CN109711643B - Load prediction method and device for building, readable medium and electronic equipment - Google Patents
Load prediction method and device for building, readable medium and electronic equipment Download PDFInfo
- Publication number
- CN109711643B CN109711643B CN201910112104.4A CN201910112104A CN109711643B CN 109711643 B CN109711643 B CN 109711643B CN 201910112104 A CN201910112104 A CN 201910112104A CN 109711643 B CN109711643 B CN 109711643B
- Authority
- CN
- China
- Prior art keywords
- building
- caused
- design load
- parameters
- load
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The embodiment of the invention provides a load prediction method, a device, a readable medium and electronic equipment of a building, wherein the method comprises the following steps: acquiring meteorological parameters, building thermal parameters and maintenance structure thermal parameters; calculating design load caused by temperature difference between the inside and the outside of the building, design load caused by solar radiation energy absorbed by the building and design load caused by indoor comprehensive heat dissipation power of the building according to meteorological parameters, building heat parameters and maintenance structure heat parameters; and predicting the load prediction result of the building based on the design load caused by the temperature difference between the inside and the outside of the building, the design load caused by the solar radiation energy absorbed by the building, the design load caused by the indoor comprehensive heat dissipation power of the building and the load prediction model. According to the technical scheme, the parameters related to the load prediction model are more convenient to obtain, the calculation amount is low, the load prediction result of the building can be rapidly calculated, and the accuracy of the load prediction result of the building is improved.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of energy, in particular to a load prediction method and device of a building, a readable medium and electronic equipment.
[ background of the invention ]
The load prediction of the building refers to predicting the future load capacity of the building based on the load historical data of the building, the load prediction result of the building is the basis of energy planning and scheme design operation, and it is important to obtain an accurate load prediction result. In the prior art, the load of a building is generally predicted by an index method and a DeST (Designer's Simulation Toolkit) software Simulation calculation method.
The index method roughly calculates the load result of the building by acquiring the air-conditioning area and the experience coefficient of the user. It can be seen that the calculation process involves fewer parameters, and the important parameters are estimated empirically, so that the load prediction result is less accurate. The DEST software simulation calculation method is to input a large number of parameters in software and carry out simulation calculation to obtain the load result of the building. It can be seen that too many relevant parameters are selected in the simulation calculation process, which means that the data collection needs to be comprehensive and accurate, in practice, the collection of some data is difficult, the more variables are selected, the more complicated the prediction model is, and the accuracy of prediction is difficult to guarantee.
[ summary of the invention ]
In view of this, embodiments of the present invention provide a method, an apparatus readable medium, and an electronic device for predicting a load of a building, so as to solve the problems of a building that load prediction difficulty is large and a prediction result is inaccurate in the prior art.
In a first aspect, an embodiment of the present invention provides a load prediction method for a building, including:
acquiring meteorological parameters, building thermal parameters and maintenance structure thermal parameters;
calculating design load caused by temperature difference between the inside and the outside of the building, design load caused by solar radiation energy absorbed by the building and design load caused by indoor comprehensive heat dissipation power of the building according to meteorological parameters, building heat parameters and maintenance structure heat parameters;
and predicting the load prediction result of the building based on the design load caused by the temperature difference between the inside and the outside of the building, the design load caused by the solar radiation energy absorbed by the building, the design load caused by the indoor comprehensive heat dissipation power of the building and the load prediction model.
As for the above-mentioned aspects and any possible implementation manner, there is further provided an implementation manner, where the load prediction model specifically is:
Q＝Q1+Q2+Q3
wherein Q is the load prediction result of the building, Q1Design load Q caused by temperature difference between inside and outside of building2Design load, Q, caused by the absorption of solar radiation energy for buildings3The design load caused by the indoor comprehensive heat dissipation power of the building is achieved.
