CN109637967A - 一种混合集成电路共晶烧结用石墨夹具 - Google Patents

一种混合集成电路共晶烧结用石墨夹具 Download PDF

Info

Publication number
CN109637967A
CN109637967A CN201811552872.3A CN201811552872A CN109637967A CN 109637967 A CN109637967 A CN 109637967A CN 201811552872 A CN201811552872 A CN 201811552872A CN 109637967 A CN109637967 A CN 109637967A
Authority
CN
China
Prior art keywords
graphite
film substrate
integrated circuit
multiple groups
integration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811552872.3A
Other languages
English (en)
Other versions
CN109637967B (zh
Inventor
余定展
王卫杰
张夏
张夏一
孙健
都科
武哲宇
刘祖冲
罗闯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Space Star Technology Co Ltd
Original Assignee
Space Star Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Space Star Technology Co Ltd filed Critical Space Star Technology Co Ltd
Priority to CN201811552872.3A priority Critical patent/CN109637967B/zh
Publication of CN109637967A publication Critical patent/CN109637967A/zh
Application granted granted Critical
Publication of CN109637967B publication Critical patent/CN109637967B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Die Bonding (AREA)

Abstract

本发明一种混合集成电路共晶烧结用石墨夹具,包括:石墨组件(1)、石墨独立限位框(2)、多组一体化活动重针(3)、石墨底座(4)、石墨盖板(5)、石墨定位销(6)、混合集成电路管壳(7)、薄膜基片、厚膜基片(9)、载板(11);所述倒扣式配重一体化石墨组件(1)由石墨独立限位框(2)、活动重针(3)组成,石墨独立限位框(2)上设置安装接口(24)及若干个限位槽,且多组一体化活动重针(3)通过裸装锁紧安装于安装接口(24)处,并通过将倒扣式一体化石墨组件(1)倒置使得多组一体化活动重针(3)悬空不施压;本发明可实现精确定位,有效保证微波混合集成电路产品内部薄膜基片、厚膜基片及载板较好的接地性。

