CN109713483B - Microwave vertical interconnecting assembly - Google Patents
Microwave vertical interconnecting assembly Download PDFInfo
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- CN109713483B CN109713483B CN201910111256.2A CN201910111256A CN109713483B CN 109713483 B CN109713483 B CN 109713483B CN 201910111256 A CN201910111256 A CN 201910111256A CN 109713483 B CN109713483 B CN 109713483B
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- layer
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- circuit board
- dielectric body
- elastomer
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- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 4
- 239000004020 conductor Substances 0.000 claims description 51
- 229920001971 elastomer Polymers 0.000 claims description 29
- 239000000806 elastomer Substances 0.000 claims description 29
- 239000002131 composite material Substances 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Abstract
The invention provides a microwave vertical interconnecting component, which comprises an antenna layer, a signal receiving and transmitting layer, a circuit board layer, a structure assembly layer and a circulator layer which are arranged in a stacked manner from top to bottom; wherein the lower surface of the antenna layer is provided with a plurality of first connectors for transmitting microwave signals; the signal receiving and transmitting layer is provided with a plurality of second connectors used for transmitting microwave signals and penetrating through the layer, and the first ends of the second connectors are spliced with the first connectors through an adapter; the signal terminal on the upper surface of the circuit board layer is connected with the second end of the second connector; the upper surface of the structure assembly layer is riveted with the lower surface of the circuit board and used for reinforcing the circuit board layer, the structure assembly layer is provided with a plurality of medium assembly pieces which are used for transmitting microwave signals and penetrate through the layer, and the first end of each medium assembly piece is connected with a signal terminal on the lower surface of the circuit board layer; the upper surface of the circulator layer is connected to a second end of the media pack.
Description
Technical Field
The invention relates to the field of microwave radars, in particular to a microwave vertical interconnection component.
Background
The microwave component is one of key components in the active phased array radar, and functions of power amplification, low-noise amplification, frequency conversion and the like of radar microwave signals are realized through a microwave device arranged in the box body. With the development of radar technology and microwave integrated circuit technology, the requirements on the size thereof are further increased.
The existing microwave assembly mainly adopts a cable connection or welding mode to realize interconnection between each module and each unit. In the radio frequency microwave assembly, because more signal channels are arranged, all the components are connected by adopting cables, so that the whole structure of the assembly is larger, and more space is occupied. And thus the problems of high difficulty in the processing process, easy damage to electronic devices and the like are brought.
Disclosure of Invention
In view of the above, the present invention provides a microwave vertical interconnection assembly, which includes an antenna layer, a signal transceiver layer, a circuit board layer, a structural assembly layer and a circulator layer, which are stacked from top to bottom; wherein the method comprises the steps of
The lower surface of the antenna layer is provided with a plurality of first connectors for transmitting microwave signals;
the signal receiving and transmitting layer is provided with a plurality of second connectors used for transmitting microwave signals and penetrating through the layer, and the first ends of the second connectors are spliced with the first connectors through an adapter;
the signal terminal on the upper surface of the circuit board layer is connected with the second end of the second connector;
the upper surface of the structure assembly layer is riveted with the lower surface of the circuit board and used for reinforcing the circuit board layer, the structure assembly layer is provided with a plurality of medium assembly pieces which are used for transmitting microwave signals and penetrate through the layer, and the first end of each medium assembly piece is connected with a signal terminal on the lower surface of the circuit board layer;
the upper surface of the circulator layer is connected to a second end of the media pack.
Optionally, the first connector includes an inner conductor, an outer conductor, and a dielectric body, wherein the outer conductor serves as a mount for connecting the lower surface of the antenna layer.
Optionally, the second connector includes an inner conductor, an outer conductor and a dielectric body, wherein the inner conductor is in a pin shape, and a first end of the inner conductor is used as a pin connected with the adapter; the outer conductor is sleeve-shaped and surrounds the inner conductor, and the medium body is arranged between the inner conductor and the outer conductor.
