CN109679502A - A kind of silane-modified Electronic Packaging glue and preparation method thereof - Google Patents
A kind of silane-modified Electronic Packaging glue and preparation method thereof Download PDFInfo
- Publication number
- CN109679502A CN109679502A CN201811600115.9A CN201811600115A CN109679502A CN 109679502 A CN109679502 A CN 109679502A CN 201811600115 A CN201811600115 A CN 201811600115A CN 109679502 A CN109679502 A CN 109679502A
- Authority
- CN
- China
- Prior art keywords
- silane
- electronic packaging
- packaging glue
- modified electronic
- modified
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/63—Additives non-macromolecular organic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
Abstract
This application involves a kind of methods for preparing silane-modified Electronic Packaging glue comprising at the first temperature, uniform mixed plasticizer and calcic filler, and and negative pressure dehydration is carried out to mixture system under vacuum conditions, obtain the first reaction mixture；At the second temperature, the first reaction mixture, silane-modified resin and other auxiliary agents are uniformly mixed, the second reaction mixture is obtained；At a temperature of third, the second reaction mixture and catalyst are uniformly mixed, the silane-modified Electronic Packaging glue is obtained.The application further relates to the silane-modified Electronic Packaging glue using above method preparation.Colorless and odorless under the silane-modified Electronic Packaging glue material room temperature of the application, in preparation Electronic Packaging glue product, excellent in stability meets moisture cure crosslinking, environment friendly and pollution-free.
Description
Technical field
This application involves sealant technical fields.Specifically, this application involves a kind of silane-modified Electronic Packaging glue and
Preparation method.
Background technique
Electronic Packaging glue is for the bonding of electronic component, sealing, encapsulating and coating protection.Electron pouring sealant is uncured
Preceding presentation is liquid, has mobility, gelatin viscosity is according to the material of electron pouring sealant product, performance, the difference of production technology
And different from.Casting glue is just able to achieve its use value after being fully cured, can be played after encapsulating adhesive curing it is waterproof and dampproof,
Dust-proof, insulation, thermally conductive, secrecy, anticorrosion, heatproof, shockproof effect.Electronic Packaging glue type is very more, comes from material type
Point, use at most most common predominantly 3 kinds, i.e. epoxy resin packaging plastic, organic siliconresin packaging plastic, polyurethane packaging plastic.
There are many type of organic silicon packaging glue, and different types of organic silicon packaging glue is in heat resistance, waterproof performance, insulation
Performance, optical property have very big difference to the bonding adhesion property of unlike material and hardness etc..Organic silicon packaging glue
Some functional fillers can be added to assign the performance of its conductive and heat-conductive magnetic conduction etc..The machinery of organic silicon packaging glue is strong
Degree is general all poor, also exactly borrows this performance, reaches the effect of " can break into two with one's hands ".This is convenient for the maintenance of electronic device.
Specifically, if certain component is out of order, it is only necessary to casting glue is pried open, after changing new component, so that it may continue to use.
Polyurethane packaging plastic needs digital preservation for precision circuit controller and component in electronics industry and develops
Sealant.Polyurethane packaging plastic has excellent electrical insulating property, is particularly suitable in adverse circumstances (such as moist, vibration and corrosion
The places such as property) sealing of electronic circuit board and component that uses.In addition, polyurethane packaging plastic is suitable for various electronics member devices
Part, the encapsulation of microcomputer control panel etc..
Silane-modified Electronic Packaging glue combines the two-fold advantage of organosilicon material and polyurethane material.As a kind of novel
Electronic package material, silane-modified Electronic Packaging glue has obviously advantage.
Therefore, there is an urgent need in the art to develop a kind of silane-modified Electronic Packaging glue and preparation method thereof.
Summary of the invention
The application's is designed to provide a kind of silane-modified Electronic Packaging glue material, thus solve it is above-mentioned in the prior art
The technical issues of.The purpose of the application, which also resides in, provides a kind of method for preparing silane-modified Electronic Packaging glue material.Herein
In the method for preparing silane-modified Electronic Packaging glue material, plasticizer and calcium powder are dehydrated at high temperature first, then
Silane-modified resin and other auxiliary agent small powders are added, silane-modified Electronic Packaging glue is uniformly mixing to obtain.
