CN109712908B - Electrostatic chuck maintenance device and method for vacuum treatment device - Google Patents
Electrostatic chuck maintenance device and method for vacuum treatment device Download PDFInfo
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- CN109712908B CN109712908B CN201711026362.8A CN201711026362A CN109712908B CN 109712908 B CN109712908 B CN 109712908B CN 201711026362 A CN201711026362 A CN 201711026362A CN 109712908 B CN109712908 B CN 109712908B
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Abstract
The present invention provides an electrostatic chuck maintenance tool for a vacuum processing apparatus, comprising: the upper surface of the support base plate is fixed with a rotating base and a connecting rod, the connecting rod comprises a first end connected to a pressure rod, a second end connected to the rotating base, so that the rotating arm does circular motion around the rotating base, the lower end of the pressure rod comprises a friction head, the bottom surface of the friction head comprises a friction plate, the friction plate does circular motion around the outer edge of the support base plate, and the circular motion can cover the sealing ring on the upper surface of the electrostatic chuck.
Description
Technical Field
The invention relates to the technical field of semiconductor processing, in particular to a maintenance device and a maintenance method for an electrostatic chuck in a vacuum processing device.
Background
In order to fix the substrate 30 to be processed, an electrostatic chuck is disposed in a lower space of the vacuum processing chamber, and a high voltage direct current is connected to an electrode in the electrostatic chuck, so that an electrostatic attraction force is generated to firmly attach the substrate on the electrostatic chuck to the electrostatic chuck. Figure 1 is a schematic diagram of a typical electrostatic chuck configuration in which the vacuum processing chamber includes a substrate carrier comprising a conductive base 10 and an electrostatic chuck positioned on the conductive base. Wherein the electrically conductive base is typically made of aluminum and a plurality of heat exchange tubes are disposed therein to allow a volume of coolant to flow through the heat exchange tubes to control the temperature of the electrically conductive base. The electrostatic chuck comprises a bottom insulating layer 20, a top insulating layer 23, and an electrode layer 21 located between the two insulating layers, typically made of alumina or aluminum nitride, and the electrode layer is typically made of tungsten or molybdenum. The base 10 is connected to an external radio frequency power supply through a cable, and a through hole penetrating through the upper and lower surfaces of the base is formed in the base 10, and an insulating pipe is arranged in the through hole and is provided with a conductive element 131 connected between a high voltage direct current power supply (HV) and the electrode layer 21.
In order to control the temperature of the substrate 30, a cooling gas such as helium is introduced between the upper surface of the electrostatic chuck and the bottom surface of the substrate 30, and to prevent the helium from leaking at the edge of the electrostatic chuck, a raised sealing ring 23a is further included at the edge of the electrostatic chuck, the thickness of the material layer of the sealing ring 23a protruding from the upper surface of the electrostatic chuck is about 3 μm, and the transverse width of the sealing ring is about 2-4 mm.
Generally, the electrostatic chuck is made of alumina or aluminum nitride, which can avoid being corroded by plasma and respective corrosive reaction gases, but inevitably, ceramic materials for manufacturing the electrostatic chuck can be mixed with various impurities (such as silicon), and during the long-term operation of the electrostatic chuck, the trace impurities such as silicon are corroded, which has no serious influence on most functions of the electrostatic chuck, but at the upper surface of the sealing ring 23a, the uneven surface formed by the trace corrosion can cause helium to leak from the sealing ring 23a to the vacuum processing device. The leakage of helium affects the gas composition in the edge region of the substrate, and also affects the temperature reduction of the substrate, and affects the subsequent desorption process of the substrate from the electrostatic chuck, so it is desirable to avoid the leakage. In order to maintain the electrostatic chuck, the prior art manually grinds the surface of the sealing ring 23a with sand paper, but due to the difference between habits and experiences of workers, the maintenance effect of this method is unstable, and the whole electrostatic chuck is taken out of the vacuum treatment device and treated by a refurbishing process, but this refurbishing process is not only expensive, but also difficult to treat separately because the material thickness difference of the surface of the electrostatic chuck is very small (3 μm), the width of the sealing ring 23a is also very narrow, so that the central surface of the electrostatic chuck and the two areas of the sealing ring are both ground downwards at the same time, and the final grinding amount can reach about 9 μm. Although the surface roughness of each part of the electrostatic chuck treated by the refurbishing process can meet the requirement, the actual microstructure of the surface material is changed, which causes the difference between the actual microstructure and the actual microstructure of the electrostatic chuck before refurbishing when the electrostatic chuck is used again, and finally causes the treatment effect to be greatly deviated, and the electrostatic chuck is scrapped due to the excessive deviation.
