CN109696259A - A kind of redundant pressure sensor and preparation method - Google Patents

A kind of redundant pressure sensor and preparation method Download PDF

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Publication number
CN109696259A
CN109696259A CN201811562809.8A CN201811562809A CN109696259A CN 109696259 A CN109696259 A CN 109696259A CN 201811562809 A CN201811562809 A CN 201811562809A CN 109696259 A CN109696259 A CN 109696259A
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CN
China
Prior art keywords
elastic element
pressure chamber
flexible sheet
back side
pressure sensor
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Pending
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CN201811562809.8A
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Chinese (zh)
Inventor
蓝镇立
谢锋
周国方
谢明
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CETC 48 Research Institute
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CETC 48 Research Institute
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Priority to CN201811562809.8A priority Critical patent/CN109696259A/en
Publication of CN109696259A publication Critical patent/CN109696259A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00Measuring force or stress, in general
    • G01L1/16Measuring force or stress, in general using properties of piezoelectric devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The invention discloses a kind of redundant pressure sensor, including elastic element and impulse element, the back side of elastic element is equipped with pressure chamber, forms flexible sheet between pressure chamber and the front of elastic element;The front of the elastic element of pressure chamber face is prepared with multiple mutually independent strain bridges;The back side side of elastic element is connect with impulse component seal, and the tracting pressuring hole being connected with pressure chamber is provided on impulse element.Pressure sensor of the invention has many advantages, such as small in size, light-weight.The invention also discloses a kind of preparation method, comprising steps of S01, at the back side of elastic element opening up pressure chamber, flexible sheet is formed between pressure chamber and the front of elastic element;S02, multiple strain bridges are made on flexible sheet, form chip;S03, the back side side of the elastic element in chip and impulse element are welded and forms seal chamber;S04, lead packages complete assembly.Method of the invention has many advantages, such as simple process, easy to operate.

