CN109686872B - Preparation method of OLED device - Google Patents
Preparation method of OLED device Download PDFInfo
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- CN109686872B CN109686872B CN201811577636.7A CN201811577636A CN109686872B CN 109686872 B CN109686872 B CN 109686872B CN 201811577636 A CN201811577636 A CN 201811577636A CN 109686872 B CN109686872 B CN 109686872B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
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Abstract
The invention provides a preparation method of an LED device, which comprises the following steps. Providing a substrate, defining a display area and a temporary coating area (dummy area) outside the edge of the display area, wherein the temporary coating area is arranged adjacent to the edge of the display area; preparing a device structure in the display region on the substrate by a solvent method and performing first solvent coating on the temporary coating region; removing the first solvent coated on the temporary coating area. The invention provides a preparation method of an OLED device, which is characterized in that an additional evaporation area is arranged to counteract the impact on s-pixel at the edge of a display area of the device when a solvent is volatilized, so that the uniform film thickness distribution in each row and column s-pixel at the edge of the display area is effectively ensured.
Description
Technical Field
The invention relates to the technical field of light emitting display, in particular to a preparation method of an OLED device.
Background
Organic electroluminescent devices (OLEDs) are known to be the most potential new display devices in recent years due to their advantages of self-luminescence, all solid-state, high contrast, and the like.
Furthermore, the use of evaporation equipment to prepare OLED devices is the mainstream way for producing OLED devices in the industry at present. However, the evaporation process has the disadvantages of low material utilization rate, poor uniformity and the like, and the industry has lacked an effective solution for the problem. The solution process developed later for preparing OLED films gradually shows its advantages of high material utilization rate, low equipment cost, etc.
The solution process mainly includes spin coating, printing, and printing. A method in which a solution containing a light-emitting (or functional) material is dropped in a form of a micro-droplet (pl-scale) at a predetermined position and then the solvent is evaporated to remove, leaving only a thin film formed of a solute (light-emitting or functional material) is abbreviated as IJP (Ink-Jet Printing), which is also a process most suitable for the preparation of the OLED light-emitting device at present.
The major steps of IJP in preparing OLED include:
(1) a precise volume of a droplet is dropped into the sub-pixel opening of Panel.
(2) The droplets were dried to a film by vacuum drying under reduced pressure.
(3) And (4) heating and annealing treatment to improve the quality of the obtained OLED film.
For the display screen produced by the IJP printing OLED technology described above, in addition to the influence of the equipment precision and the raw material, the film thickness shape abnormality generated during the vacuum drying process is also an important factor affecting the product quality.
The reason why the film thickness is not uniform is mainly that the printed solvent itself volatilizes to the periphery in the IJP process, so that the s-pixel film thickness uniformity of the most marginal row and column of the display area is poor and is concentrated to one side due to the influence of the steam when the solvent in the printing ink volatilizes.
To solve this problem, various solutions have been proposed by domestic and foreign research institutes, such as: arranging a blowing device in the direction opposite to the steam volatilization direction or setting the cavity to be in the saturated steam pressure state of the solvent, and the like.
Disclosure of Invention
One aspect of the present invention is to provide a method for manufacturing an OLED device, which includes disposing an additional evaporation area to counteract the impact on the s-pixel at the edge of the display area of the device when a solvent is evaporated, so as to effectively ensure that the film thickness distribution in the corresponding s-pixel at the edge of the display area is uniform.
The technical scheme adopted by the invention is as follows:
a preparation method of an OLED device comprises the following steps:
providing a substrate, defining a display area and a temporary coating area (dummy area) outside the edge of the display area, wherein the temporary coating area is arranged adjacent to the edge of the display area;
preparing a device structure in the display region on the substrate by a solvent method and performing first solvent coating on the temporary coating region;
removing the first solvent coated on the temporary coating area.
Further, in various embodiments, the solvent process is an IJP process.
Further, in various embodiments, the first solvent applied on the temporary application area is a blank solvent used in the IJP process and not dissolved with printing ink.
Further, in various embodiments, the substrate is first coated with the first solvent in the temporary coating region, and then an IJP process of the device structure in the display region is performed.
Further, in various embodiments, the width of the temporary coating area is between 2mm and 100 mm.
Further, in various embodiments, the temporary coating area is defined outward at the peripheral edge of the display area.
Further, in various embodiments, the temporary coating areas are joined at their ends to enclose the display area.
Further, in various embodiments, wherein the temporary coating area is coated with an organic material prior to coating the first solvent.
Further, in various embodiments, wherein the organic material comprises an organic resin material. For example, long chain fatty acid esters.
Further, in various embodiments, wherein the organic resin material is applied by printing on the temporary application area.
Further, in various embodiments, the organic material and the first solvent coated on the temporary coating area are removed by heating and volatilizing.
Compared with the prior art, the invention has the beneficial effects that: the invention relates to a preparation method of an OLED device, which is characterized in that a temporary coating area is arranged around a display area, a blank solvent used in an IJP process of the display area is coated on the temporary coating area, and the impact of the solvent coated at the edge of the display area on each row and column s-pixel at the edge of the display area due to the volatilization of the blank solvent on the temporary coating area is counteracted, so that the uniform film thickness distribution in each row and column s-pixel at the edge of the display area can be ensured.