The above aspects, and any possible implementations, further provide an implementation,
the meteorological parameters include: outdoor calculation dry bulb temperature T of building0Indoor dry bulb temperature T of buildingi；
The building thermal parameters include: area of building exterior wall AwaBuilding window area AwiBuilding air-conditioning area AcThermal resistance R of outer wall of buildingwaThermal resistance R of building windowwiHeight h of single floor of building, density e of indoor electric equipment of building1Density p of people in buildinge；
The maintenance structure thermal parameters include: heat transfer correction coefficient epsilon of building envelopeniAverage heat transfer coefficient k of building envelopeniArea A of the enclosure structureni。
The above aspects and any possible implementation manners further provide an implementation manner of the design load Q caused by the temperature difference between the inside and the outside of the building1The calculation formula of (2) is as follows:
the above aspects and any possible implementations further provide an implementation in which the building absorbs a design load Q caused by solar radiation energy2The calculation formula of (2) is as follows:
the method as described aboveFurther provided is an implementation manner of the design load Q caused by indoor comprehensive heat dissipation power of the building3The calculation formula of (2) is as follows:
the above aspects and any possible implementations further provide an implementation in which the building is of a public building type.
In a second aspect, an embodiment of the present invention provides a load prediction apparatus for a building, including:
the acquisition module is used for acquiring meteorological parameters, building heat parameters and maintenance structure heat parameters;
the calculation module is used for calculating the design load caused by the temperature difference between the inside and the outside of the building, the design load caused by the solar radiation energy absorbed by the building and the design load caused by the indoor comprehensive heat dissipation power of the building according to the meteorological parameters, the building heat parameters and the maintenance structure heat parameters;
and the prediction module is used for predicting the load prediction result of the building based on the design load caused by the temperature difference between the inside and the outside of the building, the design load caused by the solar radiation energy absorbed by the building, the design load caused by the indoor comprehensive heat dissipation power of the building and the load prediction model.
As for the above-mentioned aspects and any possible implementation manner, there is further provided an implementation manner, where the load prediction model specifically is:
Q＝Q1+Q2+Q3
wherein Q is the load prediction result of the building, Q1Design load Q caused by temperature difference between inside and outside of building2Design load, Q, caused by the absorption of solar radiation energy for buildings3The design load caused by the indoor comprehensive heat dissipation power of the building is achieved.
The above-described aspects and any possible implementations further provide an implementation, where the meteorological parameters include: building outdoorCalculating the dry bulb temperature T0Indoor dry bulb temperature T of buildingi；
The building thermal parameters include: area of building exterior wall AwaBuilding window area AwiBuilding air-conditioning area AcThermal resistance R of outer wall of buildingwaThermal resistance R of building windowwiHeight h of single floor of building, density e of indoor electric equipment of building1Density p of people in buildinge；
The maintenance structure thermal parameters include: heat transfer correction coefficient epsilon of building envelopeniAverage heat transfer coefficient k of building envelopeniArea A of the enclosure structureni。
The above aspects and any possible implementation further provide an implementation that the design load Q caused by the temperature difference between the inside and the outside of the building1The calculation formula of (2) is as follows:
the above aspects and any possible implementations further provide an implementation in which the building absorbs a design load Q caused by solar radiation energy2The calculation formula of (2) is as follows:
the above aspects and any possible implementation manners further provide an implementation manner that the design load Q caused by the indoor comprehensive heat dissipation power of the building3The calculation formula of (2) is as follows:
the above aspects and any possible implementations further provide an implementation in which the building is of a public building type.
In a third aspect, the invention provides a readable medium comprising executable instructions, which when executed by a processor of an electronic device, perform the method according to any of the first aspect.
In a fourth aspect, the present invention provides an electronic device, comprising: a processor, a memory, and a bus;
the memory is used for storing execution instructions, the processor is connected with the memory through the bus, and when the electronic device runs, the processor executes the execution instructions stored in the memory to enable the processor to execute the method according to any one of the first aspect.
One of the above technical solutions has the following beneficial effects:
according to the method, meteorological parameters, building thermal parameters and maintenance structure thermal parameters are collected firstly, then design loads caused by temperature difference between the inside and the outside of a building, design loads caused by solar radiation energy absorbed by the building and design loads caused by indoor comprehensive heat dissipation power of the building are calculated, finally, the load prediction result of the building is predicted based on the load prediction model, the parameters related to the load prediction model are obtained more conveniently, the calculation amount is low, the load prediction result of the building can be calculated rapidly, and the accuracy of the building load prediction result is improved to a certain extent.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive labor.
