CN109702332B - Laser processing method and laser processing system for polaroid - Google Patents
Laser processing method and laser processing system for polaroid Download PDFInfo
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Abstract
The application relates to a laser processing method and a laser processing system of a polaroid, wherein the method comprises the following steps: acquiring target processing parameters of a polarizer to be processed, which are fixed on a processing platform, wherein the target processing parameters comprise a target processing speed and a target light-emitting frequency; the target processing speed is used for controlling the processing platform to work at the target processing speed; detecting the current movement speed of the processing platform; and adjusting the current light-emitting frequency according to the current movement speed of the processing platform and the target light-emitting frequency. By the laser processing method of the polaroid, the subsection control can be realized on the processing graph of the polaroid to be processed, different processing parameters are correspondingly adopted in different subsections, but the ratio of the processing speed to the light emitting frequency in each section is constant, namely the distance between the laser focusing light spots is constant, so that the processing effect in each section is consistent, the processing times required by each processing direction are consistent, the control process is simplified, and the production efficiency is improved.
Description
Technical Field
The present disclosure relates to the field of laser processing technologies, and in particular, to a laser processing method and a laser processing system for a polarizer.
Background
Polarizers (polarizers), all known as polarizers, control the polarization direction of a particular beam. The main function is to convert the natural light without polarization into polarized light, and control the penetration of light by the turning of liquid crystal, so as to generate the display effect of light and shade on the panel, and to control the passing degree of light by the torsion characteristic of liquid crystal molecules.
For the processing method of the polarizer, most of the methods are realized by laser. However, in the existing process of processing the polarizer by laser, due to the special polarizing property of the polarizer, the cutting times required for cutting the polarizer in different processing directions are different, the processing control process is complex, and the production efficiency is low.
Disclosure of Invention
In view of the above, it is necessary to provide a laser processing method and a laser processing system for a polarizer.
A method of laser processing a polarizer, the method comprising:
acquiring target processing parameters of a polarizer to be processed, which are fixed on a processing platform, wherein the target processing parameters comprise a target processing speed and a target light-emitting frequency; the target processing speed is used for controlling the processing platform to work at the target processing speed;
detecting the current movement speed of the processing platform;
and adjusting the current light-emitting frequency according to the current movement speed of the processing platform and the target light-emitting frequency.
In one embodiment, the acquiring target processing parameters of the polarizer to be processed fixed on the processing platform includes:
dividing a processing graph of the polaroid to be processed into a plurality of processing intervals, wherein each processing interval correspondingly acquires a group of target processing parameters.
In one embodiment, in each processing interval, the target processing speed corresponds to the target light-emitting frequency one to one, and a ratio of the target processing speed to the target light-emitting frequency is constant.
In one embodiment, the target machining parameter further comprises a threshold machining speed.
In one embodiment, the method further comprises: the target processing parameters are divided into two groups;
when the current movement speed is detected to be a first target processing speed which is less than or equal to the threshold processing speed, adjusting the current light emitting frequency to a first target light emitting frequency corresponding to the first target processing speed;
and when the current movement speed is detected to be a second target processing speed which is greater than the threshold processing speed, adjusting the current light-emitting frequency to be a second target light-emitting frequency corresponding to the second target processing speed.
In one embodiment, the target processing parameters are at least two sets; and the number of the processing intervals is at least two.
In one embodiment, the processing pattern of the polarizer to be processed comprises a pattern formed by combining straight segments and/or a pattern formed by combining circular segments.
A laser processing system for a polarizer, the system comprising: the device comprises a laser, a light path transmission module, a processing platform and a control module;
the laser is used for emitting laser beams;
the light path module is used for transmitting the laser beam and focusing the laser beam on a polarizer to be processed for processing;
the processing platform is used for placing the polaroid to be processed and driving the polaroid to be processed to move;
the control module is connected with the laser and the processing platform and used for controlling the light emitting frequency of the laser and controlling the movement speed of the processing platform.
In one embodiment, a speed sensor is disposed on the processing platform for detecting a current moving speed of the processing platform.
In one embodiment, the laser beam has a wavelength of 9.0um to 11 um.
