CN109698145A - Nozzle apparatus ' of standby, liquid processing device and its method of operation and storage medium - Google Patents
Nozzle apparatus ' of standby, liquid processing device and its method of operation and storage medium Download PDFInfo
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- CN109698145A CN109698145A CN201811234661.5A CN201811234661A CN109698145A CN 109698145 A CN109698145 A CN 109698145A CN 201811234661 A CN201811234661 A CN 201811234661A CN 109698145 A CN109698145 A CN 109698145A
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- nozzle
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- liquid
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
- H01L21/02307—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a liquid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02343—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment by exposure to a liquid
Abstract
The present invention provides a kind of nozzle apparatus ' of standby.In nozzle incorporating section, when liquid layer by the front end of solvent inlet nozzle to form solvent, the solvent supplied to nozzle incorporating section can be saved.Keep nozzle standby in nozzle incorporating section, supply solvent from solvent liquid outlet with first flow, after forming liquid film in a manner of the outlet of valve nozzles, solvent is supplied with the second flow fewer than first flow.Second flow is to be able to maintain that the outlet of nozzle by the flow of the closed state of solvent, and the liquid film for being formed in the outlet of nozzle is contacted with solvent, and the front end of solvent inlet nozzle is thus formed the liquid layer of solvent using surface tension.It therefore, there is no need to form the hydrops of solvent in nozzle incorporating section, and during supplying solvent from solvent liquid outlet, reduce the supply flow rate to second flow from first flow, therefore solvent can be saved.
Description
Technical field
Spue can be because the nozzle of dry and cured treatment fluid be standby in nozzle incorporating section the present invention relates to being used in, will be molten
The front end of agent inlet nozzle is to form the technology of the liquid layer of solvent.
Background technique
In the manufacturing process of semiconductor devices, exist to form resist pattern and resist liquid is coated on substrate
Processing.The coating of resist liquid for example makes the semiconductor wafer (hereinafter referred to as " chip ") for being maintained at rotary chuck by one side
Rotation, carries out from nozzle to the substantially central portion discharge resist liquid of the chip on one side.
Resist liquid includes the ingredient of the resist film formed by organic material and the solvent such as dilution of the ingredient
(thinner), have and be easy dry property when contacting with atmosphere, concentration etc. may change due to dry.Therefore, it uses
The outside of internal resist liquid layer forms air layer and solvent layer (liquid layer of solvent) in the front end of nozzle, to prevent in nozzle
The dry method of resist liquid.Such as simulation discharge nozzle in resist liquid after, by air be attracted in the nozzle with
It air layer is formed, is then attracted to the front end of nozzle dipping in nozzle in a solvent and by solvent, thus execute the party
Method.
Patent document 1 records a kind of method, wherein attracting the resist in nozzle after making nozzle enter purge chamber
Liquid then forms the hydrops of solvent in purge chamber, the front end that nozzle impregnates in the hydrops and is attracted the hydrops, thus shape
At solvent layer.Purge chamber is configured to the funnel-form of inverted conical shape, and lower end is provided with discharge path via tap.
But using such as the feelings of the higher resist liquid of viscosity the agent film against corrosion of three dimensional NAND type storage
Under condition, resist liquid is easy to attach and is deposited in the inner wall of tap, therefore is easy to happen blocking in tap.Thus, for example
In simulation discharge resist liquid next time, resist hydrorrhea goes out, and the front end of nozzle is possible to contaminated.If expanding tap,
The stopping state of resist liquid can be improved, but solvent becomes difficult to be accumulated in purge chamber, in order to be formed in purge chamber
Hydrops, it has to which the flow for increasing solvent haves the shortcomings that the consumption quantitative change of solvent is more.
A kind of method of consumption for inhibiting nozzle cleaning liquid is proposed in patent document 2.In this method, in bottom surface sections
It is provided with supply cleaning solution in the nozzle incorporating section of discharge duct, and supplies cleaning solution into discharge duct also to form whirlpool
Stream adjusts delivery flow by the vortex, inhibits the consumption of cleaning solution when stockpiling cleaning solution in nozzle incorporating section.But
It is that this method is the method that cleaning solution is stockpiled in nozzle incorporating section, so when increasing the internal diameter of discharge duct, cleaning solution
It is more to supply quantitative change, it is difficult to solve the problem of the present invention.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2010-62352 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2017-92239 bulletin (0069,0070 section etc.)
Summary of the invention
Technical problems to be solved by the inivention
The present invention has been made in view of such circumstances, and its purpose is to provide a kind of technologies, is used at discharge
The nozzle for managing liquid is standby in nozzle incorporating section, in the liquid layer by the front end of solvent inlet nozzle to form solvent, Neng Goujie
Save the solvent supplied to nozzle incorporating section.
For solving the technical solution of technical problem
Therefore, the present invention is a kind of nozzle apparatus ' of standby, and be used for: being used in discharge can be because of dry and cured treatment fluid
Nozzle it is standby, the front end of solvent inlet nozzle is formed to the liquid layer of solvent,
Said nozzle apparatus ' of standby is characterised by comprising:
Nozzle incorporating section comprising the inner peripheral surface formed in a manner of the front end for surrounding said nozzle, with going out for nozzle
Mouth is relatively formed with incorporating section outlet；
Solvent liquid outlet in said nozzle incorporating section inner opening, and is formed as the inner peripheral surface along said nozzle incorporating section
It is discharged from above-mentioned incorporating section outlet from the solvent that the solvent liquid outlet spues in guidance；
Gone out with first flow to solvent with solvent supply unit when the front end of said nozzle forms the liquid layer of solvent
Liquid mouth supplies solvent, after the solvent forms liquid film in the way of the outlet for closing said nozzle, than above-mentioned first flow
Few second flow supplies solvent to solvent liquid outlet, wherein above-mentioned second flow is to be able to maintain that the outlet of said nozzle is molten
The flow of the closed state of agent.