Optionally, the adaptor includes an inner conductor, an outer conductor and a dielectric body, wherein the inner conductor is in a jack shape, a first end of the inner conductor is plugged with the inner conductor of the first connector, and a second end of the inner conductor is plugged with the first end of the inner conductor of the second connector.
Optionally, the second end of the inner conductor of the second connector is an elastic button, and extends out from the surface of the signal receiving and transmitting layer, and is elastically pressed against the signal terminal on the upper surface of the circuit board layer.
Optionally, the surface of the elastic hair button is gold-plated.
Optionally, the structural assembly layer is further provided with a plurality of first shielding rings and a plurality of second shielding rings, wherein the first shielding rings are disposed on the upper surface and the second shielding rings are disposed on the lower surface.
Optionally, the first end of the media pack comprises:
the columnar dielectric body is internally provided with a through hole, a first elastomer is filled in the columnar dielectric body, and a second elastomer is filled in a gap between the outer ring of the columnar dielectric body and the structural member;
a contact cap disposed in the through hole, in contact with the first elastomer, and at least partially protruding from the surface of the structural composite layer;
a metal sleeve surrounding the columnar dielectric body and in contact with the second elastomer, and at least partially protruding from the surface of the structural composite layer.
Optionally, the second end of the media pack comprises:
the columnar dielectric body is internally provided with a through hole, a first elastomer is filled in the columnar dielectric body, and a second elastomer is filled in a gap between the outer ring of the columnar dielectric body and the structural member;
a contact cap disposed in the through hole, in contact with the first elastomer, and at least partially protruding from the surface of the structural composite layer;
a metal sleeve surrounding the columnar dielectric body and in contact with the second elastomer, and at least partially protruding from the surface of the structural composite layer.
Optionally, a plurality of sockets are provided on the upper surface of the circulator layer and connected with the contact cap.
According to the microwave vertical interconnection component provided by the invention, the antenna layer and the signal receiving and transmitting layer which are vertically interconnected are connected with each other through the connector and the adapter, the connection mode can improve the matching tolerance of the antenna layer and the signal receiving and transmitting layer, the antenna component and the receiving and transmitting component are protected during assembly, and the stress of the antenna layer and the signal receiving and transmitting layer can be reduced after assembly; the signal receiving and transmitting layers which are vertically interconnected are connected with the circuit board layer through the contact type connector, so that the welding-free connection between the signal receiving and transmitting layers and the circuit board layer is realized, and the effect of protecting components of the circuit board is achieved; the structural composite layer therein serves to strengthen the circuit board and in which the dielectric composite is disposed, and serves to vertically connect the circuit board layer and the circulator layer in series. According to the structure, the thickness of each part can be set to be thinner, the whole assembly is miniaturized, the stress of each part is effectively reduced, the assembly is not easy to damage, and the reliability is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a microwave vertical interconnect assembly according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a first connector according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of a second connector according to an embodiment of the present invention;
FIG. 4 is a schematic view of an adapter according to an embodiment of the present invention;
FIG. 5 is a schematic view of a structural composite layer according to an embodiment of the present invention;
FIG. 6 is a cross-sectional view of a media pack in accordance with an embodiment of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, or can be communicated inside the two components, or can be connected wirelessly or in a wired way. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In addition, the technical features of the different embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
The embodiment of the invention provides a microwave vertical interconnection component which can be used as a small antenna unit in a phased array radar. As shown in fig. 1, the assembly includes an antenna layer 1, a signal transmitting and receiving layer 2, a circuit board layer 3, a structural assembly layer 4 and a circulator layer 5, which are stacked from top to bottom, and are electrically connected to each other to transmit microwave signals in a vertical direction. In the embodiment of the invention, the components forming the microwave assembly are all in the shape of thin plates, and the thicknesses of the components are in millimeter level.
The uppermost antenna layer 1 includes an antenna housing and an SMP (radio frequency) connector (first connector 11), and the first connector 11 is provided on the lower surface of the antenna layer 1 for transmitting microwave signals. Specifically, the first connector 11 serves as a mechanical connection member and an electrical connection member for connecting the signal transmitting-receiving layer 2. The antenna layer 1 may transmit signals to the signal transmitting/receiving layer 2 through the first connector 11, and may receive signals transmitted from the signal transmitting/receiving layer 2 through the first connector 11.