The silane-modified Electronic Packaging glue material of the application is free of free isocyanate, environment friendly and pollution-free.The silicon of the application
The modified Electronic Packaging glue product of alkane can crosslink reaction in the case where certain temperature and humidity to reach adhering and sealing
Performance.Toxic and harmful gas is not discharged simultaneously, oily substance is not discharged, greatly improves Electronic Packaging glue to the bonding of substrate
Performance.
To achieve the goals above, the application provides following technical proposals.
In the first aspect, the application provides a kind of method for preparing silane-modified Electronic Packaging glue, the method includes
Following step:
S1: at the first temperature, uniform mixed plasticizer and calcic filler, and under vacuum conditions to mixture system into
The dehydration of row negative pressure, obtains the first reaction mixture；
S2: at the second temperature, uniformly mixing the first reaction mixture, silane-modified resin and other auxiliary agents, obtains the
Two reaction mixtures；
S3: at a temperature of third, the second reaction mixture and catalyst is uniformly mixed, the silane-modified electronic seal is obtained
Fill glue；
Wherein the silane-modified resin degree of functionality is 2, and color clarification is transparent, and viscosity is 40000- under standard conditions
60000mPa·s。
In a kind of embodiment of first aspect, first temperature is 100-120 DEG C, it is therefore preferable to 105-115 DEG C；
And/or the second temperature is lower than 50 DEG C；
And/or the third temperature is lower than 50 DEG C.
In a kind of embodiment of first aspect, the negative pressure dewatering time in step S1 is 4-6 hours；
And/or the mixing in the step S2 is realized by stirring, incorporation time is 0.5-1 hours；
And/or the mixing in the step S3 is realized by stirring, incorporation time is 0.5-1 hours.
In a kind of embodiment of first aspect, plasticizer described in step S1 is diisononyl phthalate
DINP, diisooctyl phthalate DIDP or dibutyl phthalate DBP (；
And/or calcic filler described in step S1 is powdered whiting.
In a kind of embodiment of first aspect, in step S2 silane-modified resin be 910R, S203H,
The combination of one or more of SPUR1015LM, Desmoseal S XP 2636；
And/or in step S2, other auxiliary agents include one of age resister, water absorbing agent or adhesion promoters or
It is several.
In a kind of embodiment of first aspect, counted on the basis of weight, in the step S1, the plasticizer and
Calcic filler weight accounts for the 50%-55% of all raw material gross weights.
In a kind of embodiment of first aspect, counted on the basis of weight, in the step S2, silane-modified resin
And the weight of other auxiliary agents accounts for the 45%-50% of all raw material gross weights.
In a kind of embodiment of first aspect, counted on the basis of weight, in the step S3, the weight of catalyst
Account for the 0.1%-0.2% of all raw material gross weights.
In a kind of embodiment of first aspect, in step S3, the catalyst is dibutyl tin dilaurate DY-
12, one of DY-5505, DY-5508, organic bismuth catalyst DY-20, environmentally friendly zinc catalyst DY-5350.
In second aspect, the application provide it is a kind of by as described in relation to the first aspect prepare silane-modified Electronic Packaging glue
Method prepared by silane-modified Electronic Packaging glue.
In a kind of embodiment of second aspect, silane-modified Electronic Packaging glue material moisture solidification in air
The surface drying time of maintenance one week, gel is less than or equal to 60 minutes.
It in a kind of embodiment of second aspect, is counted on the basis of parts by weight, the silane-modified Electronic Packaging glue
It is made of following raw material components: 150 parts of plasticizer, 250 parts of calcic fillers, 90 parts of silane-modified resins, 3 parts of age resisters, 7 parts
Deicer, 4 parts of adhesion promoters and 0.8 part of catalyst.
Compared with prior art, the beneficial effects of the present application are as follows the silane-modified Electronic Packaging glue material room temperature of the application
Lower colorless and odorless, in preparation Electronic Packaging glue product, excellent in stability meets moisture cure crosslinking, environment friendly and pollution-free.