In addition, liquid processing device of the invention is characterised by comprising:
Keep the board holder of substrate；
Nozzle, being used to spue to the surface for the substrate for being held in aforesaid substrate maintaining part can be because of dry and cured processing
Liquid；
Said nozzle apparatus ' of standby；With
Attracting mechanism is used to be inhaled to the upstream side of the flow path in the standby nozzle of said nozzle apparatus ' of standby
Draw, to suck solvent.
In addition, the method for operation of liquid processing device of the invention is characterised by comprising:
Spuing from nozzle to the surface for the substrate for being held in board holder can be because of the process of dry and cured treatment fluid；
Then make the process that said nozzle is standby in nozzle incorporating section, said nozzle incorporating section include to surround nozzle before
The inner peripheral surface that the mode of end is formed, and incorporating section outlet is relatively formed with the outlet of nozzle；
From the outlet discharge treatment fluid in the standby nozzle in said nozzle incorporating section, and it is opposite from the outlet with the nozzle
The process of incorporating section outlet discharge treatment fluid；
Then, with first flow from the solvent liquid outlet discharge solvent in said nozzle incorporating section inner opening, along above-mentioned spray
The solvent that the inner peripheral surface guidance of mouth incorporating section spues, forms liquid film by the solvent in the way of the outlet for closing said nozzle
Process；With
Then, from the solvent liquid outlet in said nozzle incorporating section inner opening with the second flow fewer than above-mentioned first flow
Discharge solvent, the process for the solvent that the inner peripheral surface guidance along said nozzle incorporating section spues, wherein second flow is to be able to maintain that
The outlet of said nozzle is by the flow of the closed state of solvent.
In addition, storage medium of the invention is stored in computer program used in liquid processing device, above-mentioned liquid processing dress
Set from nozzle to the surface for the substrate for being maintained at board holder spue can because of dry and cured treatment fluid,
Above-mentioned storage medium is characterized in that:
Step group is incorporated into above-mentioned computer program, to execute the method for operation of above-mentioned liquid processing device.
Invention effect
According to the present invention, in nozzle incorporating section, solvent is sucked into the front end of the nozzle for the treatment fluid that is used to spue with shape
At solvent liquid layer when, solvent is supplied from the solvent liquid outlet of nozzle incorporating section with first flow, with the outlet of valve nozzles
Mode form liquid film after, solvent is supplied with the second flow fewer than first flow.Second flow is to be able to maintain that going out for nozzle
Mouth is formed in liquid film and the solvent contact of the outlet of nozzle by the flow of the closed state of solvent, thus will using surface tension
The front end of solvent inlet nozzle forms the liquid layer of solvent.It therefore, there is no need to form the hydrops of solvent in nozzle incorporating section, and
And during supplying solvent from solvent liquid outlet, reduce the supply flow rate to second flow from first flow, therefore can save
Save solvent.
Detailed description of the invention
Fig. 1 is to indicate that the vertical of an embodiment of the liquid processing device equipped with nozzle apparatus ' of standby of the invention cuts side
Figure.
Fig. 2 is the perspective view that outlined liquid processing device.
Fig. 3 is the perspective view for indicating to be arranged in the nozzle unit of liquid processing device.
Fig. 4 is that the vertical of a part of the coating nozzle and standby unit that indicate to be arranged in nozzle unit cuts side view.
Fig. 5 is to indicate that nozzle unit and the vertical of standby unit cut side view.
Fig. 6 is to indicate that the vertical of effect of liquid processing device cuts side view.
Fig. 7 is to indicate that the vertical of effect of liquid processing device cuts side view.
Description of symbols
1 liquid processing device
2 rotary chucks
3 nozzle units
32 mobile mechanisms
41 coating nozzles
42 solvent nozzles
46 flow paths
47 outlets
5 standby units
51 nozzle incorporating sections
52 reducing diameter parts
53 incorporating section outlets
56 solvent liquid outlets
57 solvent feed paths
59 flow adjustment portions
6 control units
81 processing liquid layers
82 air layers
The liquid layer (solvent layer) of 83 solvents
VA suck back valve
W semiconductor wafer.
Specific embodiment
Hereinafter, being illustrated referring to attached drawing to an embodiment of the invention.
Fig. 1 and Fig. 2 is that the vertical of the liquid processing device 1 of one embodiment of the present invention cuts side view and perspective view.Liquid processing
Device 1 includes rotary chuck 2, as absorption and the board holder of the horizontal back side central portion for keeping wafer W.The revotating card
Disk 2 is driven by 21 driven-mechanism 22 of drive shaft, can be rotated and be gone up and down around vertical axis with the state that remain wafer W, and
The center for being set to wafer W is located in the rotary shaft.Around rotary chuck 2, with the chip surrounded on rotary chuck 2
The mode of W is provided with the cover (cup) 23 that side above has opening portion 231, covers 23 lateral circle surface upper end side and is formed as inwardly
Inclined rake 232.
The bottom side of cover 23 is provided with the liquid receiving unit 24 for example in recess portion shape.Liquid receiving unit 24 is existed by partition wall 241
The periphery lower side of wafer W is divided into lateral area and inside region in a manner of throughout complete cycle, in the bottom of outer side region
It is provided with the leakage fluid dram 25 for resist stockpiled etc. to be discharged, is provided in the bottom of inside region for processing atmosphere to be discharged
Exhaust outlet 26.