Fig. 1 is a schematic flow chart of a load prediction method for a building according to an embodiment of the present invention;
fig. 2 is a functional block diagram of a load prediction apparatus for a building according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present invention.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail and completely with reference to the following embodiments and accompanying drawings. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The basic concepts and background related to embodiments of the present invention are explained in a bit below.
The cooling load refers to heat that must be taken away from a room by an air conditioning system or cooling that needs to be supplied to the room at a certain time in order to maintain a hot and humid environment of a building and a desired indoor temperature, and includes both sensible heat and latent heat. Conversely, if the air conditioning system needs to supply heat to the room to compensate for the loss of heat from the room, the heat supplied to the room is referred to as the heat load.
In the prior art, the load distribution of a building is generally regarded as relatively uniform, the load is in direct proportion to the area of the building, an index method can be generally adopted, for example, a load prediction of a unit area is determined according to historical data and a design scheme, and then the load prediction of the building is calculated according to the specific area, so that the method is a relatively rough calculation method, and the prediction result is generally large in error. Alternatively, a DeST software simulation calculation method may be adopted, for example, a large number of parameters are input into software, and a load result of a building is obtained through simulation calculation, while too many relevant parameters are selected in the simulation calculation process, which means difficulty in data collection, and the more variables are selected, the more complex the prediction model is, and the accuracy of prediction is difficult to guarantee.
Aiming at the problems of high load prediction difficulty and inaccurate load prediction result of a building in the prior art, the embodiment of the invention provides a corresponding solution idea: by collecting meteorological parameters, building thermal parameters and maintenance structure thermal parameters, the design load caused by the temperature difference between the inside and the outside of the building, the design load caused by the solar radiation energy absorbed by the building and the design load caused by the indoor comprehensive heat dissipation power of the building are calculated, and then the design load is substituted into a load prediction model to obtain a load prediction result.
Guided by this idea, embodiments of the present invention provide the following possible implementations.
Referring to fig. 1, a method for predicting load of a building according to an embodiment of the present invention is shown, which includes the following steps:
And 102, calculating the design load caused by the temperature difference between the inside and the outside of the building, the design load caused by the solar radiation energy absorbed by the building and the design load caused by the indoor comprehensive heat dissipation power of the building according to the meteorological parameters, the building heat parameters and the maintenance structure heat parameters.
And 103, predicting the load prediction result of the building based on the design load caused by the temperature difference between the inside and the outside of the building, the design load caused by the solar radiation energy absorbed by the building, the design load caused by the indoor comprehensive heat dissipation power of the building and the load prediction model.
According to the embodiment shown in FIG. 1, the method first collects meteorological parameters, building thermal parameters and maintenance structure thermal parameters, then calculates the design load caused by the temperature difference between the inside and outside of the building, the design load caused by the solar radiation energy absorbed by the building and the design load caused by the indoor comprehensive heat dissipation power of the building according to the meteorological parameters, the building thermal parameters and the maintenance structure thermal parameters, and finally predicts the load prediction result of the building based on the design load caused by the temperature difference between the inside and outside of the building, the design load caused by the solar radiation energy absorbed by the building and the design load caused by the indoor comprehensive heat dissipation power of the building and the load prediction model.
The calculation parameters collected in step 101 are classified into three categories: meteorological parameters, building thermal parameters, and maintenance structure thermal parameters. The accuracy of the acquisition of the three types of parameters is generally higher, but the acquisition difficulty is lower.
Wherein, meteorological parameters include: outdoor calculation dry bulb temperature T of building0Indoor dry bulb temperature T of buildingi。T0And TiCan be collected from temperature sensors arranged indoors and outdoors respectively.
The building thermal parameters include: area of building exterior wall AwaBuilding window area AwiBuilding air-conditioning area AcThermal resistance R of outer wall of buildingwaThermal resistance R of building windowwiHeight h of single floor of building, density e of indoor electric equipment of building1Density p of people in buildinge. Parameter Awa、Awi、Ac、Rwa、RwiAnd h can be obtained through actual measurement or from drawing data; e.g. of the type1And peCan be obtained by simple calculation, e1Is the ratio of the total power of the indoor electrical appliances of the building to the total area, peIs the ratio of the total number of people in the building to the total area.