The application provides a laser processing method and laser processing system of polaroid, through the target process velocity who obtains the polaroid of treating processing, target light-emitting frequency, in the course of working, according to target process velocity control processing platform's velocity of motion, and through the change and the target light-emitting frequency of the current velocity of motion of detection processing platform, control laser instrument adjustment current light-emitting frequency, thereby realize carrying out segmentation control on the processing figure, different segmentation corresponds and adopts different processing parameters, but guarantee that the ratio of processing velocity and light-emitting frequency in each section is invariable, namely the point interval of laser focusing facula is invariable, make the machining effect in each section unanimous, thereby guarantee that the number of times that each processing direction needs is unanimous, simplify control process, and the production efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of a laser processing system for polarizers in one embodiment;
FIG. 2 is a schematic diagram of a laser processing system for polarizers in another embodiment;
FIG. 3 is a schematic flow chart illustrating a method for laser processing a polarizer according to an embodiment;
FIG. 4 is a schematic diagram of a polarizer to be processed in an embodiment;
FIG. 5 is a flowchart illustrating a laser processing method of a polarizer according to an embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In one embodiment, the present application provides a laser processing system for a polarizer, as shown in fig. 1, including: a laser 110, an optical path module 120, a processing platform 130, and a control module 140.
Wherein, the laser 110 is used for emitting laser beams; the optical path module 120 is configured to transmit a laser beam, so that the laser beam is focused on a product to be processed on the processing platform for processing; the processing platform 130 is used for placing a product to be processed and driving the product to be processed to move; the control module 140 is connected to the laser and the processing platform, and is configured to control the light emitting frequency of the laser beam emitted by the laser 110 and control the movement speed of the processing platform 130. In one embodiment, the processing platform is provided with a displacement sensor, so that the position information of the processing platform can be fed back in real time. In the embodiment of the application, the product to be processed is a polarizer.
In one embodiment, as shown in fig. 2, the optical path module includes: an optical path transmission submodule 210, a collimation and beam expansion submodule 220, a galvanometer submodule 230 and a field lens 240. In one embodiment, a speed sensor is provided on the processing platform for detecting the current speed of movement of the processing platform. The laser emits a laser beam with a wavelength of 9.0um-11 um.
In one embodiment, as shown in fig. 3, a laser processing method for a polarizer is provided, which is described by taking the method as an example for being applied to the control module in fig. 1, and includes steps S310 to S330.
Step S310, obtaining target processing parameters of the polaroid to be processed, which is fixed on the processing platform; the target processing parameters comprise the required target processing speed and the target light-emitting frequency of the polaroid to be processed.
The target processing parameters are processing parameters of the polaroid to be processed, which are obtained through experiments, and specifically include processing parameters of each processing interval of the polaroid to be processed. Before processing, a user may input these processing parameters into the laser processing system, where these parameters are set as target processing parameters of the polarizer to be processed, so in this embodiment, the obtained processing parameters of the polarizer to be processed are recorded as the target processing parameters. The target processing speed is used for controlling the processing platform to work at the target processing speed through the control module, and the target light emitting frequency is used for controlling the laser to emit light at the target light emitting frequency. Further, in this embodiment, when the control module controls the working of the processing platform, the control module may determine the target processing speed that needs to be currently adopted by detecting the current position of the processing platform, or may control the current processing speed of the processing platform by other means.
The polarizer is called as a polarizer and can control the polarization direction of a specific light beam; the polarizer mainly functions to convert natural light without polarity into polarized light, control the penetration of light by the turning of liquid crystal, and further generate the display effect of light and shade of the panel, and control the passing degree of light by using the twisting characteristic of liquid crystal molecules. The polarizer has a multilayer structure, wherein the upper and lower surface layers are a protective film and a release film (release film), and the middle layer is a TAC (Triacetyl Cellulose) film, a PVA (polyvinyl alcohol) film, and a Pressure Sensitive Adhesive (PSA). The core film material for the polarizing function in the polarizer is a PVA film. The PVA film is dyed to adsorb iodine molecules with two-way absorption function, and the iodine molecules are stretched to arrange on the PVA film in order to form the polarizing film with homogeneous two-way absorption performance and the transmission axis is perpendicular to the stretching direction. Generally, liquid crystal displays are all oriented when displaying images, and the conversion from natural light to oriented light requires a structure for orientation selection of light, and the orientation of light requires a polarizer in addition to the liquid crystal material.
In this embodiment, a polarizer that needs to be processed by a laser processing system at present is recorded as a polarizer to be processed; the processing parameters are a series of parameters or indexes required for processing the polarizer. The processing parameters of the polarizer to be processed can be obtained through experiments, so that before processing, the control module needs to acquire the processing parameters of the polarizer and set the processing parameters as target processing parameters of the polarizer to be processed in the system, so that the processing platform and the laser are controlled to work according to the target processing parameters in the processing process. Due to the special molecular arrangement direction of the polarizer material, the processing parameters in different processing intervals are different when the polarizer is cut.