It is spued and is applied to the substantial middle for the wafer surface for being held in rotary chuck 2 using the coating nozzle 41 of nozzle unit 3
Apply liquid.As shown in figure 3, multiple (such as 10) that the nozzle unit 3 passes through the treatment fluid that will be used to spue apply nozzle 41 and use
Shared supporting part 31 is integrally fixed to as a such as solvent nozzle 42 for the solvent for the treatment of fluid in discharge and is constituted.It should
Treatment fluid in example can solidify because dry, and solvent is, for example, dilution.As the example for the treatment of fluid, such as manufacture can be enumerated
The resist liquid that such as viscosity is 50cp~1000cp used in three dimensional NAND type memory.Nozzle 41 is applied relative to this
The nozzle of invention, in the following, in the presence of that will apply nozzle 41 and the case where solvent nozzle 42 is denoted as nozzle 41,42.
Coating nozzle 41 and solvent nozzle 42 are for example constituted in the same way, along the transverse direction (Y of liquid processing device 1
Axis direction) configuration mode point-blank is fixed on supporting part 31.Such as it is shown for applying nozzle 41 in such as Fig. 4,
Said nozzle 41,42 includes: the base end part 43 connecting with supporting part 31；Extend in the lower side of base end part 43 in vertical direction
Cylindrical portion 44；With from the substantially coniform front end 45 of the cylindrical portion 44 undergauge to the lower side.In above-mentioned base end part 43, cylinder
The inside in portion 44 and front end 45 is formed with the flow path 46 of the treatment fluid extended in vertical direction, and the flow path 46 is below nozzle
Front end side opening as treatment fluid outlet 47.Be formed as rounded about outlet 47, such as flat shape.
Above-mentioned coating nozzle 41 and solvent nozzle 42 are supported by shared supporting part 31, and using mobile mechanism 32 to rotation
Turn the processing position of wafer W supply treatment fluid on chuck 2 etc. and is incorporated between the position of readiness of aftermentioned standby unit 5
It moves freely.Such as mobile mechanism 32 includes: the moving horizontally of being guided of guide rail 33 that laterally (Y direction) extends along Fig. 2
Portion 34；Portion 34 is moved horizontally from this to horizontally extend and go up and down relative to the portion that moves horizontally 34 using elevating mechanism (not shown)
Arm 35, the front end of the arm 35 is provided with supporting part 31.
As shown in Figure 1, respectively coating nozzle 41 is for example via different treatment fluid feed path 411 and different
Treatment fluid supply source 412 connects.Each treatment fluid feed path 411, which is for example provided with, has suck back valve (suck in respective midway
Back valve) VA, open and close valve, mass flow controller etc. flow adjustment portion 413.In addition, treatment fluid feed path 411
It is such as made of flexible material, when nozzle unit 3 is mobile, does not interfere the movement of nozzle unit 3.
Suck back valve VA is used for when making corresponding coating nozzle 41 stop discharge treatment fluid, makes to remain in coating nozzle 41
The front end liquid level for the treatment of fluid in flow path 46 retreats (resorption) to 411 side for the treatment of fluid feed path, and doubles as suction of the invention
Draw mechanism.Suck back valve VA is for example with the bellows for being formed with the suction chamber being connected to treatment fluid feed path 411 in inside
(bellows), by upholding the bellows so as to become negative pressure in suction chamber, the treatment fluid in nozzle 41 will be applied to processing
411 side of liquid feed path attracts.Also, suck back valve VA is provided with needle roller (neddle), changes suction chamber using the needle roller
Maximum volume, thus adjust treatment fluid front end liquid level retreat distance.
The flow that flow adjustment portion 413 is used to adjust treatment fluid has stockpiled in treatment fluid supply source 412 as processing
The resist liquid identical and different viscosity such as respective diverse resist liquid or type of liquid, such as three dimensional NAND
The resist liquid of the agent film against corrosion of type memory.Solvent nozzle 42 is via solvent feed path 421 and solvent supply source 422
Connection, is provided with the flow adjustment portion 423 with open and close valve, mass flow controller etc. in solvent feed path 421.According to
Control signal from aftermentioned control unit 6, to control the driving of suck back valve VA, flow adjustment portion 413,423.
Such as depicted in figs. 1 and 2, the standby unit 5 for constituting nozzle apparatus ' of standby is provided in the outside of cover 23.This
Outside, in Fig. 1, for convenience of illustrating, nozzle unit 3 and standby unit 5 are illustrated in a manner of bigger than reality and simplify.Such as such as
Shown in Fig. 5, in standby unit 5, the nozzle incorporating section of the tubular of each coating nozzle 41 and solvent nozzle 42 is separately stored
Quantity i.e. 11 of 51 nozzles being provided with, such as the nozzle incorporating section 51 arrange point-blank in Y direction.
The nozzle incorporating section 51 of coating nozzle 41 is constituted in the same way, illustrates the nozzle incorporating section 51 referring to Fig. 4.
Fig. 4 indicates the nozzle incorporating section 51 of the leftmost side in Fig. 5.In nozzle incorporating section 51, the cylindrical portion 44 of storage coating nozzle 41 is with before
The position of end 45 is, for example, cylindrical shape, and the lower side of nozzle incorporating section 51 is for example configured to the smaller reducing diameter part of more downward internal diameter
52.In addition, the lower end of nozzle incorporating section 51 connects via the drainage chamber 54 that incorporating section outlet 53 and each nozzle incorporating section 51 share
It is logical.The liquid for flowing into drainage chamber 54 is discharged to except liquid processing device 1 via discharge path 55.
