CN109654388A - A kind of integrated high thermal conductivity substrate LED lamp - Google Patents
A kind of integrated high thermal conductivity substrate LED lamp Download PDFInfo
- Publication number
- CN109654388A CN109654388A CN201811486415.9A CN201811486415A CN109654388A CN 109654388 A CN109654388 A CN 109654388A CN 201811486415 A CN201811486415 A CN 201811486415A CN 109654388 A CN109654388 A CN 109654388A
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- Prior art keywords
- thermal conductivity
- high thermal
- led lamp
- led
- layer
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
The present invention relates to a kind of integrated high thermal conductivity substrate LED lamps, including thermally conductive lamp body, LED light bar, the lateral wall of thermally conductive lamp body is provided with multiple holding tanks for being used to accommodate LED light bar, LED light bar includes high thermal conductivity aluminum matrix plate and is arranged in array in the positive LED lamp bead of high thermal conductivity aluminum matrix plate, high thermal conductivity aluminum matrix plate includes circuit layer, high heat conductive insulating layer and copper plate layer, circuit layer is electrically connected with LED lamp bead, and the high heat conductive insulating layer is installed between circuit layer and copper plate layer；It is encapsulated between copper plate layer and holding tank using high thermal conductivity LED packaging plastic.The heating conduction of the integrated high thermal conductivity substrate LED lamp is excellent, LED lamp from perfect heat-dissipating；Excellent thermal conductivity can reduce the point brightness temperature of LED lamp bead, so as to install high-power and more high brightness LED lamp bead, finally be able to produce out the LED lamp that power is very big, brightness is high, volume is minimum.
Description
Technical field
The present invention relates to a kind of integrated high thermal conductivity substrate LED lamps, belong to LED lamp technical field.
Background technique
LED light has that small in size, power consumption is low, long service life, high brightness, low in calories, sturdy and durable, changeable etc. are excellent
Point gradually replaces incandescent lamp in the status in lamps and lanterns market.
In the manufacturing process of LED lamp, encapsulating material is using epoxy resin adhesive.For example, the master of LED lamp
Body material is aluminum substrate.Aluminum substrate is a kind of metal-based copper-clad plate with good heat radiating function, and general single sided board is by three layers
Structure is formed, and is that circuit layer (copper foil), insulating layer and metal-based layer, insulating layer namely use epoxy resin adhesive respectively
It is made.Since circuit layer (copper foil) and metal-based layer heat-sinking capability itself are excellent, the heat-sinking capability of LED light depends primarily on heat dissipation
The insulating layer of ability difference.
Currently, the heat dissipation performance for limiting LED light is mainly thermal coefficient and the LED encapsulating of aluminum substrate in common LED light
The thermal coefficient of glue.The thermal coefficient of aluminum substrate is 1~1.5W/ (mk) according to the testing standard of ASTM-D5470, and aluminium sheet
Thermal coefficient is 237W/ (mk).LED casting glue is a kind of auxiliary material of LED encapsulation, has high refractive index and high transparency, can be with
The luminous flux that protection LED chip increases LED is played, viscosity is small, easy deaeration, is suitble to encapsulating and compression molding, there is LED preferably
Durability and reliability.Such as the coefficient of heat conduction of model OS 925 (A/B) type import organic silicon potting adhesive only has 0.92W/
(mk), it is not able to satisfy the requirement of high thermal conductivity.Therefore, the heating conduction of LED light is limited at present, and which has limited LED lamps
The heat dissipation performance of itself, it usually needs radiator is installed additional to high-power LED lamp, causes that high-powered LED lamp plate bulk is big, limitation
The defects of service life improves.
Summary of the invention
The present invention is in view of the deficienciess of the prior art, provide a kind of integrated high thermal conductivity substrate LED lamp, particular technique
Scheme is as follows:
A kind of integrated high thermal conductivity substrate LED lamp, including thermally conductive lamp body, LED light bar, the lateral wall of the thermally conductive lamp body are set
Multiple holding tanks for being used to accommodate LED light bar are equipped with, the LED light bar includes high thermal conductivity aluminum matrix plate and leads in array setting in height
The hot positive LED lamp bead of aluminum substrate, the high thermal conductivity aluminum matrix plate include circuit layer, high heat conductive insulating layer and copper plate layer, the electricity
Road floor is electrically connected with LED lamp bead, and the high heat conductive insulating layer is installed between circuit layer and copper plate layer；The copper plate layer and receiving
It is encapsulated between slot using high thermal conductivity LED packaging plastic.