Specific embodiment
Unless otherwise indicated, from context cues or belong to the convention of the prior art, otherwise number all in the application
It is all based on weight with percentage, and test and characterizing method used is all synchronous with the submission date of the application.It is being applicable in
In the case where, any patent, patent application or disclosure involved in the application are fully incorporated in this as reference, and its
Patent families of equal value are also introduced into as reference, about the synthetic technology in this field, product disclosed by these special documents
With the definition of fabrication design, polymer, comonomer, initiator or catalyst etc..If the specific art disclosed in the prior art
Defining for language is inconsistent with any definition provided herein, then term provided herein of being subject to defines.
Digital scope in the application is approximation, therefore unless otherwise stated, it may include the number other than range
Value.Numberical range include with the increased all numerical value from lower limit value to upper limit value of 1 unit, condition be any lower value with
There are the intervals of at least two unit between any high value.For example, if compositional, physics or other property (such as molecules
Amount, melt index (MI) etc.) it is 100 to 1000, it is meant that clearly list all single numbers, such as 100,101,102 etc., with
And all subranges, such as 100 to 166,155 to 170,198 to 200 etc..For comprising the numerical value less than 1 or comprising big
In the range of 1 score (such as 1.1,1.5 etc.), then suitably regard 1 unit as 0.0001,0.001,0.01 or 0.1.
For the range comprising the units less than 10 (such as 1 to 5), usually regarding 1 unit as 0.1., these are only intended to table
The specific example of the content reached, and all possible combination of the numerical value between cited minimum and peak is all recognized
In this application for clear record.Numberical range in the application particularly provides calcic filer content, whipping temp and this
The various features and property of a little components.
About chemical compound in use, unless explicitly stated otherwise, otherwise odd number includes all isomeric forms, otherwise also
So (for example, whole isomers that " hexane " either individually or collectively includes hexane).In addition, unless explicitly stated otherwise, otherwise using
"one", the noun that "an" or "the" are described also includes its plural form.
Term "comprising", " comprising ", " having " and their derivative are not excluded for any other component, step or mistake
The presence of journey, and whether disclose in this application with these other components, step or process unrelated.To eliminate any query,
Unless expressly stated, otherwise in the application it is all use term "comprising"s, " comprising ", or " having " composition may include appoint
What additional additive, auxiliary material or compound.On the contrary, in addition to necessary to operating characteristics those, term " substantially by ...
Composition " excludes any other component, step or process except the hereinafter described range of any term.Term " by ...
Composition " does not include any component, step or the process for not specifically describing or listing.Unless expressly stated, otherwise term "or" refers to
Separate member listed or any combination thereof.
In the first aspect, the application provides a kind of method for preparing silane-modified Electronic Packaging glue material, the method
May include following step:
S1: 100-120 DEG C at a temperature of, stir plasticizer and calcium powder, to mixture under vacuum condition
System carries out negative pressure dehydration；
S2: lower than 50 DEG C at a temperature of, silane-modified resin and other auxiliary agent small powders is added, stirs evenly intermediate pre-
Mixed object；
S3: lower than 50 DEG C at a temperature of, be added catalyst, be uniformly mixing to obtain silane-modified Electronic Packaging glue finished product material
Material；
Wherein the silane-modified resin degree of functionality is 2, and color clarification is transparent, and viscosity is 40000-60 under standard conditions
000mPa·s。
In a kind of embodiment of first aspect, plasticizer and calcium powder are sufficiently mixed uniformly.
In a kind of embodiment of first aspect, the mixture of plasticizer and calcium powder is carried out being heated up to 100-120 DEG C.
In a kind of embodiment of first aspect, vacuum dehydration is carried out to the mixture of plasticizer and calcium powder.
In a kind of embodiment of first aspect, the negative pressure dewatering time is 4-6 hours.
In a kind of embodiment of first aspect, the mixing time in step S2 is 0.5-1 hours；And/or step S3
In mixing time be 0.5-1 hours.
In a kind of embodiment of first aspect, the raw material include silane-modified resin, DINP, calcium powder, anti-ageing
The raw material such as agent, water absorbing agent, adhesion promoters and catalyst.
In a kind of embodiment of first aspect, in the step S1, the plasticizer and calcium powder weight accounting are
50%-55%.
In a kind of embodiment of first aspect, in the step S2, Silante terminated resin and other small powder auxiliary agents
Additive amount be 45%-50%.
In a kind of embodiment of first aspect, in the step S3, the additive amount of catalyst is 0.1%-
0.2%.
