CN109624448A - Electronic ceramics pedestal, electronic ceramic substrate and its laminating method - Google Patents
Electronic ceramics pedestal, electronic ceramic substrate and its laminating method Download PDFInfo
- Publication number
- CN109624448A CN109624448A CN201811401740.0A CN201811401740A CN109624448A CN 109624448 A CN109624448 A CN 109624448A CN 201811401740 A CN201811401740 A CN 201811401740A CN 109624448 A CN109624448 A CN 109624448A
- Authority
- CN
- China
- Prior art keywords
- green sheet
- ceramic green
- lamination
- electronic
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 140
- 238000000034 method Methods 0.000 title claims abstract description 37
- 239000000758 substrate Substances 0.000 title claims abstract description 30
- 238000010030 laminating Methods 0.000 title claims abstract description 20
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 title claims abstract description 10
- 238000003475 lamination Methods 0.000 claims abstract description 47
- 239000003292 glue Substances 0.000 claims abstract description 26
- 229920000297 Rayon Polymers 0.000 claims abstract description 20
- 238000005245 sintering Methods 0.000 claims abstract description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical group [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 51
- 229910052573 porcelain Inorganic materials 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 238000007766 curtain coating Methods 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
Abstract
The present invention relates to a kind of electronic ceramics pedestal, electronic ceramic substrate and its laminating methods.The laminating method of the electronic ceramic substrate at least includes the following steps: Step 1: required amount of ceramic green sheet is taken to cut into identical size, viscose glue is printed on ceramic green sheet using printing machine, successively lamination bonds by the ceramic green sheet for being attached with viscose glue；Step 2: the ceramic green sheet after lamination is bonded is flattened using planisher, lamination is completed；Step 3: the ceramic green sheet after lamination, which is put into sintering furnace, carries out dumping sintering, finished product is obtained.Ceramic green sheet is in adhesive stacks, viscose glue is using press printing on ceramic green sheet, viscose glue is evenly distributed, lamination can be realized under lower temperature and pressure conditions, ceramic green sheet after bonding is snugly very secured, not stratified, and is not susceptible to deformation using the three-dimensional chambers structure of small size in the electronic ceramics blank after this method lamination, it is easy to operate, it is low in cost.
Description
Technical field
The present invention relates to a kind of electronic ceramics pedestal, electronic ceramic substrate and its laminating methods.
Background technique
Modern microelectronic technology is quickly grown, wherein electronic ceramics encapsulation with its excellent electrical characteristic, mechanical features and
For thermal characteristics using increasingly extensive, encapsulating structure has compact, small in size, light-weight, good temp characteristic, reliability height etc. aobvious
Work feature.However, its development trend also brings many technical problems simultaneously, traditional pressure sintering can make the chamber of ceramic green sheet
It causes to collapse with multidimensional structure, deform, to be difficult to meet process requirements.
Other than conventional thermocompression method, also conventional thermocompression method is improved, such as the entitled Arms Material science of periodical
Remember in the laminated process progress for the multilayer curtain coating blank that 98-100 pages of Zhou Dan of the engineering fourth phase et al. in July, 2012 delivers
" insertion material method ", " expendable material method " and " bonding base laminating method " for carrying etc., wherein " insertion material method " and " sacrifice material
Material method " is although play the role of safeguarding three-dimensional chambers structure, and the removal of material is more difficult after ceramic green sheet lamination.And
Notification number is CN100502623C, and the day for announcing is that the Chinese patent of 2009.06.17 discloses a kind of SMD component ceramic package
Shell preparation method, this method are the method for base lamination " bonding ", method includes the following steps: be cast out ceramic green sheet,
The step of metal paste printing, low temperature dumping and ceramic post sintering, wherein metal paste is by press printing on ceramic green sheet.
" this method can carry out lamination under the conditions of low-temp low-pressure, can largely reduce ceramic green sheet three-dimensional structure chamber
Deformation, but this method generallys use hairbrush carries out lamination for solvent or adhesive brushing on ceramic green sheet, brushing
The uniformity is difficult control, brushes blocked up ceramic green sheet three-dimensional chambers when will lead to lamination and deforms, brush it is excessively thin will lead to it is folded
Ceramic green sheet bonding is insecure when layer, and influence of the solvent base to passive element electric property is also unknown.
Summary of the invention
The present invention proposes a kind of laminating method of easy to operate, low-cost electronic ceramic substrate, can be lower
The lamination of ceramic green sheet is realized at temperature and pressure conditions；The object of the invention is also to provide a kind of electronic ceramic substrates；This
The purpose of invention, which also resides in, provides a kind of electronic ceramics pedestal.
