CN109702355A - A kind of bidifly shaven head cutting method and its device - Google Patents
A kind of bidifly shaven head cutting method and its device Download PDFInfo
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- CN109702355A CN109702355A CN201910017111.6A CN201910017111A CN109702355A CN 109702355 A CN109702355 A CN 109702355A CN 201910017111 A CN201910017111 A CN 201910017111A CN 109702355 A CN109702355 A CN 109702355A
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Abstract
The present invention relates to laser cutting process technical fields, and in particular to a kind of bidifly shaven head cutting method and its device.The bidifly shaven head cutting method, comprising the following steps: S1, driving material uniform motion to be processed；S2, the cutting task of material to be processed is divided into the first cutting instruction and the second cutting instruction；S3, first laser head are treated processing materials according to the first instruction and are cut, while second laser head is treated processing materials according to the second instruction and cut.While material uniform motion to be processed, processing materials are treated by first laser head and second laser head jointly and are cut, processing efficiency is substantially increased.
Description
Technical field
The present invention relates to laser cutting process technical fields, and in particular to a kind of bidifly shaven head cutting method and its device.
Background technique
Existing laser cutting machine is very mature to the sheet fabrication technology of all kinds of specifications, especially in computer numerical control
Under the rapid development of technology, the very complicated figure of shape is able to achieve high-precision, processes at high speed.
But in the relatively thin material of batch machining, imitated using the processing of efficiency comparative's punching machine " beat " formula of laser processing
Rate, gap are still very big.Since punching machine easily occurs getting stuck in punching course, cracking phenomena；Mold is easy to damage, replacement is time-consuming
It is long；Processing flexibility is poor, is not suitable for the processing of various sizes small lot；Stock utilization is low；A series of problems, such as noise is big, part are looked forward to
Industry starts to introduce laser cutting to replace traditional punching machine, but utilizes laser cutting process efficiency lower.
Summary of the invention
The technical problem to be solved in the present invention is that in view of the above drawbacks of the prior art, a kind of bidifly shaven head is provided and is cut
Segmentation method, the defect of low efficiency when existing laser cutting apparatus being overcome to cut.
The technical solution adopted by the present invention to solve the technical problems is: a kind of bidifly shaven head cutting method is provided, including
Following steps: S1, driving material uniform motion to be processed；S2, the cutting instruction of material to be processed is divided into the first cutting instruction
With the second cutting instruction；S3, according to the first instruction, driving first laser head is treated processing materials and is cut, while according to the
Two instructions, driving second laser head are treated processing materials and are cut.
Further preferred embodiment of the invention is, further comprising the steps of before step S1: S0, passing through leveling
Machine flattens coiled strip at material to be processed.
Further preferred embodiment of the invention is, further comprising the steps of between step S0, S1: to pass through roller
Structure drives material uniform motion to be processed.
Further preferred embodiment of the invention is that the step S3 is specifically includes the following steps: the first gantry stand
Driving first laser head is moved along X, Y, Z-direction, makes the moving interpolation of first laser head complete independently X, Y-direction, to be processed
Material is cut by laser；Second gantry stand driving second laser head is moved along X, Y, Z-direction, keeps second laser head independently complete
At X, the moving interpolation of Y-direction, treats processing materials and be cut by laser；Wherein, processing materials uniform motion in X direction.
Further preferred embodiment of the invention is, first gantry stand and the second gantry stand in X direction between
Every setting.
Further preferred embodiment of the invention is, by the material to be processed along the direction of motion be divided into left processing district and
Right processing district, the first laser head are cut into individual part on right processing district；The second laser head is on left processing district
It is cut into individual part.
Further preferred embodiment of the invention is that the material to be processed is divided into several front and backs along the direction of motion and is handed over
For the first processing district and the second processing district of setting, the first laser head is cut into individual part on the first processing district；Institute
It states second laser head and is cut into individual part on the second processing district.
Further preferred embodiment of the invention is that the material to be processed is divided into several thirds along the direction of motion
Processing district, the first laser head and second laser head are cut into individual part on third processing district jointly.
The present invention also provides a kind of bidifly shaven head cutter device, including for placing material to be processed workbench, first
Gantry stand, the second gantry stand, first laser head, second laser head, the roller mechanism for conveying material to be processed and
Evener, evener will flatten coiled strip at material to be processed, and the material to be processed after leveling is transported to work by roller mechanism
On platform, first gantry stand and the second gantry stand are respectively mounted on the table, and the first gantry stand drives first laser
Head cuts the material to be processed on workbench, and the second portal frame drives second laser head to the object to be processed on workbench
Material is cut.