In second aspect, the application provide it is a kind of by as described in relation to the first aspect prepare modified silane Electronic Packaging glue
The method of material is come the silane-modified Electronic Packaging glue material for preparing.
In a kind of embodiment of second aspect, silane-modified Electronic Packaging glue material moisture solidification in air
The surface drying time of maintenance one week, gel is less than or equal to 60 minutes.
In a specific embodiment, this application provides a kind of modified silane Electronic Packaging glue material and its preparation sides
Method, the preparation method include the following steps:
(1) 100-120 DEG C at a temperature of, stir plasticizer and calcium powder, to mixture under vacuum condition
System carries out negative pressure dehydration；
(2) lower than 50 DEG C at a temperature of, silane-modified resin and other auxiliary agent small powders is added, stirs evenly intermediate pre-
Mixed object；
(3) lower than 50 DEG C at a temperature of, be added catalyst, be uniformly mixing to obtain silane-modified Electronic Packaging glue finished product material
Material；
In step (1), the plasticizer is the plasticizer of conventional commercial.Preferably, the plasticizer is phthalic acid
Dinonyl DINP.The diisononyl phthalate DINP is preferably by commercial (Shanghai) the limited public affairs of ExxonMobil Chemical
Department provides.
In step (1), the calcium powder is commercially available conventional calcium powder.Preferably, the calcium powder is powdered whiting Omyacarb
5-JI is provided by Changxing Ou meter Ya Gai Ye Co., Ltd.Powdered whiting ZG-1250 is mentioned by Qing Yuan chemical industry Co., Ltd
For.Powdered whiting G1250 is provided by Guangzhou Jia Liang mineral products Co., Ltd.Powdered whiting YF-E is had by skill peak mining industry science and technology
Limit company provides.
In step (1), the mixing temperature of the plasticizer and calcium powder is this field ordinary temperature, preferably less than 40
℃。
In step (1), after the mixing of the plasticizer and calcium powder, steam heating, control temperature 100-120 degrees Celsius it
Between, preferably 105-115 DEG C.
In step (1), vacuum decompression water removal starts to be dehydrated when preferably starting to warm up, pressure is maintained at -0.1MPa.
In step (1), preferably, the vacuum decompression water removal time is 4-6 hours.
In step (2), the silane-modified resin including but not limited to 910R, S203H, SPUR1015LM,
Desmoseal S XP 2636.The silane-modified resin 910R is provided by Shanghai Dongda Chemical Co., Ltd..S203H is by clock
Change trade (Shanghai) Co., Ltd. to provide.SPUR 1015LM is provided by Mitugao New Material Group.Desmoseal S XP
2636 are provided by Cohan wound polymer (China) Co., Ltd.
In step (2), the small powder auxiliary agent is respectively anti-aging auxiliary agent B 75, adhesion promoters Dynasylan1189, removes
Aqua Silquest A-171.Preferably, the B75 is provided by BASF AG.Dynasylan 1189 is by winning
Specialty Chemical (Shanghai) Co., Ltd. is created to provide.Silquest A-171 is provided by Mitugao New Material Group.
In step (2), preferably, silane-modified resin and other small powder auxiliary agents addition temperature are less than 50 DEG C.
In step (2), preferably, after silane-modified resin and the addition of other small powder auxiliary agents, the high-speed stirring at 500r/min
Mix 0.5-1h.
In step (2), during being dispersed with stirring, logical circulating water is needed, autoclave body temperature is kept to be lower than 50 DEG C.
In step (3), the catalyst is dibutyl tin dilaurate, preferably by Shanghai Aladdin biochemical technology share
Co., Ltd provides.
In step (3), catalyst adds temperature less than 50 DEG C.
In step (3), during being dispersed with stirring, logical circulating water is needed, autoclave body temperature is kept to be lower than 50 DEG C.
In step (3), preferably, after catalyst addition, high-speed stirred 0.5-1h.
In a specific embodiment, present invention also provides silane-modified Electronic Packagings made from above-mentioned preparation method
Glue material.
On the basis of common knowledge of the art, above-mentioned each optimum condition, can any combination to get each preferable reality of the application
Example.
