CN109671652A - A kind of silicon wafer discriminating conduct - Google Patents
A kind of silicon wafer discriminating conduct Download PDFInfo
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- CN109671652A CN109671652A CN201811593780.XA CN201811593780A CN109671652A CN 109671652 A CN109671652 A CN 109671652A CN 201811593780 A CN201811593780 A CN 201811593780A CN 109671652 A CN109671652 A CN 109671652A
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- silicon wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V20/00—Scenes; Scene-specific elements
- G06V20/60—Type of objects
- G06V20/62—Text, e.g. of license plates, overlay texts or captions on TV images
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V30/00—Character recognition; Recognising digital ink; Document-oriented image-based pattern recognition
- G06V30/10—Character recognition
Abstract
The invention discloses a kind of silicon wafer discriminating conducts, the following steps are included: step S01: utilizing a silicon box, after completing silicon wafer pick-and-place, the id information of silicon wafer to be distinguished on slot position each in silicon box position is scanned, obtains needing to be distinguished the id information of silicon wafer in silicon box；Step S02: the id information of the silicon wafer to be distinguished is passed into manufacturing execution system；Step S03: being compared by id information of the manufacturing execution system to the silicon wafer to be distinguished, confirms the type of the silicon wafer to be distinguished.The present invention can reduce the use of silicon box type, improve silicon box utilization rate, reduce the complexity of related silicon wafer Slicing procedure, reduce risk of error, improve production efficiency.
Description
Technical field
The present invention relates to semiconductor integrated circuit apparatus technical fields, more particularly, to a kind of silicon wafer discriminating conduct.
Background technique
In semiconductor integrated circuit manufacture, the degree of automation is higher and higher, produces and processes in 200mm and 300mm silicon wafer
In, use SMIF POD (for 200mm) and FOUP (for 300mm) silicon box generally to load the silicon wafer that need to be processed.
In silicon chip working process, before silicon wafer is sent to and is processed inside process equipment, need in silicon box
Whether silicon wafer is scanned mapping (mapping), to confirm the silicon wafer quantity in silicon box, every position and have folded
Piece is tiltedly put etc. erroneous conditions and is occurred, and avoids malfunctioning in processing piece delivery process.
Referring to FIG. 1, Fig. 1 is prior art 300mm front equipment end schematic diagram.As shown in Figure 1, front equipment end (EFEM)
101 have silicon box loading stage (FOUP Loader) 103 and scanning mapping (mapping) module 102, when silicon box 104 is put
After preparation work on loading stage 103, before starting operation, scanning mapping (mapping) module 102 can fill the inside FOUP
Some silicon wafers are scanned confirmation.
In the prior art, the movement of silicon wafer scanning mapping (mapping) needs to be sent to process equipment front end in silicon box
Loadport (loading stage) simultaneously completes to complete after silicon box loads.In existing scheme, for silicon wafer mapping, usually need
A kind of silicon wafer has been fixedly installed；But with the development of semiconductor processing technology, there are the silicon wafer needs of different-thickness at present
Processing, for example 2 pieces of silicon wafers are stacked processing by bonding (bonding) technology, this is to existing mapping scheme at present
It challenges, it is that 1 piece of normal bonding stacks silicon wafer or 2 ordinary silicon chips put lamination that equipment, which can not directly pick out silicon wafer,
, the former is normal condition, and needs to report an error in the case of the latter.
Existing solution is to install different silicon wafers using different silicon box, i.e., ordinary silicon chip is mounted in a kind of silicon
In film magazine, bonding stacks silicon wafer and is all mounted in another silicon box, is set by the info pad (information board) in silicon box
It is fixed come inform process equipment loading stage by it is to be processed be which kind of silicon wafer.
Referring to FIG. 2, Fig. 2 is two kinds of 300mm silicon box schematic internal views of the prior art.As shown in Fig. 2 (a), often
For with 25 slot positions (slot1~25), each slot position two sides have groove, when scanning maps (mapping) module pair
After being scanned inside silicon box 104, can be confirmed has one piece of silicon wafer normally put 105 in 8 position certain slot position slot,
If any exception, such as in 105 thickness of silicon wafer and setting value difference of slot position slot8, equipment mapping shows that result is different
Often；Equipment maps (mapping) information according to scanning, and can be confirmed normally take silicon wafer from each slot position position, or by silicon
Piece places correct slot position position.