Description

一种混合集成电路共晶烧结用石墨夹具
技术领域
本发明混合集成电路技术领域,涉及一种混合集成电路共晶烧结用石墨夹具。
背景技术
倒扣式配重一体化石墨夹具的创新设计作为混合集成电路及多芯片组件(MCM)研制过程中的重要研究方向之一,可广泛应用于贯军标、贯宇高等批量产品高可靠高一致性微波混合集成电路的关键研制过程,同时它对混合集成电路的成品静态及动态特性指标一致性实现尤为重要。
传统的混合集成电路研制,采用管壳内正向拼装薄膜基片、厚膜基片及载板等多种关键载体的方式,存在如下诸多问题:管壳底部无多种载体限位槽,底层合金焊料片及多种载体在拼摆后均容易错位;多种关键载体上的独立配重也易偏移且配重状态不均匀,装配过程返工率较大、批产人工成本较高;且存在多种关键载体与管壳烧结后空洞率高的问题;最终混合集成电路产品的性能一致性差,无法满足混合集成电路通用规范规定的批产一致性要求;影响贯军标项目产品的筛选试验、质量一致性检验和鉴定检验。
发明内容
发明所要解决的课题是,针对上述存在的技术问题,即在混合集成电路产品的研制过程中,能够有效解决其内部薄膜基片、厚膜基片及载板等多种关键载体在管壳内错位、偏移、配重不均匀、共晶烧结空洞率高、成品静态及动态特性指标一致性差等问题,本发明提出一种混合集成电路共晶烧结用石墨夹具,实现薄膜基片、厚膜基片及载板等关键载体在管壳内的精确定位,有效保证微波混合集成电路产品内部薄膜基片、厚膜基片及载板较好的接地性能,有效解决了某贯军标混合集成电路产品批量研制技术瓶颈,提高了批量成品的一致性水平。
本发明用于解决课题的技术手段是:
一种混合集成电路共晶烧结用石墨夹具,包括:倒扣式配重一体化石墨组件、石墨独立限位框、多组一体化活动重针、石墨底座、石墨盖板、石墨定位销、混合集成电路管壳、薄膜基片、厚膜基片、载板;其中,所述倒扣式配重一体化石墨组件由石墨独立限位框、多组一体化活动重针组成,所述石墨独立限位框上设置多组一体化重针安装接口及若干个限位槽,且多组一体化活动重针通过裸装锁紧安装于石墨独立限位框的多组一体化重针安装接口处,并通过将倒扣式一体化石墨组件倒置使得多组一体化活动重针悬空不施压,再将薄膜基片、厚膜基片、载板分别按石墨独立限位框上的限位槽反面放置;将预成型的共晶焊料片沿着石墨独立限位框的限位槽放置于薄膜基片、厚膜基片及载板之上,并将混合集成电路管壳反向倒扣装于倒扣式配重一体化石墨组件上方;所述石墨底座倒扣安装于混合集成电路管壳上,并将石墨盖板从多组一体化活动重针底部穿过后将整体正置,通过安装石墨定位销将石墨底座和石墨盖板固定;将石墨底座放置于真空共晶炉内部石墨台上,通过多组一体化活动重针自动下垂对薄膜基片、厚膜基片及载板配重及其底部预成型的共晶焊料片均匀施压,再通过石墨底座和混合集成电路管壳底部传热,完成共晶烧结。
进一步地,作为本发明的一种优选技术方案,所述石墨独立限位框设置的多组一体化重针安装接口的端面低于限位槽的安装底面。
进一步地,作为本发明的一种优选技术方案,所述多组一体化活动重针根据薄膜基片、厚膜基片、载板的厚度及重量设计。
发明效果为:
本发明的混合集成电路共晶烧结用石墨夹具,能有效解决微波混合集成电路在传统手工拼装共晶烧结中薄膜基片、厚膜基片及载板偏移和空洞率高的问题,实现薄膜基片、厚膜基片及载板的精确定位,有效保证微波混合集成电路产品内部薄膜基片、厚膜基片及载板较好的接地性能,有效解决了某贯军标混合集成电路产品批量研制技术瓶颈,提高了批量成品的质量一致性水平。因此本发明可广泛应用于微波混合集成电路产品的批量研制过程。
附图说明
图1是本发明的倒扣式配重一体化石墨组件状态图;
图2是本发明的石墨独立限位框的内部结构布局组成示意图;
图3是本发明的石墨独立限位框中多组一体化活动重针的安装接口状态图;
图4是本发明的配重一体化石墨组件及管壳倒扣安装即重针不施压的装配状态图;
图5是本发明的石墨独立限位框、薄膜基片、厚膜基片及载板等的倒扣安装状态图;
图6是本发明一种共晶烧结用石墨夹具的设计状态及装配状态图;
图7是本发明的各基片、载板、管壳等倒扣安装后管壳正面放置即重针自动下垂施压的状态图。
图中标记:1为倒扣式配重一体化石墨组件,2为石墨独立限位框,3为多组一体化活动重针,4为石墨底座,5为石墨盖板,6为石墨定位销,7为混合集成电路管壳,8为薄膜基片a,9为厚膜基片,10为薄膜基片b,11为载板,12为薄膜基片c,13为薄膜基片d,14为薄膜基片e,15为薄膜基片f,16为薄膜基片a限位槽,17为厚膜基片限位槽,18为薄膜基片b限位槽,19为薄膜基片c限位槽,20为薄膜基片d限位槽,21为薄膜基片e限位槽,22为载板限位槽,23为薄膜基片f限位槽,24为石墨独立限位框重针安装接口。
具体实施方式
以下,基于附图针对本发明进行详细地说明。
如图1至图7所示,本发明设计了一种混合集成电路共晶烧结用石墨夹具,主要包括:倒扣式配重一体化石墨组件1、石墨独立限位框2、多组一体化活动重针3、石墨底座4、石墨盖板5、石墨定位销6、混合集成电路管壳7、薄膜基片、厚膜基片9、载板11;本实施例中,薄膜基片包括薄膜基片a 8、薄膜基片b10、薄膜基片c12、薄膜基片d 13、薄膜基片e 14、薄膜基片f 15;
其中,所述倒扣式配重一体化石墨组件1的结构如图1所示,其由石墨独立限位框2、多组一体化活动重针3组成,所述石墨独立限位框2上设置多组一体化重针安装接口24及若干个限位槽,其结构如图2和图3所示,且多组一体化活动重针3通过裸装锁紧安装于石墨独立限位框2的多组一体化重针安装接口24处,并通过将倒扣式一体化石墨组件1倒置使得多组一体化活动重针3悬空不施压,再将薄膜基片、厚膜基片9、载板11分别按石墨独立限位框2上的限位槽反面放置,此时多组一体化重针3的配重接触端面与薄膜基片、厚膜基片9、载板11此时处于非接触工况;再将预成型的共晶焊料片沿着石墨独立限位框2的限位槽放置于薄膜基片、厚膜基片9及载板11之上,如图4所示,并将混合集成电路管壳7反向倒扣装于倒扣式配重一体化石墨组件1上方,其如图5所示;
然后,将所述石墨底座4倒扣安装于混合集成电路管壳7上,如图6所示,并将石墨盖板5从多组一体化活动重针3底部穿过后,将前序组合体整体正置,通过安装石墨定位销6将石墨底座4和石墨盖板5固定;将石墨底座4放置于真空共晶炉内部石墨台上,混合集成电路管壳7正面放置于石墨底座4上,如图7所示,通过多组一体化活动重针3自动下垂对薄膜基片、厚膜基片9及载板11配重及其底部预成型的共晶焊料片均匀施压,再通过石墨底座4和混合集成电路管壳7底部传热,完成混合集成电路的一致性共晶烧结。
本发明中,根据薄膜基片a 8、薄膜基片b10、薄膜基片c12、薄膜基片d 13、薄膜基片e 14、薄膜基片f 15、厚膜基片9、载板11的厚度及重量独立设计的多组一体化活动重针3,多组一体化活动重针3通过接触及配重两部分内部裸装锁紧安装于石墨独立限位框的多组一体化重针安装接口24处,与石墨独立限位框2为一体化状态。
所述的倒扣式配重一体化石墨组件1在进行混合集成电路的倒扣安装时,多组一体化活动重针3在石墨独立限位框重针安装接口24靠近基片一侧的台阶限位处于倒置自然下垂状态,其端面低于石墨独立限位框2的限位槽的安装底面。
本发明通过石墨独立限位框与多组重针组成重针径向可活动的倒扣式配重一体化石墨组件,打破传统的在微波混合集成电路管壳内腔正向拼装薄膜基片、厚膜基片及载板的方式,通过将倒扣式一体化石墨组件倒置即多组重针悬空不施压,再将薄膜基片、厚膜基片、载板按石墨独立限位框上的对应限位槽反面放置,后将共晶焊料片沿着石墨独立限位框限位槽放置于薄膜基片、厚膜基片及载板之上,再将微波混合集成电路管壳反向倒扣于前序组合体之上;再将管壳正面放置于石墨底座上,多组重针自动下垂对薄膜基片、厚膜基片和载板配重及其底部焊料片施压,再通过石墨底座、混合集成电路管壳底部传热,继而完成共晶烧结。
因此,本发明采用所述结构研制的石墨夹具,能有效解决微波混合集成电路在传统手工拼装共晶烧结中薄膜基片、厚膜基片及载板偏移和空洞率高的问题,实现薄膜基片、厚膜基片及载板的精确定位,有效保证微波混合集成电路产品内部薄膜基片、厚膜基片及载板较好的接地性能,有效解决了某贯军标混合集成电路产品批量研制技术瓶颈,提高了批量成品的质量一致性水平。因此这种夹具可广泛应用于微波混合集成电路产品的批量研制过程。
需要说明的是,以上说明仅是本发明的优选实施方式,应当理解,对于本领域技术人员来说,在不脱离本发明技术构思的前提下还可以做出若干改变和改进,这些都包括在本发明的保护范围内。

