CN109654453A - Radiator structure and manufacturing method - Google Patents
Radiator structure and manufacturing method Download PDFInfo
- Publication number
- CN109654453A CN109654453A CN201910153388.1A CN201910153388A CN109654453A CN 109654453 A CN109654453 A CN 109654453A CN 201910153388 A CN201910153388 A CN 201910153388A CN 109654453 A CN109654453 A CN 109654453A
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- China
- Prior art keywords
- heat
- metal substrate
- conducting plastic
- plastic component
- radiator structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 105
- 229910052751 metal Inorganic materials 0.000 claims abstract description 103
- 239000002184 metal Substances 0.000 claims abstract description 103
- 229920003023 plastic Polymers 0.000 claims abstract description 76
- 239000004033 plastic Substances 0.000 claims abstract description 76
- 239000011324 bead Substances 0.000 claims abstract description 16
- 238000001746 injection moulding Methods 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 206010033546 Pallor Diseases 0.000 claims description 3
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims 1
- 229910001092 metal group alloy Inorganic materials 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 22
- 230000017525 heat dissipation Effects 0.000 abstract description 12
- 238000012546 transfer Methods 0.000 abstract description 10
- 238000013461 design Methods 0.000 description 12
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000000465 moulding Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
- F21S45/48—Passive cooling, e.g. using fins, thermal conductive elements or openings with means for conducting heat from the inside to the outside of the lighting devices, e.g. with fins on the outer surface of the lighting device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Structure Of Printed Boards (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of radiator structure provided by the invention and manufacturing method, are related to automobile technical field, comprising: the circuit board with lamp bead；Metal substrate, the circuit board and the thermally conductive connection of the metal substrate, the heat of generation is conducted to the metal substrate；The metal substrate is connect with the heat-conducting plastic pieces conduct heat, and heat is dissipated by the heat-conducting plastic component.Replace metal heat sink that overall weight can be effectively reduced by heat-conducting plastic component, good heat-transfer effect can also be played by the thermal conduction characteristic of metal substrate simultaneously, and export heat by heat-conducting plastic component, to realize the effect for effectively reducing car light overall weight on the basis of ensure that heat dissipation effect.
Description
Technical field
The present invention relates to automobile technical fields, more particularly, to a kind of radiator structure and manufacturing method.
Background technique
Car light is essential component on automobile, play provided for driver in the environment of night or insufficient light it is good
Good visual-field space, and with the development of automotive light weight technology, the light-weight design of car light is also an important ring.
And existing car light has the shortcomings that weight is big, and car light is made to be difficult to meet each main engine plants for auto parts and components lightweight
Demand, if not can be well solved these problems, it will be difficult to meet the increasingly harsh energy-saving and emission-reduction requirement of automobile industry.
Summary of the invention
The purpose of the present invention is to provide a kind of radiator structure and manufacturing methods, to solve vehicle existing in the prior art
The big technical problem of lamp weight.
A kind of radiator structure provided by the invention, comprising:
Circuit board with lamp bead；
Metal substrate, the circuit board and the thermally conductive connection of the metal substrate, the heat of generation is conducted to the gold
Belong to substrate；
Heat-conducting plastic component；
The metal substrate is connect with the heat-conducting plastic pieces conduct heat, and heat is disappeared by the heat-conducting plastic component
It dissipates.
Further, in an embodiment of the present invention, the vertical thermal conductivity of the heat-conducting plastic component is with the gold
Belong to the increase of the thickness of substrate and reduces.
Further, in an embodiment of the present invention, the vertical thermal conductivity range of the heat-conducting plastic component is in 1-
Between 15W/ (mK).
Further, in an embodiment of the present invention, the thickness of the metal substrate is between 0.1mm-5mm.
Further, in an embodiment of the present invention, the heat-conducting plastic component and the metal substrate are infused by inserts
Modeling mode is integrally formed.
Further, in an embodiment of the present invention, the circuit board and the metal substrate fixed by gluing, screw thread
The fixed thermally conductive connection of mode of fixed or blanching.