In the prior art, it for different silicon wafer thicknesses, is only capable of being placed in different types of FOUP by different silicon wafers come area
Point, as shown in Fig. 2 (a) and Fig. 2 (b), the silicon box 104 of Fig. 2 (a) is only capable of the silicon wafer 105 that storage bonding stacks, the silicon of Fig. 2 (b)
Film magazine 204 is only capable of the silicon wafer 205 of storage general thickness.
It in existing scheme, needs to use a variety of silicon box, and in silicon wafer Slicing procedure, will bring greater inconvenience.
Summary of the invention
It is an object of the invention to overcome drawbacks described above of the existing technology, a kind of silicon wafer discriminating conduct is provided.
To achieve the above object, technical scheme is as follows:
A kind of silicon wafer discriminating conduct, comprising the following steps:
Step S01: utilize a silicon box, when complete silicon wafer pick and place after, on slot position each in silicon box position wait distinguish
The id information of silicon wafer is scanned, and obtains needing to be distinguished the id information of silicon wafer in silicon box；
Step S02: the id information of the silicon wafer to be distinguished is passed into manufacturing execution system；
Step S03: it is compared by id information of the manufacturing execution system to the silicon wafer to be distinguished, described in confirmation
The type of silicon wafer to be distinguished.
Further, image processing unit is arranged by each slot position position inside the silicon box, to silicon box
The id information of silicon wafer to be distinguished carries out real time scan on interior each slot position position.
Further, the id information is located at the silicon chip back side to be distinguished, described image processing unit towards it is described to
Distinguish that silicon chip back side is set on each slot position position.
Further, described image processing unit is cmos image sensor.
Further, by setting information processing and storage unit in the silicon box, by the silicon wafer to be distinguished
Id information real-time delivery is to manufacturing execution system.
Further, by the information processing and storage unit, the id information of the silicon wafer to be distinguished is handled,
And the manufacturing execution system is passed to by wireless network.
Further, the information processing and storage unit first pass through wireless network, and the ID of the silicon wafer to be distinguished is believed
Breath passes to material control system, then the id information of the silicon wafer to be distinguished is passed to the system by the material control system
Make execution system.
Further, by the manufacturing execution system, real-time statistics are carried out to the id information of the silicon wafer to be distinguished, and
It is compared with the id information of the standard silicon chip of databases storage, to confirm that the type of the silicon wafer to be distinguished is normal thickness
Single silicon wafer still stack silicon wafer.
Further, further includes:
Step S04: by the manufacturing execution system, the id information of the silicon wafer to be distinguished after will confirm that type is real-time
Pass to the equipment for needing to handle in silicon box the silicon wafer to be distinguished, and by described in the equipment automatic identification and processing to
Distinguish silicon wafer.
Compared with the prior art, it the advantage of the invention is that the use of silicon box type can be reduced, improves silicon box and utilizes
Rate, and avoiding equipment that from can not distinguishing is that normal bonding stacks silicon wafer, or abnormal ordinary silicon chip puts overlapping phenomenon, reduces
The complexity of related silicon wafer Slicing procedure reduces risk of error, improves production efficiency.
Detailed description of the invention
Fig. 1 is a kind of existing 300mm front equipment end schematic diagram.
Fig. 2 is two kinds of 300mm silicon box schematic internal views of the prior art.
Fig. 3 is a kind of silicon box schematic internal view applied in a preferred embodiment of the present invention.
Fig. 4 is a kind of silicon chip back side feature schematic diagram.
Fig. 5 is that scanning mapping (mapping) information transmission path proposed in a kind of silicon wafer discriminating conduct of the invention shows
It is intended to.
Specific embodiment
Core of the invention thought is that the present invention provides a kind of silicon wafer discriminating conduct, comprising the following steps:
Step S01: utilize a silicon box, when complete silicon wafer pick and place after, on slot position each in silicon box position wait distinguish
The id information of silicon wafer is scanned, and obtains needing to be distinguished the id information of silicon wafer in silicon box；
Step S02: the id information of the silicon wafer to be distinguished is passed into manufacturing execution system；
Step S03: it is compared by id information of the manufacturing execution system to the silicon wafer to be distinguished, described in confirmation
The type of silicon wafer to be distinguished.It may also include that
Step S04: by the manufacturing execution system, the id information of the silicon wafer to be distinguished after will confirm that type is real-time
Pass to the equipment for needing to handle in silicon box the silicon wafer to be distinguished, and by described in the equipment automatic identification and processing to
Distinguish silicon wafer.