Fig. 4 and Fig. 5 indicate state when nozzle unit 3 is located at the position of readiness being incorporated in standby unit 5, wait at this
Seat in the plane is set, such as each front end 45 for applying nozzle 41 is located at the reducing diameter part 52 of nozzle incorporating section 51, the inner circumferential of the reducing diameter part 52
Face is equivalent to the inner peripheral surface for surrounding the front end of coating nozzle 41.Moreover, incorporating section outlet 53 is located at the outlet of each nozzle 41
The 47 lower side position opposite with above-mentioned outlet 41.Be formed as round about the incorporating section outlet 53, such as flat shape,
It is formed in the mode big with the outer diameter of the coating nozzle 41 at 47 corresponding positions of outlet than coating nozzle 41.In this embodiment, it contracts
The smallest position of internal diameter between diameter portion 52 and drainage chamber 54 is relative to incorporating section outlet 53.
In addition, the side wall of the side wall such as reducing diameter part 52 in the lower side of the nozzle incorporating section 51 of coating nozzle 41, if
It is equipped with the solvent liquid outlet 56 for supplying solvent.The solvent liquid outlet 56 is for example formed as the inner peripheral surface supply along reducing diameter part 52
Solvent, therefore for example as shown in (b) of Fig. 4, solvent liquid outlet 56 is set to the tangential direction of reducing diameter part 52.As a result, along nozzle
It is discharged from incorporating section outlet 53 from the solvent that solvent liquid outlet 56 spues in the inner peripheral surface guidance of incorporating section 51, in undergauge
In portion 52, the solvent to spue from solvent liquid outlet 56 forms swirling flow and falls.
As shown in figure 5, above-mentioned solvent liquid outlet 56 is via solvent in each nozzle incorporating section 51 of each coating nozzle 41
Feed path 57 is connect with solvent supply source 58, is respectively arranged in each solvent feed path 57 with open and close valve, quality stream
The flow adjustment portion 59 of amount controller etc..Each flow adjustment portion 59 is, for example, the control signal using control unit 6 to control driving,
Adjust the mechanism of the supply amount of the solvent to spue from solvent liquid outlet 56 to each nozzle incorporating section 51.Solvent supply unit of the invention
Including solvent feed path 57, flow adjustment portion 59 and solvent supply source 58.The solvent supply unit as described later, is applying
When the front end of nozzle 41 forms the liquid layer of solvent, solvent is supplied to solvent liquid outlet 56 with first flow, to close the spray
After the mode of the outlet 47 of mouth 41 forms the liquid film of solvent, supplied with the second flow fewer than first flow to solvent liquid outlet 56
Solvent.In addition, nozzle corresponding with solvent nozzle 42 incorporating section 51, such as other than not formed solvent liquid outlet 56, with
The coating corresponding nozzle incorporating section 51 of nozzle 41 is constituted in the same way.
As described later, in standby unit 5, discharge resist liquid is simulated from coating nozzle 41, still, in resist liquid
In the higher situation of viscosity, if incorporating section outlet 53 is smaller, the blocking of resist liquid occurs.On the other hand, if incorporating section
Outlet 53 is larger, then can not form the liquid layer of solvent in the front end of coating nozzle 41.Therefore, when coating nozzle 41 with outlet
When the outer diameter L1 of the coating nozzle 41 at 47 corresponding positions is, for example, 2.5mm~3.0mm, the preferred internal diameter of incorporating section outlet 53
It is 3.2mm~3.6mm that L2, which is set to such as diameter,.
The coating nozzle 41 and solvent nozzle 42 of nozzle unit 3 are for example arranged in straight on the rotation center by wafer W
On line, in addition, each nozzle incorporating section 51 of standby unit 5 is also with the side on the straight line on the rotation center by wafer W
Formula arrangement.Nozzle unit 3 is configured to as described above using mobile mechanism 32 on the straight line on the rotation center by wafer W
Mobile and liftable, so, nozzle unit 3 can move between position of readiness and processing position.Position of readiness is
The front end 45 of each coating nozzle 41 is incorporated in the position of the reducing diameter part 52 of each nozzle incorporating section 51 as described above.In addition,
Processing position be apply nozzle 41, any nozzle of solvent nozzle 42 supplies treatment fluid or solvent to the rotation center of wafer W
Position.In addition, there is also nozzle unit 3 position of readiness upper side (such as before each coating nozzle 41 of nozzle unit 3
End in the nozzle incorporating section 51 away from standby unit 5 upper surface be only such as 1mm~2mm or so upper side) position wait for
Machine.
The liquid processing device 1 has control unit 6, and control unit 6 is for example made of computer, has program (not shown) storage
Portion.The program storage part is stored with program, and order (step group) is incorporated into the program to be able to carry out at the coating of wafer W
To various movements such as the processing of coating nozzle 41 in reason, standby unit 5.Moreover, by utilizing the program from control unit 6 to liquid
Processing unit 1 each portion output control signal, come control the liquid processing device 1 each portion movement.Program is for example to be accommodated in
The state of the storage medium of hard disk, CD, disk or storage card etc. is stored in program storage part.
Then, referring to figure 6 and figure 7, the coating of resist liquid is carried out using a coating nozzle 41A of nozzle unit 3
In case where processing, illustrate the effect of liquid processing device 1.Firstly, the resist for the use of viscosity being for example 50cp~1000cp
Liquid, using coating surface discharge resist liquid from nozzle 41A to the wafer W for being maintained at rotary chuck 2 to carry out coating processing.
That is, rotary chuck 2 is made to rise to the upper side of cover 23, wafer W is received from baseplate conveying mechanism (not shown).Then, make nozzle
Unit 3 is moved to solvent nozzle 42 to the position of the rotation center for the wafer W for being held in rotary chuck 2 supply solvent, and supply is made
For the dilution of solvent.Then, wafer W is rotated using rotary chuck 2, so that dilution is diffused to periphery using the centrifugal force
Portion.
Then, the rotation for stopping rotary chuck 2 makes nozzle unit 3 be moved to coating nozzle 41A to being maintained at rotary chuck
The position of the rotation center supply resist liquid of 2 wafer W, discharge resist liquid.Then, revolve wafer W using rotary chuck 2
Turn, so that resist liquid is diffused to peripheral part from the central part of wafer W using the centrifugal force.Such as liquid profit is diluted in wafer surface
Resist liquid is applied in the state of wet, the wafer W for being so coated with resist liquid is handed off to baseplate conveying mechanism.
On the other hand, after processing terminate in coating in the case where the not above discharge coating liquid in required time, make nozzle
Unit 3 declines after being moved to the position opposite with standby unit 5, the front end of each coating nozzle 41 is accommodated in corresponding
In nozzle incorporating section 51, it is allowed to be located at position of readiness.In this state, it is stored using analog distributor (dispense) to nozzle
Resist liquid 71 in portion 51 inside the front end of the flow path 46 of discharge coating nozzle 41A (referring to (a) of Fig. 6).
Resist liquid 71 is discharged to 54 side of drainage chamber via the incorporating section outlet 53 of nozzle incorporating section 51.In the example
In, incorporating section outlet 53 is formed as bigger with the outer diameter of the nozzle 41A at 47 corresponding positions of outlet than coating nozzle 41A.Example
Such as the size that diameter is 3.6mm, therefore in the case where the viscosity of resist liquid 71 is the higher situation of degree as about 1000cp,
It is able to suppress the blocking of resist liquid 71 in incorporating section outlet 53.
Then, first time suction is carried out using the suck back valve VA for the treatment fluid feed path 411 that coating nozzle 41A is arranged in
Draw.So when being acted, apply the liquid level of the resist liquid 71 in the flow path 46 of nozzle 41A as shown in (b) of Fig. 6 to
411 side for the treatment of fluid feed path retreats, which rises from the front end of coating nozzle 41A.It is inhaled preferably by suck back valve VA
Draw, so that the liquid level for for example applying the resist liquid 71 in nozzle 41A rises 1mm~3mm effect from spray nozzle front end.
Then, as shown in (c) of Fig. 6, second is carried out using suck back valve VA on one side and is attracted, on one side from solvent liquid outlet 56
Solvent 72 is supplied into nozzle incorporating section 51 with first flow and with the first service time, is applying the flow path 46 of nozzle 41A
The liquid film 73 of front end formation solvent.Liquid film 73 is the film of the outlet 47 of closing coating nozzle 41A, and thickness is, for example, 1mm.Edge
The inner peripheral surface of the reducing diameter part 52 of nozzle incorporating section 51 guide the solvent 72 that spues from solvent liquid outlet 56, formation swirling flow and
It falls, and is discharged from incorporating section outlet 53.
As described above, inner peripheral surface of the solvent 72 along nozzle incorporating section 51 falls in the shape of a spiral, therefore arranged when increasing incorporating section
When exporting 53, solvent 72 is rapidly discharged via incorporating section outlet 53.As a result, from aftermentioned evaluation test also it is understood that
When the supply amount of solvent 72 is fewer than first flow, even if attracting solvent 72 into coating nozzle 41A, it is not also inhaled into nozzle
It is interior.Therefore, the supply amount of solvent 72 is set as first flow, using the suck back valve VA for constituting attracting mechanism, from coating nozzle
The upstream side of flow path 46 in 41 is attracted to suck solvent 72.As described above, solvent 72 is attracted as shown in (a) of Fig. 7
To the coating side nozzle 41A, the liquid film 73 of solvent is formed in the front end of coating nozzle 41A.
In this embodiment, the diameter of incorporating section outlet 53 is 3.6mm, therefore, by the way that first flow is set as 90ml/ points
Clock~150ml/ minutes, such as 100ml/ minutes, the first service time is set as such as 1~2 second, it can be in coating nozzle
The front end of 41A forms the liquid film 73 of solvent.In addition, it is contemplated that first can be made by the attraction for increasing coating nozzle 41A
Flow is less than 90ml/ minutes, and when resist liquid higher using viscosity, resist liquid is liable to stick to coating nozzle 41A's
The inner wall of flow path 46.Therefore, when increasing attraction, resist liquid is possible to be broken into aliquot and separate, and exists as described later
When applying the liquid layer of inside formation solvent of nozzle 41A, it is easy to mix with the liquid layer of resist liquid, not good method.
Then, it as shown in (d) of Fig. 6, continues with flow path 46 of the suck back valve VA into coating nozzle 41A and is attracted,
In the state that the front end for applying nozzle 41A is formed with liquid film 73, from solvent liquid outlet 56 in a manner of being contacted with the liquid film 73
Solvent is supplied with second flow and with for example longer than the first service time the second service time.Second flow is to be able to maintain that
The outlet 47 of nozzle 41 is applied by the closed state of solvent, fewer than first flow flow.
