CN109652803A - Protect etching solution in a kind of LED aluminium face - Google Patents
Protect etching solution in a kind of LED aluminium face Download PDFInfo
- Publication number
- CN109652803A CN109652803A CN201811624253.0A CN201811624253A CN109652803A CN 109652803 A CN109652803 A CN 109652803A CN 201811624253 A CN201811624253 A CN 201811624253A CN 109652803 A CN109652803 A CN 109652803A
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- China
- Prior art keywords
- parts
- etching solution
- aluminium face
- protected
- etching
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- ing And Chemical Polishing (AREA)
Abstract
The present invention provides a kind of LED aluminium face protection etching solution; the etching solution includes the ingredient of following parts by weight: hydrochloric acid: 25 ~ 35 parts, potassium phosphate: and 15 ~ 25 parts, potassium chloride: 10 ~ 15 parts; sodium chloride: 15 ~ 20 parts; ferric trichloride: 10 ~ 15 parts, ammonium chloride: 10 ~ 15 parts, corrosion inhibiter: 1 ~ 5 part; stabilizer: 1 ~ 5 part; surfactant: 1 ~ 5 part, oxidant: 1 ~ 5 part, deionized water: 70 ~ 80 parts.The etching solution, aluminium base plate surface can not cover protective film, while aluminium face will not be corroded, and protect aluminium face not to be corroded while etching, etch effect is good.
Description
Technical field
The present invention relates to a kind of LED aluminium faces to protect etching solution.
Background technique
Aluminum substrate is a kind of metal-based copper-clad plate with good heat radiating function, and general single sided board is by three-decker institute group
At being circuit layer (copper foil), insulating layer and metal-based layer respectively.It is common in LED illumination product.There are a tow sides, white one
Face is welding LED pin, and another side is presented aluminium true qualities, contacts after generally smearing thermally conductive solidifying slurry with thermal conduction portions.At present also
There is ceramic substrate etc..
Aluminum substrate is a kind of metal-based copper-clad plate with good heat radiating function, and general single sided board is by three-decker institute group
At being circuit layer (copper foil), insulating layer and metal-based layer respectively.For it is high-end use be also designed as dual platen, structure is
Circuit layer, insulating layer, aluminium base, insulating layer, circuit layer.It is multi-layer board that only a few, which is applied, can be by common multi-layer board and insulation
Layer, aluminium base are bonded.
LED aluminum base plate is exactly the meaning of PCB and printed wiring board, and only the material of wiring board is aluminium alloy, in the past I
The material of general wiring board be glass, but because LED generates heat larger, the wiring board of LED lamp is usually aluminium base
Plate, can be thermally conductive fast, the wiring board or glass-fiber-plate of other equipment or electric type.
Etching solution is a kind of copperplate etching engraving raw material.
A kind of liquid carved by the characteristic of erosion material.It is theoretically, all that can aoxidize steel and generate can
The reagent of dissolubility mantoquita may serve to etching copper foil laminate, but weigh to the destruction situation of resist layer, etching speed, etching
Coefficient, molten copper capacity, solution regeneration and recycling, environmental protection and the economic effect of copper etc..
Because of environmental requirement, etching needs to be acid etching, but when acid etching produces aluminum substrate can sting erosion aluminium face, cause
Aluminium face blacks, while readily volatilized its body of generation of hydrochloric acid, corrodes equipment, by adjusting the acid equivalent of acid etching liquid medicine, addition
Salt is etched, so that liquid medicine is not stung aluminium, while etching efficiency will not be influenced because reducing acid equivalent.
Traditional highly basic liquid medicine has very strong corrosivity to aluminum substrate aluminium face, it is necessary to pasting protective film.