Further, in an embodiment of the present invention, the heat-conducting plastic component includes hardware body and several cooling fins；
Several cooling fins are distributed across in the hardware body.
Further, in an embodiment of the present invention, the metal substrate includes aluminum substrate, copper base, iron substrate or gold
Belong to alloy substrate.
The present invention also provides a kind of manufacturing methods of radiator structure, include the following steps:
By with lamp bead circuit board and the thermally conductive connection of metal substrate, the heat of generation is conducted to the Metal Substrate
Plate；
And connect the metal substrate with heat-conducting plastic pieces conduct heat, the heat that circuit board is generated passes through the gold
Belong to substrate to conduct to the heat-conducting plastic component and dissipate.
Further, in an embodiment of the present invention, by insert injection moulding mode by the heat-conducting plastic component with it is described
The thermally conductive connection of metal substrate.
In the above-mentioned technical solutions, the structure of metal substrate and heat-conducting plastic component design is the light-weighted design of car light
Main points.Firstly, metal substrate has good heat-conducting effect, but compared with metal heat sink in the prior art, Metal Substrate
Plate only plays the role of heat transfer, and non-final heat dissipation effect, thus the thickness of metal substrate, volume can be set compared with
It is thin, to mitigate the overall weight of car light.And finally play heat dissipation effect is heat-conducting plastic component, that is, utilizes heat-conducting plastic portion
Part replaces metal heat sink in the prior art, since the weight of plastics is far smaller than the weight of metal, so this just can be big
The overall weight of big reduction car light.
So replacing metal heat sink that overall weight can be effectively reduced by heat-conducting plastic component, while passing through metal
The thermal conduction characteristic of substrate can also play good heat-transfer effect, and heat is exported by heat-conducting plastic component, thus real
It ensure that the effect for effectively reducing car light overall weight on the basis of heat dissipation effect now, improve structural strength.Meanwhile
The assembly technology process for simplifying existing radiator, reduces manufacturing cost.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art
Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below
Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the main view of the circuit board provided in an embodiment of the present invention with lamp bead；
Fig. 2 is the first main view of circuit board provided in an embodiment of the present invention and metal substrate；
Fig. 3 is the second main view of circuit board provided in an embodiment of the present invention and metal substrate；
Fig. 4 is the structural schematic diagram of radiator structure provided in an embodiment of the present invention.
Appended drawing reference:
1- lamp bead；
2- circuit board；
3- metal substrate；
4- heat-conducting plastic component；
41- hardware body；
42- cooling fin.
Specific embodiment
Technical solution of the present invention is clearly and completely described below in conjunction with attached drawing, it is clear that described implementation
Example is a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ",
" third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection, it is also possible to be electrically connected；It can be directly connected, can also can be indirectly connected through an intermediary
Connection inside two elements.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
Concrete meaning in invention.
Light-weight design is carried out to car light in order to realize, so being studied on the whole the structure of car light.It was found that
In the design structure of car light, radiator structure have can light-weight design space.
In existing car light, since the heat dissipation effect of LED in car light can directly determine the operating temperature of LED, and it is excessively high
Operating temperature will lead to the life time decay of LED itself.So the radiator structure of LED is to pass in the design and manufacture of car light
Part and parcel uses heat-conducting glue, metal heat sink and fastener on existing car light to guarantee good heat dissipation effect
Etc. the hard PCB circuit board 2 of structures and integrated LED assembled so that the heat that LED is generated is conducted to the circuit board 2 of PCB,
Heat-conducting glue transfers heat on radiator as the heat-conducting medium between pcb board and metal heat sink, passes through metal heat sink
It transfers heat in air, completes radiation processes.
And in this Vehicle lamp structure, although the metal heat sink such as aluminium alloy heat radiator has high excellent of thermal conductivity
Point, but the shortcomings such as that there is also weight simultaneously is big, processing cost is high, molding cycle is long, needs to post-process, this undoubtedly will cause
The big problem of car light weight.So in order to mitigate the weight of car light, the application just improves its radiator structure.