As a result, as shown in (b) of Fig. 7, the solvent 72 contacted with liquid film 73 is because of surface tension and into coating nozzle 41A
Movement that flow path 46 is attracted and be inhaled into the flow path 46 of coating nozzle 41A.That is, liquid film 73 becomes starting point, it is supplied to spray
The solvent 72 of the inner peripheral surface of the reducing diameter part 52 of mouth incorporating section 51 is inhaled into flow path 46 because of surface tension.By being spat with second flow
Solvent 72 out are able to maintain that the outlet 47 of coating nozzle 41 by the closed state of solvent, therefore by utilizing surface tension, is being sprayed
Mouth incorporating section 51 does not form the hydrops of the solvent of closing incorporating section outlet 53, and solvent can be sucked to coating nozzle 41A.?
In the example, the diameter of incorporating section outlet 53 is 3.6mm, therefore the second supply amount is set as 30ml/ minutes~60ml/ points
Clock, such as 40ml/ minutes, the second service time is set as such as 6~7 seconds.
First flow, the first service time, second flow and the second service time are the pre- numbers for first passing through experiment to calculate
According to.According to the viscosity of resist liquid, the size for the outlet 47 for applying nozzle 41 and outer with the nozzle at 47 corresponding positions of outlet
The size of diameter sets the size of the incorporating section outlet 53 of nozzle incorporating section 51, according to the size of the incorporating section outlet 53, fits
When calculating first flow, the first service time, second flow and the second service time.
So, as shown in (e) of Fig. 6, in the flow path 46 of coating nozzle 41A, from 411 side for the treatment of fluid feed path
Act the liquid layer (solvent layer) 83 for sequentially forming processing liquid layer 81, air layer 82 and solvent.Air layer 82 and solvent layer are utilized as a result,
83 by the treatment fluid (resist liquid) and atmospheric isolation inside the front end for applying nozzle 41A, therefore treatment fluid can be prevented dry.
For example, it is preferable to attract the liquid level of the solvent layer 83 in coating nozzle 41A using suck back valve VA, so that it is sprayed from coating
The front end of mouth 41A rises 5mm~15mm degree.In addition, later, it can also be in the shape for stopping supplying solvent from solvent liquid outlet 56
Under state, attracted using flow path 46 of the suck back valve VA into coating nozzle 41A, in the front end internal solvent of coating nozzle 41A
The outside of layer 83 also forms air layer.It is being located further forward end side formation air layer than solvent layer 83 so in coating nozzle 41A, by
This can prevent the drop that solvent is sucked into the front end of coating nozzle 41A.In this state, each coating spray of nozzle unit 3
Position of readiness of the mouth 41 in standby unit 5 is standby.
Then, processing liquid layer 81, air layer 82 and solvent layer 83 are formed in the front end of each coating nozzle 41 for using
Nozzle unit 3, in liquid processing device 1 carry out wafer W coating processing the case where, to use one of nozzle unit 3 to apply
It is illustrated in case where applying nozzle 41A.Firstly, carrying out the processing from coating nozzle 41A discharge solvent layer 83.That is, will apply
Nozzle 41A configuration is applied in the position of readiness of standby unit 5, using nozzle 41A 413 discharge specified amount of flow adjustment portion it is anti-
Agent liquid is lost, after the solvent layer 83 of discharge spray nozzle front end, carries out the resorption of resist liquid.At this point, in order to reduce resist liquid
Discarding amount, first passes through the supply amount for the resist liquid that experiment is found out for solvent layer 83 to be only discharged in advance, such as makes resist liquid
Liquid level declines such as 2mm or so, is so discharged solvent layer 83.
Then, nozzle unit 3 is made to be moved to coating nozzle 41A to the processing position of wafer W supply coating liquid, from the coating
Nozzle 41A supplies resist liquid to wafer W, carries out coating processing according to above-mentioned method.Moreover, after in coating, processing terminate
Not in required time in the case where the above discharge coating liquid, used coating nozzle 41A is accommodated in the nozzle of standby unit 5
In incorporating section 51, as described above, sequentially forming treatment fluid from 411 side for the treatment of fluid feed path in the inside of coating nozzle 41A
Layer 81, air layer 82 and solvent layer 83.
Hereafter, in the feelings for carrying out coating processing using another coating nozzle 41B different from said one coating nozzle 41A
Same as coating nozzle 41A under condition, solvent layer 83 is discharged in another coating nozzle 41B.Then, using coating nozzle 41B to crystalline substance
Piece W carries out the coating processing of the resist liquid as treatment fluid, then, nozzle unit 3 is configured the standby position in standby unit 5
It sets, carries out the processing for forming processing liquid layer 81, air layer 82 and solvent layer 83 inside the front end of coating nozzle 41B.
Here, according to the program for being accommodated in control unit 6, to execute following movement: discharge coating nozzle 41A's to be used
Solvent, carry out as defined in coating processing, then, carry out for inside the front end of coating nozzle 41A formed processing liquid layer 81,
A series of actions of the processing of air layer 82 and solvent layer 83；Then next coating is carried out using another coating nozzle 41B etc.
A series of movement when processing.
According to above-mentioned embodiment, in nozzle incorporating section 51, solvent is formed in the front end of coating nozzle 41
When liquid layer 83, by first flow supply solvent and by close coating nozzle 41 outlet 47 in a manner of form liquid film 73 after, with than
The few second flow of first flow supplies solvent.The liquid film 73 and solvent of the outlet 47 of nozzle 41 are applied by being formed in as a result,
Contact, solvent are inhaled into the front end of coating nozzle 41 because of surface tension, form the liquid layer 83 of solvent.It therefore, there is no need to
Nozzle incorporating section 51 forms the hydrops of the solvent of covering incorporating section outlet 53, and supplies in solvent to nozzle incorporating section 51
The way amount of being supplied to is reduced to second flow from first flow, therefore can be realized province's liquefaction of solvent.