The signal transceiver layer 2, i.e. the T/R (Transmitter and Receiver, transmit and receive) component layer, has its upper surface connected to the lower surface of the antenna layer 1 and its lower surface connected to the upper surface of the circuit board layer 3, and is used for amplifying, phase shifting and attenuating signals transmitted by the antenna layer 1 and the circuit board layer 3. The signal transmitting and receiving layer 2 is provided with a plurality of second connectors 21 for transmitting microwave signals and penetrating the layer, and a first end (upper end) of the second connectors 21 is plugged with the first connectors 11 through the adapter 20. Specifically, in the present embodiment, the connection ends of the first connector 11 and the second connector 21 are sockets, and the adapter 20 is a bidirectional plug; in other embodiments, the connection ends of the first connector 11 and the second connector 21 may be plugs, and the adapter 20 is a bidirectional socket. They may be limit sockets or plugs, semi-limit sockets or plugs, locking sockets or plugs, etc.
A circuit board layer 3 for generating, receiving and processing microwave signals, the upper surface of which is connected with the signal receiving and transmitting layer 2 and the lower surface of which is connected with the structural assembly layer 4. Specifically, pads are provided at the substrate edges of the circuit board layer 3, through which the fixed connection with the upper and lower layers is achieved. While the signal terminals on the upper surface of the circuit board layer 3 are connected to the second ends (lower ends) of the second connectors 21 in such a manner that they are solder-free.
The upper surface of the structural composite layer 4 is riveted to the lower surface of the circuit board layer 3 for reinforcing the circuit board layer 3. The structure assembly layer 4 is provided with a plurality of dielectric assemblies 41 which are used for transmitting microwave signals and penetrate through the layer, the dielectric assemblies 41 are used as components of the serial circuit board layer 3 and the circulator layer 5, and the first ends of the dielectric assemblies 41 are connected with signal terminals on the lower surface of the circuit board layer 3;
the circulator layer 5 is provided at the bottom layer as a device for unidirectional annular transmission of electromagnetic waves. The upper surface of the dielectric body is connected with the lower surface of the structural assembly layer 4, wherein the signal terminals are connected with the second end of the dielectric body assembly 41 in a welding-free connection mode.
According to the microwave vertical interconnection component provided by the embodiment of the invention, the antenna layer 1 and the signal receiving and transmitting layer 2 which are vertically interconnected are connected with each other through the connector and the adapter 20, the connection mode can improve the matching tolerance of the antenna layer 1 and the signal receiving and transmitting layer, the antenna component and the receiving and transmitting component can be protected during assembly, and the stress of the antenna layer 1 and the signal receiving and transmitting layer can be reduced after assembly; the signal receiving and transmitting layer 2 and the circuit board layer 3 which are vertically interconnected are connected through a contact connector, so that the welding-free connection between the two layers is realized, and the effect of protecting components of the circuit board can be achieved; the structural composite layer 4 therein serves to strengthen the circuit board and the dielectric composite 41 is provided therein, and serves to vertically connect the circuit board layer 3 and the circulator layer 5 in series. According to the structure, the thickness of each part can be set to be thinner, the whole assembly is miniaturized, the stress of each part is effectively reduced, the assembly is not easy to damage, and the reliability is improved.
In a preferred embodiment, as shown in fig. 2, the first connector 11 includes an inner conductor 111, an outer conductor 112, and a dielectric body 113, wherein the outer conductor 112 serves as a mount for connecting the lower surface of the antenna layer 1.
In a preferred embodiment, as shown in fig. 3, the second connector 21 includes an inner conductor 211, an outer conductor 222 and a dielectric body, wherein the inner conductor 221 is pin-shaped, and a first end of the inner conductor 221 serves as a pin connected to the adapter 20; the outer conductor 222 has a sleeve shape surrounding the inner conductor 221, and a dielectric body is provided between the inner conductor 221 and the outer conductor 222.
