CN109719279A - Convex configuration ultrasonic transducer manufacturing method and equipment - Google Patents
Convex configuration ultrasonic transducer manufacturing method and equipment Download PDFInfo
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- CN109719279A CN109719279A CN201811621626.9A CN201811621626A CN109719279A CN 109719279 A CN109719279 A CN 109719279A CN 201811621626 A CN201811621626 A CN 201811621626A CN 109719279 A CN109719279 A CN 109719279A
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Abstract
The present invention relates to a kind of convex configuration ultrasonic transducer manufacturing method and equipment.When using above-mentioned convex configuration ultrasonic transducer manufacturing method and equipment, lamination is mounted in setting slot first and realizes that the bending of lamination shapes, then first circuit board and second circuit board are lifted on to using the first flap seat the welding of the pad of the pad and second circuit board of the piezoelectricity array element module and first circuit board that carry out lamination in pouring basin, radiating block is lifted in pouring basin followed by the second flap seat and is poured back lining materials formation backing in pouring basin.The welding difficulty that can reduce the pad of the piezoelectricity array element module of lamination and the pad and second circuit board of first circuit board using the convex configuration ultrasonic transducer manufacturing method and equipment, advantageously ensures that firm welding.
Description
Technical field
The present invention relates to ultrasonic transducer technical fields, more particularly to a kind of convex configuration ultrasonic transducer manufacturer
Method and equipment.
Background technique
Ultrasonic transducer is that one kind can convert electrical signals into ultrasonic wave and pass to human body or other test objects, then
The ultrasonic wave that human body or other test objects reflect is converted to the device of electric signal, it is widely used in medical diagnosis and nothing
Damage detection etc..There are the diversified forms such as mechanical, Linear Array Realtime, convex configuration in ultrasonic transducer.For convex configuration ultrasonic wave transducer
Device generally comprises lamination that backing, piezoelectricity array element module and acoustic matching layer be formed by stacking, positioned at piezoelectricity array element module side
First circuit board, positioned at components such as second circuit board, radiating block and the acoustic lens of the piezoelectricity array element module other side.In manufacture ultrasound
When wave transducer, need complete have tens even the piezoelectricity array element module of several hundred a array elements and the pad of first circuit board and
The welding of the pad of second circuit board.However, the manufacturing process of convex configuration ultrasonic transducer realizes piezoelectricity array element module at present
It is larger with the difficulty of the pad solder of the pad and second circuit board of first circuit board, it is difficult to guarantee firm welding.
Summary of the invention
Based on this, it is necessary to realize piezoelectricity array element module and for the manufacturing process of current convex configuration ultrasonic transducer
The difficulty of the pad solder of the pad and second circuit board of one circuit board is larger, it is difficult to which the problem of guaranteeing firm welding provides
A kind of convex configuration ultrasonic transducer manufacturing method and equipment.
A kind of convex configuration ultrasonic transducer manufacturing method, comprising the following steps:
Convex configuration ultrasonic transducer manufacturing equipment is provided, the convex configuration ultrasonic transducer manufacturing equipment includes casting
Mold, the casting mold include casting seat, the first flap seat and the second flap seat, and the casting seat is equipped with pouring basin, described to pour
The setting slot being connected to the pouring basin is additionally provided on note slot；
Lamination is mounted in the setting slot of casting seat and is bent lamination and is shaped；
First circuit board and second circuit board are mounted on the first flap seat and hang first circuit board and second circuit board
In the pouring basin of casting seat；
The piezoelectricity array element module of lamination is welded on the pad of first circuit board and the pad of second circuit board；
Radiating block is mounted on the second flap seat and is lifted on radiating block in the pouring basin of casting seat；
Casting back lining materials form backing in the pouring basin of casting seat.
