CN109698167A - The method of stress release during alleviation ceramic package - Google Patents
The method of stress release during alleviation ceramic package Download PDFInfo
- Publication number
- CN109698167A CN109698167A CN201811574860.0A CN201811574860A CN109698167A CN 109698167 A CN109698167 A CN 109698167A CN 201811574860 A CN201811574860 A CN 201811574860A CN 109698167 A CN109698167 A CN 109698167A
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- Prior art keywords
- wall
- chassis
- destressing
- ceramic
- release during
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- Pending
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- 239000000919 ceramic Substances 0.000 title claims abstract description 107
- 238000000034 method Methods 0.000 title claims abstract description 48
- 229910000679 solder Inorganic materials 0.000 claims abstract description 34
- 238000003466 welding Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 7
- 238000012360 testing method Methods 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims description 5
- 238000004364 calculation method Methods 0.000 claims description 4
- 229910000833 kovar Inorganic materials 0.000 claims description 4
- 230000008569 process Effects 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 238000009825 accumulation Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract description 2
- 238000012536 packaging technology Methods 0.000 abstract description 2
- 238000006243 chemical reaction Methods 0.000 description 4
- 208000037656 Respiratory Sounds Diseases 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4817—Conductive parts for containers, e.g. caps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Abstract
The present invention provides a kind of methods of stress release during alleviation ceramic package, belong to ceramic packaging technology field, including chassis, ceramic body on chassis and the wall on chassis, ceramic body is placed in the one end on chassis, one end of wall is equipped with the opening for ceramic body to be arranged, one end that wall connects with ceramic body and chassis is equipped with the destressing groove extended along seam, destressing groove is arranged in the inner wall surface of wall, inner wall of the destressing groove close to ceramic body and chassis is overlapped with ceramic body and chassis contact surface, the slot bottom of destressing groove is lower than the inner wall surface of wall.The method of stress release during alleviation ceramic package provided by the invention, increase destressing destressing groove in the sensitive position that wall and ceramic member and chassis weld, portion of residual stress is absorbed by accumulation solder, make ceramic stress point far from structural weak point, and then fails caused by alleviating ceramics and being mismatched in metal parts encapsulation process as thermal expansion coefficient.
Description
Technical field
The invention belongs to ceramic packaging technology fields, are to be related to answering during a kind of alleviation ceramic package more specifically
The method of power release.
Background technique
With the arrival in 5G epoch, ceramet shell with higher performance, it is more highly integrated, be more difficult structure, more unmanageable
Posture challenges optical communication field.Due to the mismatch of ceramics and thermal expansion metal coefficient, residual stress is formed in welding process
Reduce bonding strength, therefore Ceramic and metal joining generate residual stress calculating, measurement, alleviation be engineering ceramics in the application
One of the critical issue that must be solved.And the alleviation of residual stress more becomes the most important thing.At present to the alleviation of residual stress
Mode mainly using stress relief layer is added, is designed reasonable connection structure, is made using the methods of reasonable Joining Technology, but by shell
It is needed to seek other means when structure change can not be carried out and technique changes with influence and goes to discharge or alleviate existing remnants
Stress.
Summary of the invention
The purpose of the present invention is to provide a kind of methods of stress release during alleviation ceramic package, to solve existing skill
The technical issues of residual stress present in art influences casing rigidity.
To achieve the above object, the technical solution adopted by the present invention is that: stress during a kind of alleviation ceramic package is provided
The method of release,
The described method includes:
Destressing destressing groove is arranged along soldered in the one end to connect on wall with ceramic body and chassis, according to ceramics
Body yield strength and chassis deformation requirement, utilize the size of destressing groove described in FEM calculation；
Calculate amount of solder；
Combination Welding is assembled on wall, ceramic body and chassis；
Residual stress contrast test.
Further, the distance between the wall face of the slot bottom of the destressing groove to the wall is greater than or equal to
0.1mm。
Further, the width of the destressing groove is less than or equal to 0.2mm.
Further, the chassis is tungsten copper material.