Claims (3)

1.一种混合集成电路共晶烧结用石墨夹具,其特征在于,包括:倒扣式配重一体化石墨组件(1)、石墨独立限位框(2)、多组一体化活动重针(3)、石墨底座(4)、石墨盖板(5)、石墨定位销(6)、混合集成电路管壳(7)、薄膜基片(8、10、12、13、14、15)、厚膜基片(9)、载板(11);其中,所述倒扣式配重一体化石墨组件(1)由石墨独立限位框(2)、多组一体化活动重针(3)组成,所述石墨独立限位框(2)上设置多组一体化重针安装接口(24)及若干个限位槽,且多组一体化活动重针(3)通过裸装锁紧安装于石墨独立限位框(2)的多组一体化重针安装接口(24)处,并通过将倒扣式一体化石墨组件(1)倒置使得多组一体化活动重针(3)悬空不施压,再将薄膜基片(8、10、12、13、14、15)、厚膜基片(9)、载板(11)分别按石墨独立限位框(2)上的限位槽反面放置;将预成型的共晶焊料片沿着石墨独立限位框(2)的限位槽放置于薄膜基片、厚膜基片(9)及载板(11)之上,并将混合集成电路管壳(7)反向倒扣装于倒扣式配重一体化石墨组件(1)上方;所述石墨底座(4)倒扣安装于混合集成电路管壳(7)上,并将石墨盖板(5)从多组一体化活动重针(3)底部穿过后将整体正置,通过安装石墨定位销(6)将石墨底座(4)和石墨盖板(5)固定;将石墨底座(4)放置于真空共晶炉内部石墨台上,通过多组一体化活动重针(3)自动下垂对薄膜基片、厚膜基片(9)及载板(11)配重及其底部预成型的共晶焊料片均匀施压,再通过石墨底座(4)和混合集成电路管壳(7)底部传热,完成共晶烧结。
2.根据权利要求1所述混合集成电路共晶烧结用石墨夹具,其特征在于,所述石墨独立限位框(2)设置的多组一体化重针安装接口(24)的端面低于限位槽的安装底面。
3.根据权利要求1所述混合集成电路共晶烧结用石墨夹具,其特征在于,所述多组一体化活动重针(3)根据薄膜基片(8、10、12、13、14、15)、厚膜基片(9)、载板(11)的厚度及重量设计。
CN201811552872.3A 2018-12-19 2018-12-19 一种混合集成电路共晶烧结用石墨夹具 Active CN109637967B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811552872.3A CN109637967B (zh) 2018-12-19 2018-12-19 一种混合集成电路共晶烧结用石墨夹具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811552872.3A CN109637967B (zh) 2018-12-19 2018-12-19 一种混合集成电路共晶烧结用石墨夹具