Compared with the prior art, the advantages of the present invention are as follows the uses that can reduce silicon box type, improve silicon box benefit
With rate, and avoiding equipment that from can not distinguishing is that normal bonding stacks silicon wafer, or abnormal ordinary silicon chip puts overlapping phenomenon, subtracts
The complexity of few correlation silicon wafer Slicing procedure, reduces risk of error, improves production efficiency.
With reference to the accompanying drawing, specific embodiments of the present invention will be described in further detail.
It should be noted that in following specific embodiments, when describing embodiments of the invention in detail, in order to clear
Ground indicates structure of the invention in order to illustrate, spy does not draw to the structure in attached drawing according to general proportion, and has carried out part
Amplification, deformation and simplified processing, therefore, should be avoided in this, as limitation of the invention to understand.
In specific embodiment of the invention below, referring to FIG. 3, Fig. 3 is applied in a preferred embodiment of the present invention
A kind of silicon box schematic internal view.As shown in figure 3, in a kind of silicon wafer discriminating conduct of the invention, in 304 inside 25 of silicon box
Each position slot position slot1~25 in a slot position is provided with image processing unit 307, for reading each slot position (slot)
ID (silicon wafer number) information for the identical or different silicon wafer 305,306 placed on position.It is schematically shown out in figure in silicon box
Put the single silicon wafer 305 there are two general thickness.And two stacking silicon wafers 306.It can be piled in silicon box or part is put
Full silicon wafer, is also possible in blank state.
Fig. 4 is conventional silicon wafers schematic rear view.According to SEMI standard, 205 back side of silicon wafer, which can use, meets unified standard
ID of the character 206 as every piece of silicon wafer, this ID has uniqueness, and position is fixed.
The present invention has the feature of ID using silicon chip back side note, i.e., has the feature of id information in silicon chip back side to be distinguished,
Each position slot position slot1~25 in 304 25 slot positions in inside of silicon box shown in Fig. 3, and towards silicon chip back side to be distinguished
Direction, all be provided with image processing unit 307, to silicon wafer 305,306 to be distinguished on slot position position each in silicon box 304
Id information carry out real time scan, so as to read the identical or different silicon wafer 305 placed on the position each slot position (slot),
306 ID (silicon wafer number) information.
As an optional embodiment, cmos image sensor is can be used in image processing unit.
Fig. 5 is scanning mapping (mapping) information transmission path schematic diagram.It completes to treat discrimination in FOUP (silicon box)
After the scanning mapping (mapping) of silicon wafer, the ID for the silicon wafer to be distinguished that can in real time obtain scanning mapping (mapping) believes
Final updated is ceased to required equipment.
It wherein, can be by the setting information processing in the silicon box 304 of Fig. 3 and storage unit (figure omits), to silicon box 304
The id information of interior every piece of silicon wafer 305,306 is collected, and by the id information real-time delivery of silicon wafer 305,306 to be distinguished to manufacture
Execution system (Manufacturing Execution System, MES) is counted.
Also it can treat by information processing and storage unit and distinguish that the id information of silicon wafer 305,306 is handled, and pass through
Wireless network real-time delivery is to manufacturing execution system.
Further, it goes back available information processing and storage unit first passes through wireless network, it will silicon wafer 305,306 be distinguished
Id information real-time delivery give material control system (Material Control System, MCS), then by material control system
By the id information real-time delivery of silicon wafer 305,306 to be distinguished to manufacturing execution system.By manufacturing execution system, discrimination silicon is treated
The id information of piece 305,306 carries out real-time statistics, and compares with the id information of the standard silicon chip of databases storage, with true
The type for recognizing silicon wafer 305,306 to be distinguished confirms which silicon wafer is the single silicon wafer of normal thickness, which silicon wafer is bonding heap
Folded silicon wafer.
MES system can know the silicon wafer information in each silicon box 304 in real time, then by silicon wafer 305,306 to be distinguished
Id information real-time delivery gives the equipment for needing silicon wafer in handle box, the information of silicon wafer is informed process equipment, so as to equipment
The automatic silicon wafer type differentiated in box, avoiding equipment that from can not distinguishing is that normal bonding stacks silicon wafer, or abnormal ordinary silicon
Piece puts overlapping.