For etching solution, the current country is primarily present following patent document:
China Patent Publication No.: CN103952702A discloses a kind of etching solution and carries out flexible circuit board using the etching solution
Filament etching method, the etching solution using water as solvent, including solute and each solute concentration it is as follows: Copper dichloride dihydrate,
130-250g/L；30% hydrochloric acid, 100-150mL/L；Ammonium chloride, 26.7-128.4g/L；Shore protection agent, 0.5-16g/L；It assists molten
Agent, 2-6g/L；Wherein, the shore protection agent is corrosion inhibiter, and the secondary solvent is polyalcohol.The etching solution is a kind of Gao Rong
The fast acidic etching liquid of copper, etch-rate is equipped with secondary solvent and shield using low acid content without hydrogen peroxide or sodium hypochlorite
Bank agent, mitigates lateral erosion while achieving the purpose that improve etch-rate, carries out the etching of flexible circuit board filament using the etching solution
Method, etching can be comparatively fast completed in short length, etches that the route come is straight, and etching factor is high, thus can be used for processing
The fine rule road of flexible circuit board.However, etching solution provided by the invention, needs the additives such as shore protection agent to be protected, production
It is at high cost.
Summary of the invention
Above-mentioned to solve the problems, such as, the purpose of the present invention is to provide a kind of LED aluminium faces to protect etching solution, described
Etching solution, aluminium base plate surface can not cover protective film, while aluminium face will not be corroded, and protect aluminium face not while etching
It is corroded, etch effect is good.
In order to achieve the above objectives, the technical scheme is that
Etching solution is protected in a kind of LED aluminium face, and the etching solution includes the ingredient of following parts by weight: hydrochloric acid: 25 ~ 35 parts, phosphorus
Sour potassium: 15 ~ 25 parts, potassium chloride: 10 ~ 15 parts, sodium chloride: 15 ~ 20 parts, ferric trichloride: 10 ~ 15 parts, ammonium chloride: 10 ~ 15 parts, delay
Erosion agent: 1 ~ 5 part, stabilizer: 1 ~ 5 part, surfactant: 1 ~ 5 part, oxidant: 1 ~ 5 part, deionized water: 70 ~ 80 parts.
Further, the etching solution includes the ingredient of following parts by weight: hydrochloric acid: 25 ~ 30 parts, potassium phosphate: 15 ~ 20
Part, potassium chloride: 10 ~ 13 parts, sodium chloride: 18 ~ 20 parts, ferric trichloride: 12 ~ 15 parts, ammonium chloride: 13 ~ 15 parts, corrosion inhibiter: 1 ~ 4
Part, stabilizer: 1 ~ 3 part, surfactant: 2 ~ 5 parts, oxidant: 3 ~ 5 parts, deionized water: 75 ~ 80 parts.
Further, the etching solution includes the ingredient of following parts by weight: hydrochloric acid: 20 parts, potassium phosphate: and 20 parts, chlorination
Potassium: 13 parts, sodium chloride: 18 parts, ferric trichloride: 14 parts, ammonium chloride: 13 parts, corrosion inhibiter: 3 parts, stabilizer: 2 parts, surface-active
Agent: 4 parts, oxidant: 3 parts, deionized water: 75 parts.
Further, stabilizer is ethylene glycol monomethyl ether, diethylene glycol (DEG) or diethylene glycol monomethyl ether.
Further, the corrosion inhibiter is benzotriazole or methylbenzotrazole.
Further, the surfactant is sodium alkyl benzene sulfonate, sodium alkyl sulfate, pareth sulfate
Or sodium soap.
Further, the oxidant is hydrogen peroxide.
Further, shape on the aluminium face of LED substrate is included the following steps: using the method that the etching solution is etched
At one layer of photoresist layer, etching solution is heated to 40 ~ 50 DEG C, exposes to the aluminium on the outside of photoresist layer using etching solution etching
Face is soaked in etching solution, completes the etching to aluminium face.
The beneficial effects of the present invention are:
The etching solution, aluminium base plate surface can not cover protective film, while aluminium face will not be corroded, and protect while etching
Shield aluminium face is not corroded, and etch effect is good.
Specific embodiment
Below by specific embodiment, the present invention is described further, but embodiment is not intended to limit protection of the invention
Range.
Etching solution is protected in a kind of LED aluminium face of the present invention, and the etching solution includes the ingredient of following parts by weight:
Hydrochloric acid: 25 ~ 35 parts, potassium phosphate: 15 ~ 25 parts, potassium chloride: 10 ~ 15 parts, sodium chloride: 15 ~ 20 parts, ferric trichloride: 10 ~ 15 parts, chlorine
Change ammonium: 10 ~ 15 parts, corrosion inhibiter: 1 ~ 5 part, stabilizer: 1 ~ 5 part, surfactant: 1 ~ 5 part, oxidant: 1 ~ 5 part, deionization
Water: 70 ~ 80 parts.