As an improvement of the above technical solution, the high heat conductive insulating layer is by epoxy resin, tertiary amines curing agent, imidazoles
Promotor, silane coupling agent, high thermal conductivity filler and solvent mixing are made glue and then glue are made by heat cure.
As an improvement of the above technical solution, the epoxy resin, tertiary amines curing agent, imidazoles promotor, silane are even
Join agent, high thermal conductivity filler, solvent mass ratio be (100~120): (3.5~4.3): (1.2~1.6): (2.9~3.6):
(100~110): (50~60).
As an improvement of the above technical solution, the high thermal conductivity filler is the aluminum nitride powder that partial size is less than or equal to 0.6 μm.
As an improvement of the above technical solution, the solvent is ethyl alcohol, acetone, butanone, dimethylformamide, propylene glycol first
One of ether is several.
As an improvement of the above technical solution, by 100 mass parts organic silicon type casting glues, 10~12 mass parts poly dimethyls
The hexagonal boron nitride powder of siloxanes, 30~40 mass parts partial sizes less than or equal to 0.6 μm is mixed into just sizing material, every wet bar
0.5~0.6 mass parts methyltrimethoxysilane and 0.2~0.22 mass parts 3- aminopropyl front three is added under part into first sizing material
Oxysilane, which is uniformly mixed, is made into high thermal conductivity LED packaging plastic.
Beneficial effects of the present invention:
The heating conduction of the integrated high thermal conductivity substrate LED lamp is excellent, LED lamp from perfect heat-dissipating；Excellent
Thermal conductivity can reduce the point brightness temperature of LED lamp bead, so as to install high-power and more high brightness LED lamp bead, finally
It is able to produce out the LED lamp that power is very big, brightness is high, volume is minimum.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of integrated high thermal conductivity substrate LED lamp of the present invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Embodiment 1
As shown in Figure 1, the integrated high thermal conductivity substrate LED lamp, including thermally conductive lamp body 10, LED light bar 20, it is described thermally conductive
The lateral wall of lamp body 10 is provided with multiple holding tanks 11 for being used to accommodate LED light bar 20, and the LED light bar 20 includes high thermal conductivity aluminium
Substrate and it is arranged in array in the positive LED lamp bead 21 of high thermal conductivity aluminum matrix plate, the high thermal conductivity aluminum matrix plate includes that circuit layer, height are led
Thermal insulation layer and copper plate layer, the circuit layer are electrically connected with LED lamp bead 21, and the high heat conductive insulating layer is installed in circuit layer and copper
Between plate layer；It is encapsulated between the copper plate layer and holding tank 11 using high thermal conductivity LED packaging plastic.
By 100Kg epoxy resin, 3.5Kg tertiary amines curing agent, 1.2Kg imidazoles promotor, 2.9Kg silane coupling agent,
Glue is made in 100Kg high thermal conductivity filler and the mixing of 50Kg solvent, and high heat conductive insulating layer is made by heat cure in the glue.
Wherein, the high thermal conductivity filler is the aluminum nitride powder that partial size is less than or equal to 0.6 μm.The thermal coefficient of the high heat conductive insulating layer
For 2W/ (mk).
100Kg organic silicon type casting glue, 10Kg dimethyl silicone polymer, 30Kg partial size are less than or equal to the six of 0.6 μm
Square boron nitride powder is mixed into just sizing material, be added into first sizing material every wet under the conditions of 0.5Kg methyltrimethoxysilane and
The 3- aminopropyl trimethoxysilane of 0.2Kg, which is uniformly mixed, is made into high thermal conductivity LED packaging plastic.The high thermal conductivity LED packaging plastic
Thermal coefficient be 1.35W/ (mk).The high thermal conductivity LED packaging plastic is observed after being sealed and stored at room temperature 3 months, nothing
Grain is reunited or sedimentation, also separates without liquid material.