Fig. 1 is the main view of the circuit board 2 provided in an embodiment of the present invention with lamp bead 1；Fig. 2 mentions for the embodiment of the present invention
The circuit board 2 of confession and the first main view of metal substrate 3；Fig. 3 is circuit board 2 provided in an embodiment of the present invention and metal substrate 3
The second main view；Fig. 4 is the structural schematic diagram of radiator structure provided in an embodiment of the present invention.As shown in Figs 1-4, the present embodiment
A kind of radiator structure provided, comprising:
Circuit board 2 with lamp bead 1；
Metal substrate 3, the circuit board 2 and the thermally conductive connection of the metal substrate 3, the heat of generation is conducted to described
Metal substrate 3；
Heat-conducting plastic component 4；
The metal substrate 3 and the thermally conductive connection of the heat-conducting plastic component 4, pass through the heat-conducting plastic component for heat
4 dissipate.
In this configuration, the lamp bead 1 on circuit board 2 can generate heat at work, this is also the source of car light heat.Lamp
Pearl 1 may include the multiple types lamp bead 1 including LED lamp bead 1, for lamp bead 1 number amount and type without limitation.
Its structure to radiate is the assembly between circuit board 2 and metal substrate 3 and heat-conducting plastic component 4, that is, described
Circuit board 2 and the thermally conductive connection of the metal substrate 3, so the heat generated when lamp bead 1 works just can be conducted from circuit board 2
On to the metal substrate 3.
Simultaneously as the metal substrate 3 and the thermally conductive connection of the heat-conducting plastic component 4, so lamp bead 1 passes through circuit board
2 conduction just can further be dissipated by the heat-conducting plastic component 4 to the heat on metal substrate 3, realize good dissipate
Thermal effect.
In the structure, the structure design of metal substrate 3 and heat-conducting plastic component 4 is that the light-weighted design of car light is wanted
Point.Firstly, metal substrate 3 has good heat-conducting effect, but compared with metal heat sink in the prior art, metal substrate
3 only play the role of heat transfer, and non-final heat dissipation effect, thus the thickness of metal substrate 3, volume can be set compared with
It is thin, to mitigate the overall weight of car light.And finally play heat dissipation effect is heat-conducting plastic component 4, that is, utilizes heat-conducting plastic
Component 4 replaces metal heat sink in the prior art, since the weight of plastics is far smaller than the weight of metal, so this just can
Greatly reduce the overall weight of car light.
In conclusion overall weight can be effectively reduced instead of metal heat sink by heat-conducting plastic component 4, pass through simultaneously
The thermal conduction characteristic of metal substrate 3 can also play good heat-transfer effect, and heat is exported by heat-conducting plastic component 4,
To realize the effect for effectively reducing car light overall weight on the basis of ensure that heat dissipation effect.
The molding mode of heat-conducting plastic component 4 is mainly mold injection molding, and the mode of injection molding is easy to process, is not necessarily to
Secondary operation has the advantages that short molding cycle, cost of parts are low.Therefore, using heat-conducting plastic component made of heat-conducting plastic
4, conventional metals radiator is lower than in the cost of integral heat sink structure.Simultaneously as the injection-moulded square of heat-conducting plastic component 4
The heat spreader structures design of formula, this material can be more flexible.
Further, in an embodiment of the present invention, the vertical thermal conductivity of the heat-conducting plastic component 4 is with the gold
Belong to the increase of the thickness of substrate 3 and reduces.
From the foregoing, it will be observed that the metal substrate 3 can be used to conduct heat and conduct heat to heat-conducting plastic component 4.Its
In, the heating conduction of the metal substrate 3 is also related to its thickness, i.e. the more big then corresponding thermal conductivity of the thickness of metal substrate 3
It can be just better.Meanwhile the vertical thermal conductivity of heat-conducting plastic component 4 is bigger, corresponding heat dissipation performance is just also better.
So decreasing the vertical thermal conductivity of heat-conducting plastic component 4, the two when the thickness of metal substrate 3 increases
Also it will form stable heat-conducting effect after matching.Similarly, if reducing the thickness of metal substrate 3, heat-conducting plastic is increased accordingly
The vertical thermal conductivity of component 4, the two also will form stable heat-conducting effect after matching.
