CN109648461B - Method and device for scanning by grinding head - Google Patents
Method and device for scanning by grinding head Download PDFInfo
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- CN109648461B CN109648461B CN201910025095.5A CN201910025095A CN109648461B CN 109648461 B CN109648461 B CN 109648461B CN 201910025095 A CN201910025095 A CN 201910025095A CN 109648461 B CN109648461 B CN 109648461B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
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Abstract
The invention provides a method and a device for scanning a grinding head, which relate to the technical field of chemical mechanical grinding and comprise the following steps: acquiring the operating parameters of a target grinding head; the operating parameters include: frequency, number of partitions, minimum displacement, maximum displacement, time interval and smoothness; determining the time displacement coordinates of the target grinding head in each partition according to the operation parameters; fitting the running track of the target grinding head in each partition according to the time displacement coordinates; acquiring the displacement coordinates of the target grinding head, and determining a partition where the target grinding head is located according to the displacement coordinates; and controlling the target grinding head to scan according to the running track corresponding to the partition where the target grinding head is located by taking the displacement coordinates as a starting point. After the operation parameters of the target grinding head are set, determining the time displacement coordinates of the target grinding head in each partition and fitting the operation track, and scanning according to the operation track corresponding to the partition where the target grinding head is located. The scanning efficiency of the grinding head can be increased, and the scanning cost of the grinding head is reduced.
Description
Technical Field
The invention relates to the technical field of chemical mechanical polishing, in particular to a polishing head scanning method and a polishing head scanning device.
Background
Chemical Mechanical Polishing (CMP) is also called Chemical Mechanical polishing, and the principle thereof is a processing technology combining Chemical corrosion and Mechanical removal, in a CMP apparatus, each polishing Head motor of a polishing disk (Head) controls the Head scanning operation, so that a wafer (wafer) is fully polished by contacting with a polishing disk (Platen). In the process, the operation of the Head needs to meet various parameters set by the process, including a starting point, an end point, an operation frequency, a control division region and the like. The grinding process needs to be accurately controlled, and the running track of the Head is a key link influencing the grinding effect of the wafer.
The traditional Head operation needs to start from a set starting point and operate between the starting point and an end point. Wherever the Head is, it must first return to the set starting point and then start scanning, and this scanning method that must return to the set starting point will result in the efficiency of Head scanning being reduced and the control cost being increased.
Aiming at the problems of low efficiency and high cost of the grinding head scanning method in the prior art, no effective solution is provided at present.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a method and an apparatus for polishing head scanning to increase the polishing head scanning efficiency and reduce the polishing head scanning cost.
In a first aspect, an embodiment of the present invention provides a method for scanning a polishing head, which is applied to a controller of a polishing head motor, and includes: acquiring the operating parameters of a target grinding head; the operating parameters include: frequency, number of partitions, minimum displacement, maximum displacement, time interval and smoothness; determining the time displacement coordinates of the target grinding head in each partition according to the operation parameters; fitting the running track of the target grinding head in each partition according to the time displacement coordinates; acquiring the displacement coordinates of the target grinding head, and determining a partition where the target grinding head is located according to the displacement coordinates; and controlling the target grinding head to scan according to the running track corresponding to the partition where the target grinding head is located by taking the displacement coordinates as a starting point.
With reference to the first aspect, the present invention provides a first possible implementation manner of the first aspect, wherein fitting a moving trajectory of the target polishing head in each of the zones according to the time displacement coordinates includes: and fitting the running track of the target grinding head in each partition by adopting a cubic function according to the time displacement coordinates.
With reference to the first possible implementation manner of the first aspect, the present invention provides a second possible implementation manner of the first aspect, wherein the following equation is adopted to fit the movement trajectory of the target polishing head in each zone: y isn＝A[n]*(t-tn-1)3+B[n]*(t-tn-1)2+C[n]*(t-tn-1)+D[n](ii) a Wherein n is the nth partition; t is tn-1The starting time of the target grinding head entering the nth subarea; t is the time coordinate of the target grinding head; y isnThe displacement coordinate corresponding to the target grinding head when the time is t is set; a [ n ]]、B[n]、C[n]、D[n]Respectively, the fitting coefficients of the nth partition.
