CN109698411A - Electronic building brick and its conduct piece plant ball construction - Google Patents

Abstract

A kind of electronic building brick and its conduct piece plant ball construction, including the first functional module, second functional module and be located at first, third functional module between second functional module, first, second functional module is respectively arranged with conductive spacer, the electronic building brick further includes conduct piece and solder, conduct piece include flat part and respectively from flat part both ends extend the first leg and the second leg, first leg is welded in the conductive spacer of the first functional module, second leg is welded in the conductive spacer of the second functional module, every one first, second leg includes weld part, weld part is equipped with upper, lower surface and on described, the through-hole of lower surface, first, second leg includes from the hook part of the end reflexed of weld part, solder is placed on through hole and is clamped between hook part and weld part, weld part is welded on pair by solder by hot melt On the conductive spacer answered, so stable electrical connection can be formed between the first, second functional module being located at except third functional module.

Description

Electronic building brick and its conduct piece plant ball construction

[technical field]

The present invention relates to a kind of electronic building bricks and its conduct piece to plant ball construction, especially a kind of in electronic equipment Electronic building brick and its conduct piece plant ball construction.

[background technique]

Electric connector is very widely used in electronic field, and component in the electronic device and component, component and system are There is utilization between system and system, be electrically connected and signal transmits, is to constitute the necessary base set of holonomic system institute Part.Electric connection, fixed form can be realized by being usually soldered in circuit board or other electronic building bricks by conductive terminal Conductive terminal is generally welded and fixed to circuit board or electronic building brick with tin material, however the placement of tin material and terminal shape are to this The welding situation of terminal influences huge.The prior art such as U.S. Patent No. 6,095,842, the 6th, 099, No. 321 and 6,267, No. 61, be the terminal plant ball construction for disclosing existing electric connector.Wherein, the terminal and circuit board welding (not shown) It is preceding to plant tin material in advance in terminal ends, and the pre- process for planting tin material, it is first to be coated with one layer of scaling powder in terminal ends, it is viscous by it Property tin material is pre-positioned, be then heated to certain temperature make tin material part melt and be fixed in terminal ends.

But the process that existing electric connector terminal plants tin material in advance at least has the disadvantage in that firstly, because terminal sizes It is smaller, when terminal ends are coated with scaling powder, maloperation easily occurs and makes also to be stained with scaling powder on the contact portion of terminal, thus Cause terminal contact portion resistance to increase, and keep telecommunication transmission quality bad, and its terminal generallys use the side of one end scolding tin connection Formula, it is weaker for the electrical connection stability between multiple electronic components being spaced apart.Secondly, planting the technology of tin material not in advance Preferable tin material fixed form is provided, and the connection between conductive terminal and electric connector is easy there are unstable situations And often in be electrically connected with isolated two states, be thus just easy to cause be welded and fixed effect difference and influence be electrically connected into And influence signal transmission effect.

Based on the prior art, it is necessory to be improved to disadvantages described above.

[summary of the invention]

There is preferable solder fixed form the purpose of the present invention is to provide one kind and can make conduct piece and circuit board or Terminal between electronic building brick with preferable welding quality plants ball construction, the connection which can be stable by two electronic components.

To achieve the above object, the present invention adopts the following technical scheme: a kind of electronic building brick, including the first functional module, Second functional module and the third functional module between first, second functional module, first, second function Module is respectively arranged with conductive spacer, and the electronic building brick further includes conduct piece and solder, and the conduct piece includes flat part And the first leg and the second leg extended respectively from the flat part both ends, the first leg are welded in the first functional module Conductive spacer, the second leg are welded in the conductive spacer of the second functional module, and each first, second leg includes welding Portion, the weld part are equipped with upper and lower surfaces and the through-hole through the upper and lower surfaces, and first, second leg includes certainly The hook part of the end reflexed of the weld part, the solder be placed on the through hole and be clamped in the hook part and weld part it Between, the weld part is welded on corresponding conductive spacer by the solder by hot melt.

Further, first, second leg is equipped with the hook part of a pair of end reflexed from the weld part, described Shape forms an angle between hook part and weld part.

Further, the area of the through-hole is less than the area of the maximum cross-section of the solder, the downward projection of solder The lower surface of the weld part out can be flowed down along the through-hole after the solder melted by heating.