Wherein, when the vertical thermal conductivity of the heat-conducting plastic component 4 with the increase of the thickness of the metal substrate 3 and
When reduction, the raising of the thickness of the metal substrate 3 can select that thermal coefficient is lower, the preferable heat-conducting plastic component 4 of intensity, mention
High overall structural strength mitigates weight.Conversely, when the vertical thermal conductivity of the heat-conducting plastic component 4 is with the Metal Substrate
The reduction of the thickness of plate 3 and when improving, overall structure weight improves, strength reduction.
Those skilled in the art the thickness to metal substrate 3 and heat-conducting plastic component 4 can hang down according to actual needs
Straight thermal coefficient carries out collocation design.
Preferably, in an embodiment of the present invention, the vertical thermal conductivity range of the heat-conducting plastic component 4 is in 1-15W/
(mK) between.
Preferably, in an embodiment of the present invention, the thickness of the metal substrate 3 is between 0.1mm-5mm.
For example, thickness can be cooperated when the vertical thermal conductivity of the heat-conducting plastic component 4 is set as 5W/ (mK)
For the metal substrate 3 of 1mm thickness.Such as the vertical thermal conductivity of the heat-conducting plastic component 4 is when being set as 3W/ (mK),
It can cooperate with a thickness of the metal substrate 3 of 2mm thickness.
Further, in an embodiment of the present invention, the heat-conducting plastic component 4 passes through inserts with the metal substrate 3
Injection molding manner is integrally formed.
Further, in an embodiment of the present invention, the circuit board 2 fixed with the metal substrate 3 by gluing, spiral shell
The thermally conductive connection of mode that line is fixed or blanching is fixed.
Further, in an embodiment of the present invention, the heat-conducting plastic component 4 includes hardware body 41 and several heat dissipations
Piece 42；Several cooling fins 42 are distributed across in the hardware body 41.The structure that several cooling fins 42 are evacuated can increase
Add the contact area with air, is more favorable for radiating.
Further, in an embodiment of the present invention, the metal substrate 3 includes aluminum substrate, copper base, iron substrate or gold
Belong to alloy substrate.
The present invention also provides a kind of manufacturing methods of radiator structure, include the following steps:
By with lamp bead 1 circuit board 2 and the thermally conductive connection of metal substrate 3, the heat of generation is conducted to the metal
Substrate 3；
And by the metal substrate 3 with the thermally conductive connection of heat-conducting plastic component 4, the heat that circuit board 2 is generated passes through institute
The conduction of metal substrate 3 is stated to dissipate to the heat-conducting plastic component 4.
Since the specific structure of the radiator structure, the principle of work and power and technical effect are in detailed hereinbefore, herein just not
It repeats again.Any technology contents in relation to the radiator structure also can refer to the record for the radiator structure above.
Further, in an embodiment of the present invention, by insert injection moulding mode by the heat-conducting plastic component 4 with it is described
The thermally conductive connection of metal substrate 3.
In order to which the light-weight design to radiator structure clearly illustrates, now illustrate by following multiple embodiments
It is bright.
Embodiment 1:
Heat-conducting plastic component 4 is integrally formed with metal substrate 3 by insert injection moulding mode.The heat-conducting plastic component 4
For thermally conductive PA6, the vertical thermal conductivity of heat-conducting plastic component 4 is 5W/ (mK).
The metal substrate 3 uses copper base, and copper base is with a thickness of 1.0mm.Flexible circuit board 2 (FPC) with LED is logical
Gum is crossed to be fixed on metal substrate 3.When LED operation, the heat on flexible circuit board 2 is conducted to metal substrate 3, then passes through
Metal substrate 3 transfers heat to heat-conducting plastic component 4, heats sink in air.
Embodiment 2:
Heat-conducting plastic component 4 is integrally formed with metal substrate 3 by insert injection moulding mode.The heat-conducting plastic component 4
For thermally conductive PA6, the vertical thermal conductivity of heat-conducting plastic component 4 is 5W/ (mK).