Further, the material of the wall is kovar alloy.
Further, the wall face of the wall is concordant with the surrounding lateral surface on the chassis.
Further, there are three the outsides that continuous lateral surface is exposed to the wall for the ceramic body tool, wherein being located at three
An intermediate lateral surface protrudes from the chassis, and two to be parallel to each other lateral surface is concordant with the lateral surface on the chassis.
Further, the lateral surface that the ceramic body protrudes from the chassis is equipped with vertical with the lateral surface and extends outwardly
Platform.
Further, the width of the ceramic body and the wall contact surface is greater than the thickness of the wall.
The beneficial effect of the method for stress release is during alleviation ceramic package provided by the invention: with the prior art
It compares, the method that the present invention alleviates stress release during ceramic package, in the case where not changing shell contour structures, in wall
The sensitive position that body and ceramic member and chassis are welded increases destressing destressing groove, and in the welding process, solder is in destressing
It is wandering on the inside of groove to form cornerite, portion of residual stress is absorbed by accumulation solder, while also reducing bonding area, make ceramics by
Alleviate in ceramics and metal parts encapsulation process as caused by thermal expansion coefficient mismatch far from structural weak point in force
Failure.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to embodiment or description of the prior art
Needed in attached drawing be briefly described, it should be apparent that, the accompanying drawings in the following description is only of the invention some
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 illustrates for the cross-section structure of the method for stress release during alleviation ceramic package provided in an embodiment of the present invention
Figure；
The schematic perspective view one of the method for stress release during the alleviation ceramic package that Fig. 2 provides for Fig. 1；
The schematic perspective view two of the method for stress release during the alleviation ceramic package that Fig. 3 provides for Fig. 1；
Fig. 4 be it is shown in FIG. 1 alleviation ceramic package during stress release method schematic perspective view three；
Fig. 5 is the schematic perspective view of wall shown in Fig. 1；
Fig. 6 be it is provided in an embodiment of the present invention alleviation ceramic package during stress release method wall integral vertical
Body structural schematic diagram；
Solder scatters state diagram when Fig. 7 is no destressing groove；
Fig. 8 is solder wandering state diagram when having destressing groove.
Wherein, each appended drawing reference in figure:
1- wall；2- destressing groove；The chassis 3-；4- ceramic body；5- platform；6- solder cornerite；7- failure reaction length；
8- weld length.
Specific embodiment
In order to which technical problems, technical solutions and advantages to be solved are more clearly understood, tie below
Accompanying drawings and embodiments are closed, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only
To explain the present invention, it is not intended to limit the present invention.
Also referring to Fig. 1 to Fig. 6, now to it is provided by the invention alleviation ceramic package during stress release method into
Row explanation.The method of stress release during the alleviation ceramic package, comprising the following steps:
Destressing destressing groove is arranged along soldered in step 1, the one end to connect on wall with ceramic body and chassis,
According to ceramic body yield strength and chassis deformation requirement, using the size of destressing groove described in FEM calculation, destressing is recessed
The size of slot meets ceramic yield strength and tungsten copper chassis deformation requirement, wherein the pricker for calculating shell is simulated by ANSYS software
Temperature-fall period is welded, cooling conditions are 25 DEG C -810 DEG C -25 DEG C, when which meets following two condition, judge that groove size is
It is suitble to:
Maximum tension stress≤400Mpa of ceramics
Vertical deformation≤the 0.05mm on chassis.
Step 2 calculates amount of solder, it is desirable that welding surface solder thickness is met the requirements, and the wandering state of solder and solder cornerite are full
It is full；Preliminary amount of solder is the 80% of ceramics and wall bonding area, while being also contemplated that following two appearance condition:
(1) solder scatters cornerite as mellow and full oblique 45 ° of cornerites；
(2) solder is wandering smoothly without accumulation；
Therefore after primary Calculation solder materials, final amount of solder need to be adjusted by experiment.