Publications (2)

Publication Number Publication Date
CN109637967A true CN109637967A (zh) 2019-04-16
CN109637967B CN109637967B (zh) 2022-11-25

Family

ID=66075057

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811552872.3A Active CN109637967B (zh) 2018-12-19 2018-12-19 一种混合集成电路共晶烧结用石墨夹具

Country Status (1)

Country Link
CN (1) CN109637967B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110666269A (zh) * 2019-10-11 2020-01-10 华东光电集成器件研究所 一种组合式共晶焊接装置及其使用方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120181738A1 (en) * 2011-01-17 2012-07-19 Ibiden Co., Ltd. Electronic part positioning jig
US20130065403A1 (en) * 2011-09-01 2013-03-14 Ajit Paranjpe Wafer carrier with thermal features
US20170076972A1 (en) * 2015-09-15 2017-03-16 Veeco Instruments Inc. Planetary wafer carriers
CN206127419U (zh) * 2015-09-03 2017-04-26 维易科仪器有限公司 多室化学气相沉积系统
CN108701642A (zh) * 2016-03-04 2018-10-23 应用材料公司 用于高温工艺的基板支撑组件

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120181738A1 (en) * 2011-01-17 2012-07-19 Ibiden Co., Ltd. Electronic part positioning jig
US20130065403A1 (en) * 2011-09-01 2013-03-14 Ajit Paranjpe Wafer carrier with thermal features
CN206127419U (zh) * 2015-09-03 2017-04-26 维易科仪器有限公司 多室化学气相沉积系统
US20170076972A1 (en) * 2015-09-15 2017-03-16 Veeco Instruments Inc. Planetary wafer carriers
CN108701642A (zh) * 2016-03-04 2018-10-23 应用材料公司 用于高温工艺的基板支撑组件

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110666269A (zh) * 2019-10-11 2020-01-10 华东光电集成器件研究所 一种组合式共晶焊接装置及其使用方法
CN110666269B (zh) * 2019-10-11 2021-06-25 华东光电集成器件研究所 一种组合式共晶焊接装置及其使用方法

Also Published As

Publication number Publication date
CN109637967B (zh) 2022-11-25

Similar Documents

Publication Publication Date Title
CN109387348B (zh) 一种柔性多量程电容式压力传感器及其制备方法和应用
CN103811770B (zh) 燃料电池膜电极制备夹具及其加工工艺
CN108098219B (zh) 一种用于电池托盘边梁的精密焊接工装
CN109637967A (zh) 一种混合集成电路共晶烧结用石墨夹具
CN108344887A (zh) 悬臂式探针卡的探针头结构
CN207528777U (zh) 一种微型激光芯片装载固定用夹具
US4288835A (en) Pressure sensor
CN209271280U (zh) 一种防弹陶瓷混料机定量进料装置
CN205996841U (zh) 基板定位夹具
CN202098074U (zh) 一种太阳能光伏组件层压机
CN212722971U (zh) 光通信器件的高低温测试夹具
CN115091763A (zh) 一种应用于电池盒结构胶的在线加热固化设备
CN109317553A (zh) 一种变压边力橡皮囊成形的钣金加工方法
CN209021913U (zh) 一种生物指纹类fpc的盖金属环治具
CN214563098U (zh) 一种航空复合材料平板成型工装
CN111269574A (zh) 一种应用在新能源汽车电池组的泡棉材料
CN207944111U (zh) 一种核酸提取纯化仪
CN208108977U (zh) 一种汽车摆臂检具
CN105799311A (zh) 一种印刷机印版温度控制装置及其温度控制方法
CN207872778U (zh) 一种具有极耳整形机构的检测机
CN216433227U (zh) 一种高精度电子天平
CN206627723U (zh) 液晶模组贴合设备
CN206194810U (zh) 锂离子电池组通用支架组件
CN211601773U (zh) 一种汽车座椅靠背右侧支架压铆单品件检具
CN213747855U (zh) 一种支撑悬空烧结陶瓷治具

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant