the second circuit board are hoisted in the pouring groove by the first hoisting seat to weld the laminated piezoelectric array element module with the bonding pad of the first circuit board and the bonding pad of the second circuit board, then the heat dissipation block is hoisted in the pouring groove by the second hoisting seat, and a backing material is poured in the pouring groove to form a backing. By adopting the manufacturing method and the manufacturing equipment of the convex array type ultrasonic transducer, the welding difficulty of the laminated piezoelectric array element module, the welding pad of the first circuit board and the welding pad of the second circuit board can be reduced, and the welding firmness can be favorably ensured.
Description
Technical Field
The invention relates to the technical field of ultrasonic transducers, in particular to a method and equipment for manufacturing a convex array type ultrasonic transducer.
Background
An ultrasonic transducer is a device which can convert an electric signal into an ultrasonic wave and transmit the ultrasonic wave to a human body or other detection objects, and then convert the ultrasonic wave reflected by the human body or other detection objects into the electric signal, and is widely applied to medical diagnosis, nondestructive detection and the like. Ultrasonic transducers exist in various forms such as mechanical type, linear array type and convex array type. The convex array type ultrasonic transducer generally comprises a back lining, a lamination formed by laminating a piezoelectric array element module and an acoustic matching layer, a first circuit board positioned on one side of the piezoelectric array element module, a second circuit board positioned on the other side of the piezoelectric array element module, a radiating block, an acoustic lens and other parts. When manufacturing the ultrasonic transducer, it is necessary to complete the welding of the piezoelectric array element module having tens or even hundreds of array elements with the bonding pads of the first circuit board and the bonding pads of the second circuit board. However, the difficulty of welding the piezoelectric array element module with the bonding pad of the first circuit board and the bonding pad of the second circuit board is high in the current manufacturing process of the convex array type ultrasonic transducer, and the welding firmness is difficult to guarantee.
Disclosure of Invention
Therefore, it is necessary to provide a method and an apparatus for manufacturing a convex array type ultrasonic transducer, aiming at the problems that the difficulty of welding the piezoelectric array element module with the bonding pad of the first circuit board and the bonding pad of the second circuit board is high and the welding firmness is difficult to ensure in the current manufacturing process of the convex array type ultrasonic transducer.
A method for manufacturing a convex array type ultrasonic transducer comprises the following steps:
providing convex array type ultrasonic transducer manufacturing equipment, wherein the convex array type ultrasonic transducer manufacturing equipment comprises a casting mold, the casting mold comprises a casting seat, a first hanging seat and a second hanging seat, a casting groove is formed in the casting seat, and a shaping groove communicated with the casting groove is further formed in the casting groove;
installing the lamination in a fixed groove of the casting seat and bending and shaping the lamination;
installing the first circuit board and the second circuit board on the first hanging seat and hanging the first circuit board and the second circuit board in a pouring groove of the pouring seat;
welding the laminated piezoelectric array element module on a bonding pad of a first circuit board and a bonding pad of a second circuit board;
installing the heat dissipation block on the second hanging seat and hanging the heat dissipation block in a pouring groove of the pouring seat;
and pouring a backing material into the pouring groove of the pouring seat to form a backing.
When the manufacturing method of the convex array type ultrasonic transducer is used, the lamination is installed in the shaping groove to achieve bending shaping of the lamination, then the first circuit board and the second circuit board are hoisted in the pouring groove by the first hanging seat to weld the laminated piezoelectric array element module with the bonding pad of the first circuit board and the bonding pad of the second circuit board, then the heat dissipation block is hoisted in the pouring groove by the second hanging seat, and a backing material is poured into the pouring groove to form a backing. On one hand, the first circuit board and the second circuit board can keep relative positions between the first circuit board and the second circuit board and the laminated piezoelectric array element module through the mode that the first hanging seat is hung in the pouring groove of the pouring seat, and the welding difficulty is greatly reduced; on the other hand, the mode that the lamination, the first circuit board, the second circuit board and the radiating block are integrally cast through the backing can absorb and attenuate radiated ultrasonic energy and can strengthen the welding firmness of the piezoelectric array element module of the lamination, the bonding pad of the first circuit board and the bonding pad of the second circuit board. By adopting the manufacturing method of the convex array type ultrasonic transducer, the welding difficulty of the laminated piezoelectric array element module and the welding pad of the first circuit board and the welding pad of the second circuit board can be reduced, and the welding firmness can be favorably ensured.
In one embodiment, the step of soldering the stacked piezoelectric array element modules to the pads of the first circuit board and the pads of the second circuit board specifically includes the following steps:
and welding the laminated piezoelectric array element module with a bonding pad of the first circuit board and a bonding pad of the second circuit board through leads.
The mode that the laminated piezoelectric array element is welded with the bonding pad of the first circuit board and the bonding pad of the second circuit board through the lead can improve the welding reliability of the laminated piezoelectric array element module, the bonding pad of the first circuit board and the bonding pad of the second circuit board.
The convex array type ultrasonic transducer manufacturing equipment comprises a casting mold, wherein the casting mold comprises a casting seat, a first hanging seat and a second hanging seat, a casting groove is formed in the casting seat and used for back lining casting, a shaping groove communicated with the casting groove is further formed in the casting groove and used for laminated installation and laminated bending shaping, the first hanging seat is used for installing a circuit board and a second circuit board and hanging the circuit board and the second circuit board in the casting groove, and the second hanging seat is used for installing a radiating block and hanging the radiating block in the casting groove.
When the convex array type ultrasonic transducer manufacturing equipment is used, firstly, the lamination is installed in the shaping groove to achieve bending shaping of the lamination, then the first circuit board and the second circuit board are hoisted in the pouring groove by the first hanging seat to weld the laminated piezoelectric array element module with the bonding pad of the first circuit board and the bonding pad of the second circuit board, then the radiating block is hoisted in the pouring groove by the second hanging seat, and a backing material is poured into the pouring groove to form a backing. On one hand, the first circuit board and the second circuit board can keep relative positions between the first circuit board and the second circuit board and the laminated piezoelectric array element module through the mode that the first hanging seat is hung in the pouring groove of the pouring seat, and the welding difficulty is greatly reduced; on the other hand, the mode that the lamination, the first circuit board, the second circuit board and the radiating block are integrally cast through the backing can absorb and attenuate radiated ultrasonic energy and can strengthen the welding firmness of the piezoelectric array element module of the lamination, the bonding pad of the first circuit board and the bonding pad of the second circuit board. The convex array type ultrasonic transducer manufacturing equipment can reduce the welding difficulty of the laminated piezoelectric array element module and the bonding pad of the first circuit board and the bonding pad of the second circuit board, and is favorable for ensuring the welding firmness.
In one embodiment, the pouring seat comprises a base and at least two stop blocks, the fixed groove is arranged on the base, the at least two stop blocks are arranged around the base, and the at least two stop blocks are respectively arranged on the base to form the pouring groove. The pouring seat is of a split structure, so that the convenience in installation of each component is improved, and meanwhile, the bending and shaping of the laminated layers and the welding operation of the laminated piezoelectric array element module, the welding disc of the first circuit board and the welding disc of the second circuit board can be avoided.
In one embodiment, at least two of the stoppers are detachably connected to the base, respectively. So both be convenient for take off and accomplish the semi-manufactured goods of back lining pouring, be convenient for again pouring mold's used repeatedly.
In one embodiment, the first hanger is mounted on the casting base and the second hanger is mounted on the casting base. First hanging seat is installed and can be improved casting mold's compact structure nature on the pouring seat, guarantees the hoist and mount stability of first circuit board and second circuit board simultaneously. The second hangs the seat and installs the compact structure nature that can improve casting mold on the pouring seat, guarantees the hoist and mount stability of radiating block simultaneously.
In one embodiment, the first hanging seat is provided with a first mounting structure for mounting the first circuit board and the second circuit board. The first circuit board and the second circuit board are mounted on the first hanging seat through the first mounting structure, and the first circuit board and the second circuit board are mounted conveniently.
In one embodiment, the first mounting structure is a plurality of mounting posts arranged on the first hanging seat, and the mounting posts are used for penetrating into mounting holes of the first circuit board or the second circuit board, so that the mounting is convenient.
In one embodiment, the second hanging seat is provided with a second mounting structure for mounting a heat dissipation block. And the radiating block is arranged on the second hanging seat by utilizing the second mounting structure, so that the radiating block is convenient to mount.
In one embodiment, the second mounting structure is a screw arranged on the second hanging seat, and the screw is used for being in threaded connection with the radiating block, so that the mounting is convenient.