When using above-mentioned convex configuration ultrasonic transducer manufacturing method, lamination is mounted in setting slot realizes lamination first
Bending setting, then using the first flap seat by first circuit board and second circuit board be lifted in pouring basin carry out lamination pressure
The welding of the pad of the pad and second circuit board of electric array element module and first circuit board, followed by the second flap seat by radiating block
It is lifted in pouring basin and casting back lining materials forms backing in pouring basin.On the one hand, first circuit board and the second electricity
This mode that road plate is lifted in the pouring basin of casting seat by the first flap seat is able to maintain first circuit board and second circuit
Relative position between plate and the piezoelectricity array element module of lamination, substantially reduces the difficulty of welding；On the other hand, lamination, the first electricity
Road plate, second circuit board, radiating block is poured integral this mode by backing can either absorb and the ultrasound of degrading radiation
Wave energy, and the welding of the pad of the piezoelectricity array element module of lamination and the pad and second circuit board of first circuit board can be reinforced
Fastness.It can reduce the piezoelectricity array element module and first circuit board of lamination using the convex configuration ultrasonic transducer manufacturing method
Pad and second circuit board pad welding difficulty, advantageously ensure that firm welding.
The pad and that the piezoelectricity array element module of lamination is welded on to first circuit board in one of the embodiments,
On the pad of two circuit boards, specifically includes the following steps:
The piezoelectricity array element module of lamination is passed through into the pad solder of the pad and second circuit board of lead and first circuit board.
The piezoelectricity array element of lamination is this by the pad solder of lead and the pad and second circuit board of first circuit board
The welding that mode can be improved the pad of the piezoelectricity array element module of lamination and the pad and second circuit board of first circuit board is reliable
Property.
A kind of convex configuration ultrasonic transducer manufacture applied to above-mentioned convex configuration ultrasonic transducer manufacturing method is set
It is standby, including casting mold, the casting mold include casting seat, the first flap seat and the second flap seat, the casting seat is equipped with and pours
Slot is infused, the pouring basin is poured for backing, is additionally provided with the setting slot being connected to the pouring basin on the pouring basin, described fixed
Shape slot is used to install for lamination and be bent lamination and shape, and first flap seat is used for power circuit board and second circuit board installation simultaneously
Circuit board and second circuit board are lifted in the pouring basin, second flap seat is used to install for radiating block and by radiating block
It is lifted in the pouring basin.
When using above-mentioned convex configuration ultrasonic transducer manufacturing equipment, lamination is mounted in setting slot realizes lamination first
Bending setting, then using the first flap seat by first circuit board and second circuit board be lifted in pouring basin carry out lamination pressure
The welding of the pad of the pad and second circuit board of electric array element module and first circuit board, followed by the second flap seat by radiating block
It is lifted in pouring basin and casting back lining materials forms backing in pouring basin.On the one hand, first circuit board and the second electricity
This mode that road plate is lifted in the pouring basin of casting seat by the first flap seat is able to maintain first circuit board and second circuit
Relative position between plate and the piezoelectricity array element module of lamination, substantially reduces the difficulty of welding；On the other hand, lamination, the first electricity
Road plate, second circuit board, radiating block is poured integral this mode by backing can either absorb and the ultrasound of degrading radiation
Wave energy, and the welding of the pad of the piezoelectricity array element module of lamination and the pad and second circuit board of first circuit board can be reinforced
Fastness.It can reduce the piezoelectricity array element module and first circuit board of lamination using the convex configuration ultrasonic transducer manufacturing equipment
Pad and second circuit board pad welding difficulty, advantageously ensure that firm welding.
The casting seat includes pedestal and at least two blocks in one of the embodiments, and the setting slot setting exists
On the pedestal, at least two blocks are arranged around the pedestal, and at least two blocks be separately mounted to it is described
The pouring basin is formed on pedestal.Casting seat adopts a split structure the property easy for installation for being conducive to improve all parts, simultaneously
It can be avoided the pad and second circuit board for influencing the bending setting of lamination and the piezoelectricity array element module of lamination and first circuit board
Pad weld job.