Embodiment 2
By 110Kg epoxy resin, 4Kg tertiary amines curing agent, 1.5Kg imidazoles promotor, 3Kg silane coupling agent, 106Kg
Glue is made in high thermal conductivity filler and the mixing of 55Kg solvent, and high heat conductive insulating layer is made by heat cure in the glue.Wherein,
The high thermal conductivity filler is the aluminum nitride powder that partial size is less than or equal to 0.6 μm.The thermal coefficient of the high heat conductive insulating layer is
2.12W/(mk)。
100Kg organic silicon type casting glue, 11Kg dimethyl silicone polymer, 36Kg partial size are less than or equal to the six of 0.6 μm
Square boron nitride powder is mixed into just sizing material, be added into first sizing material every wet under the conditions of 0.56Kg methyltrimethoxysilane and
The 3- aminopropyl trimethoxysilane of 0.21Kg, which is uniformly mixed, is made into high thermal conductivity LED packaging plastic.The high thermal conductivity LED packaging plastic
Thermal coefficient be 1.39W/ (mk).The high thermal conductivity LED packaging plastic is observed after being sealed and stored at room temperature 3 months, nothing
Grain is reunited or sedimentation, also separates without liquid material.
Embodiment 3
By 120Kg epoxy resin, 4.3Kg tertiary amines curing agent, 1.6Kg imidazoles promotor, 3.6Kg silane coupling agent,
Glue is made in 110Kg high thermal conductivity filler and the mixing of 60Kg solvent, and high heat conductive insulating layer is made by heat cure in the glue.
Wherein, the high thermal conductivity filler is the aluminum nitride powder that partial size is less than or equal to 0.6 μm.The thermal coefficient of the high heat conductive insulating layer
For 2.08W/ (mk).
100Kg organic silicon type casting glue, 12Kg dimethyl silicone polymer, 40Kg partial size are less than or equal to the six of 0.6 μm
Square boron nitride powder is mixed into just sizing material, be added into first sizing material every wet under the conditions of 0.6Kg methyltrimethoxysilane and
The 3- aminopropyl trimethoxysilane of 0.22Kg, which is uniformly mixed, is made into high thermal conductivity LED packaging plastic.The high thermal conductivity LED packaging plastic
Thermal coefficient be 1.35W/ (mk).The high thermal conductivity LED packaging plastic is observed after being sealed and stored at room temperature 3 months, nothing
Grain is reunited or sedimentation, also separates without liquid material.
In the above-described embodiments, the solvent is ethyl alcohol, acetone, butanone, dimethylformamide, one in propylene glycol monomethyl ether
Kind is several.The organic silicon type casting glue uses the packaging plastic of Darbond Technology Co., Ltd., Yantai's production.Using six sides are added
Boron nitride can significantly improve the thermal coefficient of the LED packaging plastic, while influence on the refraction performance of LED packaging plastic little
(refractive index fall is no more than 2%)；And water chestnut side's boron nitride or cubic boron nitride are used, the range of decrease under the refractive index of subsequent product
Degree is more than 5%；If using the filler of other excellent heat conductivities, the refractive index fall of such as aluminium nitride, subsequent product is more than
8%.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (6)
1. a kind of integrated high thermal conductivity substrate LED lamp, including thermally conductive lamp body, LED light bar, the lateral wall setting of the thermally conductive lamp body
There are multiple holding tanks for being used to accommodate LED light bar, the LED light bar includes high thermal conductivity aluminum matrix plate and is arranged in array in high thermal conductivity
The positive LED lamp bead of aluminum substrate, which is characterized in that the high thermal conductivity aluminum matrix plate includes circuit layer, high heat conductive insulating layer and copper sheet
Layer, the circuit layer are electrically connected with LED lamp bead, and the high heat conductive insulating layer is installed between circuit layer and copper plate layer；The copper
It is encapsulated between plate layer and holding tank using high thermal conductivity LED packaging plastic.
2. a kind of integrated high thermal conductivity substrate LED lamp according to claim 1, which is characterized in that the high heat conductive insulating
Layer is mixed by epoxy resin, tertiary amines curing agent, imidazoles promotor, silane coupling agent, high thermal conductivity filler and solvent and is made
Then glue is made by heat cure at glue.