Further preferred embodiment of the invention is, the roller mechanism includes first motor and the first roller component,
The first motor can drive the first roller component to rotate, and the workbench is equipped with the second motor and the second roller component, institute
Stating the second motor can drive the second roller component to rotate, and first roller component is identical as the second roller component revolving speed.
The beneficial effects of the present invention are pass through first laser head and second while material uniform motion to be processed
Laser head is treated processing materials jointly and is cut, and processing efficiency is substantially increased.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples, in attached drawing:
Fig. 1 is the flow diagram of bidifly shaven head cutting method of the present invention；
Fig. 2 is the structural schematic diagram of bidifly shaven head cutter device of the present invention；
Fig. 3 is the distribution schematic diagram of coordinate system of the present invention；
Fig. 4 is the first structure diagram of bidifly shaven head cutting method of the present invention；
Fig. 5 is the second structural schematic diagram of bidifly shaven head cutting method of the present invention；
Fig. 6 is the third structural schematic diagram of bidifly shaven head cutting method of the present invention；
Fig. 7 is the 4th structural schematic diagram of bidifly shaven head cutting method of the present invention.
Specific embodiment
Now in conjunction with attached drawing, elaborate to presently preferred embodiments of the present invention.
As shown in Figure 1, the present invention provides a kind of bidifly shaven head cutter device, including the work for placing material to be processed
Platform 5, the first gantry stand, the second gantry stand, first laser head 1, second laser head 2, the roller for conveying material to be processed
Cylinder mechanism 3 and evener 4.Evener 4 flattens coiled strip at material to be processed, and roller mechanism 3 is by the object to be processed after leveling
Material is transported on workbench 5, and first gantry stand and the second gantry stand are installed on workbench 5, the first gantry plane
Material to be processed on frame driving 1 pair of workbench 5 of first laser head is cut, and the second portal frame drives 2 pairs of second laser head
Material to be processed on workbench 5 is cut.
The bidifly shaven head cutter device of the application further includes uncoiler 6, and storage is wound with a large amount of coiled strips in uncoiler 6, using opening
Volume machine 6 exports coiled strip, can promote the degree of automation of the present apparatus, and later, coiled strip is material to be processed by the leveling of evener 4,
Buffer area 7 is additionally provided between roller mechanism 3 and evener 4, it is ensured that reach the material to be processed at roller mechanism 3 and keep one
Fixed space rate and pushing precision.Roller mechanism 3 transports material to be processed to workbench 5 with certain speed, the
Material to be processed on 2 pairs of workbench 5 of one laser head 1 and second laser head carries out processing cutting.
As shown in Figure 1, the roller mechanism 3 includes that first motor and the first roller component 31, the first motor can drive
Dynamic first roller component 31 rotation, the workbench 5 are equipped with 51 component of the second motor and the second roller, and second motor can
The second roller component 51 is driven to rotate, first roller component 31 is identical as 51 revolving speed of the second roller component, makes object to be processed
Material remains certain movement velocity during processing cutting, while material movement to be processed, swashs by first
Shaven head 1 and second laser head 2 are treated processing materials jointly and are cut, and processing efficiency is substantially increased.
As shown in Fig. 2, the present invention also provides a kind of bidifly shaven head cutting methods, comprising the following steps:
S1, driving material uniform motion to be processed；It is further comprising the steps of before step S1: S0, to be incited somebody to action by evener
Coiled strip is flattened into material to be processed.Before cutting, setting evener 4 by material leveling to be processed, avoid cutting when material not
Smooth influence cutting effect.
It is further comprising the steps of between step S0, S1: material uniform motion to be processed is driven by roller mechanism.Pass through
Cylinder mechanism 3 is set, material to be processed is at the uniform velocity transported, structure is simple.
S2, the cutting instruction of material to be processed is divided into the first cutting instruction and the second cutting instruction；
S3, it being instructed according to first, driving first laser head is treated processing materials and is cut, while instructing according to second,
Driving second laser head is treated processing materials and is cut.In the present embodiment, while material uniform motion to be processed, lead to
It crosses first laser head 1 and second laser head 2 is treated processing materials jointly and cut, substantially increase processing efficiency.
Further, the step S3 specifically includes the following steps:
First gantry stand driving first laser head is moved along X, Y, Z-direction, makes first laser head complete independently X, Y-direction
Moving interpolation, treat processing materials and be cut by laser；
Second gantry stand driving second laser head is moved along X, Y, Z-direction, makes second laser head complete independently X, Y-direction
Moving interpolation, treat processing materials and be cut by laser；Wherein, processing materials uniform motion in X direction.