At least two blocks are detachably connected with the base respectively in one of the embodiments,.So both just
In the semi-finished product for removing completion backing casting, and convenient for the reuse of casting mold.
First flap seat is mounted on the casting seat in one of the embodiments, and second flap seat is mounted on
On the casting seat.First flap seat is mounted on the structural compactness that can be improved casting mold on casting seat, while guaranteeing first
The lifting stability of circuit board and second circuit board.Second flap seat be mounted on casting seat on can be improved casting mold structure it is tight
Gathering property, while guaranteeing the lifting stability of radiating block.
First flap seat is equipped with for for first circuit board and second circuit board installation in one of the embodiments,
The first mounting structure.First circuit board and second circuit board are mounted on the first flap seat using the first mounting structure, it is convenient
The installation of first circuit board and second circuit board.
First mounting structure is the multiple installations being arranged on first flap seat in one of the embodiments,
Column, multiple mounting posts are for being threaded through in the mounting hole of first circuit board or second circuit board, install convenient.
Second flap seat is equipped with the second mounting structure for installing for radiating block in one of the embodiments,.
Radiating block is mounted on the second flap seat using the second mounting structure, facilitates the installation of radiating block.
Second mounting structure is the screw being arranged on second flap seat in one of the embodiments, described
Screw with radiating block for being threadedly coupled, install convenient.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of convex configuration ultrasonic transducer manufacturing equipment described in the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of casting seat described in the embodiment of the present invention (after disassembly positive stop)；
Fig. 3 is the decomposition diagram that seat is poured described in the embodiment of the present invention.
Description of symbols:
10, casting mold, 11, casting seat, 110, pouring basin, 111, pedestal, 111a, setting slot, 112, block, 112a,
Positive stop, 112b, left block, 112c, backstop, 112d, right block, the 12, first flap seat, the 120, first mounting structure, 13,
Two flap seats, the 130, second mounting structure, 20, backing, 30, lamination, 40, first circuit board, 50, second circuit board, 60, heat dissipation
Block.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give better embodiment of the invention.But the invention can be realized in many different forms, however it is not limited to herein
Described embodiment.On the contrary, the purpose of providing these embodiments is that making to understand more the disclosure
Add thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.On the contrary, when element is referred to as " directly existing " another element "upper",
There is no intermediary elements.Term as used herein "vertical", "horizontal", "left" and "right" and similar statement are
For illustrative purposes, it is not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term " and or " used herein includes one or more
Any and all combinations of relevant listed item.
In conjunction with shown in Fig. 1-Fig. 3, a kind of convex configuration ultrasonic transducer manufacturing method is provided in one embodiment, including with
Lower step:
S10: providing convex configuration ultrasonic transducer manufacturing equipment, and the convex configuration ultrasonic transducer manufacturing equipment includes
Casting mold 10, the casting mold 10 include casting seat 11, the first flap seat 12 and the second flap seat 13, are set on the casting seat 11
There is pouring basin 110, the setting slot 111a being connected to the pouring basin 110 is additionally provided on the pouring basin 110.
S20: lamination 30 is mounted in the setting slot 111a of casting seat 11 and lamination 30 is bent setting.
In the present embodiment, S20 specifically includes the following steps:
Lamination 30 is mounted in the setting slot 111a of pedestal 111, applying pressure to lamination 30 makes the bending setting of lamination 30.
S30: first circuit board 40 and second circuit board 50 are mounted on the first flap seat 12 and by 40 He of first circuit board
Second circuit board 50 is lifted in the pouring basin 110 of casting seat 11.
In the present embodiment, S30 specifically includes the following steps:
Left block 112b, right block 112d are separately mounted on pedestal 111 and the first flap seat 12 is mounted on right block
On 112d, then first circuit board 40 and second circuit board 50 be mounted on the first flap seat 12.
S40: the piezoelectricity array element module of lamination 30 is welded on to the weldering of the pad and second circuit board 50 of first circuit board 40
On disk.