Therefore, in one embodiment, acquiring the target processing parameters of the polarizer to be processed fixed on the processing platform comprises: dividing a processing graph of the polaroid to be processed into a plurality of processing intervals, and correspondingly acquiring a group of target processing parameters in each processing interval. In one embodiment, the target processing parameters are at least two sets; the number of processing intervals is at least two.
In one embodiment, the processing pattern of the polarizer to be processed may be a pattern formed by combining straight line segments, such as a rectangle; or a figure formed by combining arc segments, such as a circle; or a graph formed by combining straight line segments and circular arc segments, and the like, wherein the processing graph is divided into a plurality of processing intervals, and each processing interval corresponds to one group of target processing parameters.
For example, in one embodiment, the processing pattern of the polarizer to be processed is divided into processing sections in the X direction (D1A1 section and BC section) and processing sections in the Y direction (A1B1 section and C1D1 section) as shown in fig. 4. In this embodiment, a set of target processing parameters is obtained for the processing section in the X direction, and a set of target processing parameters is obtained for the processing section in the Y direction.
In one embodiment, within each processing interval, the target processing speed and the target light-emitting frequency correspond to each other one by one, and the ratio of the target processing speed to the target light-emitting frequency is constant. For example, as shown in fig. 4, assuming that the target processing speed of the processing interval in the X direction is V1, the target light-emitting frequency is f1, V1 corresponds to f1, and the ratio of V1 to f1 is constant; assuming that the target processing speed of the processing section in the Y direction is V2, the target light emitting frequency is f2, V2 corresponds to f2, and the ratio of V2 to f2 is constant.
In one embodiment, the ratio of the processing speed to the light-emitting frequency in one processing interval is recorded as the dot pitch. The dot pitch represents the interval between the laser spots acting on the product to be processed, and if uniform processing effect is to be obtained, the dot pitch value on a section of processing track needs to be ensured to be consistent. In the embodiment, different processing parameters are set in different processing intervals before the processing process, so that the point intervals of the processing intervals of the polaroid to be processed are kept unchanged, and the cutting times required by the processing intervals are consistent. Further, the dot pitch in each processing section is determined according to the laser energy required in each processing section.
In one embodiment, the dot spacing d is expressed in terms of the optical frequency f and the processing speed v: d is v/f. It can be understood that the polarizer to be processed is placed on the processing platform during the processing process, and thus the current moving speed on the processing platform is also the current moving speed of the product to be processed.
Further, in this embodiment, after the control module obtains the laser energy required in each processing direction of the polarizer to be processed, according to the frequency of the laser emitted by the laser of the laser processing system, a corresponding point interval may be set in each processing direction of the polarizer to be processed, and the setting of the point interval needs to keep the cutting times in each processing direction of the polarizer to be processed consistent, for example, by setting the point intervals in different processing directions, the different processing directions of the polarizer to be processed can all complete the whole-piece cutting through one processing process; or the polarizer to be processed is cut into a whole piece through two processing procedures in the same way in different processing directions.
In one embodiment, when the processing parameters of the polarizer to be processed are obtained, the dot pitch that should be set in each processing direction of the polarizer may also be obtained.
In one embodiment, the part for controlling the processing platform and the control part for controlling the laser are two independent control sub-modules, but the two sub-modules can acquire the information of each other. In the machining process, the control module may determine a position currently being machined according to the position of the machining platform, so as to control the current movement speed of the machining platform to be set to a corresponding target machining speed, for example, if the control module determines that the machining interval in the X direction is currently machined, the control module controls the machining platform to move at the target machining speed in the X direction. Or, in an embodiment, before processing the polarizer to be processed, the control module further needs to set parameters such as a target trajectory, and in this embodiment, the control module may further determine a current processing position according to the target trajectory.
And step S320, detecting the current movement speed of the processing platform.
The processing platform needs to set the processing track of the polarizer to be processed and the processing speed in each processing section before starting processing. The setting of the processing track is set according to the processing graph of the polaroid to be processed, in one embodiment, the target processing speed is obtained by obtaining the target processing parameter of the polaroid to be processed before processing, and in the processing process, a control module for controlling the processing platform controls the processing platform to work at the corresponding (corresponding to the processing interval) target processing speed in each processing interval; in this embodiment, the control sub-module for controlling the laser knows the current speed of movement of the machining platform from the machining platform control sub-module. It is to be understood that setting the machining trajectory and the machining speed in each machining direction before machining can be accomplished in any manner that can be achieved.