Embodiment
Below in conjunction with embodiments herein, clear and complete description is carried out to the technical solution of the application.Such as nothing
It illustrates, reagent used and raw material can all be bought by commercial sources.Actual conditions are not specified in the following example
Experimental method according to conventional methods and conditions, or is selected according to product manual.
In following embodiments, diisononyl phthalate DINP is preferably had by ExxonMobil Chemical commercial (Shanghai)
Limit company provides.
Silane-modified resin 910R is provided by Shanghai Dongda Chemical Co., Ltd..
S203H is provided by Zhong Hua trade (Shanghai) Co., Ltd..
SPUR 1015LM is provided by Mitugao New Material Group.
Desmoseal S XP 2636 is provided by Cohan wound polymer (China) Co., Ltd.
Powdered whiting Omyacarb 5-JI is provided by Changxing Ou meter Ya Gai Ye Co., Ltd.
Powdered whiting ZG-1250 is provided by Qing Yuan chemical industry Co., Ltd.
Powdered whiting G1250 is provided by Guangzhou Jia Liang mineral products Co., Ltd.
Powdered whiting YF-E is provided by Yi Feng mining industry Science and Technology Ltd..
B75 is provided by BASF AG.
Dynasylan 1189 is provided by Ying Chuan Specialty Chemical (Shanghai) Co., Ltd..
Silquest A-171 is provided by Mitugao New Material Group.
Dibutyl tin dilaurate is provided by Shanghai Aladdin biochemical technology limited liability company.
In following implementations, carried out in a planetary stirrer.
Embodiment 1
A kind of silane-modified Electronic Packaging glue material, by being made following preparation method:
(1) 150g diisononyl phthalate DINP and 250g Omyacarb 5-JI is put into reaction kettle, high speed
(500r/min) stirring while logical steam are warming up to 110 DEG C, and negative pressure vacuumizes dehydration 4 hours and is cooled to after detection moisture is qualified
90g 910R is separately added into after 50 DEG C, 3g B75,7g Silquest A-171,4g Dynasylan 1189 is stirred evenly simultaneously
Logical cooling cooling water circulation.
After (2) 1 hours, dibutyl tin dilaurate 0.8g is added at lower than 50 DEG C, is stirred under cooling water cycling condition
After half an hour discharge to get.
Embodiment 2
A kind of silane-modified Electronic Packaging glue material, by being made following preparation method:
(1) 150g diisononyl phthalate DINP and 250g ZG-1250 is put into reaction kettle, high speed (500r/
Min it) stirs while logical steam is warming up to 110 DEG C, negative pressure vacuumizes dehydration 4 hours, after detection moisture is qualified, after being cooled to 50 DEG C
It is separately added into 90g SPUR 1015LM, 3g B75,7g Silquest A-171,4g Dynasylan 1189, is stirred evenly simultaneously
Logical cooling cooling water circulation.
After (2) 1 hours, dibutyl tin dilaurate 0.8g is added at lower than 50 DEG C, is stirred under cooling water cycling condition
After half an hour discharge to get.
Embodiment 3
A kind of silane-modified Electronic Packaging glue material, by being made following preparation method:
(1) 150g diisononyl phthalate DINP and 250g G1250 is put into reaction kettle, high speed (500r/min)
Stirring while logical steam are warming up to 110 DEG C, and negative pressure vacuumizes dehydration 4 hours, after detection moisture is qualified, after being cooled to 50 DEG C respectively
90g Desmoseal S XP 2636,3g B75,7g Silquest A-171,4g Dynasylan 1189 is added, stirring is equal
Even and logical cooling cooling water circulation.
After (2) 1 hours, dibutyl tin dilaurate 0.8g is added at lower than 50 DEG C, is stirred under cooling water cycling condition
After half an hour discharge to get.
Embodiment 4
A kind of silane-modified Electronic Packaging glue material, by being made following preparation method:
(1) 150g diisononyl phthalate DINP and 250g YF-E is put into reaction kettle, high speed (500r/min) is stirred
It mixes while logical steam is warming up to 110 DEG C, negative pressure vacuumizes dehydration 4 hours and is cooled to after 50 DEG C and adds respectively after detection moisture is qualified
Enter 90g S203H, 3g B75,7g Silquest A-171,4g Dynasylan 1189, stir evenly and leads to cooling water circulation
Cooling.