Combination Welding is assembled on step 3, wall, ceramic body and chassis；Whole parts such as ceramics, solder, wall are put into stone
In black grinding tool, positioning assembly is carried out, is welded using 25 DEG C of -810 DEG C of -25 DEG C of temperature；The shell assembled is entered into high temperature brazing
In furnace, 1 was as a child cooled and shaped.
Step 4, residual stress contrast test；Using boring method contrast test ceramics weak location residual stress；Using pole
Limits pressure destroys two kinds of structural failure pressure values (having destressing groove and without two kinds of structures of destressing groove) of comparison.Pass through comparison
It was found that when no destressing groove, solder scatters state in wall outer side, the failure at solder edge to ceramic edge reflect length compared with
Short, starting stress point is close to ceramic edge, easily formation crackle；When having destressing groove, solder scatters on the inside of groove and forms packet
Angle absorbs distributed stress, and the failure reflection length of welding surface solder edge to ceramic edge increases, and starting stress point is separate
Ceramic edge alleviates residual stress.
Two kinds of structures using boring method to groove containing destressing and without destressing groove compare test, comparison pottery
Residual stress numerical value of the porcelain after high temperature brazing.The weak location ceramic sidewalls of ceramics are tested, test result is as follows: without going
The ceramics of stress groove structure measure residual stress 80% in 100-150Mpa, and the ceramics of the groove structure containing destressing measure remnants
Stress 50% is in 100-150Mpa, it is seen that the high stress areas that ceramics can be reduced after addition destressing groove reduces the wind of failure
Danger.
The method of stress release during alleviation ceramic package provided by the invention is not changing compared with prior art
In the case where hull outside structure, the position welded on wall 1 with ceramic body 4 and chassis 3 processes destressing destressing groove 2.
When due to no destressing destressing groove 2, solder scatters state in 1 outside of wall, and the failure at solder edge to ceramic edge is anti-
It is shorter to reflect length, starting stress point is close to ceramic edge, easily formation crackle；And when having destressing destressing groove 2, solder is being gone
It scatters on the inside of stress groove 2 and forms cornerite, absorb distributed stress, and the failure of welding surface solder edge to ceramic edge reflects
Length increases, and starting stress point alleviates residual stress, avoid ceramic member cracked far from ceramic edge.
Referring to fig. 2, the structure of the ceramic shell of method preparation provided by the invention includes chassis 3, the pottery on chassis 3
Porcelain body 4 and the wall 1 on chassis 3, ceramic body 4 are placed in the one end on chassis 3, and one end of wall 1 is equipped with for ceramics to be arranged
The opening of body 4, one end that wall 1 connects with ceramic body 4 and chassis 3 are equipped with the destressing groove 2 extended along seam, and destressing is recessed
Slot 2 is arranged in the inner wall surface of wall 1, inner wall and ceramic body 4 and chassis 3 of the destressing groove 2 close to ceramic body 4 and chassis 3
Contact surface is overlapped, and the slot bottom of destressing groove 2 is lower than the inner wall surface of wall 1.When having destressing groove, solder effluent in groove
It dissipates and forms cornerite, absorb distributed stress, and the failure reflection length of welding surface solder edge to ceramic edge increases (Fig. 4),
Stress point is originated far from ceramic edge, alleviates residual stress.
Referring to Fig. 2, one kind as the method for stress release during alleviation ceramic package provided by the invention is specific
Embodiment, the distance between slot bottom of destressing groove 2 to the wall face of wall 1 are greater than or equal to 0.1mm.Destressing goes to answer
2 size of power groove is not answered too small, it is ensured that solder has enough build-up areas, conventional 1 wall thickness 0.5mm of wall, and destressing goes to answer
2 size of power groove is no less than 0.1mm.
Fig. 1 to Fig. 5 is please referred to, one kind as the method for stress release during alleviation ceramic package provided by the invention
The width of specific embodiment, destressing groove 2 is less than or equal to 0.2mm.Normal welding face width is 0.5mm, and increase goes to answer
After power destressing groove 2, minimum welding surface width is no less than 0.2mm.