In this embodiment, the current moving speed of the processing platform is the actual moving speed of the current processing platform. In some embodiments, since the processing pattern of the polarizer to be processed is not a straight line, for example, a circular arc segment, the speed of the processing platform may be non-uniform during the processing of the circular arc segment.
And step S330, adjusting the current light-emitting frequency based on the current motion speed of the processing platform and the target light-emitting frequency.
Wherein the laser emits laser light, the single pulse energy of which remains fixed, but the frequency of the pulses can be adjusted. Therefore, in the embodiment, the energy density of the distribution of each processing section of the polarizer to be processed is made different by controlling and changing the light emitting frequency of the laser according to the processing section during the processing process, so that the cutting times of each processing section are kept consistent. In one embodiment, the laser emits laser light having a wavelength of 9.0um to 11 um.
Further, in one embodiment, the target processing parameters of the polarizer to be processed are divided into two groups; i.e. the processing intervals are divided into two groups.
In this embodiment, the target machining parameter further includes a threshold machining speed. Because the required laser energy is different in different processing directions of the polaroid, when the cutting times in all the processing directions are required to be consistent, the processing speeds of the processing platforms are different when the laser spots are positioned in all the processing sections of the polaroid to be processed.
Further, when the current movement speed is detected to be a first target processing speed which is less than or equal to the threshold processing speed, the current light emitting frequency is adjusted to be a first target light emitting frequency corresponding to the first target processing speed. And when the current movement speed is detected to be a second target processing speed which is greater than the threshold processing speed, adjusting the current light-emitting frequency to be a second target light-emitting frequency corresponding to the second target processing speed.
In the above embodiment, it is assumed that the target processing parameters are two sets, which are respectively a first target processing parameter and a second target processing parameter, and it is assumed that a first target processing speed in the first target processing parameter is less than or equal to a threshold acceleration and a second target processing speed in the second target processing parameter is greater than the threshold processing speed. When the current movement speed is less than or equal to the threshold processing speed, the control module determines that the laser is currently processing with the first target processing parameter, so that the laser is controlled to emit light at a first target light emitting frequency in the first target processing parameter, namely, the current light emitting frequency is adjusted to be the first target light emitting frequency; and when the current movement speed is detected to be greater than the threshold processing speed, adjusting the current light-emitting frequency to be a second target light-emitting frequency. In this embodiment, it can also be understood that the control module determines, according to a relationship between the current movement speed and the threshold processing speed, which processing interval of the polarizer to be processed the current laser spot is located in, so as to determine which set of target light emitting frequencies should be currently adopted, and further, may adjust the current light emitting frequency to the set of target light emitting frequencies.
In the embodiment where the processing pattern of the polarizer to be processed is rectangular, two parallel sides are set as the same processing interval, so that the polarizer to be processed with the rectangular processing pattern includes two processing intervals. In another embodiment, the processing pattern of the polarizer to be processed may also be a rectangle with four corners at the inner corners as R corners; for example, the processing pattern shown in fig. 4, the processing pattern of the polarizer to be processed shown in fig. 4, when the polarizer is processed to the R corner, the speed of the processing platform is not uniform.
In one embodiment, if the current movement speed is detected to be the target processing speed, controlling and adjusting the light emitting frequency to be the corresponding target light emitting frequency; if it is detected that the current movement speed is not completely consistent with the target processing speed, for example, in a processing interval of an arc segment, the processing speed is not uniform, and therefore the speed may change constantly, and at this time, due to the property that the ratio of the target processing speed to the target light emitting frequency is constant in each processing interval, the control module determines the current light emitting frequency according to the current movement speed and the ratio.
Specifically, for example, the target processing speed of the current processing interval is v1, the target light emitting frequency is f1, the ratio of v1 to f1 is d1, and when the current movement speed is detected to be v, the control module adjusts the current light emitting frequency to be the ratio f of v to d1, so that the point distance in the processing interval is ensured to be unchanged, and the processing effects are consistent.
In the laser processing method of the polaroid, the target processing speed and the target light-emitting frequency of the polaroid to be processed are obtained, in the processing process, the moving speed of the processing platform is controlled according to the target processing speed, the change of the current moving speed of the processing platform and the target light-emitting frequency are detected, the laser is controlled to adjust the current light-emitting frequency, the segmentation control on the processing graph is realized, different segmentation corresponds to different processing parameters, the constant ratio of the processing speed to the light-emitting frequency in each segment is ensured, namely the constant point interval of laser focusing light spots is ensured, the processing effect in each segment is consistent, the consistent processing times required by each processing direction are ensured, the control process is simplified, and the production efficiency is improved.