Further, the solder includes tin material and coating and the scaling powder on tin material surface, the tin material and is helped The weld part is respectively welded to first, second functional module by way of hot melt by solder flux.

Further, the solder passes through the through-hole and stretches out the lower surface of the weld part downwards to lead with described Contact is constituted between electrical pad piece, forms a gap between the weld part and conductive spacer, by the weldering after the solder hot melt Socket part is welded and fixed on the conductive spacer.

Further, first, second leg includes the interconnecting piece for being connected to the flat part and weld part, described Weld part is horizontally extending and parallel with the plane where the flat part, and the interconnecting piece of first, second leg is certainly The both ends of the flat part are bent in the same direction to be extended to form and the relatively described flat part and weld part are obliquely installed.

Further, the flat part is pasted and fixed in the third functional module, and the electronic building brick is at least distinguished Three first, second legs of interval setting.

To achieve the above object, following technical solution also can be used in the present invention: a kind of conduct piece plant ball construction, including solder And for generating the conduct piece being electrically connected between electronic building brick, the conduct piece includes flat part and respectively from the plate The first leg and the second leg that portion both ends extend, first, second leg includes for being welded and fixed to electronic building brick Weld part, the weld part is equipped with upper and lower surfaces and the through-hole through the upper and lower surfaces, and first, second leg is equal Hook part including the end reflexed from the weld part, the solder are placed on the through hole and are clamped in the hook part and weldering Between socket part.

Further, first, second leg is equipped with the hook part of a pair of free terminal reflexed from the weld part, Shape forms an angle between the hook part and weld part, and the area of the through-hole is less than the area of the maximum cross-section of the solder, The solder stretches out downwards the lower surface of the weld part, can flow down along the through-hole after the solder melted by heating.

Further, the solder is tin material, and the weld part is soldered to institute by the hot melting way of laser spot welding State electronic building brick.

It compared with prior art, can be spaced more the invention has the following beneficial effects: setting conduct piece is passed through Stable electric connection is realized between a electronic component, the weld part of conductive terminal includes setting the biggish of the solder for holding in the palm Through-hole and from its end reflexed extend hook part, solder can be held fixedly between hook part and weld part in order to transport Defeated, the solder after melting can be smoothly flowed down along through-hole to obtain preferable welding effect.

[Detailed description of the invention]

Fig. 1 is the perspective view that electronic building brick and its conduct piece of the present invention plant ball construction.

Fig. 2 is the decomposition diagram that electronic building brick shown in Fig. 1 and its conduct piece plant ball construction.

Fig. 3 is decomposition diagram when Fig. 2 does not add scaling powder.

Fig. 4 is the perspective view that conduct piece shown in Fig. 3 plants that ball constructs another angle.

Fig. 5 is the decomposition diagram that conduct piece shown in Fig. 3 plants ball construction.

Fig. 6 is cross-sectional view of the Fig. 1 along line A-A.

[main element symbol description]

1000 weld part 43 of electronic building brick

First functional module, 1 through-hole 430

Conduct piece plants ball and constructs 100 upper surfaces 431

Conductive spacer 11,21 lower surfaces 432

Second functional module, 2 hook part 44

3 interconnecting piece 45 of third functional module

4 frame oral area 46 of conduct piece

40 solder 5 of flat part

First leg, 41 tin material 51

Second leg, 42 gap 6

[specific embodiment]

Hereinafter, Fig. 1 to Fig. 6 will be combined to introduce the specific embodiment party that electronic building brick and its conduct piece of the present invention plant ball construction Formula.Electronic building brick 1000 of the invention is to install to an electronic equipment (not shown) to transmit signal message.The electronics group Part 1000 includes the first functional module 1, the second functional module 2, between the first functional module 1 and the second functional module 2 Third functional module 3, conduct piece 4 and solder 5, the conduct piece 4 and solder 5 form conduct piece of the invention and plant ball construction 100. First, second functional module 1,2 is respectively arranged with conductive spacer 11,21, the conduct piece 4 include flat part 40 and respectively from The first leg 41 and the second leg 42 that 40 both ends of flat part extend, the first leg 41 are welded in the first functional module 1 Conductive spacer 11, the second leg weldering 42 are connected to the conductive spacer 21 of the second functional module 2.