With reference to the first aspect, an embodiment of the present invention provides a third possible implementation manner of the first aspect, where acquiring displacement coordinates of the target polishing head, and determining a partition in which the target polishing head is located according to the displacement coordinates includes: determining the zone in which the target polishing head is located using the following equation: n ═ Yi-Ymin)/(Ymax-Ymin) N; wherein n is the number of the partition where the target polishing head is located; n is the number of partitions; y isiIs the displacement coordinate of the target grinding head; y isminIs the minimum value of displacement; y ismaxIs the displacement maximum.
With reference to the first aspect, embodiments of the present invention provide a fourth possible implementation manner of the first aspect, wherein the acquiring the operation parameters of the target polishing head includes: acquiring the frequency of a target grinding head; determining the running period of the target grinding head by the frequency; acquiring the number of partitions of a target grinding head; the number of the subareas determines the grinding fineness of the target grinding head; acquiring the minimum displacement value and the maximum displacement value of the target grinding head; determining a displacement area of the target grinding head according to the minimum displacement value and the maximum displacement value; acquiring the time interval of a target grinding head; the time interval determines the residence time of the target grinding head in each subarea; acquiring smoothness of a target grinding head; the smoothness determines the smoothness of the target polishing head's trajectory.
With reference to the fourth possible implementation manner of the first aspect, this embodiment of the present invention provides a fifth possible implementation manner of the first aspect, wherein the range of the smoothness is between 0 and 1.
In a second aspect, an embodiment of the present invention further provides a polishing head scanning device, including: the parameter acquisition module is used for acquiring the operating parameters of the target grinding head; the operating parameters include: frequency, number of partitions, minimum displacement, maximum displacement, time interval and smoothness; the coordinate determination module is used for determining the time displacement coordinate of the target grinding head in each partition according to the operation parameters; the track fitting module is used for fitting the running track of the target grinding head in each partition according to the time displacement coordinates; the partition determining module is used for acquiring the displacement coordinates of the target grinding head and determining the partition of the target grinding head according to the displacement coordinates; and the control scanning module is used for controlling the target grinding head to scan according to the running track corresponding to the partition where the target grinding head is located by taking the displacement coordinate as a starting point.
With reference to the second aspect, an embodiment of the present invention provides a first possible implementation manner of the second aspect, where the method further includes: and the cubic function fitting module is used for fitting the running track of the target grinding head in each partition by adopting a cubic function according to the time displacement coordinates.
With reference to the first possible implementation manner of the second aspect, an embodiment of the present invention provides a second possible implementation manner of the second aspect, where the method further includes: a first calculating module, configured to fit the movement trajectory of the target polishing head within each zone by using the following formula: y isn＝A[n]*(t-tn-1)3+B[n]*(t-tn-1)2+C[n]*(t-tn-1)+D[n](ii) a Wherein n is the nth partition; t is tn-1The starting time of the target grinding head entering the nth subarea; t is the time coordinate of the target grinding head; y isnThe displacement coordinate corresponding to the target grinding head when the time is t is set; a [ n ]]、B[n]、C[n]、D[n]Respectively, the fitting coefficients of the nth partition.
With reference to the second aspect, an embodiment of the present invention provides a third possible implementation manner of the second aspect, where the third possible implementation manner further includes: a second calculation module for determining a zone in which the target polishing head is located using the following equation: n ═ Yi-Ymin)/(Ymax-Ymin) N; wherein n is the number of the partition where the target polishing head is located; n is the number of partitions; y isiIs the displacement coordinate of the target grinding head; y isminIs the minimum value of displacement; y ismaxIs the displacement maximum.
The embodiment of the invention has the following beneficial effects:
according to the grinding head scanning method and device provided by the embodiment of the invention, after the operation parameters of the target grinding head are set, the time displacement coordinates of the target grinding head in each partition are determined and the operation track is fitted, the partition where the target grinding head is located is determined according to the displacement coordinates, and scanning is carried out according to the operation track corresponding to the partition where the target grinding head is located. The scanning efficiency of the grinding head can be increased, and the scanning cost of the grinding head is reduced.
Additional features and advantages of the disclosure will be set forth in the description which follows, or in part may be learned by the practice of the above-described techniques of the disclosure, or may be learned by practice of the disclosure.