Therefore, a new maintenance tool for the electrostatic chuck is needed to be developed in the industry, the maintenance of the electrostatic chuck can be realized in the vacuum treatment device, only the upper surface of the sealing ring is ground flat, helium leakage is reduced, meanwhile, the maintained precision chuck can still keep original parameters, and the long-term stability and non-deviation of the plasma treatment effect are ensured.
Disclosure of Invention
The invention discloses an electrostatic chuck maintenance tool for a vacuum processing apparatus, comprising: the electrostatic chuck comprises a support base plate, a rotary base and a rotary arm, wherein the lower surface of the support base plate is used for being placed on the upper surface of the electrostatic chuck, the upper surface of the support base plate is fixedly provided with the rotary base, the rotary arm comprises a first end connected to the rotary base so that the rotary arm can make circular motion around the rotary base, and the second end of the rotary arm is connected to a pressure rod; the lower end of the pressure rod comprises a friction head, the bottom surface of the friction head comprises a friction plate, the friction plate does circular motion around the outer edge of the supporting bottom plate, and the circular motion can cover a sealing ring on the upper surface of the electrostatic chuck.
The rotating base is a rotating shaft and a rotating bearing positioned on the outer side wall of the rotating shaft, and the first end of the rotating arm is connected to the rotating bearing. The rotating base may also include a circular support wall, and a circular track located outside the support wall, wherein the first end of the rotating arm is connected to the circular track.
Wherein, the top of the pressure rod may include a weight to provide a predetermined downward pressure. The pressure rod may be further sleeved with a spring, one end of the spring is fixed to the friction head, and the other end of the spring is fixed to the pressure rod or the connecting rod.
The friction head is provided with a first inclined side wall on the inner side, the support bottom plate is provided with a second inclined side wall on the outer side, and the first inclined side wall and the second inclined side wall are matched in shape. The friction head applies a downward pressure to the second inclined sidewall through the first inclined sidewall, and the second inclined sidewall generates a force in an opposite direction.
The invention also provides an electrostatic chuck maintenance method for the vacuum processing device, which comprises the following steps:
opening a top cover at the top of the vacuum processing device; placing the electrostatic chuck maintenance tool of claim 1 onto an electrostatic chuck within a vacuum processing apparatus; performing a polishing step to drive a friction plate on an electrostatic chuck maintenance tool to make a circular motion around the outer edge of the support base plate, wherein the circular motion can cover a sealing ring on the upper surface of the electrostatic chuck; and after the polishing step is finished, taking out the electrostatic chuck maintenance tool, and closing the top cover at the top of the vacuum processing device. Preferably, the polishing process reduces the seal ring thickness by less than 1 μm.
Wherein in the polishing step, the friction plate polishes the seal ring for more than 10 revolutions. And an environment recovery step is further included after the polishing of the sealing ring is finished, and at least 10 wafers are processed in the environment recovery step.
Drawings
FIG. 1 is a schematic view of a prior art electrostatic chuck and pedestal configuration;
FIG. 2 is a schematic diagram of an electrostatic chuck maintenance tool according to the present invention;
FIG. 3 is an enlarged fragmentary view within the dashed box X of FIG. 2;
FIG. 4 is a schematic view of another embodiment of an electrostatic chuck maintenance tool of the present invention;
FIG. 5 is a schematic view of another embodiment of an electrostatic chuck maintenance tool of the present invention;
FIG. 6a is a graph illustrating the roughness change of a seal ring after polishing of the seal ring using the electrostatic chuck service tool of the present invention;
fig. 6b is a graph showing the change in helium leakage measured after different number of polishing cycles of a seal ring using the electrostatic chuck service tool of the present invention.
Detailed Description
The following describes the embodiments of the present invention with reference to fig. 2 to 5.
An electrostatic chuck maintenance tool for a vacuum processing apparatus is disclosed. As shown in fig. 2, the inventive electrostatic chuck service tool 40 includes a support base plate 42, the support base plate 42 having a diameter that covers just the middle region of the electrostatic chuck while exposing the sealing ring 23a at the edge of the electrostatic chuck. A rotation shaft 43 is fixed at the center of the support base plate 42 and is fixed on the support base plate 42 in the vertical direction. The rotating shaft 43 is provided with a bearing 44, and a rotating portion of the bearing 44 is laterally extended by a rotating arm 46 and connected to a vertically disposed pressure rod 45. The pressure bar 45 includes a press P at the top, such as a weight of suitable weight, to provide optimal downward pressure. The pressure bar includes a friction head 47 beneath, and a friction pad 49, typically a piece of sandpaper, is secured to the underside of the friction head 47.