Further, the etching solution includes the ingredient of following parts by weight: hydrochloric acid: 25 ~ 30 parts, potassium phosphate: 15 ~ 20
Part, potassium chloride: 10 ~ 13 parts, sodium chloride: 18 ~ 20 parts, ferric trichloride: 12 ~ 15 parts, ammonium chloride: 13 ~ 15 parts, corrosion inhibiter: 1 ~ 4
Part, stabilizer: 1 ~ 3 part, surfactant: 2 ~ 5 parts, oxidant: 3 ~ 5 parts, deionized water: 75 ~ 80 parts.
Further, the etching solution includes the ingredient of following parts by weight: hydrochloric acid: 20 parts, potassium phosphate: and 20 parts, chlorination
Potassium: 13 parts, sodium chloride: 18 parts, ferric trichloride: 14 parts, ammonium chloride: 13 parts, corrosion inhibiter: 3 parts, stabilizer: 2 parts, surface-active
Agent: 4 parts, oxidant: 3 parts, deionized water: 75 parts.
Further, stabilizer is ethylene glycol monomethyl ether, diethylene glycol (DEG) or diethylene glycol monomethyl ether.
Further, the corrosion inhibiter is benzotriazole or methylbenzotrazole.
Further, the surfactant is sodium alkyl benzene sulfonate, sodium alkyl sulfate, pareth sulfate
Or sodium soap.
Further, the oxidant is hydrogen peroxide.
Further, shape on the aluminium face of LED substrate is included the following steps: using the method that the etching solution is etched
At one layer of photoresist layer, etching solution is heated to 40 ~ 50 DEG C, exposes to the aluminium on the outside of photoresist layer using etching solution etching
Face is soaked in etching solution, completes the etching to aluminium face.
It should be noted that the above examples are only used to illustrate the technical scheme of the present invention and are not limiting.Although referring to compared with
Good embodiment describes the invention in detail, those skilled in the art should understand that, it can be to the technology of invention
Scheme is modified or replaced equivalently, and without departing from the range of technical solution of the present invention, should all be covered in power of the invention
In sharp claimed range.
Claims (8)
1. etching solution is protected in a kind of LED aluminium face, which is characterized in that the etching solution includes the ingredient of following parts by weight: salt
Acid: 25 ~ 35 parts, potassium phosphate: 15 ~ 25 parts, potassium chloride: 10 ~ 15 parts, sodium chloride: 15 ~ 20 parts, ferric trichloride: 10 ~ 15 parts, chlorination
Ammonium: 10 ~ 15 parts, corrosion inhibiter: 1 ~ 5 part, stabilizer: 1 ~ 5 part, surfactant: 1 ~ 5 part, oxidant: 1 ~ 5 part, deionized water:
70 ~ 80 parts.
2. etching solution is protected in a kind of LED aluminium face according to claim 1, which is characterized in that the etching solution includes
The ingredient of following parts by weight: hydrochloric acid: 25 ~ 30 parts, potassium phosphate: 15 ~ 20 parts, potassium chloride: 10 ~ 13 parts, sodium chloride: 18 ~ 20 parts, three
Iron chloride: 12 ~ 15 parts, ammonium chloride: 13 ~ 15 parts, corrosion inhibiter: 1 ~ 4 part, stabilizer: 1 ~ 3 part, surfactant: 2 ~ 5 parts, oxidation
Agent: 3 ~ 5 parts, deionized water: 75 ~ 80 parts.
3. etching solution is protected in a kind of LED aluminium face according to claim 1, which is characterized in that the etching solution includes
The ingredient of following parts by weight: hydrochloric acid: 20 parts, potassium phosphate: 20 parts, potassium chloride: 13 parts, sodium chloride: 18 parts, ferric trichloride: 14 parts,
Ammonium chloride: 13 parts, corrosion inhibiter: 3 parts, stabilizer: 2 parts, surfactant: 4 parts, oxidant: 3 parts, deionized water: 75 parts.
4. etching solution is protected in a kind of LED aluminium face according to claim 1, which is characterized in that stabilizer is ethylene glycol first
Ether, diethylene glycol (DEG) or diethylene glycol monomethyl ether.