The maintenance structure thermal parameters include: heat transfer correction coefficient epsilon of building envelopeniAverage heat transfer coefficient k of building envelopeniArea A of the enclosure structureni。kniAnd AniCan be obtained by actual measurement or from drawing dataniThe calculation is performed by national standards.
Specifically, the load prediction model of the embodiment of the present invention is established in an ideal external environment, and the boundary conditions of the load prediction model are assumed by the following three points:
1) the temperature inside the building is uniform;
2) each room inside the building is approximately formed by two walls, because the prior public building mainly takes the building and the roof and the floor do not exchange heat with the outside, the room is approximately formed by two walls;
3) only the interference of personnel and electric equipment exists in the building.
Therefore, the following load prediction model of the building can be established in step 103:
Q＝Q1+Q2+Q3 (1)
wherein Q is the load prediction result of the building, Q1Design load Q caused by temperature difference between inside and outside of building2Design load, Q, caused by the absorption of solar radiation energy for buildings3The design load caused by the indoor comprehensive heat dissipation power of the building is achieved.
It can be seen from the above that, in the embodiment of the present invention, the load prediction result of the building is divided into three parts, namely, the design load caused by the temperature difference between the inside and the outside of the building, the design load caused by the solar radiation energy absorbed by the building, and the design load caused by the indoor comprehensive heat dissipation power of the building, and the three design loads are calculated and are brought into the model to be summed, so that the load prediction result of the building of the present invention can be obtained.
In step 102, the design load Q caused by the difference between the temperature inside and outside the building in the load prediction model of the building1The calculation formula of (2) is as follows:
wherein Q is1Design load, T, caused by the difference in temperature between the inside and outside of the building0Calculating dry bulb temperature, T, for a building outdoorsiCalculating dry bulb temperature, A, for a building indoorwaIs the area of the outer wall of the building, RwaIs the thermal resistance of the outer wall of a building, AwiIs the window area R of the buildingwiIs the thermal resistance of the building window AcThe air conditioning area of the building.
Design load Q caused by solar radiation energy absorption of building in load prediction model of building2The calculation formula of (2) is as follows:
wherein Q is2Design load, T, caused by the absorption of solar radiation energy for a building0Calculating dry bulb temperature, T, for a building outdoorsiCalculating dry bulb temperature, epsilon for building indoorniHeat transfer correction coefficient k for building envelopeniIs the average heat transfer coefficient of the building envelope, AniIs the area of the enclosure, AcThe air conditioning area of the building.
Note that ε in formula (3)niThe value of n in the formula (3) is 1 or 2, and the value is used for distinguishing two walls of a building.
Design load Q caused by indoor comprehensive heat dissipation power of building3The calculation formula of (2) is as follows:
wherein Q is3Design load caused by indoor comprehensive heat dissipation power of the building, h is single-storey height of the building, e1Density, p, for electrical equipment in buildingseIs the density of people in the building.
In addition, e is1Is the ratio of the total power of the indoor electrical appliances of the building to the total area, peThe ratio of the total number of people in the building to the total area is 50.
The type of the building mentioned in the embodiment of the present invention is a public building, the public building may be, but is not limited to, a multistoried residential building, a high-rise residential building, a general office building, a general hotel building, a mall building, a business office building, a business hotel building, a school building, and a hospital building, and the industrial building includes a food factory, a medical building, a textile building, a paper making building, a printing and dyeing building, an electroplating building, a chemical building, a manufacturing building, a metal material processing building, and a new energy building.
The embodiment of the invention further provides an embodiment of a device for realizing the steps and the method in the embodiment of the method.
Please refer to fig. 2, which is a functional block diagram of a load prediction apparatus for a building according to an embodiment of the present invention, as shown in the figure, the apparatus includes:
an acquisition module 210 for acquiring meteorological parameters, building thermal parameters and maintenance structure thermal parameters;
the calculation module 220 is used for calculating the design load caused by the temperature difference between the inside and the outside of the building, the design load caused by the solar radiation energy absorbed by the building and the design load caused by the indoor comprehensive heat dissipation power of the building according to the meteorological parameters, the building heat parameters and the maintenance structure heat parameters;
and the prediction module 230 is used for predicting the load prediction result of the building based on the design load caused by the temperature difference between the inside and the outside of the building, the design load caused by the solar radiation energy absorbed by the building, the design load caused by the indoor comprehensive heat dissipation power of the building and the load prediction model.