After the vacuum processing apparatus has been operated for a certain period of time, when the electrostatic chuck needs to be maintained, the top cover of the top of the vacuum processing apparatus is first opened, and then the electrostatic chuck maintenance tool 40 of the present invention is placed in the vacuum processing apparatus at a position such that the support base plate 42 covers the upper surface of the electrostatic chuck, which is not to be polished, while the upper surface of the seal ring 23a, which is to be surface-polished, is exposed. Then the rotating arm 46 is driven manually or mechanically, so that the rotating arm 46 rotates around the rotating shaft 43 as a circle center, the friction plate 49 fixed on the friction head 47 at the lower end of the pressure rod makes a circular motion along the upper surface of the sealing ring 23a at the edge of the electrostatic chuck, and the pressure device P at the top gives an optimal downward pressure to realize the friction polishing of the sealing ring.
Since the components such as the pressure rod 45, the rotating arm 46 and the rotating shaft 43 are mechanically deformed or vibrated during the rotation of the friction head 47, and these deformations or vibrations eventually cause the position of the friction plate 49 at the bottom of the friction head 47 to shift within a certain range, for the sealing ring 23a with a width of only 2-4mm, such a slight shift in the horizontal direction also causes unstable distribution of the friction polishing effect of the friction plate 49 on the entire sealing ring 23 a. In order to minimize the track fluctuations of the friction head 47 in the circumferential movement, the invention also proposes an improved construction. Fig. 3 is an enlarged view of the device in the broken line box X of the embodiment of the present invention shown in fig. 2, wherein the friction head 47 includes an inclined side surface 47a at the lower part of the inner side, and the corresponding support base 42 also includes an inclined outer side surface 42a, and the inclined side surface 47a and the side surface 42a are matched in shape, so that the side surfaces 47a and 42a abut against each other when the presser 47 makes a circular motion when downward pressure is provided by the presser bar 45. The friction head 47 is pressed downwards to press the side surface 47a to the outer side surface 42a of the support base plate 42, and the outer side surface 42a of the support base plate 42 provides acting forces with opposite directions, so that the friction head 47 is tightly attached to the outer side surface 42a and the position of the friction head 47 in the horizontal direction is stable, and finally, the friction plate 49 is uniformly pressed, and the upper surface of the sealing ring is uniformly polished. The object of the present invention can be achieved by a combination of the friction head 47 and the supporting base plate having the inclined surfaces corresponding thereto, in addition to the inclined surface shape shown in fig. 3, as long as the inner inclined surface of the friction head 47 provides an obliquely downward pressure to the outer inclined surface of the supporting base plate while the outer inclined surface of the supporting base plate provides a corresponding obliquely upward supporting force, and finally the horizontal forces are cancelled out by each other, and only a vertically downward partial pressure is transmitted to the friction plate 49, thereby performing the polishing operation of the seal ring 23 a.
In addition to the electrostatic chuck service tool configuration shown in fig. 2, the present invention provides another electrostatic chuck service tool embodiment as shown in fig. 4. As shown in fig. 4, the electrostatic chuck service tool 40' of the variant embodiment of the present invention also has the support base plate 42 but does not have the rotation shaft 43, and provides a cylindrical support wall 244 having the outer side wall with the circular rails 241a, 241b of the support wall 244. One connecting rod 246 is disposed between the circular rails 241a, 241b at one end and connected to the pressure rod 245 at the other end. A pressure spring 248 is also sleeved on the pressure rod 245 to provide a proper downward pressure. A friction head 47 is arranged below the pressure spring 248, and a friction plate 49 is arranged on the lower surface of the friction head 47. The pressure rod 245 also has a movable member inside it, which is vertically movable inside the pressure rod, fixed to the friction head 47 to ensure that the friction head 47 only performs a vertical movement.
The present invention also provides a modified embodiment, shown in fig. 5 as an electrostatic chuck service tool 40 ". The maintenance tool 40 has a similar structure to that of the first embodiment, and mainly differs from the rotating arm 346, the pressure rod 345 and the connecting portion 348, wherein the pressure rod 345 is not vertically disposed, and the connecting portion 348 is provided with an elastic member therein, so that the pressure rod 345 can have downward pressure.
The support base plate 42 of the electrostatic chuck maintenance tool can be made of metal or ceramic or resin, the rotating arm (46), the pressure rods (45, 245), the rotating shaft 43, the bearing 44 and the support arm 244 can be made of metal materials, the structure is simple, the materials are easy to obtain, the cost is low, the service life of the electrostatic chuck can be obviously prolonged, and the cost is saved.
When the electrostatic chuck maintenance tool is used, the airtight effect can be obviously improved by performing friction polishing on the electrostatic chuck in a vacuum treatment device for a few cycles. As shown in fig. 6a, after 10 times of rubbing polishing is performed on the sealing ring 23a by using the maintenance tool provided by the present invention, the surface roughness is reduced from 1.2 μm to 0.9 μm, and the leakage amount of helium on the electrostatic chuck is reduced simultaneously with the reduction of the surface roughness. After the vacuum processing apparatus shown in fig. 6b has been operated for a long time and serious helium leakage occurs, a processing cycle of 750 wafers is selected for testing, wherein 0-40 wafers in the T0 section are not maintained by the electrostatic chuck using the maintenance tool of the present invention; the T1 section of 41-140 sheets is polished by the tool for two circles on the electrostatic chuck sealing ring; the T2 section of the 141-280 tablets is polished again by adopting the tool of the invention, and the total polishing times reach 4 circles; the T3 section of 281-425 tablets is polished again by adopting the tool of the invention, and the total polishing times reach 8 circles; 426-750 pieces of T4 are polished again by the tool of the invention, and the total polishing times reach 10 circles; it can be seen from fig. 6b that the helium leakage amount is substantially stable after the maintenance tool of the present invention is used for polishing for more than 10 cycles, and the helium leakage amount rebounds during the subsequent processing of several or more than ten substrates because part of the ground particles remain on the upper surface of the sealing ring to affect the airtight effect after each polishing. After more than 10 substrates are processed, the residual particles are carried away, and the friction polishing effect is stabilized. Since the semiconductor industry itself requires a chamber interior environment recovery process (seasoning process) for a certain period of time after the vacuum processing chamber is opened to perform the vacuum processing process again, such as a plasma etching process. And in the environment recovery process, the wafer special for the environment recovery process is conveyed into a processing cavity of the vacuum processing device, and a preset environment recovery process is executed until the plurality of special wafers are processed. Therefore, after the electrostatic chuck maintenance tool is adopted for polishing, an additional treatment process is not needed, the aim of the invention can be achieved only by executing an environment recovery flow, and helium leakage is greatly reduced, so that the gas leakage amount is less than 3sccm, even 2.5 sccm.
The electrostatic chuck maintenance tool provided by the invention can independently polish the sealing ring at the edge of the upper surface of the electrostatic chuck under the condition that the electrostatic chuck is not taken out from the vacuum processing device, and can ensure that the polishing effect of the whole sealing ring is uniform and stable in the polishing process. After polishing for multiple cycles (>10 times), the upper surface of the sealing ring is ground off, the number of cycles of the polishing process cannot be too large, so that the thickness of the ground-off material layer of the sealing ring is too large, the material of the sealing ring is close to being polished and fails, and the optimal thickness reduction of the sealing ring needs to be less than or equal to 1 μm in one polishing process, so as to ensure that the polishing process can be executed again. After the polishing process of the sealing ring on the electrostatic chuck is finished, the electrostatic chuck maintenance tool is taken out, and the vacuum treatment device is subjected to an environment recovery process for a period of time, so that the use state of the electrostatic chuck can be recovered to be close to factory settings again. Compared with the prior art that the whole electrostatic chuck needs to be ground with surface materials in a large range, the invention recovers the performance of the electrostatic chuck in a short time by using a simple tool, does not cause the electrostatic chuck to be scrapped, and has obvious economic effect.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be determined from the following claims.
Claims (11)
1. An electrostatic chuck maintenance tool for a vacuum processing apparatus, comprising:
a supporting bottom plate, wherein the lower surface of the supporting bottom plate is used for being placed on the upper surface of the electrostatic chuck, a rotating base is fixed on the upper surface of the supporting bottom plate,
a rotating arm having a first end coupled to said rotating base such that the rotating arm moves circumferentially about said rotating base, said rotating arm further comprising a second end coupled to a pressure rod;
the lower end of the pressure rod comprises a friction head, the bottom surface of the friction head comprises a friction plate, the friction plate does circular motion around the outer edge of the supporting bottom plate, and the circular motion can cover a sealing ring on the upper surface of the electrostatic chuck.
2. The electrostatic chuck maintenance tool for a vacuum processing apparatus according to claim 1, wherein the spin base is a spin shaft and a spin bearing located at an outer sidewall of the spin shaft, the spin arm first end being coupled to the spin bearing.
3. The electrostatic chuck service tool for a vacuum processing apparatus according to claim 1, wherein the spin base comprises a circular through support wall and a circular ring track located outside the support wall, the first end of the spin arm being coupled to the circular ring track.
4. The electrostatic chuck service tool of claim 1, wherein the top of the pressure bar comprises a weight to provide a predetermined downward pressure.
5. The electrostatic chuck service tool for a vacuum processing apparatus according to claim 1, wherein the pressure bar further has a spring sleeved thereon, the spring having one end fixed to the friction head and the other end fixed to the pressure bar or the connecting bar.
6. The electrostatic chuck service tool for a vacuum processing apparatus according to claim 1, wherein the friction head has a first sloped sidewall on an inside and a second sloped sidewall on an outside of the support base, the first and second sloped sidewalls being shaped to match.
7. The electrostatic chuck service tool for a vacuum processing apparatus according to claim 6, wherein the friction head applies a downward pressure to the second sloped sidewall through the first sloped sidewall, the second sloped sidewall generating an opposite force.
8. A method of maintaining an electrostatic chuck for a vacuum processing apparatus, comprising the steps of:
opening a top cover at the top of the vacuum processing device;
placing the electrostatic chuck maintenance tool of claim 1 onto an electrostatic chuck within a vacuum processing apparatus;
performing a polishing step to drive a friction plate on an electrostatic chuck maintenance tool to make a circular motion around the outer edge of the support base plate, wherein the circular motion can cover a sealing ring on the upper surface of the electrostatic chuck;
and after the polishing step is finished, taking out the electrostatic chuck maintenance tool, and closing the top cover at the top of the vacuum processing device.
9. An electrostatic chuck maintenance method according to claim 8, wherein in the polishing step, the friction plate polishes the seal ring for more than 10 revolutions.
10. An electrostatic chuck maintenance method according to claim 8, further comprising an environmental recovery step after finishing polishing the seal ring, wherein at least 10 wafers are processed in the environmental recovery step.
11. An electrostatic chuck maintenance method according to claim 8, wherein the polishing process reduces a seal ring thickness by less than 1 μ ι η.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711026362.8A CN109712908B (en) | 2017-10-26 | 2017-10-26 | Electrostatic chuck maintenance device and method for vacuum treatment device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711026362.8A CN109712908B (en) | 2017-10-26 | 2017-10-26 | Electrostatic chuck maintenance device and method for vacuum treatment device |
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| CN109712908A CN109712908A (en) | 2019-05-03 |
| CN109712908B true CN109712908B (en) | 2020-10-30 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010063395A (en) * | 1999-12-22 | 2001-07-09 | 고석태 | The Method Making Electrostatic Chuck And That's Electrostatic Chuck |
| CN203077069U (en) * | 2012-12-13 | 2013-07-24 | 湖南省电力公司凤滩水力发电厂 | Runner plate grinder |
| CN204565824U (en) * | 2015-03-27 | 2015-08-19 | 蓝思科技（长沙）有限公司 | The large Bevel polishing devices in a kind of circular glass straight body position |
| CN105453234A (en) * | 2013-08-10 | 2016-03-30 | 应用材料公司 | A method of polishing a new or a refurbished electrostatic chuck |
-
2017
- 2017-10-26 CN CN201711026362.8A patent/CN109712908B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010063395A (en) * | 1999-12-22 | 2001-07-09 | 고석태 | The Method Making Electrostatic Chuck And That's Electrostatic Chuck |
| CN203077069U (en) * | 2012-12-13 | 2013-07-24 | 湖南省电力公司凤滩水力发电厂 | Runner plate grinder |
| CN105453234A (en) * | 2013-08-10 | 2016-03-30 | 应用材料公司 | A method of polishing a new or a refurbished electrostatic chuck |
| CN204565824U (en) * | 2015-03-27 | 2015-08-19 | 蓝思科技（长沙）有限公司 | The large Bevel polishing devices in a kind of circular glass straight body position |
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| CN109712908A (en) | 2019-05-03 |
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