In an embodiment, taking the polarizer to be processed as a processed figure in the shape shown in fig. 4 as an example, the process of describing the laser processing method of the polarizer in detail is performed, and a direction X and a direction Y are set for the polarizer to be processed as shown in the figure, wherein A, B, C, D four points are intersection points of a straight line segment and a circular arc segment on a processing track, and a1, B1, C1 and D1 are switching points of speeds on the processing track; that is, the segments D1A1 and B1C1 are a machining interval, and are denoted as machining interval X, and the segments A1B1 and C1D1 are a machining interval (assuming that the machining locus is clockwise), and are denoted as machining interval Y. According to the actual test results, the A1, B1, C1, D1 and A, B, C, D have slight deviation, but the distance is short, the length of AA1 is small, so the influence of the deviation on the actual cutting effect can be ignored. Fig. 5 is a schematic flow chart of a laser processing method of a polarizer in this embodiment.
Before the processing is started, the control module obtains target processing parameters of the polarizer to be processed, wherein the target processing parameters comprise a target processing speed v1 and a target light-emitting frequency f1 of a processing interval X, a target processing speed v2 and a target light-emitting frequency f2 of a processing interval Y, and a threshold processing speed v 0. The ratio of v1 to f1 in the processing interval X is d1, and the ratio of v2 to f2 in the processing interval Y is d 2; wherein v1 is not more than v0, and v2 is more than v 0.
After the processing is started, the processing platform is provided with the displacement sensor, and the control module obtains the current position of the processing platform by obtaining the parameters of the displacement sensor, so that the current processing position of the laser spot on the polaroid to be processed can be determined, and further the processing interval of the polaroid to be processed in which the laser spot is located can be determined, so that the target processing speed which should be adopted at present can be determined, and the control module adjusts the current movement speed to the target processing speed. For example, when the current machining interval X is detected, the control module controls the current movement speed of the machining platform to be v 1.
And detecting the motion speed v of the current processing platform in real time. When v is judged to be constant and v is not more than v0, namely the current processing interval X is located, the control module adjusts the current light emitting frequency to be f 1; when it is determined that v is not at a constant speed and v is not greater than v0, the control module adjusts the current light emitting frequency to be f 1' which is the ratio of v to d 1.
When v is judged to be constant and v is greater than v0, namely the current position is in the processing interval Y, the control module adjusts the current light emitting frequency to be f 2; when it is determined that v is not at a constant speed and v is not greater than v0, the control module adjusts the current light emitting frequency to be f 2' which is the ratio of v to d 2.
In this embodiment, the processing stage A1B1 is a uniform motion, and the processing stage D1A1 has a process of deceleration-acceleration-uniform-deceleration-acceleration, so that in the stage D1A1, the light-emitting frequency of the laser is controlled by detecting the motion speed and position of the processing platform in real time, according to the ratio of the target processing speed to the target light-emitting frequency in the stage and the current motion speed, and the inter-dot distance is kept to D1, so as to achieve a uniform processing effect. In another embodiment, after the current movement speed of the processing platform is obtained, the current processing direction is determined by comparing the current movement speed with the processing speed threshold, so as to determine the distance between the target points set at the current position, and further adjust the light emitting frequency of the laser in real time.
According to the polaroid processing method, the piecewise parameter control is carried out on the polaroid according to the material characteristics of the polaroid, the moving speed of the moving shaft of the processing platform is monitored, and when the moving speed of the shaft reaches a preset critical speed value v0, the energy distribution density of the processing interval in the X direction and the Y direction is made to form difference by changing the light emitting frequency f of a laser and adjusting the value of the point interval, so that the times required for cutting off in the X processing direction and the Y processing direction are kept consistent, and the processing flow is complete; in the cutting process of the whole sample wafer, the platform moves uninterruptedly without pause, thereby improving the production efficiency.