Since this bidifly shaven head cutting method is cut to the material to be processed of uniform motion, i.e., material sheet to be processed
Body has certain speed v, so actual speed when the first portal frame driving first laser head 1 moves along the x axis need to add
The speed v of material to be processed itself, the first portal frame driving first laser head 1 is mobile along the x axis while driving first laser
First 1 movement moved along the y axis is moving interpolation.
In digital control system, one is divided into three channels, and three channels are respectively channel a, channel b and channel c, channel
A is the moving interpolation for completing first laser head 1, and channel b is the moving interpolation for completing second laser head 2, and channel c is roller mechanism
3 and workbench 5 the second roller component 51 feeding campaign.Wherein there are speed overlaying relations between channel a and channel c, lead to
There are speed overlaying relations between road b and channel c.
As shown in figure 3, the processable range of frame A internal representation lathe, the range of work of frame B internal representation workpiece.First
Laser head 1 and second laser head 2 are co-located in a machine coordinates MCS and a workpiece coordinate system OCS, in first laser head
1 executed seek side movement after, the edge coordinate information of material to be processed is given to second laser head 2, it is ensured that two laser heads exist
There is same starting point in material wide direction to be processed.At this point, being equivalent in the range of work of a super large breadth, two laser heads
It is separately machined under same workpiece coordinate system, it respectively completes respective machining path and obtains workpieces processing.
Further, first gantry stand and the second gantry stand are spaced setting in X direction, make first laser head 1
Collision is not generated in process with second laser head 2, non-interference, complete independently processing order.Between two laser heads
There is no connection relationship, graphics processing Track command all derives from NC program, after completing the process a cycle, roller mechanism
3 drive material uniform motion to be processed always, carry out second round processing later, circuit sequentially.
Embodiment one
As shown in figure 4, the material to be processed is divided into right processing district I and left processing district II along the direction of motion, described
One laser head 1 is cut into individual part on right processing district I；The second laser head 2 is cut into independence on left processing district II
Part.First laser head 1 is moved in I part range always, is cut in I in one's duty materiel machining to be processed.Meanwhile the
Dual-laser head 2 moves in II part range always, cuts in II in one's duty materiel machining to be processed.The present embodiment
Individual part is by the first cut mark M1, the second cut mark M2, third cut mark M3, the 4th cut mark M4, the 5th cut mark M5 and the 6th cut mark
M6 is cut, wherein first laser head 1 is cut into the first cut mark M1, the second cut mark M2, third cut mark M3 according to the first instruction
And the 4th cut mark M4, second laser head 2 are cut into the 5th cut mark M5 and the 6th cut mark M6 according to the second instruction.First laser head
1 and second laser head 2 according to different instructions simultaneously treat processing materials cut, improve work efficiency.
Embodiment two
As shown in figure 5, the material to be processed is divided into the first processing district that several front and backs are arranged alternately along the direction of motion
P1 and the second processing district P2, the first laser head 1 are cut into individual part on the first processing district P1；The second laser head
2 are cut into individual part on the second processing district P2.The individual part of the present embodiment is by the first welding trace T1, the second welding trace T2,
Three welding trace T3, the 4th welding trace T4 and the first welding trace T5 are cut, wherein first laser head 1 is according to the first instruction in the area P1
Domain is cut into the first welding trace T1, the second welding trace T2, third welding trace T3, the 4th welding trace T4 and the first welding trace T5, while second swashs
Shaven head 2 according to second instruction the region P2 be cut into the first welding trace T1, the second welding trace T2, third welding trace T3, the 4th welding trace T4 with
And the first welding trace T5.Using this cutting mode, material to be processed can be made full use of, cost is reduced.
Embodiment three
As shown in fig. 6, the material to be processed is divided into several third processing districts P3 along the direction of motion, described first swashs
Shaven head 1 and second laser head 2 are cut into individual part on the P3 of third processing district jointly.By right simultaneously using two laser heads
Material cutting to be processed, greatly improves working efficiency.
Select such cutting mode altogether there are two types of situation, a kind of cutting method is the cutting track and the of first laser head 1
The cutting track of dual-laser head 2 is non-intersecting.As shown in fig. 6, the individual part of the present embodiment is by the 4th trace V4, the 5th trace
V5, the 6th trace V6, the 7th trace V7 and the 8th trace V8 are cut, wherein first laser head 1 is cut according to the first instruction
The 4th trace V4, the 5th trace V5 and the 6th trace V6 are cut out, meanwhile, second laser head 2 is cut into the according to the second instruction
Seven trace V7 and the 8th trace V8, first laser head 1 and second laser head 2 treat processing materials cutting simultaneously, improve work effect
Rate.