Description

A kind of redundant pressure sensor and preparation method
Technical field
The invention mainly relates to pressure sensor technique field, a kind of redundant pressure sensor and preparation method are refered in particular to.
Background technique
The high reliability in sensor information channel is the premise of the normal works such as electronic monitoring, control system, and passes Sensor Redundancy Design and measurement are to improve the important means of reliability, can avoid mono signal acquisition sensor failure and cause Operating interruptions even damage, cause irremediable heavy economic losses and casualties, aerospace, weapons, ship, It is more and more applied in the fields such as industry.The design of existing pressure redundant measurement, mainly using dual chip or multi-chip into Row encapsulation measurement, or even directly adopt two or more sensors and be mounted on same pipe joint 4 and measure, as shown in Figure 1, from And volume and weight needed for causing sensor redundancy installation is big, is unable to satisfy development of the Redundancy Design to small size, light weight Demand.
Summary of the invention
The technical problem to be solved in the present invention is that, for technical problem of the existing technology, the present invention provides one Small in size, the light-weight redundant pressure sensor of kind, and a kind of easy to operate, simple process preparation method is accordingly provided.
In order to solve the above technical problems, technical solution proposed by the present invention are as follows:
The back side of a kind of redundant pressure sensor, including elastic element and impulse element, the elastic element is equipped with blind hole To form pressure chamber, flexible sheet is formed between the pressure chamber and the front of the elastic element;The pressure chamber face The front of elastic element is prepared with multiple mutually independent strain bridges;The back side side of the elastic element and impulse member Part is tightly connected, and is provided with tracting pressuring hole on the impulse element, the tracting pressuring hole is connected with the pressure chamber.
As a further improvement of the above technical scheme:
The quantity of the pressure chamber be it is multiple, each strain bridge is respectively arranged on the corresponding flexible sheet of each pressure chamber.
Multiple pressure chambers are mutually indepedent and are evenly distributed on elastic element centered on the axis of the elastic element.
The quantity of the blind hole is three.
The back side of the elastic element opens up fluted, and the groove is connected with each pressure chamber.
The back side side of the elastic element and the impulse element weld.
The invention also discloses a kind of preparation methods of redundant pressure sensor as described above, comprising steps of
S01, blind hole is opened up at the back side of elastic element to form pressure chamber, the front of the blind hole and the elastic element Between form flexible sheet;
S02, multiple strain bridges are made on flexible sheet, form chip;
S03, the back side side of the elastic element in chip and impulse element are welded and forms seal chamber;
S04, lead packages complete assembly.
As a further improvement of the above technical scheme:
In step S02, mirror surface treatment is carried out to flexible sheet surface, passes through semiconductive thin film depositing operation and photoetching work Skill prepares strain bridge on the flexible sheet.
In step S02, multiple foil gauges are pasted on flexible sheet and form multiple strain bridges.
Compared with the prior art, the advantages of the present invention are as follows:
Redundant pressure sensor of the invention is provided with multiple pressure chambers on same elastic element and forms elastic membrane Independent strain bridge is arranged in piece on each flexible sheet, to be assembled into multiple chips on same elastic element, is realizing On the basis of the pressure signal measurement of more redundancies, guarantee integrally-built encapsulation miniaturization and lightweight;Each strain bridge difference Preparation on mutually independent flexible sheet, do not interfere with each other, arbitrarily all the way or two-way chip failure will not influence it is remaining The performance and pressure signal of chip acquire.
The preparation method of redundant pressure sensor of the invention, it is simple process, easy to operate;Prepared redundant pressure passes Sensor has the advantages that as described above.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the prior art.
Fig. 2 is schematic cross-sectional view (embodiment one) of the invention.
Fig. 3 is the schematic cross-sectional view (embodiment one) of elastic element of the present invention.
Fig. 4 is the overlooking structure diagram of elastic element of the present invention.
Fig. 5 is the structure chart (embodiment one) that strain bridge is prepared on elastic element of the invention.
Fig. 6 is overall structure diagram of the invention.
Fig. 7 is the structural schematic diagram (embodiment two) of elastic element of the present invention.
Fig. 8 is the structural schematic diagram (embodiment three) of elastic element of the present invention.
Figure label indicates: 1, elastic element;101, pressure chamber;102, flexible sheet;103, sealing surface;104, groove; 105, section;106, hard-core;2, strain bridge;201, strain resistor;3, impulse element;301, tracting pressuring hole;4, pipe joint.
Specific embodiment
Below in conjunction with Figure of description and specific embodiment, the invention will be further described.
Embodiment one:
As shown in Figures 2 to 6, the redundant pressure sensor of the present embodiment, including elastic element 1 (such as conventional elastomer) With impulse element 3, the back side of elastic element 1 is equipped with multiple blind holes to form pressure chamber 101, pressure chamber 101 and elastic element 1 Flexible sheet 102 is formed between front;The front of the elastic element 1 of each 101 face of pressure chamber is prepared with strain bridge 2, answers Power transformation bridge 2 is made of multiple strain resistors 201, mutually indepedent between each strain bridge 2;The back side side of elastic element 1 is (i.e. close Cover 103) with impulse element 3 be tightly connected (such as weld), be provided with tracting pressuring hole 301 on impulse element 3, tracting pressuring hole 301 and Pressure chamber 101 is connected.Redundant pressure sensor of the invention, be provided on same elastic element 1 multiple pressure chambers 101 with Multiple flexible sheets 102 are formed, independent strain bridge 2 is set on each flexible sheet 102, thus in same elastic element 1 On be assembled into multiple chips, on the basis of realizing the pressure signal measurement of more redundancies, guarantee that integrally-built encapsulation minimizes And lightweight;Each strain bridge 2 is prepared respectively on mutually independent flexible sheet 102, is not interfere with each other, arbitrarily all the way or two-way Chip failure will not influence the performance and pressure signal acquisition of remaining chip.
In the present embodiment, the quantity of pressure chamber 101 is three, and three pressure chambers 101 are mutually indepedent and with elastic element 1 It is evenly distributed on centered on axis on elastic element 1;Each strain bridge 2 is then respectively arranged at the corresponding elasticity of each pressure chamber 101 On diaphragm 102.Certainly, the quantity of pressure chamber 101 is not defined herein, in other embodiments, two can also be used It is a, four or more.
In the present embodiment, for the ease of the assembly between impulse element 3 and elastic element 1, opened at the back side of elastic element 1 Equipped with groove 104, groove 104 is connected with each pressure chamber 101.
The present invention further correspondingly discloses a kind of preparation method of redundant pressure sensor as described above, comprising steps of
S01, blind hole is opened up at the back side of elastic element 1 to form pressure chamber 101, pressure chamber 101 and elastic element 1 are just Flexible sheet 102 is formed between face;In addition the excision on one side of elastic element 1 is formed into section 105, is convenient for subsequent strain bridge 2 Positioning;
S02, mirror surface treatment is carried out to 102 surface of flexible sheet, multiple strain bridges is then prepared on flexible sheet 102 2, form chip;It is of course also possible to form multiple strain bridges 2 by pasting multiple foil gauges;
S03, the back side side (i.e. sealing surface 103) of the elastic element 1 in chip and the welding of impulse element 3 are formed into sealing Chamber;
S04, lead packages complete assembly.
In the present embodiment, in step S02, mirror is carried out to 102 surface of flexible sheet by abrasive polishing process Reason;By semiconductive thin film depositing operation and photoetching process (belonging to common process, details are not described herein) prepared by strain bridge 2 On flexible sheet 102.
In the present embodiment, in step S04, according to the demand of measurement task, can optionally two-way strain bridge 2 carry out it is double Redundant pressure measurement, or open on elastic element 1 double blind hole formed dual redundant pressure measurement, open three or more blind holes formed it is more Redundant pressure measurement.
Embodiment two:
As shown in fig. 7, the present embodiment and the difference of embodiment one are only that: the quantity of pressure chamber 101 is one, i.e., corresponding The quantity of flexible sheet 102 is also one, and each strain bridge 2 is then distributed on flexible sheet 102, is specifically existed with annular distribution On flexible sheet 102.Other not described contents are the same as example 1, and details are not described herein.
Embodiment three:
As shown in figure 8, the difference of the present embodiment and embodiment one is only that: passing through hard-core 106 between each pressure chamber 101 (protrusion is machined into) is mutually isolated, to make between each flexible sheet 102 independently of each other, to avoid interfering with each other.Its Its not described content is the same as example 1, and details are not described herein.
The above is only the preferred embodiment of the present invention, protection scope of the present invention is not limited merely to above-described embodiment, All technical solutions belonged under thinking of the present invention all belong to the scope of protection of the present invention.It should be pointed out that for the art For those of ordinary skill, several improvements and modifications without departing from the principles of the present invention should be regarded as protection of the invention Range.