As shown in fig. 4, the adaptor 20 includes an inner conductor 201, an outer conductor 202 and a dielectric body, wherein the inner conductor 201 has a jack shape, a first end of which is plugged with the first connector 11, and a second end of which is plugged with the second connector 21.
The second end of the inner conductor of the second connector 21 is an elastic button, which protrudes from the surface of the signal receiving-transmitting layer 2, and elastically presses the signal terminal on the upper surface of the circuit board layer 3, wherein the surface of the elastic button is gold-plated. This preferred structure can improve the reliability of the electrical connection between the signal-receiving-transmitting layer 2 and the circuit-board layer 3.
In a preferred embodiment, as shown in fig. 5, the two sides of the structural composite layer 4 are each provided with a plurality of shielding rings 42. The arrangement mode of partition shielding is adopted for avoiding interference of other signals on the local signal.
In a preferred embodiment, as shown in fig. 6, the first end (upper end) of the media pack 41 includes:
the columnar dielectric body 411 is internally provided with a through hole, is filled with a first elastomer (button hair), and is filled with a second elastomer (button hair) in a gap between the outer ring of the columnar dielectric body and the structural member;
a contact cap 412 disposed in the through hole, in contact with the first elastomer, and at least partially protruding from the surface of the structural composite layer 4;
a metal sleeve 413, surrounding the cylindrical dielectric body, is in contact with the second elastomer and extends at least partially beyond the surface of the structural composite layer 4.
The elastomer in the preferred embodiment described above provides axial tolerance, radial tolerance and angular tolerance for the connection between the circuit board layer 3 and the structural composite layer 4, improving the reliability of the connection relationship between the two, while protecting the vertically interconnected components from tearing as a cushioning component.
The second end (lower end) of the dielectric body 41 includes:
the columnar dielectric body 411 is internally provided with a through hole, is filled with a first elastomer (button hair), and is filled with a second elastomer (button hair) in a gap between the outer ring of the columnar dielectric body and the structural member;
a contact cap 412 disposed in the through hole, in contact with the first elastomer, and at least partially protruding from the surface of the structural composite layer 4;
a metal sleeve 413, surrounding the cylindrical dielectric body, is in contact with the second elastomer and extends at least partially beyond the surface of the structural composite layer 4.
The upper surface of the circulator layer 5 is provided with a plurality of sockets connected to the contact cap 412.
The elastomer in the preferred embodiment described above provides axial, radial and angular tolerances for the connection between the circulator layer 5 and the structural composite layer 4, improving the reliability of the connection relationship between the two, while protecting the vertically interconnected components from tearing as a cushioning component.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.
Claims (4)
1. A microwave vertical interconnection component, which is characterized by comprising an antenna layer, a signal receiving and transmitting layer, a circuit board layer, a structural assembly layer and a circulator layer which are arranged from top to bottom in a stacking manner; wherein the method comprises the steps of
The lower surface of the antenna layer is provided with a plurality of first connectors for transmitting microwave signals, and the first connectors are SMP connectors;
the signal receiving and transmitting layer is provided with a plurality of second connectors used for transmitting microwave signals and penetrating through the layer, and the first ends of the second connectors are spliced with the first connectors through an adapter; the second connector comprises an inner conductor, an outer conductor and a dielectric body, wherein the inner conductor of the second connector is in a pin shape, and the first end of the inner conductor of the second connector is used as a pin connected with an adapter of the second connector; the outer conductor is sleeve-shaped and surrounds the inner conductor of the second connector, and the dielectric body of the second connector is arranged between the inner conductor of the second connector and the outer conductor of the second connector; the second end of the inner conductor of the second connector is an elastic button hair which extends out of the surface of the signal receiving and transmitting layer and is elastically pressed against the signal terminal on the upper surface of the circuit board layer;
the signal terminal on the upper surface of the circuit board layer is connected with the second end of the second connector;