And after the IJP process, removing the printed solvent and organic resin by heating and volatilizing to finish the preparation of the OLED device.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a structural plan view of an OLED device manufactured by a method for manufacturing an OLED device according to an embodiment of the present invention in an intermediate process;
fig. 2 is a partial side view of the OLED device shown in fig. 1.
The reference numerals in fig. 1-2 are illustrated as follows:
Detailed Description
The following will describe in further detail the technical scheme of the method for manufacturing an OLED device according to the present invention with reference to the accompanying drawings and examples.
One embodiment of the present invention provides a method for manufacturing an OLED device, including the steps of:
providing a substrate, defining a display area and a temporary coating area outside the edge of the display area on the substrate, wherein the temporary coating area is arranged adjacent to the edge of the display area and surrounds the periphery of the display area;
coating the prepared volatile organic resin on the temporary coating area in a coating manner to form a dummy area, wherein the width of the temporary coating area on each side of the display area is between 2mm and 100mm, for example, 15mm, 20mm, 30mm, 50mm, 60mm, and the like, and the specific application can be determined as required and is not limited;
applying a blank solvent of printing Ink (Ink) to the organic resin on the temporary application area by printing;
performing an IJP process on the display area to prepare a device structure in the display area, wherein a solvent related to the printing ink used is a blank solvent used for coating on the temporary coating area;
and after the IJP process of the display area is finished, removing the organic resin and the blank solvent on the temporary coating area in a heating mode.
Further, for the application of the material on the temporary application area, 1 additional set of coating head module can be added on the printer of the application equipment used to apply the organic resin and the blank solvent on the temporary application area.
The invention relates to a preparation method of an OLED device, which is characterized in that a temporary coating area is arranged around a display area, a blank solvent used in an IJP process of the display area is coated on the temporary coating area, and the impact of the solvent coated at the edge of the display area on each row and column s-pixel at the edge of the display area due to the volatilization of the blank solvent on the temporary coating area is counteracted, so that the uniform film thickness distribution in each row and column s-pixel at the edge of the display area can be ensured.
And after the IJP process, removing the printed solvent and organic resin by heating and volatilizing to finish the preparation of the OLED device.
The technical scope of the present invention is not limited to the contents described in the above description, and those skilled in the art can make various changes and modifications to the above-described embodiments without departing from the technical spirit of the present invention, and these changes and modifications should fall within the scope of the present invention.
Claims (6)
1. A method for preparing an OLED device; the method is characterized by comprising the following steps:
providing a substrate, defining a display area and a temporary coating area outside the edge of the display area on the substrate, wherein the temporary coating area is arranged adjacent to the edge of the display area;
preparing a device structure in the display region on the substrate by a solvent method and performing first solvent coating on the temporary coating region; the solvent method process is an IJP process, wherein the substrate is coated with the first solvent in the temporary coating area, and then the IJP process of the device structure in the display area is performed; wherein the temporary coating area is coated with an organic material comprising a volatilizable organic resin material prior to coating the first solvent on the temporary coating area;
removing the organic material and the first solvent coated on the temporary coating region.
2. A method of making an OLED device according to claim 1; the first solvent coated on the temporary coating area is a blank solvent used in the IJP process and not dissolved with printing ink.
3. A method of making an OLED device according to claim 1; wherein the width of the temporary coating area is between 2mm and 100 mm.
4. A method of making an OLED device according to claim 1; the display panel is characterized in that the temporary coating areas are defined outwards at the peripheral edges of the display area, and the ends of the temporary coating areas are connected to wrap the display area inside.
5. A method of making an OLED device according to claim 1; wherein the organic resin material is applied to the temporary application area by printing.
6. A method of making an OLED device according to claim 1; wherein the organic material and the first solvent applied on the temporary coating area are removed by heating and volatilizing.
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CN107799575A (en) * | 2017-10-31 | 2018-03-13 | 京东方科技集团股份有限公司 | Display base plate, its manufacture method, display and compensation member paster |
CN108063155A (en) * | 2017-12-15 | 2018-05-22 | 京东方科技集团股份有限公司 | Electroluminance display backboard and preparation method thereof, display device |
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CN104260554B (en) * | 2014-09-24 | 2016-03-30 | 京东方科技集团股份有限公司 | The preparation method of inkjet printing methods and equipment, display base plate |
CN104409471B (en) * | 2014-11-04 | 2018-07-24 | 京东方科技集团股份有限公司 | A kind of display base plate and its application method, polymer electroluminescent device |
CN108010953B (en) * | 2017-12-06 | 2020-06-26 | 京东方科技集团股份有限公司 | Organic light-emitting display back plate, preparation method thereof and display device |
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CN107799575A (en) * | 2017-10-31 | 2018-03-13 | 京东方科技集团股份有限公司 | Display base plate, its manufacture method, display and compensation member paster |
CN108063155A (en) * | 2017-12-15 | 2018-05-22 | 京东方科技集团股份有限公司 | Electroluminance display backboard and preparation method thereof, display device |
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