3. a kind of integrated high thermal conductivity substrate LED lamp according to claim 2, which is characterized in that the epoxy resin, uncle
Amine curing agent, imidazoles promotor, silane coupling agent, high thermal conductivity filler, solvent mass ratio be (100~120): (3.5~
4.3): (1.2~1.6): (2.9~3.6): (100~110): (50~60).
4. a kind of integrated high thermal conductivity substrate LED lamp according to claim 3, which is characterized in that the high thermal conductivity filler
It is less than or equal to 0.6 μm of aluminum nitride powder for partial size.
5. a kind of integrated high thermal conductivity substrate LED lamp according to claim 2, which is characterized in that the solvent be ethyl alcohol,
One of acetone, butanone, dimethylformamide, propylene glycol monomethyl ether are several.
6. a kind of integrated high thermal conductivity substrate LED lamp according to claim 1, which is characterized in that 100 mass parts are organic
Silicon type casting glue, 10~12 mass parts dimethyl silicone polymers, 30~40 mass parts partial sizes are less than or equal to 0.6 μm of six side's nitrogen
Change boron powder and be mixed into just sizing material, 0.5~0.6 mass parts methyl trimethoxy oxygroup silicon is added every wet under the conditions of into first sizing material
Alkane and 0.2~0.22 mass parts 3- aminopropyl trimethoxysilane, which are uniformly mixed, is made into high thermal conductivity LED packaging plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811486415.9A CN109654388A (en) | 2018-12-06 | 2018-12-06 | A kind of integrated high thermal conductivity substrate LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811486415.9A CN109654388A (en) | 2018-12-06 | 2018-12-06 | A kind of integrated high thermal conductivity substrate LED lamp |
Publications (1)
| Publication Number | Publication Date |
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| CN109654388A true CN109654388A (en) | 2019-04-19 |
Family
ID=66112821
Family Applications (1)
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| CN201811486415.9A Pending CN109654388A (en) | 2018-12-06 | 2018-12-06 | A kind of integrated high thermal conductivity substrate LED lamp |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102027068A (en) * | 2008-04-16 | 2011-04-20 | 陶氏康宁公司 | Polymeric compositions |
| CN102691921A (en) * | 2011-03-22 | 2012-09-26 | 展晶科技(深圳)有限公司 | Light-emitting diode light bar and method for manufacturing same |
| CN104169383A (en) * | 2012-03-08 | 2014-11-26 | 日立化成株式会社 | Adhesive sheet and method for manufacturing semiconductor device |
| WO2015180630A1 (en) * | 2014-05-28 | 2015-12-03 | 深圳市绎立锐光科技开发有限公司 | Wavelength conversion device and related light-emitting device thereof |
| CN107702059A (en) * | 2017-09-18 | 2018-02-16 | 苏州汉瑞森光电科技股份有限公司 | A kind of high radiating automobile LED headlight |
| CN108368326A (en) * | 2015-12-18 | 2018-08-03 | 纳美仕有限公司 | Composition epoxy resin |
| CN108461484A (en) * | 2018-04-09 | 2018-08-28 | 黄山学院 | A kind of encapsulating structure and processing technology of high reliability IGBT module |
-
2018
- 2018-12-06 CN CN201811486415.9A patent/CN109654388A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102027068A (en) * | 2008-04-16 | 2011-04-20 | 陶氏康宁公司 | Polymeric compositions |
| CN102691921A (en) * | 2011-03-22 | 2012-09-26 | 展晶科技(深圳)有限公司 | Light-emitting diode light bar and method for manufacturing same |
| CN104169383A (en) * | 2012-03-08 | 2014-11-26 | 日立化成株式会社 | Adhesive sheet and method for manufacturing semiconductor device |
| WO2015180630A1 (en) * | 2014-05-28 | 2015-12-03 | 深圳市绎立锐光科技开发有限公司 | Wavelength conversion device and related light-emitting device thereof |
| CN108368326A (en) * | 2015-12-18 | 2018-08-03 | 纳美仕有限公司 | Composition epoxy resin |
| CN107702059A (en) * | 2017-09-18 | 2018-02-16 | 苏州汉瑞森光电科技股份有限公司 | A kind of high radiating automobile LED headlight |
| CN108461484A (en) * | 2018-04-09 | 2018-08-28 | 黄山学院 | A kind of encapsulating structure and processing technology of high reliability IGBT module |
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Application publication date: 20190419 |