In the present embodiment, S40 specifically includes the following steps:
The piezoelectricity array element module of lamination 30 is passed through into the weldering of lead and the pad and second circuit board 50 of first circuit board 40
Disk welding.
It is emphasized that the piezoelectricity array element of lamination 30 passes through the pad and second circuit board of lead and first circuit board 40
This mode of 50 pad solder can be improved the piezoelectricity array element module of lamination 30 and the pad and second of first circuit board 40
The soldering reliability of the pad of circuit board 50.
It should be noted that the pad and second circuit board 50 of the piezoelectricity array element module of lamination 30 and first circuit board 40
The distance of pad too far should not be conducive to that lead is avoided to be broken during the welding process.
S50: radiating block 60 is mounted on the second flap seat 13 to and is lifted on radiating block 60 pouring basin 110 of casting seat 11
It is interior.
In the present embodiment, S50 specifically includes the following steps:
Radiating block 60 is mounted on the second flap seat 13 and the both ends of the second flap seat 13 are separately mounted to left block 112b
On right block 112d.
S60: casting back lining materials form backing 20 in the pouring basin 110 of casting seat 11.
In the present embodiment, S60 specifically includes the following steps:
Positive stop 112a, backstop 112c are separately mounted to form complete pouring basin 110 on pedestal 111, toward casting
It is slowly poured back lining materials in the pouring basin 110 of seat 11 and forms backing 20.
When using above-mentioned convex configuration ultrasonic transducer manufacturing method, lamination 30 is mounted on first real in setting slot 111a
The bending setting of existing lamination 30, is then lifted on pouring basin for first circuit board 40 and second circuit board 50 using the first flap seat 12
The welding of the pad of the piezoelectricity array element module of lamination 30 and the pad of first circuit board 40 and second circuit board 50 is carried out in 110,
Radiating block 60 is lifted in pouring basin 110 followed by the second flap seat 13 and is poured back lining materials in pouring basin 110 and is formed
Backing 20.On the one hand, first circuit board 40 and second circuit board 50 are lifted on by the first flap seat 12 is poured pouring for seat 11
This mode in note slot 110 be able to maintain first circuit board 40 and second circuit board 50 and lamination 30 piezoelectricity array element module it
Between relative position, substantially reduce the difficulty of welding；On the other hand, lamination 30, first circuit board 40, second circuit board 50, dissipate
Heat block 60, which is poured integral this mode by backing 20, can either absorb ultrasonic energy with degrading radiation, and can add
The firm welding of the pad of the strong piezoelectricity array element module of lamination 30 and the pad of first circuit board 40 and second circuit board 50.It adopts
It can reduce the piezoelectricity array element module of lamination 30 and the weldering of first circuit board 40 with the convex configuration ultrasonic transducer manufacturing method
The welding difficulty of the pad of disk and second circuit board 50, advantageously ensures that firm welding.
As shown in connection with fig. 1, it provides in one embodiment a kind of applied to above-mentioned convex configuration ultrasonic transducer manufacturer
The convex configuration ultrasonic transducer manufacturing equipment of method, including casting mold 10.
In conjunction with shown in Fig. 2-Fig. 3, the casting mold 10 includes casting seat 11, the first flap seat 12 and the second flap seat 13.Institute
It states casting seat 11 and is equipped with pouring basin 110, the pouring basin 110 is poured for backing 20.Be additionally provided on the pouring basin 110 with
The setting slot 111a that the pouring basin 110 is connected to, the setting slot 111a, which is used to install for lamination 30 and be bent lamination 30, to be determined
Shape.First flap seat 12 is installed for power circuit board and second circuit board 50 and is lifted on circuit board and second circuit board 50
In the pouring basin 110.Second flap seat 13 is used to install for radiating block 60 and radiating block 60 is lifted on the pouring basin
In 110.