With continued reference to Fig. 1 to Fig. 6, each first, second leg 41,42 includes weld part 43, the weld part 43 are equipped with upper and lower surfaces 431,432 and the through-hole 430 through the upper and lower surfaces 431,432, first, second leg 41,42 include from the hook part 44 of the end reflexed of the weld part 43, and the solder 5 is placed at the through-hole 430 and presss from both sides It holds between the hook part 44 and weld part 43, the weld part 43 is welded on corresponding conduction by hot melt by the solder 5 On gasket 11,21.In the present embodiment, first, second leg 41,42 is equipped with a pair of from the end of the weld part 43 The hook part 44 of reflexed, shape forms an angle between the hook part 44 and weld part 43, so as to facilitate the clamping solder 5.At it In his embodiment, the through-hole 430, which can also further run through to the direction of 43 end of weld part, to be extended to form nick shaped, thus The area for further increasing the through-hole 430, after expanding 5 heating melting of solder while guaranteeing solder 5 by stable holding The space circulated downwards help to obtain preferable welding effect.The electronic building brick 1000 is at least respectively separated setting three First, second leg 41,42, under optimal cases, first leg 41 and the second leg 42 be disposed as three and point It is not symmetricly set on the opposite end of the flat part 40.

The flat part 40 further includes frame oral area 46, and the frame oral area 46 is closer to the second leg 42, the flat part 40 are pasted and fixed in the third functional module 3 by glue, after glue can be first coated in the third functional module 3 The flat part 40 is set up thereon again, it can also first coating glue sets up fixation again on the lower surface of the flat part 40 To the third functional module 3.

The area of the through-hole 430 is less than the area of the maximum cross-section of the solder 5, so that the solder 5 can dash forward downwards The lower surface 432 of the weld part 43 is stretched out, can be flowed down along the through-hole 430 after 5 melted by heating of solder.In conjunction with such as Fig. 6 Shown, the solder 5 passes through the through-hole 430 and stretches out the lower surface 432 of the weld part 43 downwards with first, second Contact, shape between the weld part 43 and conductive spacer 11,21 are constituted between the conductive spacer 11,21 of functional module 1,2 At a gap 6, the solder 5 can fill up the gap 6 to which the weld part 43 is welded and fixed to the conduction after heating On gasket 11,21.

In the present embodiment, the solder 5 includes helping in spherical tin material 51 and coating and 51 surface of tin material Solder flux (does not indicate).The weld part 43 is respectively welded to by way of hot melt described by the tin material 51 and scaling powder together On the conductive spacer 11,21 of first, second functional module 1,2.Meanwhile the hot melting way is laser spot welding.

As shown in Figures 2 to 5, the main assembling process of solder 5 is as follows: the tin material 51 being placed on the conduct piece first On the through-hole 430 at 4 both ends, the tin material 51 is placed in due to stretching out the lower surface 432 of the weld part 43 by support is stablized In the through-hole 430；Secondly, by the scaling powder paste coat to 51 periphery of tin material and fill up the hook part 44 with Space between weld part 43 so that the solder 5 by stable holding；Then, in the lower surface of 4 flat part 40 of conduct piece And/or the upper surface of the third functional module 3 applies glue；Then, then by the conduct piece 4 it is bonded to the third function Module 3, while the first, second leg 41,42 is respectively placed in the conductive spacer 11,21 of first, second functional module 1,2 On；Finally, the tin material 51 for being coated with the scaling powder carries out laser spot welding or high temperature hot melt and makes it from the through-hole 430 Conductive spacer 11,21 is flowed into, just makes the conduct piece 4 form stable electrical property with the first, second module 1,2 after cooling and connects It connects.First functional module 1 mainly absorbs various signals, and some of signals, such as optical signal are transferred to described Three functional modules 3；It is real can will to be located at the first, second functional module except third functional module 1,2 by the conduct piece 4 Now stable electric connection, so that other signals, such as electronic signal can be transmitted between the first, second functional module 1,2. It is possible thereby to which each signal is made to stablize independent transmission without interruption, mutually to induction signal message.

First, second leg 41,42 includes the interconnecting piece 45 for being connected to the flat part 40 and weld part 43, institute It is horizontally extending and parallel with the plane where the flat part 40 to state weld part 43, first, second leg 41,42 Interconnecting piece 45 bend and extend to form and the relatively described flat part 40 and weld part 43 incline in the same direction from the both ends of the flat part 40 Tiltedly setting.The interconnecting piece 45 has elasticity so that the conduct piece 4 is before welding to first, second functional module 1,2 Precompression is formed to adapt to the elastic demand under different situations.