Wherein, when referring to Fig. 7 for no destressing groove, solder forms oblique 45 ° of cornerites in wall and ceramic intersection, this
When, the failure reaction length L1 of edge to the ceramic edge of solder cornerite 6 is 0.2mm, and starting stress point loses close to ceramic edge
Validity response length is shorter, easily formation crackle.
It is when having destressing groove referring to Fig. 8, solder forms solder cornerite 6 in groove and ceramic boundary inside upper surface,
It displaced part stress suffered by ceramics, and the failure reaction length L2 of the edge of solder cornerite 6 to ceramic edge is 0.4mm, is risen
Beginning stress point is compared with Fig. 7 far from ceramic edge it is found that reaction length growth of failing, alleviates residual stress.Moreover, comparing Fig. 7
Weld length L3, have destressing groove weld length L4 shorten.
As a kind of specific embodiment of the method for stress release during alleviation ceramic package provided by the invention, bottom
Disk 3 is tungsten copper material.
Referring to Fig. 6, one kind as the method for stress release during alleviation ceramic package provided by the invention is specific
Embodiment, the material of wall 1 are kovar alloy.The oxidation film of also referred to as iron cobalt nickel alloy, alloy is fine and close, is easy welding and melts
It connects, there is good plasticity, machinable is widely used in production electrovacuum element, transmitting tube, kinescope, switching tube, transistor
And sealing plug and relay1 case etc..For kovar alloy because of cobalt containing ingredients, product is more wear-resisting.
Due to that can cut down, ceramic, tungsten copper three thermal expansion coefficient is different, and residual stress is easily formed in welding process reduces connection
Intensity, while three forms different distortion trend, easily cracks ceramics and fails.
Referring to Fig. 4, one kind as the method for stress release during alleviation ceramic package provided by the invention is specific
Embodiment, the wall face of wall 1 and the surrounding lateral surface on chassis 3 are concordant.
A kind of tool refering to Fig. 3 and Fig. 4, as the method for stress release during alleviation ceramic package provided by the invention
Body embodiment, there are three the outsides that continuous lateral surface is exposed to wall 1 for the tool of ceramic body 4, wherein one for being located at three centres is outer
Side protrudes from chassis 3, and two to be parallel to each other lateral surface is concordant with the lateral surface on chassis 3.
One kind as the method for stress release during alleviation ceramic package provided by the invention referring to FIG. 1 to FIG. 4,
Specific embodiment, the lateral surface that ceramic body 4 protrudes from the chassis 3 are equipped with platform vertical and outwardly extending with the lateral surface
5, the platform 5 is for welding capillary.
One kind as the method for stress release during alleviation ceramic package provided by the invention referring to FIG. 1 to FIG. 4,
The width of specific embodiment, ceramic body 4 and 1 contact surface of wall is greater than the thickness of wall 1.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (9)
1. alleviating the method for stress release during ceramic package, which is characterized in that the described method includes:
Destressing destressing groove is arranged along soldered in the one end to connect on wall with ceramic body and chassis, is bent according to ceramic body
Intensity and chassis deformation requirement are taken, the size of destressing groove described in FEM calculation is utilized；
Calculate amount of solder；
Combination Welding is assembled on wall, ceramic body and chassis；
Residual stress contrast test.
2. alleviating the method for stress release during ceramic package as described in claim 1, it is characterised in that: the destressing
The slot bottom of groove to the distance between the wall face of the wall is greater than or equal to 0.1mm.
3. alleviating the method for stress release during ceramic package as described in claim 1, it is characterised in that: the destressing
The width of groove is less than or equal to 0.2mm.
4. alleviating the method for stress release during ceramic package as described in claim 1, it is characterised in that: the chassis is
Tungsten copper material.
5. alleviating the method for stress release during ceramic package as described in claim 1, it is characterised in that: the wall
Material is kovar alloy.
6. alleviating the method for stress release during ceramic package as described in claim 1, it is characterised in that: the wall
Wall face is concordant with the surrounding lateral surface on the chassis.