Claims (9)

1. a kind of redundant pressure sensor, which is characterized in that including elastic element (1) and impulse element (3), the elastic element (1) the back side is equipped with blind hole to be formed pressure chamber (101), between the pressure chamber (101) and the front of the elastic element (1) It is formed flexible sheet (102);The front of the elastic element (1) of pressure chamber (101) face is prepared with multiple mutually independent Strain bridge (2);The back side side of the elastic element (1) and the impulse element (3) are tightly connected, the impulse element (3) it is provided on tracting pressuring hole (301), the tracting pressuring hole (301) is connected with the pressure chamber (101).
2. redundant pressure sensor according to claim 1, which is characterized in that the quantity of the pressure chamber (101) is more A, each strain bridge (2) is respectively arranged on the corresponding flexible sheet (102) of each pressure chamber (101).
3. redundant pressure sensor according to claim 2, which is characterized in that multiple pressure chambers (101) it is mutually indepedent and It is evenly distributed on centered on the axis of the elastic element (1) on elastic element (1).
4. redundant pressure sensor according to claim 3, which is characterized in that the quantity of the blind hole is three.
5. redundant pressure sensor as claimed in any of claims 2 to 4, which is characterized in that the elastic element (1) the back side opens up fluted (104), and the groove (104) is connected with each pressure chamber (101).
6. redundant pressure sensor as claimed in any of claims 1 to 4, which is characterized in that the elastic element (1) back side side and the impulse element (3) is welded.
7. a kind of preparation method of the redundant pressure sensor as described in any one of claim 1 to 6, which is characterized in that Comprising steps of
S01, blind hole is opened up at the back side of elastic element (1) to be formed pressure chamber (101), the blind hole and the elastic element (1) flexible sheet (102) are formed between front;
S02, multiple strain bridges (2) are made on flexible sheet (102), form chip;
S03, the back side side of the elastic element (1) in chip and impulse element (3) welding are formed into seal chamber;
S04, lead packages complete assembly.
8. preparation method according to claim 7, which is characterized in that in step S02, to flexible sheet (102) surface Mirror surface treatment is carried out, is prepared strain bridge (2) in the flexible sheet by semiconductive thin film depositing operation and photoetching process (102) on.
9. preparation method according to claim 7, which is characterized in that in step S02, glued on flexible sheet (102) It pastes multiple foil gauges and forms multiple strain bridges (2).
CN201811562809.8A 2018-12-20 2018-12-20 A kind of redundant pressure sensor and preparation method Pending CN109696259A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110044520A (en) * 2019-05-29 2019-07-23 南京元感微电子有限公司 The force snesor of pressure between measurement solid
CN112880799A (en) * 2021-03-25 2021-06-01 梅特勒-托利多(常州)精密仪器有限公司 Safety redundant sensor

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CN2483705Y (en) * 2001-05-31 2002-03-27 湖南长沙索普测控技术有限公司 Nano pressure sensor
CN102980711A (en) * 2011-09-06 2013-03-20 霍尼韦尔国际公司 Packaged sensor with multiple sensors elements
CN104931194A (en) * 2014-03-19 2015-09-23 阿尔斯通技术有限公司 Probe for measuring pressure oscillations in the combustor of a gas turbine
CN105115659A (en) * 2015-08-31 2015-12-02 中国电子科技集团公司第四十八研究所 Multi-redundancy pressure-sensitive core body
US20150377729A1 (en) * 2013-02-28 2015-12-31 Hitachi Automotive Systems, Ltd. Pressure detecting device
CN205027465U (en) * 2015-05-21 2016-02-10 武汉中航传感技术有限责任公司 Two remaining pressure tube structures
CN106525264A (en) * 2016-12-20 2017-03-22 中国航天空气动力技术研究院 Sputtering thin film temperature-pressure composite sensor and manufacturing method thereof
CN106995205A (en) * 2013-04-30 2017-08-01 基德科技公司 The method for manufacturing pressure sensor
CN206695932U (en) * 2017-03-02 2017-12-01 南京沃天科技有限公司 Triplex redundance pressure sensor

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2483705Y (en) * 2001-05-31 2002-03-27 湖南长沙索普测控技术有限公司 Nano pressure sensor
CN102980711A (en) * 2011-09-06 2013-03-20 霍尼韦尔国际公司 Packaged sensor with multiple sensors elements
US20150377729A1 (en) * 2013-02-28 2015-12-31 Hitachi Automotive Systems, Ltd. Pressure detecting device
CN106995205A (en) * 2013-04-30 2017-08-01 基德科技公司 The method for manufacturing pressure sensor
CN104931194A (en) * 2014-03-19 2015-09-23 阿尔斯通技术有限公司 Probe for measuring pressure oscillations in the combustor of a gas turbine
CN205027465U (en) * 2015-05-21 2016-02-10 武汉中航传感技术有限责任公司 Two remaining pressure tube structures
CN105115659A (en) * 2015-08-31 2015-12-02 中国电子科技集团公司第四十八研究所 Multi-redundancy pressure-sensitive core body
CN106525264A (en) * 2016-12-20 2017-03-22 中国航天空气动力技术研究院 Sputtering thin film temperature-pressure composite sensor and manufacturing method thereof
CN206695932U (en) * 2017-03-02 2017-12-01 南京沃天科技有限公司 Triplex redundance pressure sensor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110044520A (en) * 2019-05-29 2019-07-23 南京元感微电子有限公司 The force snesor of pressure between measurement solid
CN110044520B (en) * 2019-05-29 2021-02-26 南京元感微电子有限公司 Force sensor for measuring pressure between solids
CN112880799A (en) * 2021-03-25 2021-06-01 梅特勒-托利多(常州)精密仪器有限公司 Safety redundant sensor

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