After (2) 1 hours, dibutyl tin dilaurate 0.8g is added at lower than 50 DEG C, is stirred under cooling water cycling condition
After half an hour discharge to get.
At 25 DEG C, the silane-modified Electronic Packaging glue material of testing example 1-4 in air support by moisture solidification respectively
Modulus, surface drying time, viscosity and the tensile strength of shield after a week, test result is as follows shown in table 1.
The silane-modified Electronic Packaging glue performance data of table 1.
The above-mentioned description to embodiment is that this Shen can be understood and applied for the ease of those skilled in the art
Please.Person skilled in the art obviously easily can make various modifications to these embodiments, and described herein
General Principle is applied in other embodiments without paying creative labor.Therefore, the application is not limited to implementation here
Example, those skilled in the art make according to herein disclosed content in the case where not departing from the application scope and spirit
It improves and modifies within all scope of the present application.
Claims (10)
1. a kind of method for preparing silane-modified Electronic Packaging glue, the method includes the following steps:
S1: at the first temperature, uniform mixed plasticizer and calcic filler, and mixture system is born under vacuum conditions
Press-dehydrating obtains the first reaction mixture；
S2: at the second temperature, the first reaction mixture, silane-modified resin and other auxiliary agents are uniformly mixed, it is anti-obtains second
Answer mixture；
S3: at a temperature of third, the second reaction mixture and catalyst is uniformly mixed, the silane-modified Electronic Packaging is obtained
Glue；
Wherein the silane-modified resin degree of functionality is 2, and color clarification is transparent, and viscosity is 40000- under standard conditions
60000mPa·s。
2. preparing the method for silane-modified Electronic Packaging glue as described in claim 1, which is characterized in that first temperature is
100-120 DEG C, it is therefore preferable to 105-115 DEG C；
And/or the second temperature is lower than 50 DEG C；
And/or the third temperature is lower than 50 DEG C.
3. preparing the method for silane-modified Electronic Packaging glue as described in claim 1, which is characterized in that the negative pressure in step S1
Dewatering time is 4-6 hours；
And/or the mixing in the step S2 is realized by stirring, incorporation time is 0.5-1 hours；
And/or the mixing in the step S3 is realized by stirring, incorporation time is 0.5-1 hours.
4. preparing the method for silane-modified Electronic Packaging glue as described in claim 1, which is characterized in that increase described in step S1
Modeling agent is diisononyl phthalate DINP, diisooctyl phthalate DIDP or dibutyl phthalate DBP；
And/or calcic filler described in step S1 is powdered whiting.
5. preparing the method for silane-modified Electronic Packaging glue as described in claim 1, which is characterized in that silane changes in step S2
Property resin be 910R, S203H, SPUR 1015LM, the combination of one or more of Desmoseal S XP 2636；
And/or in step S2, other auxiliary agents include one or more of age resister, water absorbing agent or adhesion promoters.
6. preparing the method for silane-modified Electronic Packaging glue as described in claim 1, which is characterized in that on the basis of weight
Meter, in the step S1, the plasticizer and calcic filler weight account for the 50%-55% of all raw material gross weights；
And/or in the step S2, the weight of silane-modified resin and other auxiliary agents accounts for the 45%- of all raw material gross weights
50%；
And/or in the step S3, the weight of catalyst accounts for the 0.1%-0.2% of all raw material gross weights.
7. preparing the method for silane-modified Electronic Packaging glue as described in claim 1, which is characterized in that described in step S3
Catalyst is dibutyl tin dilaurate DY-12, DY-5505, DY-5508, organic bismuth catalyst DY-20, environmentally friendly zinc catalyst
One of DY-5350.
8. a kind of by as prepared by the method for any of claims 1-7 for preparing silane-modified Electronic Packaging glue
Silane-modified Electronic Packaging glue.
9. silane-modified Electronic Packaging glue as claimed in claim 8, which is characterized in that the silane-modified Electronic Packaging glue material
Moisture solidification conserves one week material in air, and the surface drying time of gel is less than or equal to 60 minutes.