As for the above-mentioned aspects and any possible implementation manner, there is further provided an implementation manner, where the load prediction model specifically is:
Q＝Q1+Q2+Q3
wherein Q is the load prediction result of the building, Q1Design load Q caused by temperature difference between inside and outside of building2Design load, Q, caused by the absorption of solar radiation energy for buildings3The design load caused by the indoor comprehensive heat dissipation power of the building is achieved.
The above-described aspects and any possible implementations further provide an implementation, where the meteorological parameters include: outdoor calculation dry bulb temperature T of building0Indoor dry bulb temperature T of buildingi；
The building thermal parameters include: area of building exterior wall AwaBuilding window area AwiBuilding air-conditioning area AcThermal resistance R of outer wall of buildingwaThermal resistance R of building windowwiHeight h of single floor of building, density e of indoor electric equipment of building1Density p of people in buildinge；
The maintenance structure thermal parameters include: heat transfer correction coefficient epsilon of building envelopeniAverage heat transfer coefficient k of building envelopeniArea A of the enclosure structureni。
The above aspects and any possible implementation further provide an implementation that the design load Q caused by the temperature difference between the inside and the outside of the building1The calculation formula of (2) is as follows:
the above aspects and any possible implementations further provide an implementation in which the building absorbs a design load Q caused by solar radiation energy2The calculation formula of (2) is as follows:
the above aspects and any possible implementation manners further provide an implementation manner that the design load Q caused by the indoor comprehensive heat dissipation power of the building3The calculation formula of (2) is as follows:
the above aspects and any possible implementations further provide an implementation in which the building is of a public building type.
Since each unit module in the embodiment can execute the method shown in fig. 1, reference may be made to the related description of fig. 1 for a part of the embodiment that is not described in detail.
Fig. 3 is a schematic structural diagram of an electronic device according to an embodiment of the present invention. Referring to fig. 3, at a hardware level, the electronic device includes a processor, and optionally further includes an internal bus, a network interface, and a memory. The Memory may include a Memory, such as a Random-Access Memory (RAM), and may further include a non-volatile Memory, such as at least 1 disk Memory. Of course, the electronic device may also include hardware required for other services.
The processor, the network interface, and the memory may be connected to each other via an internal bus, which may be an ISA (Industry Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus, an EISA (Extended Industry Standard Architecture) bus, or the like. The bus may be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one double-headed arrow is shown in FIG. 3, but this does not indicate only one bus or one type of bus.
And the memory is used for storing programs. In particular, the program may include program code comprising computer operating instructions. The memory may include both memory and non-volatile storage and provides instructions and data to the processor.
In a possible implementation manner, the processor reads the corresponding computer program from the non-volatile memory into the memory and then runs the computer program, and the corresponding computer program can also be obtained from other devices, so as to form the thermal load prediction apparatus on a logic level. And the processor executes the program stored in the memory so as to realize the heat load prediction method provided by any embodiment of the invention through the executed program.
Embodiments of the present invention also provide a computer-readable storage medium storing one or more programs, the one or more programs comprising instructions, which when executed by an electronic device including a plurality of application programs, enable the electronic device to perform the thermal load prediction method provided in any of the embodiments of the present invention.
The method performed by the thermal load prediction apparatus according to the embodiment of the present invention shown in fig. 2 may be applied to or implemented by a processor. The processor may be an integrated circuit chip having signal processing capabilities. In implementation, the steps of the above method may be performed by integrated logic circuits of hardware in a processor or instructions in the form of software. The Processor may be a general-purpose Processor, including a Central Processing Unit (CPU), a Network Processor (NP), and the like; but also Digital Signal Processors (DSPs), Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs) or other Programmable logic devices, discrete Gate or transistor logic devices, discrete hardware components. The various methods, steps and logic blocks disclosed in the embodiments of the present invention may be implemented or performed. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The steps of the method disclosed in connection with the embodiments of the present invention may be directly implemented by a hardware decoding processor, or implemented by a combination of hardware and software modules in the decoding processor. The software module may be located in ram, flash memory, rom, prom, or eprom, registers, etc. storage media as is well known in the art. The storage medium is located in a memory, and a processor reads information in the memory and completes the steps of the method in combination with hardware of the processor.