In conclusion electronic building brick of the present invention and its conduct piece plant ball construction, by setting conduct piece and its ball construction is planted, Stable electric connection can be realized between spaced multiple electronic components；By the way that the flexible connection is arranged Portion can also promote the precompression between the conduct piece and the functional module to adapt to the elastic demand under different situations； Meanwhile the weld part of conductive terminal be provided with for hold in the palm set the solder biggish through-hole and from its end reflexed extend Hook part, the solder that can be held fixedly solder in order to transport between hook part and weld part, after melting can be suitable along through-hole Benefit is flowed down to obtain preferable welding effect.

The foregoing is merely some embodiments of the invention, the embodiment being not all of, ordinary skill people Any equivalent variation that member takes technical solution of the present invention by reading description of the invention, is right of the invention It is required that being covered.

Claims (10)

1. a kind of electronic building brick, including the first functional module, the second functional module and it is located at first, second functional module Between third functional module, first, second functional module is respectively arranged with conductive spacer, it is characterised in that: the electricity Sub-component further includes conduct piece and solder, and the conduct piece includes flat part and extends respectively from the flat part both ends First leg and the second leg, the first leg are welded in the conductive spacer of the first functional module, and the second leg is welded in the second function Can module conductive spacer, each first, second leg includes weld part, the weld part be equipped with upper and lower surfaces and Through the through-hole of the upper and lower surfaces, first, second leg include from the hook part of the end reflexed of the weld part, The solder is placed on the through hole and is clamped between the hook part and weld part, and the solder is by hot melt and by the weldering Socket part is welded on corresponding conductive spacer.

2. electronic building brick as described in claim 1, it is characterised in that: first, second leg is equipped with a pair of described in The hook part of the end reflexed of weld part, shape forms an angle between the hook part and weld part.

3. electronic building brick as claimed in claim 2, it is characterised in that: the maximum that the area of the through-hole is less than the solder is cut The area in face, the solder stretch out downwards the lower surface of the weld part, can be along the through-hole after the solder melted by heating It flows down.

4. electronic building brick as described in claim 1, it is characterised in that: the solder includes tin material and coating and the tin material The weld part is respectively welded to described first, by way of hot melt by the scaling powder on surface, the tin material and scaling powder Two functional modules.

5. electronic building brick as described in claim 1, it is characterised in that: the solder passes through the through-hole and stretches out institute downwards It states the lower surface of weld part to contact to be constituted between the conductive spacer, be formed between one between the weld part and conductive spacer The weld part is welded and fixed on the conductive spacer by gap, the solder after heating.

6. electronic building brick as described in claim 1, it is characterised in that: first, second leg include be connected to it is described The interconnecting piece of flat part and weld part, the weld part is horizontally extending and parallel with the plane where the flat part, The interconnecting piece of first, second leg bent in the same direction from the both ends of the flat part extend to form and the relatively described flat part and Weld part is obliquely installed.

7. such as electronic building brick of any of claims 1-6, it is characterised in that: the flat part is pasted and fixed on described In third functional module, the electronic building brick is at least respectively separated three first, second legs of setting.

8. a kind of conduct piece plants ball construction, special including solder and for generating the conduct piece being electrically connected between electronic building brick Sign is: the conduct piece include flat part and respectively from the flat part both ends extend the first leg and the second leg, First, second leg includes the weld part for being welded and fixed to electronic building brick, and the weld part is equipped with upper and lower surfaces And the through-hole through the upper and lower surfaces, first, second leg include the hook from the end reflexed of the weld part Portion, the solder are placed on the through hole and are clamped between the hook part and weld part.

9. conduct piece as claimed in claim 8 plants ball construction, it is characterised in that: first, second leg is equipped with a pair From the hook part of the free terminal reflexed of the weld part, shape forms an angle between the hook part and weld part, the through-hole Area is less than the area of the maximum cross-section of the solder, and the solder stretches out downwards the lower surface of the weld part, the weldering It can be flowed down along the through-hole after material melted by heating.

10. conduct piece as claimed in claim 8 plants ball construction, it is characterised in that: the solder is tin material, and passes through laser point The weld part is soldered to the electronic building brick by the hot melting way of weldering.