7. alleviating the method for stress release during ceramic package as claimed in claim 6, it is characterised in that: the ceramic body
There are three the outsides that continuous lateral surface is exposed to the wall for tool, wherein a lateral surface for being located at three centres protrudes from the bottom
Disk, two lateral surfaces being parallel to each other are concordant with the lateral surface on the chassis.
8. alleviating the method for stress release during ceramic package as claimed in claim 7, it is characterised in that: the ceramic body
The lateral surface for protruding from the chassis is equipped with platform vertical and outwardly extending with the lateral surface.
9. alleviating the method for stress release during ceramic package as described in claim 1, it is characterised in that: the ceramic body
It is greater than the thickness of the wall with the width of the wall contact surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811574860.0A CN109698167A (en) | 2018-12-21 | 2018-12-21 | The method of stress release during alleviation ceramic package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811574860.0A CN109698167A (en) | 2018-12-21 | 2018-12-21 | The method of stress release during alleviation ceramic package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109698167A true CN109698167A (en) | 2019-04-30 |
Family
ID=66232746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811574860.0A Pending CN109698167A (en) | 2018-12-21 | 2018-12-21 | The method of stress release during alleviation ceramic package |
Country Status (1)
| Country | Link |
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| CN (1) | CN109698167A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115312606A (en) * | 2022-07-29 | 2022-11-08 | 中国电子科技集团公司第五十五研究所 | Refrigeration-based infrared detector ceramic Dewar packaging shell structure and manufacturing method |
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| JPH1168284A (en) * | 1997-08-11 | 1999-03-09 | Yaskawa Electric Corp | Surface-mounted electronic component |
| JP2000191380A (en) * | 1998-12-28 | 2000-07-11 | Kyocera Corp | Joined body of ceramic member and metallic member, and wafer supplying member using the same |
| US20100266931A1 (en) * | 2007-12-24 | 2010-10-21 | Commiss. A L'energie Atom. Et Aux Energ. Alterna. | Sealed flexible link between a metal substrate and a ceramic substrate, method for making such a link, application of the method to sealing high temperature electrolyzers and fuel cells |
| JP2012009736A (en) * | 2010-06-28 | 2012-01-12 | Mitsubishi Electric Corp | Semiconductor element, method of manufacturing the same and semiconductor device |
| CN104600037A (en) * | 2014-12-30 | 2015-05-06 | 中国电子科技集团公司第五十五研究所 | Multi-die high-power diode shell and manufacturing method thereof as well as chip packaging method |
-
2018
- 2018-12-21 CN CN201811574860.0A patent/CN109698167A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1168284A (en) * | 1997-08-11 | 1999-03-09 | Yaskawa Electric Corp | Surface-mounted electronic component |
| JP2000191380A (en) * | 1998-12-28 | 2000-07-11 | Kyocera Corp | Joined body of ceramic member and metallic member, and wafer supplying member using the same |
| US20100266931A1 (en) * | 2007-12-24 | 2010-10-21 | Commiss. A L'energie Atom. Et Aux Energ. Alterna. | Sealed flexible link between a metal substrate and a ceramic substrate, method for making such a link, application of the method to sealing high temperature electrolyzers and fuel cells |
| JP2012009736A (en) * | 2010-06-28 | 2012-01-12 | Mitsubishi Electric Corp | Semiconductor element, method of manufacturing the same and semiconductor device |
| CN104600037A (en) * | 2014-12-30 | 2015-05-06 | 中国电子科技集团公司第五十五研究所 | Multi-die high-power diode shell and manufacturing method thereof as well as chip packaging method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115312606A (en) * | 2022-07-29 | 2022-11-08 | 中国电子科技集团公司第五十五研究所 | Refrigeration-based infrared detector ceramic Dewar packaging shell structure and manufacturing method |
| CN115312606B (en) * | 2022-07-29 | 2024-07-30 | 中国电子科技集团公司第五十五研究所 | Ceramic Dewar packaging shell structure based on refrigeration infrared detector and manufacturing method |
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Inventor after: Xu Jiali Inventor before: Xu Jiali Inventor before: Liu Linjie |