In order to make the aforementioned objects, features and advantages of the present disclosure more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a flowchart of a polishing head scanning method according to an embodiment of the present invention;
FIG. 2 is a schematic view of a scanning track of a polishing head according to an embodiment of the present invention;
FIG. 3 is a flowchart of a method for obtaining operational parameters of a target polishing head according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a polishing head scanning device according to an embodiment of the present invention.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Currently, in the CMP apparatus, in each flaten, a Head motor is required to control a Head scanning operation so that wafer is sufficiently ground in contact with the flaten. In the process, the operation of the Head needs to meet various parameters set by the process, including a starting point, an end point, an operation frequency, a control division region and the like. The grinding process needs to be accurately controlled, and the running track of the Head is a key link influencing the grinding effect of the wafer. In CMP, Head operation moves according to parameters such as start point, end point, frequency, etc. The traditional Head operation needs to start from a set starting point and operate between the starting point and an end point. In CMP, Head operation moves according to parameters such as start point, end point, frequency, etc. The traditional Head operation needs to start from a set starting point and operate between the starting point and an end point. Based on this, according to the polishing head scanning method and apparatus provided by the embodiments of the present invention, after the operation parameters of the target polishing head are set, the time displacement coordinates of the target polishing head in each partition are determined and the operation trajectory is fitted, the partition where the target polishing head is located is determined according to the displacement coordinates, and scanning is performed according to the operation trajectory corresponding to the partition where the target polishing head is located. The scanning efficiency of the grinding head can be increased, and the scanning cost of the grinding head is reduced.
To facilitate understanding of the present embodiment, a detailed description will be given of a scanning method of a polishing head disclosed in the present embodiment.
Example 1
step S102, obtaining the operating parameters of the target polishing head.
The operating parameters include: frequency, number of partitions, minimum displacement, maximum displacement, time interval and smoothness; determining the running period of a target grinding head motor by the frequency; the number of the subareas determines the number of the operation subareas of the target grinding head motor, and the more the number of the subareas is, the more the control of the target grinding head motor is fine; the minimum value of the displacement determines the minimum value of the outward running of the motor of the target grinding head; the maximum displacement value determines the maximum value of the outward operation of a target grinding head motor, and the unit of the operation is inch or millimeter; the time interval represents the stay time of the target grinding head motor in each subarea, and the larger the value, the longer the time proportion of the target grinding head motor in the area is; the smoothness determines the smoothness of the motor running track of the target grinding head.
And step S104, determining the time displacement coordinate of the target grinding head in each partition according to the operation parameters.
Knowing the operating parameters, the time displacement coordinates of the target polishing head within each zone can be determined, with time as the abscissa and displacement as the ordinate.
And step S106, fitting the running track of the target grinding head in each partition according to the time displacement coordinates.
According to the time displacement coordinates in each subarea, the running track of the target grinding head can be fitted. Referring to fig. 2, a schematic diagram of a scanning trajectory of a polishing head is shown, wherein the abscissa is time in seconds(s) in fig. 2; the ordinate is displacement in millimeters (mm); the starting point is 130mm, the maximum value is 150, the minimum value is 113, the period is 10s, and the number of partitions is 3.
And step S108, acquiring the displacement coordinates of the target grinding head, and determining the partition of the target grinding head according to the displacement coordinates.
Because the trajectory is fitted to the zones, it is necessary to determine the zone in which the target polishing head is located. Then, the position of the fitted moving track where the target polishing head is located can be judged according to the fitted moving track of the partition, and then the target polishing head continues to operate according to the fitted moving track.
Step S110, controlling the target polishing head to scan according to the movement track corresponding to the partition where the target polishing head is located, with the displacement coordinates as a starting point.
After the division is determined, scanning is performed according to the moving track fitted to the division, with the displacement coordinates of the target polishing head as a starting point.
According to the method provided by the embodiment of the invention, after the operation parameters of the target grinding head are set, the time displacement coordinates of the target grinding head in each partition are determined and the operation track is fitted, the partition where the target grinding head is located is determined according to the displacement coordinates, and scanning is carried out according to the operation track corresponding to the partition where the target grinding head is located. The scanning efficiency of the grinding head can be increased, and the scanning cost of the grinding head is reduced.
In the process of fitting the movement path, a cubic function may be used to fit the movement path of the target polishing head in each of the zones, and the method further includes: and fitting the running track of the target grinding head in each partition by adopting a cubic function according to the time displacement coordinates. By using the cubic function fitting, the running track of the target grinding head in each partition can be fitted more accurately without consuming longer time.
Fitting the moving track of the target grinding head in each subarea by adopting the following formula:
Yn＝A[n]*(t-tn-1)3+B[n]*(t-tn-1)2+C[n]*(t-tn-1)+D[n]；
wherein n is the nth partition; t is tn-1The starting time of the target grinding head entering the nth subarea; t is the time coordinate of the target grinding head; y isnThe displacement coordinate corresponding to the target grinding head when the time is t is set; a [ n ]]、B[n]、C[n]、D[n]Respectively, the fitting coefficients of the nth partition.