the upper surface of the structure assembly layer is riveted with the lower surface of the circuit board and used for reinforcing the circuit board layer, the structure assembly layer is provided with a plurality of medium assembly pieces which are used for transmitting microwave signals and penetrate through the layer, and the first end of each medium assembly piece is connected with a signal terminal on the lower surface of the circuit board layer;
the signal terminal on the upper surface of the circulator layer is in welding-free connection with the second end of the medium body assembly;
the edge of the circuit board layer is provided with a bonding pad, the bonding pad is used for realizing the fixed connection with the signal receiving and transmitting layer, and the signal terminal on the upper surface of the circuit board layer is connected with the second end of the second connector without welding;
the antenna layer and the signal receiving and transmitting layer which are vertically interconnected are connected with each other through the first connector, the second connector and the adapter, so that the matching tolerance of the antenna layer and the signal receiving and transmitting layer is improved;
the structure assembly layer is also provided with a plurality of first shielding rings and a plurality of second shielding rings, wherein the first shielding rings are arranged on the upper surface, and the second shielding rings are arranged on the lower surface;
the first end of the media pack includes:
the first columnar dielectric body is internally provided with a through hole, a first elastomer is filled in the first columnar dielectric body, a second elastomer is filled in a gap between the outer ring of the first columnar dielectric body and the structural assembly layer, and the first elastomer and the second elastomer are both button bristles;
a first contact cap disposed in the through hole in contact with the first elastomer, and at least partially protruding from the structural composite layer surface;
a first metal sleeve surrounding the first columnar dielectric body and in contact with the second elastomer, the first metal sleeve at least partially extending beyond the surface of the structural composite layer;
the first and second elastomers provide axial tolerance, radial tolerance, and angular tolerance for the connection between the circuit board layer and the structural composite layer;
the second end of the media pack includes:
the second cylindrical dielectric body is internally provided with a through hole, a third elastomer is filled in the second cylindrical dielectric body, and a fourth elastomer is filled in a gap between the outer ring of the second cylindrical dielectric body and the structural assembly layer;
a second contact cap disposed in the through hole in contact with the third elastomer, and extending at least partially beyond the structural composite layer surface;
a second metal sleeve surrounding the columnar dielectric body and in contact with the fourth elastomer, and extending at least partially out of the surface of the structural composite layer;
the upper surface of the circulator layer is provided with a plurality of sockets which are connected with the second contact cap.
2. The microwave vertical interconnect assembly of claim 1 wherein the first connector includes an inner conductor, an outer conductor, and a dielectric body, wherein the outer conductor of the first connector acts as a mount for connecting a lower surface of the antenna layer.
3. The microwave vertical interconnect assembly of claim 1 or 2, wherein the adapter includes an inner conductor, an outer conductor, and a dielectric body, wherein the inner conductor of the adapter is in the shape of a socket having a first end that mates with the inner conductor of the first connector and a second end that mates with the first end of the inner conductor of the second connector.
4. The microwave vertical interconnect assembly according to claim 1 wherein the elastomeric button surface is gold plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910111256.2A CN109713483B (en) | 2019-02-12 | 2019-02-12 | Microwave vertical interconnecting assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910111256.2A CN109713483B (en) | 2019-02-12 | 2019-02-12 | Microwave vertical interconnecting assembly |
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| CN109713483A CN109713483A (en) | 2019-05-03 |
| CN109713483B true CN109713483B (en) | 2023-10-31 |
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| CN201910111256.2A Active CN109713483B (en) | 2019-02-12 | 2019-02-12 | Microwave vertical interconnecting assembly |
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| CN111509432B (en) * | 2020-04-23 | 2021-03-23 | 中航光电科技股份有限公司 | A kind of interface unit |
| CN112180352A (en) * | 2020-08-24 | 2021-01-05 | 西安空间无线电技术研究所 | High-integration-level comprehensive radio frequency sensing array system |
| CN113161787B (en) * | 2021-03-15 | 2022-08-09 | 上海航天科工电器研究院有限公司 | Double-floating hair button coaxial sealing connector |
| CN113506983B (en) * | 2021-05-25 | 2023-05-05 | 中国电子科技集团公司第二十九研究所 | Interconnection structure and interconnection method of antenna and front end assembly |
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| CN109713483A (en) | 2019-05-03 |
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