The metal substrate 3 uses aluminum substrate, and aluminum substrate is with a thickness of 1.0mm.Flexible circuit board 2 (FPC) with LED is logical
Gum is crossed to be fixed on metal substrate 3.When LED operation, the heat on flexible circuit board 2 is conducted to metal substrate 3, then passes through
Metal substrate 3 transfers heat to heat-conducting plastic component 4, heats sink in air.
Embodiment 3:
Heat-conducting plastic component 4 is integrally formed with metal substrate 3 by insert injection moulding mode.The heat-conducting plastic component 4
For thermally conductive PET, the vertical thermal conductivity of heat-conducting plastic is 3W/ (mK).The metal substrate 3 uses aluminum substrate, aluminum substrate
With a thickness of 2.0mm.Flexible circuit board 2 (FPC) with LED is fixed on metal substrate 3 by gum.It is flexible when LED operation
Heat on circuit board 2 is conducted to metal substrate 3, then transfers heat to heat-conducting plastic component 4 by metal substrate 3, will be hot
Amount is dissipated in air.
Weight change and cost, intensity and heat dissipation effect variation after Curve guide impeller can be compared by lower table.
Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that: its according to
So be possible to modify the technical solutions described in the foregoing embodiments, or to some or all of the technical features into
Row equivalent replacement；And these are modified or replaceed, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme.
Claims (10)
1. a kind of radiator structure characterized by comprising
Circuit board with lamp bead；
Metal substrate, the circuit board and the thermally conductive connection of the metal substrate, the heat of generation is conducted to the Metal Substrate
Plate；
Heat-conducting plastic component；
The metal substrate is connect with the heat-conducting plastic pieces conduct heat, and heat is dissipated by the heat-conducting plastic component.
2. radiator structure according to claim 1, which is characterized in that the vertical thermal conductivity of the heat-conducting plastic component with
The increase of the thickness of the metal substrate and reduce.
3. radiator structure according to claim 2, which is characterized in that the vertical thermal conductivity model of the heat-conducting plastic component
It is trapped among between 1-15W/ (mK).
4. radiator structure according to claim 2, which is characterized in that the thickness of the metal substrate 0.1mm-5mm it
Between.
5. radiator structure described in any one of -4 according to claim 1, which is characterized in that the heat-conducting plastic component with it is described
Metal substrate is integrally formed by insert injection moulding mode.
6. radiator structure described in any one of -4 according to claim 1, which is characterized in that the circuit board and the Metal Substrate
Plate fixed gluing, is screwed or thermally conductive connection by way of blanching is fixed.
7. radiator structure described in any one of -4 according to claim 1, which is characterized in that the heat-conducting plastic component includes portion
Part ontology and several cooling fins；
Several cooling fins are distributed across in the hardware body.
8. radiator structure described in any one of -4 according to claim 1, which is characterized in that the metal substrate includes aluminium base
Plate, copper base, iron substrate or metal alloy substrate.
9. a kind of manufacturing method of radiator structure, which comprises the steps of:
By with lamp bead circuit board and the thermally conductive connection of metal substrate, the heat of generation is conducted to the metal substrate；
And connect the metal substrate with heat-conducting plastic pieces conduct heat, the heat that circuit board is generated passes through the Metal Substrate
Plate is conducted to the heat-conducting plastic component and is dissipated.
10. manufacturing method according to claim 9, which is characterized in that by insert injection moulding mode by the heat-conducting plastic
Component and the thermally conductive connection of the metal substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910153388.1A CN109654453A (en) | 2019-02-28 | 2019-02-28 | Radiator structure and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910153388.1A CN109654453A (en) | 2019-02-28 | 2019-02-28 | Radiator structure and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109654453A true CN109654453A (en) | 2019-04-19 |
Family
ID=66123802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910153388.1A Pending CN109654453A (en) | 2019-02-28 | 2019-02-28 | Radiator structure and manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109654453A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110375282A (en) * | 2019-08-15 | 2019-10-25 | 广州融捷照明科技有限公司 | A kind of plastic tank radiators LED street lamp mould group and its manufacturing method |
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Application publication date: 20190419 |