CN109643055A - The judgment method and manufacturing equipment of metal mask board defect - Google Patents
The judgment method and manufacturing equipment of metal mask board defect Download PDFInfo
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- CN109643055A CN109643055A CN201780053925.4A CN201780053925A CN109643055A CN 109643055 A CN109643055 A CN 109643055A CN 201780053925 A CN201780053925 A CN 201780053925A CN 109643055 A CN109643055 A CN 109643055A
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- 239000002184 metal Substances 0.000 title claims abstract description 174
- 230000007547 defect Effects 0.000 title claims abstract description 64
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 59
- 238000000034 method Methods 0.000 title claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 129
- 230000002950 deficient Effects 0.000 claims abstract description 30
- 230000002159 abnormal effect Effects 0.000 claims abstract description 22
- 230000003287 optical effect Effects 0.000 claims description 17
- 238000004891 communication Methods 0.000 claims description 12
- 230000008439 repair process Effects 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 14
- 230000006870 function Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 239000000203 mixture Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 230000003190 augmentative effect Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 210000003733 optic disk Anatomy 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
Abstract
A kind of judgment method and a kind of manufacturing equipment (100) for being used to judge metal mask plate (700) defect of metal mask plate (700) defect, metal mask plate (700) form multiple substrate pixel points (820) for being bonded pixel substrate (800) with auxiliary pixel substrate (800).For judgment method comprising steps of (S112) obtains the image of metal mask plate (700), image includes image slices vegetarian refreshments；(S114) under same reference frame, the positional relationship of image slices vegetarian refreshments and substrate pixel point (820) is established；(S116) test substrate pixel point (820) is to judge whether substrate pixel point (820) exception and obtains the coordinate position of abnormal substrate pixel point (820)；(S118) determines the defective locations of metal mask plate (700) according to the coordinate position and positional relationship of abnormal substrate pixel point (820).
Description
The present invention relates to art of display device manufacture, in particular to a kind of the judgment method and manufacturing equipment of metal mask board defect.
In the related art, full-color organic light emitting display includes the pixel of multiple color, it is formed the emitting layer material (such as red, green, blue emitting layer material) of the pixel of each color by vapor deposition mode, the emitting layer material of different colours intersects colour mixture in forming process in order to prevent, is deposited using metal mask plate.But metal mask plate, there may be defect, this meeting is so that the yield issues such as colour mixture or dim spot occurs in the pixel formed.Therefore, how to judge that metal mask plate becomes technical problem to be solved with the presence or absence of defect.
Summary of the invention
Embodiments of the present invention provide the judgment method and manufacturing equipment of a kind of metal mask board defect.
The present invention provides a kind of judgment method of metal mask board defect, and for being bonded pixel substrate to assist the pixel substrate to form multiple substrate pixel points, the judgment method includes: the metal mask plate
The image of the metal mask plate is obtained, described image includes image slices vegetarian refreshments；
Under same reference frame, the positional relationship of described image pixel and substrate pixel point is established；
The substrate pixel point is tested to judge whether the substrate pixel point exception and obtains the coordinate position of the abnormal substrate pixel point；With
The defective locations of the metal mask plate are determined according to the coordinate position of the abnormal substrate pixel point and the positional relationship.
The present invention provides a kind of manufacturing equipment, and for judging metal mask board defect, the metal mask plate is for being bonded pixel substrate to assist the pixel substrate to form multiple substrate pixel points, and the manufacturing equipment includes processor, and the processor is used for:
The image of the metal mask plate is obtained, described image includes image slices vegetarian refreshments；
Under same reference frame, the positional relationship of described image pixel and substrate pixel point is established；
The substrate pixel point is tested to judge whether the substrate pixel point exception and obtains the coordinate position of the abnormal substrate pixel point；With
The defective locations of the metal mask plate are determined according to the coordinate position of the abnormal substrate pixel point and the positional relationship.
The judgment method and manufacturing equipment of the metal mask board defect of embodiment of the present invention utilize the position of abnormal substrate pixel point
It can rapidly judge that metal mask plate with the presence or absence of defect, and in existing defects, accurately determines the defective locations of metal mask plate.
The additional aspect and advantage of embodiments of the present invention will be set forth in part in the description, and partially will become apparent from the description below, or the practice of embodiment through the invention is recognized.
Above-mentioned and/or additional aspect and advantage of the invention will be apparent and be readily appreciated that in the description from combination following accompanying drawings to embodiment, in which:
Fig. 1 is the flow diagram of the judgment method of the metal mask board defect of embodiment of the present invention；
Fig. 2 be the manufacturing equipment of embodiment of the present invention, metal mask plate, pixel substrate structural schematic diagram；
Fig. 3 is another flow diagram of the judgment method of the metal mask board defect of embodiment of the present invention；
Fig. 4 be the manufacturing equipment of embodiment of the present invention, metal mask plate, pixel substrate another structural schematic diagram；
Fig. 5 is another flow diagram of the judgment method of the metal mask board defect of embodiment of the present invention；
Fig. 6 is another flow diagram of the judgment method of the metal mask board defect of embodiment of the present invention；
Fig. 7 is another flow diagram of the judgment method of the metal mask board defect of embodiment of the present invention；
Fig. 8 be the manufacturing equipment of embodiment of the present invention, metal mask plate, pixel substrate another structural schematic diagram；
Fig. 9 is another flow diagram of the judgment method of the metal mask board defect of embodiment of the present invention；
Figure 10 be the manufacturing equipment of embodiment of the present invention, metal mask plate, pixel substrate another structural schematic diagram；
Figure 11 is another flow diagram of the judgment method of the metal mask board defect of embodiment of the present invention；
Figure 12 be the manufacturing equipment of embodiment of the present invention, metal mask plate, pixel substrate another structural schematic diagram；
Figure 13 is another flow diagram of the judgment method of the metal mask board defect of embodiment of the present invention；
Figure 14 is another flow diagram of the judgment method of the metal mask board defect of embodiment of the present invention.
Main element symbol Detailed description of the invention:
Manufacturing equipment 100, processor 10, mask repairing machine 20, mask defect optical checking machine 30, lighting machine 40, communication module 50, metal mask plate 700, pixel substrate 800, substrate pixel point 820, server 900.
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, and in which the same or similar labels are throughly indicated same or similar element or elements with the same or similar functions.It is exemplary below with reference to the embodiment of attached drawing description, for explaining only the invention, and is not considered as limiting the invention.
In the description of the present invention, it is to be understood that, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicate the quantity of indicated technical characteristic.Define as a result, " first ",
The feature of " second " can explicitly or implicitly include one or more feature.In the description of the present invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can be mechanical connection, be also possible to be electrically connected or can be in communication with each other；It can be directly connected, the connection inside two elements or the interaction relationship of two elements can also be can be indirectly connected through an intermediary.For the ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and is not intended to limit the present invention.In addition, the present invention repeat reference numerals and/or reference letter, this repetition can be for purposes of simplicity and clarity, itself not indicate the relationship between discussed various embodiments and/or setting in different examples.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art may be aware that other techniques application and/or other materials use.
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, and in which the same or similar labels are throughly indicated same or similar element or elements with the same or similar functions.It is exemplary below with reference to the embodiment of attached drawing description, for explaining only the invention, and is not considered as limiting the invention.
Also referring to Fig. 1 and Fig. 2, the judgment method of 700 defect of metal mask plate of embodiment of the present invention can be used for manufacturing equipment 100.Metal mask plate 700 forms multiple substrate pixel points 820 for being bonded pixel substrate 800 with auxiliary pixel substrate 800.Judgment method includes:
Step S112: the image of metal mask plate 700 is obtained, image includes image slices vegetarian refreshments；
Step S114: under same reference frame, the positional relationship of image slices vegetarian refreshments and substrate pixel point 820 is established；
Step S116: test substrate pixel point 820 is to judge whether substrate pixel point 820 exception and obtains the coordinate position of abnormal substrate pixel point 820；With
Step S118: the defective locations of metal mask plate 700 are determined according to the coordinate position of abnormal substrate pixel point 820 and positional relationship.
Referring to Fig. 2, the manufacturing equipment 100 of embodiment of the present invention can be used for judging 700 defect of metal mask plate.Metal mask plate 700 forms multiple substrate pixel points 820 for being bonded pixel substrate 800 with auxiliary pixel substrate 800.Manufacturing equipment 100 includes processor 10, and processor 10 is used for:
The image of metal mask plate 700 is obtained, image includes image slices vegetarian refreshments；
Under same reference frame, the positional relationship of image slices vegetarian refreshments and substrate pixel point 820 is established；
Test substrate pixel point 820 is to judge whether substrate pixel point 820 exception and obtains the coordinate position of abnormal substrate pixel point 820；With
The defective locations of metal mask plate 700 are determined according to the coordinate position of abnormal substrate pixel point 820 and positional relationship.
In other words, the judgment method of embodiment of the present invention can be realized by the manufacturing equipment 100 of embodiment of the present invention, and in other words, step S112, S114, S116 and S118 can be realized by manufacturing equipment 100.
The judgment method and manufacturing equipment 100 of 700 defect of metal mask plate of embodiment of the present invention can rapidly judge metal mask plate 700 with the presence or absence of defect using the position of abnormal substrate pixel point 820; and in existing defects, the defective locations of metal mask plate 700 are accurately determined.
In embodiments of the present invention, step S112 and S114 is executed before step S116, it will be understood that in other embodiments, step S112 and S114 can be executed after step sll beta, be not specifically limited herein.
In some embodiments, pixel substrate 800 can be glass substrate, by forming luminous material layer on the glass substrate to form substrate pixel point 820.
In some embodiments, metal mask plate 700 refers to the metal plate for cooperating pixel substrate 800 to form substrate pixel point 820, such as pixel substrate 800 generally forms substrate pixel point 820 by vapor deposition, by the way that the fitting pixel substrate 800 of metal mask plate 700 is arranged, the luminescent material of multiple color can be formed on pixel substrate 800, to obtain the pixel substrate 800 of the substrate pixel point 820 of multiple color.
In some embodiments, the image of metal mask plate 700, and the positional relationship by under same reference frame, establishing image slices vegetarian refreshments and substrate pixel point 820 are obtained.So, when obtaining abnormal substrate pixel point 820, the coordinate position of image slices vegetarian refreshments can be directly obtained according to the coordinate position that the positional relationship and substrate pixel of the same coordinate system select 820, to judge the position of the corresponding metal mask plate 700 of the coordinate position of image slices vegetarian refreshments for defective locations, i.e. there may be defects for the position of the corresponding metal mask plate 700 of the coordinate position of image slices vegetarian refreshments.
It should be noted that, under same reference frame, the positional relationship of image slices vegetarian refreshments and substrate pixel point 820 is established, the coordinate position of image slices vegetarian refreshments can be rapidly obtained according to the coordinate position that the abnormal substrate pixel of acquisition selects 820, to will rapidly obtain defective locations.If the positional relationship of image slices vegetarian refreshments and substrate pixel point 820 is not established under same reference frame, it then needs first to carry out coordinate conversion by the transformational relation of different reference coordinates, it will increase many unnecessary workloads, and the acquisition efficiency of defective locations is relatively low.
In some embodiments, manufacturing equipment 100 includes grabbing device (not shown) and evaporation coating device (not shown), processor 10 controls grabbing device crawl metal mask plate 700 and/or pixel substrate 800 and is deposited to form substrate pixel point to be bonded metal mask plate 700 and pixel substrate 800, then by controlling evaporation coating device.
In some embodiments, the defective locations of metal mask plate 700 refer to the region of existing defects.Metal mask plate 700 is generally the metal flat comprising multiple through-holes, and through-hole, the through-hole of misconduct are excessive, through-hole is too small, through-hole amount is very little, through-hole amount is too many etc. all may be regarded as the defect of metal mask plate 700.
Also referring to Fig. 3 and Fig. 4, in some embodiments, judgment method includes:
Step S122: processing image is to judge whether metal mask plate 700 meets preset standard；
Step S124: pixel substrate 800 is bonded using metal mask plate 700 when metal mask plate 700 meets preset standard, multiple substrate pixel points 820 are formed with auxiliary pixel substrate 800；With
Step S126: metal mask plate 700 is repaired using mask repairing machine 20 when metal mask plate 700 does not meet preset standard.
Referring to Fig. 4, in some embodiments, manufacturing equipment 100 includes mask repairing machine 20, and processor 10 is used for:
Image is handled to judge whether metal mask plate 700 meets preset standard；
Pixel substrate 800 is bonded using metal mask plate 700 when metal mask plate 700 meets preset standard, and multiple substrate pixel points 820 are formed with auxiliary pixel substrate 800；With
Metal mask plate 700 is repaired using mask repairing machine 20 when metal mask plate 700 does not meet preset standard.
In other words, step S122, S124 and S126 can be realized by manufacturing equipment 100.
So, it can be ensured that metal mask plate 700 being capable of normal use.
Specifically, in 700 existing defects of metal mask plate, the problems such as dim spot, colour mixture can be had by being bonded the substrate pixel point 820 that pixel substrate 800 is formed using metal mask plate 700, therefore in metal mask plate 700 for can first judge whether metal mask plate 700 meets preset standard before assisting forming substrate pixel point 820.Image by handling metal mask plate 700 may determine that whether metal mask plate 700 meets preset standard, when metal mask plate 700 meets preset standard, illustrate metal mask plate 700 can normal use, therefore can use metal mask plate 700 be bonded pixel substrate 800 with assist form multiple substrate pixel points 820；When metal mask plate 700 does not meet preset standard, illustrate the problems such as dim spot, colour mixture occur using being likely to result in substrate pixel point 820 when metal mask plate 700, therefore it can use mask repairing machine 20 and repair metal mask plate 700, to obtain the metal mask plate 700 for meeting preset standard.
In some embodiments, preset standard can be pre-stored in manufacturing equipment 100 or be preset by user.Preset standard can refer to the quality of metal mask plate 700, when there are more defects for metal mask plate 700, illustrate that the quality of metal mask plate 700 is low, that is, do not meet preset standard；When metal mask plate 700 is there are fewer defect or does not have defect, illustrates that the quality of metal mask plate 700 is high, that is, meet preset standard.In addition, mask repairing machine 20 refers to the machine that can be repaired to metal mask plate 700, mask repairing machine 20 can be repaired metal mask plate 700 by the modes such as cutting off, augmenting, and be not specifically limited herein.
Referring to Fig. 5, in some embodiments, judgment method includes:
Step S128: the coordinate of mask repairing machine 20 is established using reference frame.
Referring to Fig. 4, in some embodiments, processor 10 is used for:
The coordinate of mask repairing machine 20 is established using reference frame.
In other words, step S128 can be realized by manufacturing equipment 100.
In this way, can rapidly obtain image slices when judging that metal mask plate 700 does not meet preset standard after processing the image
The defective locations of the corresponding metal mask plate 700 of vegetarian refreshments.
Specifically, since the coordinate position of image slices vegetarian refreshments and the coordinate of mask repairing machine 20 are under same reference coordinate, therefore, after processing the image, if judging, metal mask plate 700 does not meet preset standard, the coordinate position that mask repairing machine 20 then can be rapidly obtained according to the coordinate position of image slices vegetarian refreshments, to be repaired using the defective locations of the corresponding metal mask plate 700 of coordinate position of the mask repairing machine 20 to image slices vegetarian refreshments.
It should be noted that, since the coordinate position of substrate pixel point 820 is also under identical reference coordinate, therefore, the coordinate that substrate pixel selects 820 coordinate position, the coordinate position of image slices vegetarian refreshments and mask repairing machine 20 shares same reference frame, this can be realized the consistent of coordinate position between three.
Referring to Fig. 6, in some embodiments, including: after step S126
Step S132: return step S112.
Referring to Fig. 4, in some embodiments, processor 10 is used for:
The step of returning to the image for obtaining metal mask plate 700.
In other words, step S132 can be realized by manufacturing equipment 100.
So, it can be determined that whether the metal mask plate 700 after repairing meets preset standard.
Specifically, when metal mask 700 does not meet preset standard, it can use mask repairing machine 20 and repair metal mask plate 700, since mask repairing machine 20 repairs various problems that may be present, the precision for such as repairing failure or repairing is inadequate, metal mask plate 700 after leading to repairing is likely present more defective locations, therefore, after repairing metal mask plate 700 using mask repairing machine 20, image can be reacquired and handle image to judge whether metal mask plate 700 meets preset standard, pixel substrate 800 is bonded using metal mask plate 700 when metal mask plate 700 meets preset standard, and multiple substrate pixel points 820 are formed with auxiliary pixel substrate 800, it can be repaired again using mask repairing machine 20 when metal mask plate 700 does not meet preset standard Metal mask plate 700 can be recycled so always, be repaired until metal mask plate 700 meets preset standard or cancels to metal mask plate 700.
In some embodiments, when repairing number more than preset times, it can cancel and metal mask plate 700 is repaired.It is excessive to repair number, illustrates that the defect of metal mask plate 700 is too serious, and is easy to cause 700 mass of metal mask plate after repairing too poor, therefore when repairing number more than preset times, can cancel and metal mask plate 700 is repaired.It should be noted that preset times can be preset in manufacturing equipment 100 or by user setting, it is not specifically limited herein.
Referring to Figure 7 together and Fig. 8, in some embodiments, step S112 includes:
Step S1122: image is obtained using mask defect optical checking machine 30.
Referring to Fig. 8, in some embodiments, manufacturing equipment 100 includes mask defect optical checking machine 30, and processor 10 is used for:
Image is obtained using mask defect optical checking machine 30.
In other words, step S1122 can be realized by manufacturing equipment 100.
In this way, can directly, rapidly obtain image.
Specifically, mask defect optical checking machine 30, which refers to using optical principle, checks whether metal mask plate 700 has defective machine, for example mask defect optical checking machine 30 can pass through the image of shooting metal mask plate 700, image procossing is carried out by processor 10 again and judges metal mask plate 700 with the presence or absence of defective locations, to judge whether metal mask plate 700 meets preset standard.
It is understood that, in other embodiments, also it can use inspection of the other modes realization to the defective locations of metal mask plate 700, for example the pressure of metal mask plate 700 everywhere is detected by pressure sensor, so that it is determined that metal mask plate 700 is not specifically limited herein with the presence or absence of modes such as defects.
Also referring to Fig. 9 and Figure 10, in some embodiments, step S116 includes:
Step S1162: substrate pixel point 820 is tested using lighting machine 40.
Referring to Figure 10, in some embodiments, manufacturing equipment 100 includes lighting machine 40, and processor 10 is used for:
Substrate pixel point 820 is tested using lighting machine 40.
In other words, step S1162 can be realized by manufacturing equipment 100.
In this way, substrate pixel point 820 can be tested by lighting machine 40, to judge whether substrate pixel point is abnormal.
Specifically, lighting machine 40, which refers to can use, to be lighted substrate pixel point 820 to judge the whether normal machine of substrate pixel point 820, for example judge whether substrate pixel point 820 is lighted by lighting machine 40 by the principle of image or photoelectric conversion, may determine that when being lit substrate pixel point 820 whether colour mixture, the substrate pixel point 820 for not being lit or occurring the problems such as colour mixture is abnormal substrate pixel point 820, and the substrate pixel point 820 for being lit and not occurring the problems such as colour mixture is normal substrate pixel point 820.With each substrate pixel point 820 of test pixel substrate 800 and the coordinate position of abnormal substrate pixel point 820 can be obtained by lighting machine 40, then obtain the defective locations of metal mask plate 700 by reference to coordinate system.
Also referring to Figure 11 and Figure 12, in some embodiments, step S112 includes:
Step S1124: the image that server 900 is sent is received.
Referring to Figure 12, in some embodiments, manufacturing equipment 100 includes the communication module 50 for communicating with server 900, and processor 10 is used for:
The image that server 900 is sent is received by communication module 50.
In other words, step S1124 can be realized by manufacturing equipment 100.
In this way, image can be obtained by communication module 50.
Specifically, the processor 10 of embodiment of the present invention can be applied in mask repairing machine 20, mask defect optical checking machine 30 or lighting machine 40, i.e., mask repairing machine 20, mask defect optical checking machine 30 or lighting machine 40 include processor 10.The communication module 50 of manufacturing equipment 100 can also be applied in mask repairing machine 20, mask defect optical checking machine 30 or lighting machine 40, i.e., mask repairing machine 20, mask defect optical checking machine 30 or lighting machine 40 include communication module 50.In some embodiments, lighting machine 40 includes processor 10 and communication module 50.Lighting machine 40 is sent out by communication module 50
Image is sent to obtain signal to server 900, the image that server 900 receives lighting machine 40 sends an image to lighting machine 40 after obtaining signal.The image of server 900 can derive from mask repairing machine 20, mask defect optical detector 30 or other image collecting devices, i.e. server 900 receives and stores the image from mask repairing machine 20, mask defect optical detector 30 or other image collecting devices.
Figure 13 is please referred to, in some embodiments, judgment method includes:
Step S134: the defective locations of metal mask plate 700 are repaired using mask repairing machine 20 at 700 existing defects position of metal mask plate.
Referring to 4, in some embodiments, manufacturing equipment 100 includes mask repairing machine 20, and processor 10 is used for:
The defective locations of metal mask plate 700 are repaired using mask repairing machine 20 at 700 existing defects position of metal mask plate.
In other words, step S134 can be realized by manufacturing equipment 100.
In this way, can be repaired at 700 existing defects position of metal mask plate to metal mask plate 700.
Specifically, it may determine that metal mask plate 700 with the presence or absence of defect by above-mentioned judgment method and determine defective locations, so as to be repaired using mask repairing machine 20 to defective locations, and then the defect of metal mask plate 700 is reduced or eliminated, facilitate the normal use of subsequent metal mask plate 700.
Figure 14 is please referred to, in some embodiments, judgment method includes:
Step S136: the prompt replacement metal mask plate 700 at 700 existing defects position of metal mask plate.
Referring to Fig. 2, in some embodiments, processor 10 is used for:
The prompt replacement metal mask plate 700 at 700 existing defects position of metal mask plate.
In other words, step S136 can be realized by manufacturing equipment 100.
In this way, replacement metal mask plate 700 can be prompted at 700 existing defects position of metal mask plate.
Specifically, there may be the machines for not having repairing metal mask plate 700 in more defect or manufacturing equipment 100 for metal mask plate 700, therefore at 700 existing defects position of metal mask plate, manufacturing equipment 100 can issue prompt, to which user is known that 700 existing defects of metal mask plate, and then metal mask plate 700 can be replaced.In one embodiment, when repairing number more than preset times, the prompt replacement metal mask plate 700 of manufacturing equipment 100.
It is understood that, manufacturing equipment 100 may include at least one of display device, electroacoustic component and vibrating elements, i.e. manufacturing equipment 100 includes display device, or electroacoustic component, or vibrating elements or display device and electroacoustic component or display device and vibrating elements, or electroacoustic component and vibrating elements or display device, electroacoustic component and vibrating elements.Manufacturing equipment 100 can be prompted by modes such as image, text, voice, vibrations in this way.It is not specifically limited herein.
In the description of this specification, the description of reference term " embodiment ", " some embodiments ", " exemplary embodiment ", " example ", " specific example " or " some examples " etc. means to be contained at least one embodiment or example of the invention in conjunction with the embodiment or example particular features, structures, materials, or characteristics described.In this specification
In, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be combined in any suitable manner in any one or more embodiments or example.
Any process described otherwise above or method description are construed as in flow chart or herein, it indicates to include the steps that one or more for executing module, segment or the part of the code of the executable instruction of specific logical function or process, and the range of the preferred embodiment of the present invention includes other execution, sequence shown or discussed can not wherein be pressed, including according to related function by it is basic simultaneously in the way of or in the opposite order, function is executed, this should understand by embodiments of the present invention person of ordinary skill in the field.
Expression or logic and/or step described otherwise above herein in flow charts, such as, it is considered the order list of the executable instruction for executing logic function, it can specifically execute in any computer-readable medium, for instruction execution system, device or equipment (such as computer based system, including the system of processor or other can be from instruction execution system, device or equipment instruction fetch and the system executed instruction) use, or used in conjunction with these instruction execution systems, device or equipment.For the purpose of this specification, " computer-readable medium " can be it is any may include, store, communicate, propagate, or transport program is for instruction execution system, device or equipment or the device used in conjunction with these instruction execution systems, device or equipment.The more specific example (non-exhaustive list) of computer-readable medium include the following: there is the electrical connection section (electronic device) of one or more wirings, portable computer diskette box (magnetic device), random access memory (RAM), read-only memory (ROM), erasable edit read-only storage (EPROM or flash memory), fiber device and portable optic disk read-only storage (CDROM).In addition, computer-readable medium can even is that the paper that can print described program on it or other suitable media, because can be for example by carrying out optical scanner to paper or other media, then it edited, interpreted or is handled when necessary with other suitable methods electronically to obtain described program, is then stored in computer storage.
It should be appreciated that each section of the invention can be executed with hardware, software, firmware or their combination.In the above-described embodiment, multiple steps or method can be executed in memory and by suitable instruction execution system with storage software or firmware executes.Such as, if executed with hardware, in another embodiment, it can be executed with any one of following technology well known in the art or their combination: there is the discrete logic of the logic gates for executing logic function to data-signal, specific integrated circuit with suitable combinational logic gate circuit, programmable gate array (PGA), field programmable gate array (FPGA) etc..
Those skilled in the art are understood that executing all or part of the steps that above-mentioned implementation method carries is that relevant hardware can be instructed to complete by program, the program can store in a kind of computer readable storage medium, the program when being executed, includes the steps that one or a combination set of method implementation.
In addition, each functional unit in each embodiment of the present invention can integrate in a processing module, it is also possible to each unit and physically exists alone, can also be integrated in two or more units in a module.Above-mentioned integrated module both can take the form of hardware execution, can also be executed in the form of software function module.If the integrated module is executed and when sold or used as an independent product in the form of software function module, also can store can in a computer
It reads in storage medium.
Storage medium mentioned above can be read-only memory, disk or CD etc..Although embodiments of the present invention have been shown and described above, it can be understood that, above embodiment is exemplary, it is not considered as limiting the invention, those skilled in the art can be changed above embodiment within the scope of the invention, modify, replacement and variant.
Claims (18)
- A kind of judgment method of metal mask board defect, which is characterized in that for being bonded pixel substrate to assist the pixel substrate to form multiple substrate pixel points, the judgment method includes: the metal mask plateThe image of the metal mask plate is obtained, described image includes image slices vegetarian refreshments；Under same reference frame, the positional relationship of described image pixel and substrate pixel point is established；The substrate pixel point is tested to judge whether the substrate pixel point exception and obtains the coordinate position of the abnormal substrate pixel point；WithThe defective locations of the metal mask plate are determined according to the coordinate position of the abnormal substrate pixel point and the positional relationship.
- Judgment method as described in claim 1, which is characterized in that the judgment method includes:Described image is handled to judge whether the metal mask plate meets preset standard；The pixel substrate is bonded to assist the pixel substrate to form the multiple substrate pixel point using the metal mask plate when the metal mask plate meets the preset standard；WithThe metal mask plate is repaired using mask repairing machine when the metal mask plate does not meet the preset standard.
- Judgment method as claimed in claim 2, which is characterized in that the judgment method includes:The coordinate of the mask repairing machine is established using the reference frame.
- Judgment method as claimed in claim 2, which is characterized in that it is described repair the metal mask plate using mask repairing machine when the metal mask plate does not meet the preset standard after include:The step of returning to the image for obtaining the metal mask plate.
- Judgment method as described in claim 1, which is characterized in that the image for obtaining the metal mask plate includes:Described image is obtained using mask defect optical checking machine.
- Judgment method as described in claim 1, which is characterized in that the test substrate pixel point is to judge whether the substrate pixel point exception and obtains the coordinate position of the abnormal substrate pixel point and include:The substrate pixel point is tested using lighting machine.
- Judgment method as described in claim 1, which is characterized in that the image for obtaining the metal mask plate includes:Receive the described image that server is sent.
- Judgment method as described in claim 1, which is characterized in that the judgment method includes:In the metal mask plate, there are the defective locations for repairing the metal mask plate when defective locations using mask repairing machine.
- Judgment method as described in claim 1, which is characterized in that the judgment method includes:In the metal mask plate, there are prompts when the defective locations to replace the metal mask plate.
- A kind of manufacturing equipment, for judging metal mask board defect, which is characterized in that the metal mask plate is for pasting Pixel substrate is closed to assist the pixel substrate to form multiple substrate pixel points, the manufacturing equipment includes processor, and the processor is used for:The image of the metal mask plate is obtained, described image includes image slices vegetarian refreshments；Under same reference frame, the positional relationship of described image pixel and substrate pixel point is established；The substrate pixel point is tested to judge whether the substrate pixel point exception and obtains the coordinate position of the abnormal substrate pixel point；WithThe defective locations of the metal mask plate are determined according to the coordinate position of the abnormal substrate pixel point and the positional relationship.
- Manufacturing equipment as claimed in claim 10, which is characterized in that the manufacturing equipment includes mask repairing machine, and the processor is used for:Described image is handled to judge whether the metal mask plate meets preset standard；The pixel substrate is bonded to assist the pixel substrate to form the multiple substrate pixel point using the metal mask plate when the metal mask plate meets the preset standard；WithThe metal mask plate is repaired using the mask repairing machine when the metal mask plate does not meet the preset standard.
- Manufacturing equipment as claimed in claim 11, which is characterized in that the processor is used for:The coordinate of the mask repairing machine is established using the reference frame.
- Manufacturing equipment as claimed in claim 11, which is characterized in that the processor is used for:The step of returning to the image for obtaining the metal mask plate.
- Manufacturing equipment as claimed in claim 10, which is characterized in that the manufacturing equipment includes mask defect optical checking machine, and the processor is used for:Described image is obtained using the mask defect optical checking machine.
- Manufacturing equipment as claimed in claim 10, which is characterized in that the manufacturing equipment includes lighting machine, and the processor is used for:The substrate pixel point is tested using lighting machine.
- Manufacturing equipment as claimed in claim 15, which is characterized in that the manufacturing equipment includes for the communication module with server communication, and the processor is used for:The described image that the server is sent is received by the communication module.
- Manufacturing equipment as claimed in claim 10, which is characterized in that the manufacturing equipment includes mask repairing machine, and the processor is used for:In the metal mask plate, there are the defective locations for repairing the metal mask plate when defective locations using the mask repairing machine.
- Manufacturing equipment as claimed in claim 10, which is characterized in that the processor is used for:In the metal mask plate, there are prompts when the defective locations to replace the metal mask plate.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/095296 WO2019023890A1 (en) | 2017-07-31 | 2017-07-31 | Method for determining metal mask plate defect and manufacturing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109643055A true CN109643055A (en) | 2019-04-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780053925.4A Pending CN109643055A (en) | 2017-07-31 | 2017-07-31 | The judgment method and manufacturing equipment of metal mask board defect |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109643055A (en) |
| WO (1) | WO2019023890A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110890043B (en) * | 2019-11-26 | 2023-06-02 | 深圳市华星光电半导体显示技术有限公司 | Cross line defect detection method and system, array substrate and display panel |
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| CN1828857A (en) * | 2005-03-02 | 2006-09-06 | 盟图科技股份有限公司 | Method for detecting optical mask fault |
| US20100092876A1 (en) * | 2008-09-30 | 2010-04-15 | Shingo Kanamitsu | Method for repairing photo mask, system for repairing photo mask and program for repairing photo mask |
| CN102169094A (en) * | 2009-12-22 | 2011-08-31 | 株式会社日立高新技术 | Lighting inspection device of organic EL display substrate and method thereof |
| CN105489517A (en) * | 2014-09-15 | 2016-04-13 | 上海和辉光电有限公司 | Method for detecting defects of mask |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7539583B2 (en) * | 2005-03-04 | 2009-05-26 | Rudolph Technologies, Inc. | Method and system for defect detection |
| KR20110027979A (en) * | 2009-09-11 | 2011-03-17 | 삼성모바일디스플레이주식회사 | Mask defect testing apparatus |
| CN102053479B (en) * | 2009-10-28 | 2012-11-21 | 中芯国际集成电路制造(上海)有限公司 | Positioning device and positioning method for optical mask defects |
| CN102129164B (en) * | 2010-01-15 | 2012-08-22 | 中芯国际集成电路制造(上海)有限公司 | Method and system for judging mask defects |
-
2017
- 2017-07-31 CN CN201780053925.4A patent/CN109643055A/en active Pending
- 2017-07-31 WO PCT/CN2017/095296 patent/WO2019023890A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1828857A (en) * | 2005-03-02 | 2006-09-06 | 盟图科技股份有限公司 | Method for detecting optical mask fault |
| US20100092876A1 (en) * | 2008-09-30 | 2010-04-15 | Shingo Kanamitsu | Method for repairing photo mask, system for repairing photo mask and program for repairing photo mask |
| CN102169094A (en) * | 2009-12-22 | 2011-08-31 | 株式会社日立高新技术 | Lighting inspection device of organic EL display substrate and method thereof |
| CN105489517A (en) * | 2014-09-15 | 2016-04-13 | 上海和辉光电有限公司 | Method for detecting defects of mask |
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| Publication number | Publication date |
|---|---|
| WO2019023890A1 (en) | 2019-02-07 |
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Application publication date: 20190416 |