Above is merely a preferred embodiment of the present invention, the scope of patent protection that embodiment is not intended to limit the invention,
Therefore all to change with equivalent structure made by specification and accompanying drawing content of the invention, it similarly should be included in of the invention
In protection scope.
Claims (9)
1. a kind of silicon wafer discriminating conduct, which comprises the following steps:
Step S01: utilizing a silicon box, after completing silicon wafer pick-and-place, to silicon wafer to be distinguished on slot position each in silicon box position
Id information be scanned, obtain needing to be distinguished the id information of silicon wafer in silicon box；
Step S02: the id information of the silicon wafer to be distinguished is passed into manufacturing execution system；
Step S03: being compared by id information of the manufacturing execution system to the silicon wafer to be distinguished, confirmation is described wait distinguish
The type of other silicon wafer.
2. silicon wafer discriminating conduct according to claim 1, which is characterized in that pass through each slot inside the silicon box
Image processing unit is arranged in position position, is swept in real time to the id information of silicon wafer to be distinguished on slot position each in silicon box position
It retouches.
3. silicon wafer discriminating conduct according to claim 2, which is characterized in that the id information is located at the silicon wafer to be distinguished
The back side, described image processing unit are set on each slot position position towards the silicon chip back side to be distinguished.
4. silicon wafer discriminating conduct according to claim 2, which is characterized in that described image processing unit is cmos image biography
Sensor.
5. silicon wafer discriminating conduct according to claim 1, which is characterized in that by the silicon box at setting information
Reason and storage unit, by the id information real-time delivery of the silicon wafer to be distinguished to manufacturing execution system.
6. silicon wafer discriminating conduct according to claim 5, which is characterized in that by the information processing and storage unit,
The id information of the silicon wafer to be distinguished is handled, and the manufacturing execution system is passed to by wireless network.
7. silicon wafer discriminating conduct according to claim 6, which is characterized in that the information processing and storage unit first pass through
The id information of the silicon wafer to be distinguished is passed to material control system by wireless network, then by the material control system by institute
The id information for stating silicon wafer to be distinguished passes to the manufacturing execution system.
8. silicon wafer discriminating conduct according to claim 1, which is characterized in that by the manufacturing execution system, to described
The id information of silicon wafer to be distinguished carries out real-time statistics, and compares with the id information of the standard silicon chip of databases storage, with
The type for confirming the silicon wafer to be distinguished is the single silicon wafer of normal thickness or stacks silicon wafer.
9. silicon wafer discriminating conduct according to claim 1, which is characterized in that further include:
Step S04: by the manufacturing execution system, the id information real-time delivery of the silicon wafer to be distinguished after will confirm that type
Equipment to needing to handle the silicon wafer to be distinguished in silicon box, and it is described wait distinguish by the equipment automatic identification and processing
Silicon wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811593780.XA CN109671652B (en) | 2018-12-25 | 2018-12-25 | Silicon wafer identification method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811593780.XA CN109671652B (en) | 2018-12-25 | 2018-12-25 | Silicon wafer identification method |
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| CN109671652A true CN109671652A (en) | 2019-04-23 |
| CN109671652B CN109671652B (en) | 2021-05-18 |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001056852A (en) * | 1999-08-18 | 2001-02-27 | Sony Corp | Fingerprint collating device |
| CN103466324A (en) * | 2013-09-26 | 2013-12-25 | 上海集成电路研发中心有限公司 | Automatic handling system |
| CN107706133A (en) * | 2017-08-16 | 2018-02-16 | 上海微阱电子科技有限公司 | A kind of silicon chip scanning mapping method and system |
-
2018
- 2018-12-25 CN CN201811593780.XA patent/CN109671652B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001056852A (en) * | 1999-08-18 | 2001-02-27 | Sony Corp | Fingerprint collating device |
| CN103466324A (en) * | 2013-09-26 | 2013-12-25 | 上海集成电路研发中心有限公司 | Automatic handling system |
| CN107706133A (en) * | 2017-08-16 | 2018-02-16 | 上海微阱电子科技有限公司 | A kind of silicon chip scanning mapping method and system |
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| CN109671652B (en) | 2021-05-18 |
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