The present invention is by having found that following situations is completed: when the outlet 47 for applying nozzle 41 forms liquid film 73, solvent
The first flow that supply amount needs for big flow, but after forming liquid film 73, even if being set as the supply amount of solvent than
One flow lacks to obtain second flow, can also suck solvent in coating nozzle 41.Therefore, the incorporating section discharge of nozzle incorporating section 51
Mouth 53 is 3.2mm~3.6mm, can save solvent and form the liquid layer 83 of solvent in the front end of coating nozzle 41.
It therefore, can be by resist liquid in the case that the viscosity of resist liquid is bigger as about 1000cp
Incorporating section outlet 53 be set to it is larger, therefore be able to suppress simulation distribution when resist liquid blocking and save solvent.Such as
1~2 second solvent is being supplied with the first flow for being set as 100ml/ minutes, then to be set as 40ml/ minutes second flows
6~7 seconds solvents are supplied, in the case where the front end for applying nozzle 41 forms liquid layer 83 of solvent, and with first flow (100ml/
Minute) supply 7~8 seconds solvents the case where compare, can by solvent supply amount cut down 45% or so.In this way, being set using existing
It is standby, solvent can be saved by adjusting the supply amount of solvent, this method is effective.
(evaluation test 1)
Hereinafter, being illustrated to for completing experimental example of the invention.Firstly, the incorporating section row of evaluation nozzle incorporating section 51
The relevance of the formation of the solvent layer 83 of the size and coating nozzle 41 of outlet 53.Nozzle storage of the invention shown in Fig. 4
In portion 51, make 53 diameter 3.6mm of incorporating section outlet, keeps the traffic attraction for applying nozzle 41 fixed, make to go out from solvent
The supply amount of the solvent of liquid mouth 56 changes between 20ml/ minutes~120ml/ minutes, confirmed whether applying by visual observation
Nozzle 41 is formed with solvent layer 83.In addition, also having been carried out similarly to the nozzle incorporating section 51 that incorporating section outlet 53 is 3.0mm
Evaluation.
As a result, confirmed: in the case that in incorporating section, outlet 53 is 3.6mm, when the supply amount of solvent is 100ml/
Solvent layer 83 is formed at minute~120ml/ minutes, in the case that outlet 53 is 3.0mm in incorporating section, when the supply amount of solvent
The liquid layer of solvent is formed when being 20ml/ minutes~120ml/ minutes.When increasing incorporating section outlet 53, solvent is arranged from incorporating section
Outlet 53 is rapidly discharged, it is difficult to it is coated the attraction of nozzle 41, it can therefore be appreciated that, in order to form solvent layer 83, need to increase
The supply flow rate of solvent.
(evaluation test 2)
Then, the presence or absence of liquid film 73 of front end of evaluation coating nozzle 41 and the formation of the solvent layer 83 of coating nozzle 41
Relevance.It has carried out the confirmation of following situation: in nozzle incorporating section 51 of the invention shown in Fig. 4, having made incorporating section outlet
53 be diameter 3.6mm, when applying the formation of nozzle 41 and not formed liquid film 73, makes the supply of the solvent from solvent liquid outlet 56
Amount changes between 20ml/ minutes~120ml/ minutes, if forms solvent layer 83.In addition, making the traffic attraction for applying nozzle 41
It is fixed.In addition, also having carried out same evaluation to the nozzle incorporating section 51 that incorporating section outlet 53 is 3.0mm.
The result, it is thus identified that: it is 40ml/ in the supply amount of solvent in the case where coating nozzle 41 is formed with liquid film 73
Solvent layer 83 is formed at minute~120ml/ minutes, is 100ml/ in the supply amount of solvent in the case where not formed liquid film 73
Solvent layer 83 is formed at minute~120ml/ minutes.As described above, observing such phenomenon；In incorporating section, outlet 53 is
In biggish situation as 3.6mm, if supplying solvent in the case where the front end for applying nozzle 41 maintains liquid film 73 in advance,
Even if solvent supply amount then later is low discharge, it can also attract the reducing diameter part of nozzle incorporating section 51 for starting point with liquid film 73
The solvent of 52 inner peripheral surface.According to above-mentioned evaluation test, it is thus identified that: when the outlet 47 for applying nozzle 41 forms liquid film 73,
Solvent is supplied with first flow, then, solvent is supplied with the second flow of the low discharge than first flow, thus, it is possible to apply
Solvent layer 83 is formed in nozzle 41 and saves solvent.It can therefore be appreciated that incorporating section outlet 53 internal diameter be 3.2~
In the case where 3.6mm, when first flow is 90ml/ minutes~150ml/ minutes, liquid film is formed in the front end of coating nozzle 41
73, when second flow is 30ml/ minutes~60ml/ minutes, form solvent layer 83.
More than, in the above-described embodiment, from solvent supply unit with the solvent liquid outlet 56 of first flow supply solvent
It can be shared with from solvent supply unit with the solvent liquid outlet 56 of second flow supply solvent, however, it is possible to will be with first flow
The solvent liquid outlet of discharge solvent and such as reducing diameter part 52 is independently arranged at the solvent liquid outlet of second flow discharge solvent
Side wall surface.
As the example for the treatment of fluid of the invention, other than resist liquid, pigment resist (OCCF), water can be enumerated
Dissolubility resist etc. can enumerate dilution or water of PGMEA, OK73 etc. etc. as the example of solvent.In addition, above-mentioned
In embodiment, the example of the nozzle unit 3 equipped with multiple coating nozzles 41 is given, but the number for applying nozzle 41 is unlimited
In above-mentioned example, the structure for being equipped with a coating nozzle can also apply to.Also, the present invention can be applied to semiconductor die
Substrate processed other than piece, such as the liquid processing device of FPD (flat panel display, flat-panel monitor) substrate.