Embodiments of the present invention also provide a computer-readable storage medium storing one or more programs, the one or more programs comprising instructions, which when executed by an electronic device including a plurality of application programs, enable the electronic device to perform the thermal load prediction method provided in any of the embodiments of the present invention.
The systems, devices, modules or units illustrated in the above embodiments may be implemented by a computer chip or an entity, or by a product with certain functions. One typical implementation device is a computer. In particular, the computer may be, for example, a personal computer, a laptop computer, a cellular telephone, a camera phone, a smartphone, a personal digital assistant, a media player, a navigation device, an email device, a game console, a tablet computer, a wearable device, or a combination of any of these devices.
For convenience of description, the above devices are described as being divided into various units or modules by function, respectively. Of course, the functionality of the units or modules may be implemented in the same one or more software and/or hardware when implementing the invention.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
In a typical configuration, a computing device includes one or more processors (CPUs), input/output interfaces, network interfaces, and memory.
The memory may include forms of volatile memory in a computer readable medium, Random Access Memory (RAM) and/or non-volatile memory, such as Read Only Memory (ROM) or flash memory (flash RAM). Memory is an example of a computer-readable medium.
Computer-readable media, including both non-transitory and non-transitory, removable and non-removable media, may implement information storage by any method or technology. The information may be computer readable instructions, data structures, modules of a program, or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), Static Random Access Memory (SRAM), Dynamic Random Access Memory (DRAM), other types of Random Access Memory (RAM), Read Only Memory (ROM), Electrically Erasable Programmable Read Only Memory (EEPROM), flash memory or other memory technology, compact disc read only memory (CD-ROM), Digital Versatile Discs (DVD) or other optical storage, magnetic cassettes, magnetic tape magnetic disk storage or other magnetic storage devices, or any other non-transmission medium that can be used to store information that can be accessed by a computing device. As defined herein, a computer readable medium does not include a transitory computer readable medium such as a modulated data signal and a carrier wave.
It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
As will be appreciated by one skilled in the art, embodiments of the present invention may be provided as a method, system, or computer program product. Accordingly, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, and the like) having computer-usable program code embodied therein.
The invention may be described in the general context of computer-executable instructions, such as program modules, being executed by a computer. Generally, program modules include routines, programs, objects, components, data structures, etc. that perform particular tasks or implement particular abstract data types. The invention may also be practiced in distributed computing environments where tasks are performed by remote processing devices that are linked through a communications network. In a distributed computing environment, program modules may be located in both local and remote computer storage media including memory storage devices.
The embodiments of the present invention are described in a progressive manner, and the same and similar parts among the embodiments can be referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the system embodiment, since it is substantially similar to the method embodiment, the description is simple, and for the relevant points, reference may be made to the partial description of the method embodiment.
The above description is only an example of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.
Claims (10)
1. A method for load prediction for a building, the method comprising:
acquiring meteorological parameters, building thermal parameters and maintenance structure thermal parameters;
calculating design load caused by temperature difference between the inside and the outside of the building, design load caused by solar radiation energy absorbed by the building and design load caused by indoor comprehensive heat dissipation power of the building according to meteorological parameters, building heat parameters and maintenance structure heat parameters;
predicting a load prediction result of the building based on a design load caused by the temperature difference between the inside and the outside of the building, a design load caused by the solar radiation energy absorbed by the building, a design load caused by the indoor comprehensive heat dissipation power of the building and a load prediction model;
the load prediction model specifically comprises:
Q＝Q1+Q2+Q3
wherein Q is the load prediction result of the building, Q1Design load Q caused by temperature difference between inside and outside of building2Design load, Q, caused by the absorption of solar radiation energy for buildings3Design load caused by indoor comprehensive heat dissipation power of the building;
the meteorological parameters include: outdoor calculation dry bulb temperature T of building0Indoor dry bulb temperature T of buildingi；
The building thermal parameters include: area of building exterior wall AwaBuilding window area AwiBuilding air-conditioning area AcThermal resistance R of outer wall of buildingwaThermal resistance R of building windowwiHeight h of single floor of building, density e of indoor electric equipment of building1Density p of people in buildinge；
The maintenance structure thermal parameters include: heat transfer correction coefficient epsilon of building envelopeniAverage heat transfer coefficient k of building envelopeniArea A of the enclosure structureni；
In the buildingDesign load Q caused by external temperature difference1The calculation formula of (2) is as follows:
2. the method of claim 1, wherein the building absorbs a design load Q caused by solar radiation energy2The calculation formula of (2) is as follows:
3. the method of claim 1, wherein the design load Q is due to the integrated heat dissipation power in the building room3The calculation formula of (2) is as follows:
4. the method of claim 1, wherein the type of building is a public building.