For different partitions, n, tn-1Are different and unique, A [ n ]]、B[n]、C[n]、D[n]Also determined as fitting coefficients, i.e. the above formula is only t as argument, YnIs a univariate cubic equation of the dependent variable, namely a univariate cubic equation of displacement and time.
The method provided by the embodiment of the invention can use a cubic function to fit the moving track of the target polishing head in each partition, and as a fitting method, the moving track of the target polishing head in each partition can be specifically fitted by using the following formula: y isn＝A[n]*(t-tn-1)3+B[n]*(t-tn-1)2+C[n]*(t-tn-1)+D[n]。
After obtaining the displacement coordinates of the target polishing head, the partition in which the target polishing head is located needs to be determined, and the partition in which the target polishing head is located can be determined by using the following equation:
n＝(Yi-Ymin)/(Ymax-Ymin)*N；
wherein n is the number of the partition where the target polishing head is located; n is the number of partitions; y isiIs the displacement coordinate of the target grinding head; y isminIs the minimum value of displacement; y ismaxIs the displacement maximum.
Taking the schematic diagram of the scanning track of the polishing head shown in FIG. 2 as an example, Ymin＝113，Y max150, N is 3, and the displacement coordinate Y of the target polishing head is inputiThe number of the partition where the target grinding head is located can be obtained, and the target grinding head can be controlled to scan according to the fitted running track without returning to the starting point by combining the fitted running track.
In the method provided by the embodiment of the present invention, after obtaining the displacement coordinates of the target polishing head, the partition where the target polishing head is located may be determined by using the following equation: n ═ Yi-Ymin)/(Ymax-Ymin) And N, the target grinding head can be controlled to scan according to the fitted running track by combining the fitted running track, and the target grinding head does not need to return to the starting point.
Acquiring the operating parameters of the target polishing head, referring to a flowchart of a method for acquiring the operating parameters of the target polishing head shown in fig. 3, may be performed according to the following steps:
in step S302, the frequency of the target polishing head is obtained.
Determining the running period of the target grinding head by the frequency; the higher the frequency of the target polishing head, the shorter the operation cycle of the target polishing head, and the more times the same time is reciprocated.
In step S304, the number of divisions of the target polishing head is acquired.
The number of the subareas determines the grinding fineness of the target grinding head; the larger the number of divisions, the more divided regions in one cycle, and the finer the grinding.
In step S306, the minimum displacement value and the maximum displacement value of the target polishing head are obtained.
Determining a displacement area of the target grinding head according to the minimum displacement value and the maximum displacement value; the minimum displacement value determines the minimum value of the outward movement of the motor of the target grinding head, the maximum displacement value determines the maximum value of the outward movement of the motor of the target grinding head, and the unit of the outward movement has inches or millimeters
In step S308, the time interval of the target polishing head is obtained.
The time interval determines the residence time of the target grinding head in each subarea; the larger the value of the time interval, the longer the target polishing head runs in this region, and the longer the target polishing head polishes in this region.
In step S310, smoothness of the target polishing head is obtained.
The smoothness determines the smoothness of the target polishing head's trajectory. The smoothness ranges from 0 to 1, and the larger the smoothness value, the smoother the running track is. If the value of the smoothness is 0, the running track is a broken line; if the value of the smoothness is 1, the running locus is a smooth curve.
According to the method provided by the embodiment of the invention, the frequency, the partition number, the displacement minimum value, the displacement maximum value, the time interval and the smoothness of the target grinding head are sequentially obtained as the operation parameters to be used for fitting the operation track.
In the method for scanning the polishing head provided by this embodiment, after setting the operation parameters of the target polishing head, time displacement coordinates of the target polishing head in each partition are determined and a running track is fitted, a partition in which the target polishing head is located is determined according to the displacement coordinates, and scanning is performed according to the running track corresponding to the partition in which the target polishing head is located; as a fitting method, a cubic function may be used to fit the movement track of the target polishing head in each zone, and specifically, the following equation may be used to fit the movement track of the target polishing head in each zone: y isn＝A[n]*(t-tn-1)3+B[n]*(t-tn-1)2+C[n]*(t-tn-1)+D[n](ii) a After obtaining the displacement coordinates of the target polishing head, the zone in which the target polishing head is located can be determined by the following equation：n＝(Yi-Ymin)/(Ymax-Ymin) N, the target grinding head can be controlled to scan according to the fitted running track by combining the fitted running track, and the target grinding head does not need to return to the starting point; the frequency, the partition number, the displacement minimum value, the displacement maximum value, the time interval and the smoothness of the target grinding head are sequentially obtained to be used as running parameters for fitting a running track. The scanning efficiency of the grinding head can be increased, and the scanning cost of the grinding head is reduced.