10. silane-modified Electronic Packaging glue as claimed in claim 8, which is characterized in that it is counted on the basis of parts by weight, it is described
Silane-modified Electronic Packaging glue is made of following raw material components: 150 parts of plasticizer, 250 parts of calcic fillers, 90 parts of silane-modified trees
Rouge, 3 parts of age resisters, 7 parts of deicers, 4 parts of adhesion promoters and 0.8 part of catalyst.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811600115.9A CN109679502A (en) | 2018-12-26 | 2018-12-26 | A kind of silane-modified Electronic Packaging glue and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811600115.9A CN109679502A (en) | 2018-12-26 | 2018-12-26 | A kind of silane-modified Electronic Packaging glue and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109679502A true CN109679502A (en) | 2019-04-26 |
Family
ID=66188558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811600115.9A Pending CN109679502A (en) | 2018-12-26 | 2018-12-26 | A kind of silane-modified Electronic Packaging glue and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109679502A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014040498A (en) * | 2012-08-21 | 2014-03-06 | Panac Co Ltd | Self-adhesive film and method for manufacturing shatterproof glass using the same |
| CN106634768A (en) * | 2016-12-14 | 2017-05-10 | 湖北回天新材料股份有限公司 | Silane modified polyether sealant with excellent water soaking bonding performance and preparation method thereof |
-
2018
- 2018-12-26 CN CN201811600115.9A patent/CN109679502A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014040498A (en) * | 2012-08-21 | 2014-03-06 | Panac Co Ltd | Self-adhesive film and method for manufacturing shatterproof glass using the same |
| CN106634768A (en) * | 2016-12-14 | 2017-05-10 | 湖北回天新材料股份有限公司 | Silane modified polyether sealant with excellent water soaking bonding performance and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105601932B (en) | A kind of dual cure type modified silicon rubber and preparation method thereof | |
| US10522724B2 (en) | LED packaging material and manufacturing method of the same | |
| CN104497959B (en) | Single-component room-temperature-vulsilicone silicone rubber sealant and preparation method thereof | |
| CN105670555A (en) | High heat conductivity organosilicon potting compound | |
| KR20120120005A (en) | Curable composition, cured product, photo-semiconductor device, and polysiloxane | |
| CN107880827A (en) | A kind of compound casting glue of epoxy resin organosilicon and preparation method thereof | |
| CN108611048A (en) | Dry-type transformer dealcoholized type organic silicon potting adhesive and preparation method thereof | |
| CN102372835B (en) | Method for manufacturing cured product of thermosetting resin composition and cured product obtained thereby | |
| KR101835937B1 (en) | Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared from using the same | |
| KR101768305B1 (en) | Phosphonium compound, epoxy resin composition comprising the same and semiconductor device prepared from using the same | |
| KR101802583B1 (en) | Epoxy resin composition for encapsulating semiconductor device and semiconductor device prepared from using the same | |
| KR101813758B1 (en) | Phosphonium compound, epoxy resin composition comprising the same and semiconductor device prepared from using the same | |
| CN109679502A (en) | A kind of silane-modified Electronic Packaging glue and preparation method thereof | |
| CN102372836A (en) | Method for manufacturing cured product of thermosetting resin composition and cured product obtained thereby | |
| CN109652008A (en) | A kind of silane-modified doors and windows sealing glue and preparation method thereof | |
| CN109679501A (en) | A kind of silane-modified water-repellent paint and preparation method thereof | |
| CN109735302A (en) | A kind of silane-modified glue for tile and preparation method thereof | |
| JP6946088B2 (en) | A composition for a cured resin, a cured product of the composition, a method for producing the composition and the cured product, and a semiconductor device. | |
| CN109735303A (en) | Silane-modified mould proof glue of one kind and preparation method thereof | |
| KR101845134B1 (en) | Phosphonium compound, epoxy resin composition comprising the same and semiconductor device prepared from using the same | |
| CN109735304A (en) | A kind of assembled architecture silane-modified sealant and preparation method thereof | |
| CN108753247A (en) | A kind of preparation method of insulating cement | |
| TWI707883B (en) | Polyalkynes and its preparation method and use | |
| KR101768287B1 (en) | Phosphonium compound, epoxy resin composition comprising the same and semiconductor device prepared from using the same | |
| CN109467679B (en) | Preparation method of epoxy molding compound |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190426 |
|
| RJ01 | Rejection of invention patent application after publication |