Claims (9)
1. a kind of nozzle apparatus ' of standby, is used for: being used in discharge can be because the nozzle of dry and cured treatment fluid be standby, will be molten
The front end of agent inlet nozzle to form the liquid layer of solvent,
The nozzle apparatus ' of standby is characterised by comprising:
Nozzle incorporating section comprising the inner peripheral surface formed in a manner of surrounding the front end of the nozzle, the outlet phase with nozzle
It is formed with incorporating section outlet over the ground；
Solvent liquid outlet in nozzle incorporating section inner opening, and is formed as guiding along the inner peripheral surface of the nozzle incorporating section
It is discharged from the incorporating section outlet from the solvent that the solvent liquid outlet spues；With
Solvent supply unit is supplied with first flow to solvent liquid outlet when the front end of the nozzle forms the liquid layer of solvent
To solvent, after the solvent forms liquid film in the way of closing the outlet of the nozzle, with fewer than the first flow
Two flows supply solvent to solvent liquid outlet, wherein the second flow is to be able to maintain that the outlet of the nozzle is closed by solvent
State flow.
2. nozzle apparatus ' of standby as described in claim 1, it is characterised in that:
From solvent supply unit with first flow supply solvent solvent liquid outlet with from solvent supply unit with second flow supply it is molten
The solvent liquid outlet of agent is shared solvent liquid outlet.
3. nozzle apparatus ' of standby as claimed in claim 1 or 2, it is characterised in that:
The solvent to spue in the nozzle incorporating section from solvent liquid outlet becomes swirling flow and the position that falls, be formed with more to
The smaller reducing diameter part of the internal diameter that goes down.
4. nozzle apparatus ' of standby as described in any one of claim 1 to 3, it is characterised in that:
The outer diameter of the nozzle at position corresponding with the outlet of the nozzle is 2.5mm~3.0mm,
The internal diameter of the outlet of the nozzle is 3.2mm~3.6mm.
5. such as described in any item nozzle apparatus ' of standby of Claims 1-4, it is characterised in that:
First flow is 90ml/ minutes~150ml/ minutes,
Second flow is 30ml/ minutes~60ml/ minutes.
6. a kind of liquid processing device characterized by comprising
Keep the board holder of substrate；
Nozzle, being used to spue to the surface for the substrate for being held in the board holder can be because of dry and cured treatment fluid；
Described in any item nozzle apparatus ' of standby of claim 1 to 5；With
Attracting mechanism is used to be attracted to the upstream side of the flow path in the standby nozzle of the nozzle apparatus ' of standby, with
Suck solvent.
7. liquid processing device as claimed in claim 6, it is characterised in that:
The viscosity of the treatment fluid is 50cp~1000cp.
8. a kind of method of operation of liquid processing device characterized by comprising
Spuing from nozzle to the surface for the substrate for being held in board holder can be because of the process of dry and cured treatment fluid；
Then make the process that the nozzle is standby in nozzle incorporating section, the nozzle incorporating section includes the front end to surround nozzle
The inner peripheral surface that is formed of mode, and be relatively formed with incorporating section outlet with the outlet of nozzle；
From the outlet discharge treatment fluid in the standby nozzle in the nozzle incorporating section, and from the opposite storage in outlet with the nozzle
The process of portion's outlet discharge treatment fluid；
Then, it is received from the solvent liquid outlet discharge solvent in nozzle incorporating section inner opening along the nozzle with first flow
The solvent that the inner peripheral surface guidance in portion of receiving spues, forms the work of liquid film by the solvent in the way of closing the outlet of the nozzle
Sequence；With
Then, it spues from the solvent liquid outlet in nozzle incorporating section inner opening with the second flow fewer than the first flow
Solvent, the process for the solvent that the inner peripheral surface guidance along the nozzle incorporating section spues, wherein second flow be able to maintain that it is described
The outlet of nozzle is by the flow of the closed state of solvent.
9. a kind of storage medium for being stored in computer program used in liquid processing device, the liquid processing device from nozzle to
Be maintained at the substrate of board holder surface spue can because of dry and cured treatment fluid,
The storage medium is characterized in that:
Step group is incorporated into the computer program, with the method for operation of liquid processing device described in perform claim requirement 8.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017204714A JP6915498B2 (en) | 2017-10-23 | 2017-10-23 | Nozzle standby device, liquid treatment device, operation method of liquid treatment device, and storage medium |
| JP2017-204714 | 2017-10-23 |
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| Publication Number | Publication Date |
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| CN109698145A true CN109698145A (en) | 2019-04-30 |
| CN109698145B CN109698145B (en) | 2023-06-27 |
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| JP (1) | JP6915498B2 (en) |
| KR (1) | KR102627121B1 (en) |
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| JP2022047040A (en) | 2020-09-11 | 2022-03-24 | 東京エレクトロン株式会社 | Nozzle standby device, liquid processing device, and operation method of liquid processing device |
| KR102635382B1 (en) * | 2020-12-31 | 2024-02-14 | 세메스 주식회사 | Substrate treating apparatus and method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP6915498B2 (en) | 2021-08-04 |
| JP2019079886A (en) | 2019-05-23 |
| KR102627121B1 (en) | 2024-01-22 |
| KR20190045062A (en) | 2019-05-02 |
| CN109698145B (en) | 2023-06-27 |
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