Example 2
An embodiment 2 of the present invention provides a polishing head scanning device, which is shown in fig. 4 and includes a parameter obtaining module 41, a coordinate determining module 42, a trajectory fitting module 43, a partition determining module 44, and a control scanning module 45, where the functions of the modules are as follows:
a parameter obtaining module 41, configured to obtain an operation parameter of the target polishing head; the operating parameters include: frequency, number of partitions, minimum displacement, maximum displacement, time interval and smoothness;
a coordinate determination module 42 for determining the time displacement coordinates of the target polishing head in each zone according to the operating parameters;
a track fitting module 43, configured to fit a moving track of the target polishing head in each partition according to the time displacement coordinates;
the partition determining module 44 is configured to obtain the displacement coordinates of the target polishing head, and determine a partition in which the target polishing head is located according to the displacement coordinates;
and the control scanning module 45 is configured to control the target polishing head to scan according to the moving track corresponding to the partition where the target polishing head is located, with the displacement coordinates as a starting point.
A cubic function may be used to fit the trajectory of the target polishing head within each zone, and the apparatus further comprises: and the cubic function fitting module is used for fitting the running track of the target grinding head in each partition by adopting a cubic function according to the time displacement coordinates.
Specifically, the following equation may be adopted to fit the operation track in each partition, and the apparatus further includes: a first calculating module, configured to fit the movement trajectory of the target polishing head within each zone by using the following formula:
Yn＝A[n]*(t-tn-1)3+B[n]*(t-tn-1)2+C[n]*(t-tn-1)+D[n]；
wherein n is the nth partition; t is tn-1The starting time of the target grinding head entering the nth subarea; t is the time coordinate of the target grinding head; y isnThe displacement coordinate corresponding to the target grinding head when the time is t is set; a [ n ]]、B[n]、C[n]、D[n]Respectively, the fitting coefficients of the nth partition.
Specifically, the division in which the target polishing head is located can be determined by the following equation, and the apparatus further includes: a second calculation module for determining a zone in which the target polishing head is located using the following equation:
n＝(Yi-Ymin)/(Ymax-Ymin)*N；
wherein n is the number of the partition where the target polishing head is located; n is the number of partitions; y isiIs the displacement coordinate of the target grinding head; y isminIs the minimum value of displacement; y ismaxIs the displacement maximum.
It is clear to those skilled in the art that, for the convenience and simplicity of description, the specific working process of the polishing head scanning device described above may refer to the corresponding process in the foregoing method embodiments, and will not be described herein again.
The polishing head scanning device provided by the embodiment of the invention has the same technical characteristics as the polishing head scanning method provided by the embodiment, so that the same technical problems can be solved, and the same technical effects can be achieved.
Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Finally, it should be noted that: the above-mentioned embodiments are only specific embodiments of the present invention, which are used for illustrating the technical solutions of the present invention and not for limiting the same, and the protection scope of the present invention is not limited thereto, although the present invention is described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: any person skilled in the art can modify or easily conceive the technical solutions described in the foregoing embodiments or equivalent substitutes for some technical features within the technical scope of the present disclosure; such modifications, changes or substitutions do not depart from the spirit and scope of the embodiments of the present invention, and they should be construed as being included therein. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (10)
1. A method for scanning a polishing head, wherein a controller applied to a polishing head motor comprises:
acquiring the operating parameters of a target grinding head; the operating parameters include: frequency, number of partitions, minimum displacement, maximum displacement, time interval and smoothness;
determining the time displacement coordinate of the target grinding head in each partition according to the operating parameters;
fitting the running track of the target grinding head in each partition according to the time displacement coordinates;
acquiring the displacement coordinates of the target grinding head, and determining a partition where the target grinding head is located according to the displacement coordinates;
and controlling the target grinding head to scan according to the running track corresponding to the partition where the target grinding head is located by taking the displacement coordinates as a starting point.
2. The method of claim 1, wherein fitting the trajectory of the target polishing head within each zone according to the time-displacement coordinates comprises: and fitting the running track of the target grinding head in each partition by adopting a cubic function according to the time displacement coordinates.