When using above-mentioned convex configuration ultrasonic transducer manufacturing equipment, lamination 30 is mounted on first real in setting slot 111a
The bending setting of existing lamination 30, is then lifted on pouring basin for first circuit board 40 and second circuit board 50 using the first flap seat 12
The welding of the pad of the piezoelectricity array element module of lamination 30 and the pad of first circuit board 40 and second circuit board 50 is carried out in 110,
Radiating block 60 is lifted in pouring basin 110 followed by the second flap seat 13 and is poured back lining materials in pouring basin 110 and is formed
Backing 20.On the one hand, first circuit board 40 and second circuit board 50 are lifted on by the first flap seat 12 is poured pouring for seat 11
This mode in note slot 110 be able to maintain first circuit board 40 and second circuit board 50 and lamination 30 piezoelectricity array element module it
Between relative position, substantially reduce the difficulty of welding；On the other hand, lamination 30, first circuit board 40, second circuit board 50, dissipate
Heat block 60, which is poured integral this mode by backing 20, can either absorb ultrasonic energy with degrading radiation, and can add
The firm welding of the pad of the strong piezoelectricity array element module of lamination 30 and the pad of first circuit board 40 and second circuit board 50.It adopts
It can reduce the piezoelectricity array element module of lamination 30 and the weldering of first circuit board 40 with the convex configuration ultrasonic transducer manufacturing equipment
The welding difficulty of the pad of disk and second circuit board 50, advantageously ensures that firm welding.
It should be noted that the shape of the setting slot 111a can be selected according to actual needs.In the present embodiment, institute
Stating setting slot 111a is arc groove, and but not limited to this.
As shown in connection with fig. 3, the casting seat 11 includes pedestal 111 and at least two blocks 112, and the setting slot 111a is set
It sets on the pedestal 111, at least two blocks 112 are arranged around the pedestal 111, and at least two blocks
112 are separately mounted to form the pouring basin 110 on the pedestal 111.Casting seat 11, which adopts a split structure, to be conducive to improve
The property easy for installation of all parts, at the same can be avoided influence lamination 30 bending setting and lamination 30 piezoelectricity array element module with
The weld job of the pad of the pad and second circuit board 50 of first circuit board 40.
It should be noted that the quantity of the block 112 can be selected according to actual needs.In the present embodiment, described
Block 112 is four, and four blocks 112 are respectively positive stop 112a, left block 112b, backstop 112c, right block
112d, the positive stop 112a, the left block 112b, the backstop 112c, the right block 112d are separately mounted to institute
It states and forms the pouring basin 110 on pedestal 111, but not limited to this.
As shown in connection with fig. 3, at least two blocks 112 are detachably connected with the pedestal 111 respectively.So both it had been convenient for
It removes and completes the semi-finished product that backing 20 is poured, and be convenient for the reuse of casting mold 10.
It should be noted that the mode that the block 112 is detachably connected with the pedestal 111 can be according to actual needs
It selects.In the present embodiment, the positive stop 112a is detachably connected by screw with the pedestal 111, the left block
112b is detachably connected by screw with the pedestal 111, and the backstop 112c is detachable by screw and the pedestal 111
Connection, the right block 112d are detachably connected by screw with the pedestal 111, and but not limited to this.
As shown in connection with fig. 2, first flap seat 12 is mounted on the casting seat 11.First flap seat 12 is mounted on casting seat
It can be improved the structural compactness of casting mold 10 on 11, while guaranteeing that the lifting of first circuit board 40 and second circuit board 50 is steady
It is qualitative.
As shown in connection with fig. 3, first flap seat 12 is detachably connected with the casting seat 11.So both it is convenient for removing completion
The semi-finished product that backing 20 is poured, and it is convenient for the reuse of casting mold 10.
It should be noted that the mode that first flap seat 12 is detachably connected with the casting seat 11 can be according to reality
It needs to select.In the present embodiment, first flap seat 12 is detachably connected by screw and the right block 112d, but not with
This is limited.
As shown in connection with fig. 2, first flap seat 12 is equipped with for for first circuit board 40 and the installation of second circuit board 50
The first mounting structure 120.First circuit board 40 and second circuit board 50 first is mounted on using the first mounting structure 120 to hang
On seat 12, facilitate the installation of first circuit board 40 and second circuit board 50.
It should be noted that the form of first mounting structure 120 can be selected according to actual needs.In the present embodiment
In, first mounting structure 120 is the multiple mounting posts being arranged on first flap seat 12, and multiple mounting posts are used for
It is threaded through in the mounting hole of first circuit board 40 or second circuit board 50, install convenient, but not limited to this.
As shown in connection with fig. 2, second flap seat 13 is mounted on the casting seat 11.Second flap seat 13 is mounted on casting seat
It can be improved the structural compactness of casting mold 10 on 11, while guaranteeing the lifting stability of radiating block 60.
As shown in connection with fig. 3, second flap seat 13 is detachably connected with the casting seat 11.So both it is convenient for removing completion
The semi-finished product that backing 20 is poured, and it is convenient for the reuse of casting mold 10.
It should be noted that the mode that second flap seat 13 is detachably connected with the casting seat 11 can be according to reality
It needs to select.In the present embodiment, one end of second flap seat 13 is detachably connected by screw and the left block 112b,
The other end of second flap seat 13 is detachably connected by screw and the right block 112d, and but not limited to this.
As shown in connection with fig. 2, second flap seat 13 is equipped with the second mounting structure 130 for installing for radiating block 60.
Radiating block 60 is mounted on the second flap seat 13 using the second mounting structure 130, facilitates the installation of radiating block 60.
It should be noted that the form of second mounting structure 130 can be selected according to actual needs.In the present embodiment
In, second mounting structure 130 is the screw being arranged on second flap seat 13, and the screw is used for and 60 spiral shell of radiating block
Line connection, install convenient, but not limited to this.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned
The all possible combination of each technical characteristic in embodiment is all described, as long as however, the combination of these technical characteristics not
There are contradictions, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of convex configuration ultrasonic transducer manufacturing method, which comprises the following steps:
Convex configuration ultrasonic transducer manufacturing equipment is provided, the convex configuration ultrasonic transducer manufacturing equipment includes casting moulds
Tool, the casting mold include casting seat, the first flap seat and the second flap seat, and the casting seat is equipped with pouring basin, the casting
The setting slot being connected to the pouring basin is additionally provided on slot；
Lamination is mounted in the setting slot of casting seat and is bent lamination and is shaped；
First circuit board and second circuit board are mounted on the first flap seat and are lifted on first circuit board and second circuit board
It is poured in the pouring basin of seat；
The piezoelectricity array element module of lamination is welded on the pad of first circuit board and the pad of second circuit board；
Radiating block is mounted on the second flap seat and is lifted on radiating block in the pouring basin of casting seat；
Casting back lining materials form backing in the pouring basin of casting seat.
2. convex configuration ultrasonic transducer manufacturing method according to claim 1, which is characterized in that the pressure by lamination
Electric array element module is welded on the pad of first circuit board and the pad of second circuit board, specifically includes the following steps:
The piezoelectricity array element module of lamination is passed through into the pad solder of the pad and second circuit board of lead and first circuit board.
3. a kind of convex configuration ultrasonic wave applied to convex configuration ultrasonic transducer manufacturing method as claimed in claim 1 or 2
Energy converter manufacturing equipment, which is characterized in that including casting mold, the casting mold includes casting seat, the first flap seat and second
Flap seat, the casting seat are equipped with pouring basin, and the pouring basin is poured for backing, are additionally provided on the pouring basin and pour with described
The setting slot of slot connection is infused, the setting slot is used to install for lamination and be bent lamination and shape, and first flap seat is for supplying
Circuit board and second circuit board are installed and circuit board and second circuit board are lifted in the pouring basin, and second flap seat is used
In for radiating block install and radiating block is lifted in the pouring basin.