5. etching solution is protected in a kind of LED aluminium face according to claim 1, which is characterized in that the corrosion inhibiter is benzo
Triazole or methylbenzotrazole.
6. etching solution is protected in a kind of LED aluminium face according to claim 1, which is characterized in that the surfactant is
Sodium alkyl benzene sulfonate, sodium alkyl sulfate, pareth sulfate or sodium soap.
7. etching solution is protected in a kind of LED aluminium face according to claim 1, which is characterized in that the oxidant is peroxide
Change hydrogen.
8. etching solution is protected in a kind of LED aluminium face according to claim 1, which is characterized in that use the etching solution
The method being etched includes the following steps: to form one layer of photoresist layer on the aluminium face of LED substrate, etching solution is heated to 40 ~
It 50 DEG C, is soaked in etching solution, is completed to aluminium face using the aluminium face that etching solution etching exposes on the outside of photoresist layer
Etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811624253.0A CN109652803A (en) | 2018-12-28 | 2018-12-28 | Protect etching solution in a kind of LED aluminium face |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811624253.0A CN109652803A (en) | 2018-12-28 | 2018-12-28 | Protect etching solution in a kind of LED aluminium face |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109652803A true CN109652803A (en) | 2019-04-19 |
Family
ID=66118140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811624253.0A Pending CN109652803A (en) | 2018-12-28 | 2018-12-28 | Protect etching solution in a kind of LED aluminium face |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109652803A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112609183A (en) * | 2020-12-07 | 2021-04-06 | 太仓市何氏电路板有限公司 | LED aluminum surface etching liquid medicine with protection function and preparation method thereof |
| CN115074734A (en) * | 2022-08-22 | 2022-09-20 | 深圳市板明科技股份有限公司 | Copper-reducing additive for aluminum substrate circuit board and preparation method and use method thereof |
Citations (5)
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| KR20140121196A (en) * | 2013-04-05 | 2014-10-15 | 해성디에스 주식회사 | Etchant composition for copper-containing metal film and etching method using the same |
| CN106884167A (en) * | 2015-12-15 | 2017-06-23 | 上海飞凯光电材料股份有限公司 | A kind of hydrogen peroxide stabilizer and hydrogen peroxide etching solution |
| CN107475715A (en) * | 2016-06-08 | 2017-12-15 | 易案爱富科技有限公司 | Hydrogen peroxide stabilizer and the etch combination for including it |
| CN107604360A (en) * | 2017-09-14 | 2018-01-19 | 江阴江化微电子材料股份有限公司 | A kind of selective copper corrosion liquid and application |
| CN107747094A (en) * | 2017-09-28 | 2018-03-02 | 侯延辉 | A kind of acid etching solution additive and acidic etching liquid |
-
2018
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Patent Citations (5)
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|---|---|---|---|---|
| KR20140121196A (en) * | 2013-04-05 | 2014-10-15 | 해성디에스 주식회사 | Etchant composition for copper-containing metal film and etching method using the same |
| CN106884167A (en) * | 2015-12-15 | 2017-06-23 | 上海飞凯光电材料股份有限公司 | A kind of hydrogen peroxide stabilizer and hydrogen peroxide etching solution |
| CN107475715A (en) * | 2016-06-08 | 2017-12-15 | 易案爱富科技有限公司 | Hydrogen peroxide stabilizer and the etch combination for including it |
| CN107604360A (en) * | 2017-09-14 | 2018-01-19 | 江阴江化微电子材料股份有限公司 | A kind of selective copper corrosion liquid and application |
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Non-Patent Citations (1)
| Title |
|---|
| 孟庆龙: "《电器制造技术手册》", 31 May 2000, 机械工业出版社 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112609183A (en) * | 2020-12-07 | 2021-04-06 | 太仓市何氏电路板有限公司 | LED aluminum surface etching liquid medicine with protection function and preparation method thereof |
| CN115074734A (en) * | 2022-08-22 | 2022-09-20 | 深圳市板明科技股份有限公司 | Copper-reducing additive for aluminum substrate circuit board and preparation method and use method thereof |
| CN115074734B (en) * | 2022-08-22 | 2022-11-08 | 深圳市板明科技股份有限公司 | Copper-reducing additive for aluminum substrate circuit board and preparation method and use method thereof |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190419 |