3. The method of claim 2, wherein the trajectory of the target polishing head within each zone is fit using the following equation:
Yn＝A[n]*(t-tn-1)3+B[n]*(t-tn-1)2+C[n]*(t-tn-1)+D[n]；
wherein n is the nth partition; t is tn-1The starting time of the target grinding head entering the nth zone; t is the time coordinate of the target grinding head; y isnThe displacement coordinate corresponding to the target grinding head when the time is t; a [ n ]]、B[n]、C[n]、D[n]Respectively, the fitting coefficients of the nth partition.
4. The method of claim 1, wherein obtaining displacement coordinates of the target abrading head and determining a zone in which the target abrading head is located based on the displacement coordinates comprises: determining a zone in which the target polishing head is located using the following equation:
n＝(Yi-Ymin)/(Ymax-Ymin)*N；
wherein n is the number of the partition where the target polishing head is located; n is the number of the partitions; y isiThe displacement coordinates of the target grinding head; y isminIs the minimum value of displacement; y ismaxIs the displacement maximum.
5. The method of claim 1, wherein acquiring the operating parameters of the target polishing head comprises:
acquiring the frequency of a target grinding head; the frequency determines the operating period of the target polishing head;
acquiring the number of the subareas of the target grinding head; the number of the subareas determines the fineness degree of the grinding of the target grinding head;
acquiring the minimum displacement value and the maximum displacement value of the target grinding head; the displacement minimum value and the displacement maximum value determine a displacement area of the target grinding head;
acquiring the time interval of the target grinding head; the time interval determines the residence time of the target polishing head in each zone;
acquiring smoothness of the target grinding head; the smoothness determines the smoothness of the running track of the target grinding head.
6. The method according to claim 5, wherein said smoothness ranges between 0-1.
7. A polishing head scanning device, comprising:
the parameter acquisition module is used for acquiring the operating parameters of the target grinding head; the operating parameters include: frequency, number of partitions, minimum displacement, maximum displacement, time interval and smoothness;
a coordinate determination module for determining the time displacement coordinates of the target polishing head in each zone according to the operating parameters;
the track fitting module is used for fitting the running track of the target grinding head in each partition according to the time displacement coordinates;
the partition determining module is used for acquiring the displacement coordinates of the target grinding head and determining a partition in which the target grinding head is located according to the displacement coordinates;
and the control scanning module is used for controlling the target grinding head to scan according to the running track corresponding to the partition where the target grinding head is located by taking the displacement coordinates as a starting point.
8. The apparatus of claim 7, further comprising: and the cubic function fitting module is used for fitting the running track of the target grinding head in each partition by adopting a cubic function according to the time displacement coordinates.
9. The apparatus of claim 8, further comprising: a first calculating module, configured to fit a trajectory of the target polishing head within each of the zones by using the following equation:
Yn＝A[n]*(t-tn-1)3+B[n]*(t-tn-1)2+C[n]*(t-tn-1)+D[n]；
wherein n is the nth partition; t is tn-1The starting time of the target grinding head entering the nth zone; t is the time coordinate of the target grinding head; y isnThe displacement coordinate corresponding to the target grinding head when the time is t; a [ n ]]、B[n]、C[n]、D[n]Respectively, the fitting coefficients of the nth partition.
10. The apparatus of claim 7, further comprising: a second calculation module for determining a zone in which the target polishing head is located using the following equation:
n＝(Yi-Ymin)/(Ymax-Ymin)*N；
wherein n is the number of the partition where the target polishing head is located; n is the number of the partitions; y isiThe displacement coordinates of the target grinding head; y isminIs the minimum value of displacement; y ismaxIs the displacement maximum.
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| US5618447A (en) * | 1996-02-13 | 1997-04-08 | Micron Technology, Inc. | Polishing pad counter meter and method for real-time control of the polishing rate in chemical-mechanical polishing of semiconductor wafers |
| JP5283506B2 (en) * | 2006-09-12 | 2013-09-04 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
| CN101098465A (en) * | 2007-07-20 | 2008-01-02 | 哈尔滨工程大学 | Moving object detecting and tracing method in video monitor |
| CN102922413B (en) * | 2011-08-12 | 2015-07-01 | 无锡华润上华科技有限公司 | Chemical mechanical polishing method |
| CN107664504A (en) * | 2016-07-29 | 2018-02-06 | 法乐第(北京)网络科技有限公司 | A kind of path planning apparatus |
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