4. convex configuration ultrasonic transducer manufacturing equipment according to claim 3, which is characterized in that the casting seat includes
Pedestal and at least two blocks, on the base, at least two blocks are set around the pedestal for the setting slot setting
It sets, and at least two blocks are separately mounted to form the pouring basin on the pedestal.
5. convex configuration ultrasonic transducer manufacturing equipment according to claim 4, which is characterized in that at least two gears
Block is detachably connected with the base respectively.
6. convex configuration ultrasonic transducer manufacturing equipment according to claim 1, which is characterized in that the first flap seat peace
On the casting seat, second flap seat is mounted on the casting seat.
7. convex configuration ultrasonic transducer manufacturing equipment according to claim 1-6, which is characterized in that described
One flap seat is equipped with for the first mounting structure for first circuit board and second circuit board installation.
8. convex configuration ultrasonic transducer manufacturing equipment according to claim 7, which is characterized in that the first installation knot
Structure is the multiple mounting posts being arranged on first flap seat, and multiple mounting posts are for being threaded through first circuit board or second
In the mounting hole of circuit board.
9. convex configuration ultrasonic transducer manufacturing equipment according to claim 1-6, which is characterized in that described
Two flap seats are equipped with the second mounting structure for installing for radiating block.
10. convex configuration ultrasonic transducer manufacturing equipment according to claim 9, which is characterized in that second installation
Structure is the screw being arranged on second flap seat, and the screw with radiating block for being threadedly coupled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811621626.9A CN109719279B (en) | 2018-12-28 | 2018-12-28 | Convex array type ultrasonic transducer manufacturing method and equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811621626.9A CN109719279B (en) | 2018-12-28 | 2018-12-28 | Convex array type ultrasonic transducer manufacturing method and equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109719279A true CN109719279A (en) | 2019-05-07 |
| CN109719279B CN109719279B (en) | 2021-04-27 |
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ID=66297447
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811621626.9A Active CN109719279B (en) | 2018-12-28 | 2018-12-28 | Convex array type ultrasonic transducer manufacturing method and equipment |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101569536A (en) * | 2008-04-29 | 2009-11-04 | 上海爱培克电子科技有限公司 | Manufacturing method of ultrasonic transducer |
| CN105686849A (en) * | 2016-01-14 | 2016-06-22 | 中国科学院深圳先进技术研究院 | Ultrasonic probe backing forming device, tool and manufacture method |
| CN106137250A (en) * | 2016-07-15 | 2016-11-23 | 深圳先进技术研究院 | Make tool and the manufacture method of ultrasonic transducer of curved surface battle array ultrasonic transducer |
| CN209599698U (en) * | 2018-12-28 | 2019-11-08 | 广州瑞派医疗器械有限责任公司 | Convex configuration ultrasonic transducer manufacturing equipment |
-
2018
- 2018-12-28 CN CN201811621626.9A patent/CN109719279B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101569536A (en) * | 2008-04-29 | 2009-11-04 | 上海爱培克电子科技有限公司 | Manufacturing method of ultrasonic transducer |
| CN105686849A (en) * | 2016-01-14 | 2016-06-22 | 中国科学院深圳先进技术研究院 | Ultrasonic probe backing forming device, tool and manufacture method |
| CN106137250A (en) * | 2016-07-15 | 2016-11-23 | 深圳先进技术研究院 | Make tool and the manufacture method of ultrasonic transducer of curved surface battle array ultrasonic transducer |
| CN209599698U (en) * | 2018-12-28 | 2019-11-08 | 广州瑞派医疗器械有限责任公司 | Convex configuration ultrasonic transducer manufacturing equipment |
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| Publication number | Publication date |
|---|---|
| CN109719279B (en) | 2021-04-27 |
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