It should be understood that, although the steps in the flowcharts of fig. 3 and 5 are shown in sequence as indicated by the arrows, the steps are not necessarily performed in sequence as indicated by the arrows. The steps are not performed in the exact order shown and described, and may be performed in other orders, unless explicitly stated otherwise. Moreover, at least some of the steps in fig. 3 and 5 may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of performing the sub-steps or stages is not necessarily sequential, but may be performed alternately or alternately with other steps or at least some of the sub-steps or stages of other steps.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (8)
1. A method of laser processing a polarizer, the method comprising:
acquiring target processing parameters of a polarizer to be processed, which are fixed on a processing platform, wherein the target processing parameters comprise a target processing speed, a target light-emitting frequency and a threshold processing speed; the target processing speed is used for controlling the processing platform to work at the target processing speed; the processing graph of the polaroid to be processed is divided into a plurality of processing intervals, and each processing interval is provided with a group of target processing parameters; in each processing interval, the target processing speed corresponds to the target light-emitting frequency one by one, and the values of the point intervals are consistent, wherein the point intervals are the ratio of the target processing speed to the target light-emitting frequency, the laser energy required in each processing direction of the polaroid to be processed is different, and the point intervals in each processing interval are determined according to the laser energy required in each processing interval;
detecting the current movement speed of the processing platform;
adjusting the current light-emitting frequency according to the current movement speed of the processing platform and the target light-emitting frequency;
when the target processing parameters are two groups, the method further comprises the following steps:
when the current movement speed is detected to be a first target processing speed which is less than or equal to the threshold processing speed, adjusting the current light emitting frequency to a first target light emitting frequency corresponding to the first target processing speed;
and when the current movement speed is detected to be a second target processing speed which is greater than the threshold processing speed, adjusting the current light-emitting frequency to be a second target light-emitting frequency corresponding to the second target processing speed.
2. The laser processing method of a polarizer according to claim 1, wherein when the processed pattern of the polarizer to be processed is rectangular, two sides parallel to each other are set to be the same processing section.
3. The laser processing method of a polarizer according to claim 1, wherein the dot pitch that should be set in each processing direction of the polarizer to be processed is obtained when target processing parameters of the polarizer to be processed are obtained.
4. The laser processing method of a polarizer according to claim 1, wherein when the processing pattern of the polarizer to be processed is a rectangle with four corners at the inner corners being the R corners, the speed of the processing platform is non-uniform when the processing pattern reaches the R corners.
5. The laser processing method of the polarizer according to claim 3, wherein the processed pattern of the polarizer to be processed comprises a pattern formed by combining straight segments and/or a pattern formed by combining circular segments.
6. A laser processing system for a polarizer, the system comprising: the device comprises a laser, a light path transmission module, a processing platform and a control module;
the laser is used for emitting laser beams;
the optical path transmission module is used for transmitting the laser beam and focusing the laser beam on a polarizer to be processed for processing;
the processing platform is used for placing the polaroid to be processed and driving the polaroid to be processed to move;
the control module is connected with the laser and the processing platform and is used for controlling the light emitting frequency of the laser and controlling the movement speed of the processing platform;
the control module is specifically used for acquiring target processing parameters of a polarizer to be processed, which are fixed on the processing platform, wherein the target processing parameters comprise a target processing speed, a target light emitting frequency and a threshold processing speed; the target processing speed is used for controlling the processing platform to work at the target processing speed; the processing graph of the polaroid to be processed is divided into a plurality of processing intervals, and each processing interval is provided with a group of target processing parameters; in each processing interval, the target processing speed corresponds to the target light-emitting frequency one by one, and the values of the point intervals are consistent, wherein the point intervals are the ratio of the target processing speed to the target light-emitting frequency, the laser energy required in each processing direction of the polaroid to be processed is different, and the point intervals in each processing interval are determined according to the laser energy required in each processing interval;
when the target processing parameters are two groups, the control module adjusts the current light-emitting frequency to a first target light-emitting frequency corresponding to the first target processing speed when detecting that the current movement speed is the first target processing speed which is less than or equal to the threshold processing speed; and when the current movement speed is detected to be a second target processing speed which is greater than the threshold processing speed, adjusting the current light-emitting frequency to a second target light-emitting frequency corresponding to the second target processing speed.
7. The laser machining system of claim 6, wherein a speed sensor is disposed on the machining platform for detecting a current speed of movement of the machining platform.
8. The laser machining system of claim 6, wherein the laser beam has a wavelength of 9.0um to 11 um.
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| CN110238544B (en) * | 2019-07-22 | 2021-08-03 | 深圳市牧激科技有限公司 | Laser thinning method and laser machine |
| CN113134687B (en) * | 2020-01-17 | 2022-08-05 | 深圳怡钛积科技股份有限公司 | Method for cutting circular hole of polaroid by laser |
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