Another kind is that the cutting track of first laser head 1 intersects with the cutting track of second laser head 2, as shown in fig. 7, originally
The individual part of embodiment is cut by the first trace V1, the second trace V2 and third trace V3,1 basis of first laser head
First instruction is cut into the first trace V1, and second laser head 2 is cut into the second trace V2 and third trace V3 according to the second instruction,
Wherein, the first trace V1 and third trace V3 intersection, using this cutting method, greatly improves working efficiency.
It should be understood that the above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations, to ability
It for field technique personnel, can modify to technical solution illustrated in the above embodiments, or special to part of technology
Sign is equivalently replaced；And all such modifications and replacement, it should all belong to the protection domain of appended claims of the present invention.
Claims (10)
1. a kind of bidifly shaven head cutting method, which comprises the following steps:
S1, driving material uniform motion to be processed；
S2, the cutting instruction of material to be processed is divided into the first cutting instruction and the second cutting instruction；
S3, it is instructed according to first, driving first laser head is treated processing materials and cut, while according to the second instruction, driving
Second laser head is treated processing materials and is cut.
2. bidifly shaven head cutting method according to claim 1, which is characterized in that further include following before step S1
Step:
S0, coiled strip is flattened into material to be processed by evener.
3. bidifly shaven head cutting method according to claim 2, which is characterized in that between step S0, S1 further include with
Lower step: material uniform motion to be processed is driven by roller mechanism.
4. bidifly shaven head cutting method according to claim 1, which is characterized in that the step S3 specifically includes following step
It is rapid:
It drives first laser head to move along X, Y, Z-direction by the first gantry stand, makes first laser head complete independently X, Y-direction
Moving interpolation, treat processing materials and be cut by laser；
It drives second laser head to move along X, Y, Z-direction by the second gantry stand, makes second laser head complete independently X, Y-direction
Moving interpolation, treat processing materials and be cut by laser；Wherein, processing materials uniform motion in X direction.
5. bidifly shaven head cutting method according to claim 4, which is characterized in that first gantry stand and the second dragon
Door machine frame is spaced setting in X direction.
6. bidifly shaven head cutting method as claimed in any of claims 1 to 5, which is characterized in that will be described to be added
Work material is divided into left processing district and right processing district along the direction of motion, and the first laser head is cut into independent zero on right processing district
Part；The second laser head is cut into individual part on left processing district.
7. bidifly shaven head cutting method as claimed in any of claims 1 to 5, which is characterized in that will be described to be added
Work material is divided into the first processing district and the second processing district that several front and backs are arranged alternately along the direction of motion, and the first laser head exists
Individual part is cut on first processing district；The second laser head is cut into individual part on the second processing district.
8. bidifly shaven head cutting method as claimed in any of claims 1 to 5, which is characterized in that will be described to be added
Work material is divided into several third processing districts along the direction of motion, and the first laser head and second laser head are on third processing district
It is cut into individual part jointly.
9. a kind of bidifly shaven head cutter device, which is characterized in that including the workbench for placing material to be processed, first gantry
Rack, the second gantry stand, first laser head, second laser head, roller mechanism and leveling for conveying material to be processed
Machine, evener will flatten coiled strip at material to be processed, and the material to be processed after leveling is transported on workbench by roller mechanism,
First gantry stand and the second gantry stand are respectively mounted on the table, and the first gantry stand drives first laser head to work
The material to be processed made on platform is cut, and the second portal frame drives second laser head to carry out the material to be processed on workbench
Cutting.
10. bidifly shaven head cutter device according to claim 9, which is characterized in that the roller mechanism includes the first electricity
Machine and the first roller component, the first motor can drive the first roller component to rotate, and the workbench is equipped with the second motor
With the second roller component, second motor can drive the second roller component to rotate, first roller component and the second roller
Component revolving speed is identical.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910017111.6A CN109702355A (en) | 2019-01-08 | 2019-01-08 | A kind of bidifly shaven head cutting method and its device |
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| CN201910017111.6A CN109702355A (en) | 2019-01-08 | 2019-01-08 | A kind of bidifly shaven head cutting method and its device |
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| CN201910017111.6A Pending CN109702355A (en) | 2019-01-08 | 2019-01-08 | A kind of bidifly shaven head cutting method and its device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114985981A (en) * | 2022-07-20 | 2022-09-02 | 新代科技(苏州)有限公司 | Processing method for simultaneous feeding and cutting |
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Application publication date: 20190503 |