5. An apparatus for predicting load of a building, the apparatus comprising:
the acquisition module is used for acquiring meteorological parameters, building heat parameters and maintenance structure heat parameters;
the calculation module is used for calculating the design load caused by the temperature difference between the inside and the outside of the building, the design load caused by the solar radiation energy absorbed by the building and the design load caused by the indoor comprehensive heat dissipation power of the building according to the meteorological parameters, the building heat parameters and the maintenance structure heat parameters;
the prediction module is used for predicting the load prediction result of the building based on the design load caused by the temperature difference between the inside and the outside of the building, the design load caused by the solar radiation energy absorbed by the building, the design load caused by the indoor comprehensive heat dissipation power of the building and the load prediction model;
the load prediction model specifically comprises:
Q＝Q1+Q2+Q3
wherein Q is the load prediction result of the building, Q1Design load Q caused by temperature difference between inside and outside of building2Design load, Q, caused by the absorption of solar radiation energy for buildings3Design load caused by indoor comprehensive heat dissipation power of the building;
the meteorological parameters include: outdoor calculation dry bulb temperature T of building0Indoor dry bulb temperature T of buildingi；
The building thermal parameters include: area of building exterior wall AwaBuilding window area AwiBuilding air-conditioning area AcThermal resistance R of outer wall of buildingwaThermal resistance R of building windowwiHeight h of single floor of building, density e of indoor electric equipment of building1Density p of people in buildinge；
The maintenance structure thermal parameters include: heat transfer correction coefficient epsilon of building envelopeniAverage heat transfer coefficient k of building envelopeniArea A of the enclosure structureni；
Design load Q caused by the difference between the internal temperature and the external temperature of the building1The calculation formula of (2) is as follows:
6. the apparatus of claim 5, wherein the building absorbs a design load Q caused by solar radiation energy2The calculation formula of (2) is as follows:
7. the apparatus of claim 5, wherein the design load Q is caused by the integrated heat dissipation power in the building3The calculation formula of (2) is as follows:
8. the apparatus of claim 5, wherein the building is of the public building type.
9. A readable medium comprising executable instructions which, when executed by a processor of an electronic device, cause the electronic device to perform the method of any one of claims 1 to 4.
10. An electronic device, comprising: a processor, a memory, and a bus; the memory is used for storing execution instructions, the processor is connected with the memory through the bus, and when the electronic device runs, the processor executes the execution instructions stored in the memory to enable the processor to execute the method according to any one of claims 1 to 4.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811479223 | 2018-12-05 | ||
| CN2018114792235 | 2018-12-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109711643A CN109711643A (en) | 2019-05-03 |
| CN109711643B true CN109711643B (en) | 2021-01-29 |
Family
ID=66264254
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910112104.4A Active CN109711643B (en) | 2018-12-05 | 2019-02-13 | Load prediction method and device for building, readable medium and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109711643B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110278687B (en) * | 2019-06-14 | 2020-07-03 | 魏晅 | Comprehensive energy-saving cooling control method for machine room environment |
| CN111222079A (en) * | 2019-12-30 | 2020-06-02 | 国网北京市电力公司 | Electric power prediction method, device, storage medium and processor |
| CN111626484A (en) * | 2020-05-11 | 2020-09-04 | 新智数字科技有限公司 | Load prediction system and method based on regional building energy system parameter correction |
| CN115095962A (en) * | 2022-07-25 | 2022-09-23 | 蘑菇物联技术（深圳）有限公司 | Method, apparatus and medium for controlling chiller of central air conditioning system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104866702A (en) * | 2015-02-26 | 2015-08-26 | 东南大学 | Calculating method for determining cooling and heating load of building in hot-summer and cold-winter zone by utilizing pivot element decoupling method |
| CN105373707A (en) * | 2015-12-10 | 2016-03-02 | 河北昌固太阳能科技有限公司 | Method for calculating heating loads of solar heating system and building |
| CN106524295A (en) * | 2016-11-21 | 2017-03-22 | 北京建筑技术发展有限责任公司 | Regional building energy consumption predicting method |
| CN107392368A (en) * | 2017-07-17 | 2017-11-24 | 天津大学 | Meteorological forecast-based office building dynamic heat load combined prediction method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120083930A1 (en) * | 2010-09-30 | 2012-04-05 | Robert Bosch Gmbh | Adaptive load management: a system for incorporating customer electrical demand information for demand and supply side energy management |
-
2019
- 2019-02-13 CN CN201910112104.4A patent/CN109711643B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104866702A (en) * | 2015-02-26 | 2015-08-26 | 东南大学 | Calculating method for determining cooling and heating load of building in hot-summer and cold-winter zone by utilizing pivot element decoupling method |
| CN105373707A (en) * | 2015-12-10 | 2016-03-02 | 河北昌固太阳能科技有限公司 | Method for calculating heating loads of solar heating system and building |
| CN106524295A (en) * | 2016-11-21 | 2017-03-22 | 北京建筑技术发展有限责任公司 | Regional building energy consumption predicting method |
| CN107392368A (en) * | 2017-07-17 | 2017-11-24 | 天津大学 | Meteorological forecast-based office building dynamic heat load combined prediction method |
Non-Patent Citations (1)
| Title |
|---|
| 区域建筑群冷热负荷预测方法研究;欧科敏;《中国优秀硕士学位论文全文数据库 工程科技II辑》;20150415;正文第2章 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109711643A (en) | 2019-05-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109711643B (en) | Load prediction method and device for building, readable medium and electronic equipment | |
| Ham et al. | Simplified server model to simulate data center cooling energy consumption | |
| Wrobel et al. | Performance of a solar assisted air conditioning system at different locations | |
| Li et al. | Recent advances in dynamic modeling of HVAC equipment. Part 1: Equipment modeling | |
| WO2021082478A1 (en) | Energy consumption prediction method and device for air conditioning system | |
| Castaldo et al. | Uses of dynamic simulation to predict thermal‐energy performance of buildings and districts: a review | |
| KR101764673B1 (en) | Energy Load Estimation Device, Method, and Computer-Readable Medium | |
| Van Schijndel | A review of the application of SimuLink S-functions to multi domain modelling and building simulation | |
| CN113987306A (en) | City block energy consumption time-varying graph set construction method, device, equipment and storage medium | |
| Hu et al. | Identification of simplified energy performance models of variable-speed air conditioners using likelihood ratio test method | |
| Bertagnolio et al. | Building and HVAC System simulation with the help of an engineering equation solver | |
| Chiu et al. | Impacts of Air-Conditioning Equipment Sizing on Energy Performance of US Office Buildings | |
| CN112822903A (en) | Data center refrigeration and system based on artificial intelligence | |
| Zhai et al. | Operating points as communication bridge between energy evaluation with air temperature and velocity based on extreme learning machine (ELM) models | |
| Oh et al. | Origins of analysis methods used to design high-performance commercial buildings: Solar energy analysis | |
| Avotins et al. | IoT Solution Approach for Energy Consumption Reduction in Buildings: Part 3. Mathematical Model of Building and Experimental Results | |
| CN109376958A (en) | A kind of load forecasting method and device of building | |
| Conklin | Weather-conditioned house | |
| CN113988473A (en) | Method, system, device and storage medium for configuring energy in region | |
| Capeluto et al. | What are the required conditions for heavy structure buildings to be thermally effective in a hot humid climate? | |
| Giraldo Soto | Optimized monitoring techniques and data analysis development for in-situ characterization of the building envelope's real energetic behaviour | |
| Zhao et al. | Model analysis of a residential building for demand response | |
| CN110307616A (en) | A kind of temperature control device and its control method and device | |
| CN116294088B (en) | Air conditioner control method and device, electronic equipment and storage medium | |
| Sanchez et al. | Modelling and mitigating lifetime impact of building demand responsive control of heating, ventilation and air-conditioning systems |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |