CN109639140B - PCB board of DC-DC switching power supply - Google Patents
PCB board of DC-DC switching power supply Download PDFInfo
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- CN109639140B CN109639140B CN201910028361.XA CN201910028361A CN109639140B CN 109639140 B CN109639140 B CN 109639140B CN 201910028361 A CN201910028361 A CN 201910028361A CN 109639140 B CN109639140 B CN 109639140B
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- mosfet
- copper foil
- pcb
- inductor
- power supply
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M3/00—Conversion of dc power input into dc power output
- H02M3/02—Conversion of dc power input into dc power output without intermediate conversion into ac
- H02M3/04—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters
- H02M3/10—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M3/145—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal
- H02M3/155—Conversion of dc power input into dc power output without intermediate conversion into ac by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a triode or transistor type requiring continuous application of a control signal using semiconductor devices only
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/14—Arrangements for reducing ripples from dc input or output
Abstract
The invention discloses a PCB (printed circuit board) of a DC-DC (direct current-direct current) switching power supply, which comprises a first MOSFET (metal-oxide-semiconductor field effect transistor), a second MOSFET and an inductor, wherein the first MOSFET, the second MOSFET and the inductor are arranged on the top layer of the PCB, the drain electrode of the first MOSFET is connected with an input voltage Vin, the source electrode of the first MOSFET is connected with the drain electrode of the second MOSFET, the drain electrode of the second MOSFET is connected with one end of the inductor, the other end of the inductor is connected with an output voltage Vout, a first copper foil is laid at the connection part of the source electrode of the first MOSFET and the drain; a second copper foil is laid at the joint of the drain electrode of the second MOSFET and one end of the inductor, and the second copper foil is positioned on the top layer and the bottom layer of the PCB; the areas of each layer of the PCB corresponding to the first copper foil, the second copper foil, the first MOSFET, the second MOSFET and the inductor are set to be forbidden areas, so that the influence of high-frequency noise generated by the switching signal on the DC power supply ripple on the PCB is reduced.
Description
Technical Field
The invention belongs to the field of switching power supplies, and particularly relates to a PCB (printed circuit board) of a DC-DC switching power supply.
Background
The switching power supply is a functional device which utilizes a switching power supply integrated circuit to control and adjust the switching time proportion of a power semiconductor switching device so as to adjust output voltage. A common DC-DC switching power supply includes components such as a power semiconductor switching device and an inductor.
The ripple is an alternating current component in a direct current voltage, and for a direct current voltage with fixed output, the ripple is usually obtained by rectifying and filtering the alternating current voltage, however, the filtering degree of the ripple is not enough or the ripple is interfered by a high-frequency switching frequency, the residual alternating current component in the direct current voltage is the ripple, and the ripple voltage affects the operation of a system and brings noise.
When designing a PCB of a DC-DC switching power supply, there is usually no processing at each layer of the PCB, however, the power semiconductor switching device has a rise time and a fall time when it is turned on and off. At this time, a high frequency noise occurs in the circuit, which is the same or an odd multiple of the frequency of the rise and fall times of the switch. This high frequency noise directly affects the dc power supply ripple on the PCB through or near the sources of these noises. If the heating value of the power device is larger, a mode of radiating heat by punching through holes on the bonding pads is adopted, and in this case, the influence of high-frequency noise on the DC power supply ripple passing through or close to the noise sources on the PCB is more obvious. Each dc voltage passes directly under the switching power device and the inductor connected to the switching power device, and high-frequency noise is coupled to the ripple of the dc power supply, so that the ripple of the dc voltages increases, and the performance of the dc voltages is also affected.
Disclosure of Invention
In view of the above defects or improvement requirements of the prior art, the present invention provides a PCB of a DC-DC switching power supply, which lays copper foils at the joints of inductors and power switching devices, i.e., a first MOSFET and a second MOSFET, and performs a distribution prohibition process in the areas of the PCB corresponding to the devices and the copper foils, thereby reducing the influence of high-frequency noise generated by switching signals on the DC power supply ripple on the PCB.
To achieve the above object, according to one aspect of the present invention, there is provided a PCB board of a DC-DC switching power supply, including a first MOSFET, a second MOSFET and an inductor disposed on a top layer of the PCB board, a drain of the first MOSFET is connected to an input voltage Vin, a source of the first MOSFET is connected to a drain of the second MOSFET, a drain of the second MOSFET is connected to one end of the inductor, the other end of the inductor is connected to an output voltage Vout,
laying a first copper foil at the joint of the source electrode of the first MOSFET and the drain electrode of the second MOSFET, wherein the first copper foil is positioned on the top layer and the bottom layer of the PCB;
a second copper foil is laid at the joint of the drain electrode of the second MOSFET and one end of the inductor, and the second copper foil is positioned on the top layer and the bottom layer of the PCB;
the areas of each layer of the PCB, corresponding to the first copper foil, the second copper foil, the first MOSFET, the second MOSFET and the inductor are set to be forbidden areas.
As a further improvement of the invention, the width of the first copper foil is not less than 4.5mm, and the width of the second copper foil is not less than 8 mm.
As a further improvement of the present invention, the first copper foil and the second copper foil are provided with via holes.
As a further improvement of the invention, a plurality of input capacitors with one end grounded are connected in parallel between the input voltage Vin and the drain of the first MOSFET.
As a further improvement of the invention, the input capacitor is connected with the drain electrode of the first MOSFET by using a third copper foil in a long strip shape.
As a further improvement of the present invention, a plurality of output capacitors with one end grounded are connected in parallel between the other end of the inductor and the output voltage Vout.
As a further improvement of the present invention, the other end of the inductor is connected to the output voltage Vout by a fourth copper foil having a long strip shape.
As a further improvement of the invention, the grounding ends of the input capacitor and the output capacitor are connected in parallel by using a fifth copper foil in a long shape.
As a further improvement of the invention, the distance between the source electrode of the first MOSFET and the drain electrode of the second MOSFET is not more than 1mm, and the distance between the drain electrode of the second MOSFET and one end of the inductor is not more than 10 mm.
As a further improvement of the invention, the width of the third copper foil is not less than 4mm, the width of the fourth copper foil is not less than 4mm, and the width of the fifth copper foil is not more than 10 mm.
Generally, compared with the prior art, the above technical solution conceived by the present invention has the following beneficial effects:
the PCB of the DC-DC switching power supply has the advantages that copper foils are laid at the connecting positions of power switching devices, namely the first MOSFET and the second MOSFET, and inductors, and the area of the PCB corresponding to the devices and the copper foils is subjected to the distribution forbidding treatment, so that the influence of high-frequency noise generated by switching signals on the ripples of the DC power supply on the PCB is reduced.
According to the PCB of the DC-DC switching power supply, the filter capacitors at the input end and the output end are connected by the copper foil, and are combined with corresponding forbidden treatment, so that ripple voltage of related direct-current voltage can be effectively reduced on the premise of not increasing related devices such as the filter capacitors.
According to the PCB of the DC-DC switching power supply, the width and the length of the copper foil at each connecting part are limited to ensure that the current loop of the DC-DC switching power supply is minimum, so that the ripple of the DC power supply is further improved.
Drawings
Fig. 1 is a schematic diagram of a PCB board of a DC-DC switching power supply according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other. The present invention will be described in further detail with reference to specific embodiments.
Fig. 1 is a schematic diagram of a PCB board of a DC-DC switching power supply according to an embodiment of the present invention. As shown in fig. 1, it includes an input capacitor, a first MOSFET, a second MOSFET, an inductor, a control IC, a sampling resistor and an output capacitor, the first MOSFET, the second MOSFET and the inductor are all located on the top layer of the PCB board,
the input voltage Vin is connected with the drain electrode of the first MOSFET, as a preferable scheme, a plurality of input capacitors are connected in parallel between the input voltage Vin and the drain electrode of the first MOSFET, the input capacitors are preferably arranged in a mode from large to small, a strip-shaped copper foil C is preferably connected between the input capacitors and the drain electrode of the first MOSFET, and the width of the copper foil C is not less than 4 mm;
the source electrode of the first MOSFET is connected with the drain electrode of the second MOSFET, a large-area copper foil A is laid at the connection position, and the distance between the source electrode of the first MOSFET and the drain electrode of the second MOSFET is not more than 1 mm; as a preferred scheme, the copper foil A is laid on the top layer and the bottom layer of the PCB, and the width of the copper foil A is not less than 4.5 mm; so as to ensure that the current loop of the DC-DC switching power supply is minimum, thereby further improving the ripple of the DC power supply.
The drain electrode of the second MOSFET is connected with one end of the inductor, and as a preferable scheme, the distance between the drain electrode of the second MOSFET and one end of the inductor does not exceed 10mm, and the horizontal center distance does not exceed 6 mm; a large-area copper foil B is laid at the joint of the drain electrode of the second MOSFET and one end of the inductor, the copper foil B is laid on the top layer and the bottom layer of the PCB, and the width of the copper foil B is not less than 8 mm; so as to ensure that the current loop of the DC-DC switching power supply is minimum, thereby further improving the ripple of the DC power supply.
The other end of the inductor is connected with an output voltage Vout, as a preferable scheme, a plurality of output capacitors are connected in parallel between the other end of the inductor and the output voltage Vout, the output capacitors are preferably arranged from large to small, a strip-shaped copper foil D is preferably adopted for connection between the output capacitors and the drain electrode of the first MOSFET, and the width of the copper foil D is not less than 4 mm; the current loop of the DC-DC switching power supply is ensured to be minimum, and the ripple of the DC power supply is further improved.
Preferably, the copper foil A and the copper foil B are provided with through holes, wherein the through holes are preferably through holes with the diameter of 0.025mm, the diameter of a solder ring is 0.457mm, and the distance between the upper part and the lower part of the through holes and the distance between the left part and the right part of the through holes are preferably 0.56 mm.
As a preferable scheme, grounding ends of the input capacitor and the output capacitor are connected by using a strip-shaped copper foil E, wherein the width of the copper foil E is not more than 10mm, so as to ensure that a current loop of the DC-DC switching power supply is minimum, and further improve the ripple of the DC power supply.
Preferably, the control chip is connected to the gate of the first MOSFET, the gate of the second MOSFET and the drain of the second MOSFET, respectively, and the source of the second MOSFET is grounded.
The areas of each layer of the PCB, corresponding to the copper foil A, the copper foil B, the copper foil C, the copper foil D, the copper foil E, the first MOSFET, the second MOSFET and the inductance element are set to be forbidden areas. Through the arrangement forbidding processing, the first MOSFET and the second MOSFET generate high-frequency noise which has the same frequency as the rising and falling time of the first MOSFET and the second MOSFET or odd frequency multiplication when the first MOSFET and the second MOSFET are switched on and switched off, so that the ripple of the DC-DC switching power supply is obviously improved on the premise of not increasing any device cost.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A PCB board of a DC-DC switching power supply comprises a first MOSFET, a second MOSFET and an inductor, wherein the first MOSFET, the second MOSFET and the inductor are arranged on the top layer of the PCB board, the drain electrode of the first MOSFET is connected with an input voltage Vin, the source electrode of the first MOSFET is connected with the drain electrode of the second MOSFET, the drain electrode of the second MOSFET is connected with one end of the inductor, the other end of the inductor is connected with an output voltage Vout,
laying a first copper foil at the joint of the source electrode of the first MOSFET and the drain electrode of the second MOSFET, wherein the first copper foil is positioned on the top layer and the bottom layer of the PCB;
a second copper foil is laid at the joint of the drain electrode of the second MOSFET and one end of the inductor, and the second copper foil is positioned on the top layer and the bottom layer of the PCB;
the areas of each layer of the PCB, corresponding to the first copper foil, the second copper foil, the first MOSFET, the second MOSFET and the inductor are set to be forbidden areas.
2. The PCB of a DC-DC switching power supply according to claim 1, wherein the width of the first copper foil is not less than 4.5mm, and the width of the second copper foil is not less than 8 mm.
3. The PCB board of a DC-DC switching power supply according to claim 2, wherein the first copper foil and the second copper foil are provided with via holes.
4. The PCB of the DC-DC switching power supply according to any one of claims 1 to 3, wherein a plurality of input capacitors with one end grounded are connected in parallel between the input voltage Vin and the drain of the first MOSFET.
5. The PCB of a DC-DC switching power supply according to claim 4, wherein the input capacitor is connected to the drain of the first MOSFET by a third copper foil having an elongated shape.
6. The PCB of claim 5, wherein a plurality of output capacitors with one end grounded are connected in parallel between the other end of the inductor and the output voltage Vout.
7. The PCB of the DC-DC switching power supply according to claim 6, wherein the other end of the inductor is connected to the output voltage Vout by a fourth copper foil having a long strip shape.
8. The PCB of a DC-DC switching power supply according to claim 7, wherein the grounding ends of the input capacitor and the output capacitor are connected in parallel by using an elongated fifth copper foil.
9. The PCB of claim 8, wherein the source of the first MOSFET is spaced from the drain of the second MOSFET by a distance of no more than 1mm, and the drain of the second MOSFET is spaced from one end of the inductor by a distance of no more than 10 mm.
10. The PCB of a DC-DC switching power supply according to claim 9, wherein the width of the third copper foil is not less than 4mm, the width of the fourth copper foil is not less than 4mm, and the width of the fifth copper foil is not more than 10 mm.
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CN201910028361.XA CN109639140B (en) | 2019-01-11 | 2019-01-11 | PCB board of DC-DC switching power supply |
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CN201910028361.XA CN109639140B (en) | 2019-01-11 | 2019-01-11 | PCB board of DC-DC switching power supply |
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CN109639140B true CN109639140B (en) | 2020-06-02 |
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CN101320396A (en) * | 2007-06-07 | 2008-12-10 | 英业达股份有限公司 | Printed circuit board wiring processing method and system |
WO2009113784A2 (en) * | 2008-03-14 | 2009-09-17 | 주식회사 에이엠오 | Led drive device |
CN102130116A (en) * | 2010-11-15 | 2011-07-20 | 深圳市威怡电气有限公司 | Power module applied to booster convertor |
KR102456266B1 (en) * | 2013-07-16 | 2022-10-18 | 라이온 세미컨덕터 인크. | Reconfigurable power regulator |
CN103648232A (en) * | 2013-12-27 | 2014-03-19 | 广东威创视讯科技股份有限公司 | Method for solving short circuit of signal through hole and packaging bonding pad |
CN103716981B (en) * | 2013-12-30 | 2017-11-17 | 惠州Tcl家电集团有限公司 | The PCB and its wiring method of stable clock signal |
CN105429457A (en) * | 2014-09-18 | 2016-03-23 | 哈尔滨恒誉名翔科技有限公司 | Low-ripple power supply applied to high-precision data acquisition system |
CN107046366B (en) * | 2016-02-05 | 2019-06-04 | 台达电子企业管理(上海)有限公司 | Supply convertor and preparation method thereof |
CN105932874B (en) * | 2016-06-02 | 2018-06-19 | 连云港杰瑞电子有限公司 | A kind of PCB fabric swatch methods of conversion circuit suitable for High-current output |
US10666140B2 (en) * | 2016-08-22 | 2020-05-26 | Infineon Technologies Americas Corp. | Power converter with at least five electrical connections on a side |
CN206164192U (en) * | 2016-10-09 | 2017-05-10 | 重庆零度智控智能科技有限公司 | Unmanned aerial vehicle |
CN107482908B (en) * | 2017-09-06 | 2020-02-18 | 郑州云海信息技术有限公司 | Mainboard input circuit for preventing ignition of PCB mainboard |
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