Drawings
Fig. 1 is a schematic structural diagram of a convex array type ultrasonic transducer manufacturing apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural view of a casting base (with a front block removed) according to an embodiment of the present invention;
fig. 3 is an exploded view of a casting base according to an embodiment of the present invention.
Description of reference numerals:
10. the heat dissipation module comprises a casting mold, 11, a casting base, 110, a casting groove, 111, a base, 111a, a shaping groove, 112, a stop block, 112a, a front stop block, 112b, a left stop block, 112c, a rear stop block, 112d, a right stop block, 12, a first hanging base, 120, a first installation structure, 13, a second hanging base, 130, a second installation structure, 20, a backing, 30, a lamination layer, 40, a first circuit board, 50, a second circuit board, 60 and a heat dissipation block.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
In one embodiment, as shown in fig. 1 to fig. 3, a method for manufacturing a convex array type ultrasonic transducer is provided, which includes the following steps:
s10: the manufacturing equipment of the convex array type ultrasonic transducer comprises a casting mold 10, wherein the casting mold 10 comprises a casting seat 11, a first hanging seat 12 and a second hanging seat 13, a casting groove 110 is formed in the casting seat 11, and a shaping groove 111a communicated with the casting groove 110 is further formed in the casting groove 110.
S20: the laminate 30 is fitted in the shaping groove 111a of the casting bed 11 and the laminate 30 is bent and shaped.
In this embodiment, S20 specifically includes the following steps:
the laminate 30 is mounted in the shaping groove 111a of the base 111, and pressure is applied to the laminate 30 to bend and shape the laminate 30.
S30: the first circuit board 40 and the second circuit board 50 are mounted on the first hanger 12 and the first circuit board 40 and the second circuit board 50 are hung in the casting groove 110 of the casting base 11.
In this embodiment, S30 specifically includes the following steps:
the left stopper 112b and the right stopper 112d are respectively mounted on the base 111, the first hanger 12 is mounted on the right stopper 112d, and the first circuit board 40 and the second circuit board 50 are mounted on the first hanger 12.
S40: the piezoelectric array element modules of the stack 30 are soldered to the pads of the first circuit board 40 and the pads of the second circuit board 50.
In this embodiment, S40 specifically includes the following steps:
the piezoelectric array element modules of the stack 30 are soldered to the pads of the first circuit board 40 and the pads of the second circuit board 50 by means of wires.
It is emphasized that the way the piezoelectric array elements of the stack 30 are soldered to the pads of the first circuit board 40 and the pads of the second circuit board 50 by the leads can improve the reliability of the soldering of the piezoelectric array element module of the stack 30 to the pads of the first circuit board 40 and the pads of the second circuit board 50.
It should be noted that the distance between the piezoelectric array element module of the stack 30 and the pads of the first circuit board 40 and the pads of the second circuit board 50 should not be too far, which is beneficial to avoid the lead from breaking during the soldering process.
S50: the heat slug 60 is mounted on the second hanger 13 and the heat slug 60 is hung in the casting groove 110 of the casting base 11.
In this embodiment, S50 specifically includes the following steps:
the heat radiation block 60 is mounted on the second hanger 13 and both ends of the second hanger 13 are mounted on the left and right stoppers 112b and 112d, respectively.
S60: the backing material is poured into the pouring slot 110 of the pouring seat 11 to form the backing 20.
In this embodiment, S60 specifically includes the following steps:
the front block 112a and the rear block 112c are respectively mounted on the base 111 to form a complete casting groove 110, and a backing material is slowly poured into the casting groove 110 of the casting base 11 to form the backing 20.
When the manufacturing method of the convex array type ultrasonic transducer is used, firstly, the lamination 30 is installed in the fixed-shape groove 111a to realize the bending and the shape fixing of the lamination 30, then the first circuit board 40 and the second circuit board 50 are hung in the pouring groove 110 by the first hanging seat 12 to weld the piezoelectric array element module of the lamination 30 with the bonding pad of the first circuit board 40 and the bonding pad of the second circuit board 50, then the heat dissipation block 60 is hung in the pouring groove 110 by the second hanging seat 13, and the backing material is poured into the pouring groove 110 to form the backing 20. On one hand, the first circuit board 40 and the second circuit board 50 can keep the relative positions between the first circuit board 40 and the second circuit board 50 and the piezoelectric array element module of the lamination layer 30 by the way that the first hanging seat 12 is hung in the pouring groove 110 of the pouring seat 11, thereby greatly reducing the difficulty of welding; on the other hand, the lamination 30, the first circuit board 40, the second circuit board 50, and the heat sink 60 are integrally molded by the backing 20 in such a way that the piezoelectric array element module of the lamination 30 can absorb and attenuate the radiated ultrasonic energy and can also enhance the soldering firmness with the pads of the first circuit board 40 and the pads of the second circuit board 50. By adopting the manufacturing method of the convex array type ultrasonic transducer, the welding difficulty of the piezoelectric array element module of the lamination layer 30, the welding pad of the first circuit board 40 and the welding pad of the second circuit board 50 can be reduced, and the welding firmness can be favorably ensured.
Referring to fig. 1, in an embodiment, an apparatus for manufacturing a convex array ultrasonic transducer, which is applied to the method for manufacturing a convex array ultrasonic transducer, includes a casting mold 10.
Referring to fig. 2 to 3, the casting mold 10 includes a casting base 11, a first hanging base 12, and a second hanging base 13. The casting seat 11 is provided with a casting groove 110, and the casting groove 110 is used for casting the back lining 20. The casting groove 110 is further provided with a shaping groove 111a communicated with the casting groove 110, and the shaping groove 111a is used for installing the lamination 30 and bending and shaping the lamination 30. The first hanging seat 12 is used for mounting the circuit board and the second circuit board 50 and hanging the circuit board and the second circuit board 50 in the pouring groove 110. The second hanging seat 13 is used for installing the heat dissipation block 60 and hanging the heat dissipation block 60 in the casting groove 110.
When the convex array type ultrasonic transducer manufacturing equipment is used, firstly, the lamination 30 is installed in the fixed groove 111a to realize the bending and the shaping of the lamination 30, then the first circuit board 40 and the second circuit board 50 are hung in the pouring groove 110 by using the first hanging seat 12 to weld the piezoelectric array element module of the lamination 30 with the bonding pad of the first circuit board 40 and the bonding pad of the second circuit board 50, then the heat dissipation block 60 is hung in the pouring groove 110 by using the second hanging seat 13, and the backing material is poured into the pouring groove 110 to form the backing 20. On one hand, the first circuit board 40 and the second circuit board 50 can keep the relative positions between the first circuit board 40 and the second circuit board 50 and the piezoelectric array element module of the lamination layer 30 by the way that the first hanging seat 12 is hung in the pouring groove 110 of the pouring seat 11, thereby greatly reducing the difficulty of welding; on the other hand, the lamination 30, the first circuit board 40, the second circuit board 50, and the heat sink 60 are integrally molded by the backing 20 in such a way that the piezoelectric array element module of the lamination 30 can absorb and attenuate the radiated ultrasonic energy and can also enhance the soldering firmness with the pads of the first circuit board 40 and the pads of the second circuit board 50. The convex array type ultrasonic transducer manufacturing equipment can reduce the welding difficulty of the piezoelectric array element module of the lamination layer 30, the bonding pad of the first circuit board 40 and the bonding pad of the second circuit board 50, and is favorable for ensuring the welding firmness.
The shape of the fixed groove 111a can be selected according to actual needs. In the present embodiment, the fixed groove 111a is an arc-shaped groove, but not limited thereto.
Referring to fig. 3, the casting base 11 includes a base 111 and at least two stoppers 112, the positioning groove 111a is disposed on the base 111, the at least two stoppers 112 are disposed around the base 111, and the at least two stoppers 112 are respectively mounted on the base 111 to form the casting groove 110. The casting base 11 has a split structure, which is beneficial to improving the installation convenience of each component, and can avoid influencing the bending and shaping of the lamination 30 and the welding operation of the piezoelectric array element module of the lamination 30, the bonding pad of the first circuit board 40 and the bonding pad of the second circuit board 50.
It should be noted that the number of the stoppers 112 can be selected according to actual needs. In this embodiment, the number of the stoppers 112 is four, the four stoppers 112 are respectively a front stopper 112a, a left stopper 112b, a rear stopper 112c, and a right stopper 112d, and the front stopper 112a, the left stopper 112b, the rear stopper 112c, and the right stopper 112d are respectively mounted on the base 111 to form the casting trough 110, but not limited thereto.
As shown in fig. 3, at least two of the stoppers 112 are detachably connected to the base 111, respectively. This facilitates both the removal of the semifinished item from which the casting of the backing 20 is completed and the reuse of the casting mould 10.
It should be noted that, the manner of detachably connecting the stopper 112 and the base 111 can be selected according to actual needs. In this embodiment, the front block 112a is detachably connected to the base 111 through a screw, the left block 112b is detachably connected to the base 111 through a screw, the rear block 112c is detachably connected to the base 111 through a screw, and the right block 112d is detachably connected to the base 111 through a screw, but not limited thereto.
As shown in fig. 2, the first hanging seat 12 is mounted on the casting seat 11. The first hanging seat 12 is installed on the casting seat 11, so that the structural compactness of the casting mold 10 can be improved, and the hoisting stability of the first circuit board 40 and the second circuit board 50 can be ensured.
As shown in fig. 3, the first hanging seat 12 is detachably connected to the casting seat 11. This facilitates both the removal of the semifinished item from which the casting of the backing 20 is completed and the reuse of the casting mould 10.
It should be noted that, the detachable connection mode of the first hanging seat 12 and the pouring seat 11 can be selected according to actual needs. In this embodiment, the first hanging seat 12 is detachably connected to the right block 112d by a screw, but not limited thereto.
Referring to fig. 2, the first hanging seat 12 is provided with a first mounting structure 120 for mounting the first circuit board 40 and the second circuit board 50. The first circuit board 40 and the second circuit board 50 are mounted on the first hanger 12 by using the first mounting structure 120, so that the first circuit board 40 and the second circuit board 50 are conveniently mounted.
It should be noted that the form of the first mounting structure 120 can be selected according to actual needs. In this embodiment, the first mounting structure 120 is a plurality of mounting posts disposed on the first hanging seat 12, and the plurality of mounting posts are used to penetrate through mounting holes of the first circuit board 40 or the second circuit board 50, so that the mounting is convenient, but not limited thereto.
As shown in fig. 2, the second hanging seat 13 is mounted on the casting seat 11. The second hanging seat 13 is installed on the casting seat 11, so that the structural compactness of the casting mold 10 can be improved, and the hoisting stability of the heat dissipation block 60 can be ensured.
As shown in fig. 3, the second hanging seat 13 is detachably connected to the casting seat 11. This facilitates both the removal of the semifinished item from which the casting of the backing 20 is completed and the reuse of the casting mould 10.
It should be noted that, the detachable connection mode of the second hanging seat 13 and the pouring seat 11 can be selected according to actual needs. In this embodiment, one end of the second hanging seat 13 is detachably connected to the left stopper 112b by a screw, and the other end of the second hanging seat 13 is detachably connected to the right stopper 112d by a screw, but not limited thereto.
Referring to fig. 2, a second mounting structure 130 for mounting the heat dissipating block 60 is disposed on the second hanging seat 13. The second mounting structure 130 is utilized to mount the heat sink 60 on the second hanger 13, thereby facilitating the mounting of the heat sink 60.
It should be noted that the form of the second mounting structure 130 can be selected according to actual needs. In this embodiment, the second mounting structure 130 is a screw disposed on the second hanging seat 13, and the screw is used for being screwed with the heat dissipation block 60, so that the mounting is convenient, but not limited thereto.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A method for manufacturing a convex array type ultrasonic transducer is characterized by comprising the following steps:
providing convex array type ultrasonic transducer manufacturing equipment, wherein the convex array type ultrasonic transducer manufacturing equipment comprises a casting mold, the casting mold comprises a casting seat, a first hanging seat and a second hanging seat, a casting groove is formed in the casting seat, a shaping groove communicated with the casting groove is further formed in the casting groove, the first hanging seat is installed on the casting seat, and the second hanging seat is installed on the casting seat;
installing the lamination in a fixed groove of the casting seat and bending and shaping the lamination;
installing the first circuit board and the second circuit board on the first hanging seat and hanging the first circuit board and the second circuit board in a pouring groove of the pouring seat;
welding the laminated piezoelectric array element module on a bonding pad of a first circuit board and a bonding pad of a second circuit board;
installing the heat dissipation block on the second hanging seat and hanging the heat dissipation block in a pouring groove of the pouring seat;
and pouring a backing material into the pouring groove of the pouring seat to form a backing.
2. The method for manufacturing the convex array type ultrasonic transducer according to claim 1, wherein the step of soldering the laminated piezoelectric array element module on the bonding pad of the first circuit board and the bonding pad of the second circuit board comprises the following steps:
and welding the laminated piezoelectric array element module with a bonding pad of the first circuit board and a bonding pad of the second circuit board through leads.
3. An apparatus for manufacturing a convex array type ultrasonic transducer applied to the method for manufacturing a convex array type ultrasonic transducer according to claim 1 or 2, it is characterized by comprising a casting mould, wherein the casting mould comprises a casting seat, a first hanging seat and a second hanging seat, the pouring seat is provided with a pouring groove used for back lining pouring, the pouring groove is also provided with a shaping groove communicated with the pouring groove, the fixed-shape groove is used for installing the lamination and bending and shaping the lamination, the fixed-shape groove is an arc-shaped groove, the first hanging seat is used for installing the circuit board and the second circuit board and hanging the circuit board and the second circuit board in the pouring groove, the second hanging seat is used for installing the radiating block and hanging the radiating block in the pouring groove, the first hanging seat is installed on the pouring seat, and the second hanging seat is installed on the pouring seat.
4. The apparatus for manufacturing convex array ultrasonic transducer according to claim 3, wherein the casting base comprises a base and at least two blocks, the shape-fixing groove is disposed on the base, at least two blocks are disposed around the base, and at least two blocks are respectively mounted on the base to form the casting groove.
5. The apparatus for manufacturing convex array ultrasonic transducer according to claim 4, wherein at least two of the stoppers are detachably connected to the base, respectively.
6. The apparatus for manufacturing convex array ultrasonic transducer according to claim 3, wherein the first hanging seat is detachably connected with the casting seat.
7. The apparatus for manufacturing a convex array type ultrasonic transducer according to any one of claims 3 to 6, wherein the first hanging seat is provided with a first mounting structure for mounting the first circuit board and the second circuit board.
8. The apparatus for manufacturing convex array ultrasonic transducer according to claim 7, wherein the first mounting structure is a plurality of mounting posts disposed on the first hanging seat, and the plurality of mounting posts are configured to be inserted into mounting holes of the first circuit board or the second circuit board.
9. The apparatus for manufacturing convex array ultrasonic transducer according to any one of claims 3-6, wherein the second hanging seat is provided with a second mounting structure for mounting a heat sink.
10. The apparatus of claim 9, wherein the second mounting structure is a screw disposed on the second mount, the screw being configured to be threadedly coupled to a heat sink.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811621626.9A CN109719279B (en) | 2018-12-28 | 2018-12-28 | Convex array type ultrasonic transducer manufacturing method and equipment |
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| CN201811621626.9A CN109719279B (en) | 2018-12-28 | 2018-12-28 | Convex array type ultrasonic transducer manufacturing method and equipment |
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| CN109719279A CN109719279A (en) | 2019-05-07 |
| CN109719279B true CN109719279B (en) | 2021-04-27 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101569536A (en) * | 2008-04-29 | 2009-11-04 | 上海爱培克电子科技有限公司 | Manufacturing method of ultrasonic transducer |
| CN105686849A (en) * | 2016-01-14 | 2016-06-22 | 中国科学院深圳先进技术研究院 | Ultrasonic probe backing forming device, tool and manufacture method |
| CN106137250A (en) * | 2016-07-15 | 2016-11-23 | 深圳先进技术研究院 | Make tool and the manufacture method of ultrasonic transducer of curved surface battle array ultrasonic transducer |
| CN209599698U (en) * | 2018-12-28 | 2019-11-08 | 广州瑞派医疗器械有限责任公司 | Convex configuration ultrasonic transducer manufacturing equipment |
-
2018
- 2018-12-28 CN CN201811621626.9A patent/CN109719279B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101569536A (en) * | 2008-04-29 | 2009-11-04 | 上海爱培克电子科技有限公司 | Manufacturing method of ultrasonic transducer |
| CN105686849A (en) * | 2016-01-14 | 2016-06-22 | 中国科学院深圳先进技术研究院 | Ultrasonic probe backing forming device, tool and manufacture method |
| CN106137250A (en) * | 2016-07-15 | 2016-11-23 | 深圳先进技术研究院 | Make tool and the manufacture method of ultrasonic transducer of curved surface battle array ultrasonic transducer |
| CN209599698U (en) * | 2018-12-28 | 2019-11-08 | 广州瑞派医疗器械有限责任公司 | Convex configuration ultrasonic transducer manufacturing equipment |
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| CN109719279A (en) | 2019-05-07 |
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