The technical solution of the laminating method of electronic ceramic substrate of the present invention is achieved in that the folded of the electronic ceramic substrate
Layer method at least includes the following steps: Step 1: required amount of ceramic green sheet is taken to cut into identical size, being existed using printing machine
Viscose glue is printed on ceramic green sheet, successively lamination bonds by the ceramic green sheet for being attached with viscose glue；Step 2: the pottery after lamination is bonded
Porcelain billet piece is flattened using planisher, completes lamination；Step 3: the ceramic green sheet after lamination, which is put into sintering furnace, carries out dumping
Sintering, obtains finished product.
Preferably, print glue thickness range of the printing machine on ceramic green sheet is 1-20 μm in the step 1.
Preferably, the ceramic green sheet in the step two after lamination bonding carries out after temperature is 20-30 DEG C of environment
Leveling, leveling pressure are 0.1-2MPa, and the leveling time is 5-120s.
Preferably, the ceramic green sheet is aluminium oxide ceramics blank.
Using above-mentioned technical proposal, the laminating method of electronic ceramic substrate of the present invention has the beneficial effect that ceramic green sheet
In adhesive stacks, using press printing on ceramic green sheet, viscose glue is evenly distributed viscose glue, can be in lower temperature and pressure
Under the conditions of realize lamination, the ceramic green sheet after bonding is snugly very securely, not stratified, and using the electricity after this method lamination
The three-dimensional chambers structure of small size is not susceptible to deformation in sub- ceramic green sheet, easy to operate, low in cost.
The technical solution of electronic ceramic substrate of the present invention is that the electronic ceramic substrate includes two layers or more of ceramic green sheet,
The ceramic green sheet carries out lamination using following steps to be made Step 1: required amount of ceramic green sheet is taken to cut into identical size
Viscose glue is printed on ceramic green sheet with printing machine, successively lamination bonds by the ceramic green sheet for being attached with viscose glue；Step 2: by lamination
Ceramic green sheet after bonding is flattened using planisher, completes lamination；Step 3: the ceramic green sheet after lamination is put into sintering
Furnace carries out dumping sintering, obtains finished product.
Preferably, print glue thickness range of the printing machine on ceramic green sheet is 1-20 μm in the step 1.
Preferably, the ceramic green sheet in the step two after lamination bonding carries out after temperature is 20-30 DEG C of environment
Leveling, leveling pressure are 0.1-2MPa, and the leveling time is 5-120s.
Preferably, the ceramic green sheet is aluminium oxide ceramics blank.
The technical solution of electronic ceramics pedestal of the present invention is: the electronic ceramics pedestal includes electronic ceramic substrate, the electricity
Sub- ceramic substrate includes two layers or more of ceramic green sheet, and the ceramic green sheet carries out lamination using following steps, Step 1: taking institute
It needs the ceramic green sheet of quantity to cut into identical size, prints viscose glue on ceramic green sheet using printing machine, viscose glue will be attached with
Successively lamination bonds ceramic green sheet；Step 2: the ceramic green sheet after lamination is bonded is flattened using planisher, complete folded
Layer；Step 3: the ceramic green sheet after lamination, which is put into sintering furnace, carries out dumping sintering, finished product is obtained.
Preferably, print glue thickness range of the printing machine on ceramic green sheet is 1-20 μm in the step 1.
Preferably, the ceramic green sheet in the step two after lamination bonding carries out after temperature is 20-30 DEG C of environment
Leveling, leveling pressure are 0.1-2MPa, and the leveling time is 5-120s.
Preferably, the ceramic green sheet is aluminium oxide ceramics blank.
Detailed description of the invention
Fig. 1 is the flow chart of the laminating method of electronic ceramic substrate of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment 1 of the laminating method of electronic ceramic substrate of the present invention, mainly comprises the steps that
(1) it first is cast out aluminium oxide ceramics blank with casting machine, the aluminium oxide ceramics blank after curtain coating is cut into identical ruler
It is very little, with being printed on type metal slurry in each aluminium oxide ceramics blank.
(2) required amount of aluminium oxide ceramics blank in step (1) is taken, (printing machine used here is existing with printing machine
Have for the common printing machine of type metal slurry in aluminium oxide ceramics blank in technology, for example, by using notification number
CN100502623C, the day for announcing are type metal in SMD component ceramic package shell preparation method in the patent of 2009.06.17
The printing machine that slurry uses no longer is described in detail) viscose glue, the print of viscose glue are equably printed in first layer aluminium oxide ceramics blank
Then brush glues the one side that second layer aluminium oxide ceramics blank is printed with viscose glue with first layer aluminium oxide blank with a thickness of 10 μm
It closes, and so on, until the aluminium oxide ceramics blank of the required number of plies all bonds.
(3) the aluminium oxide blank after bonding is placed in 20 DEG C of environment, using evener to being bonded in step (2)
Aluminium oxide ceramics blank together is flattened, and the leveling pressure of evener is 0.1Mpa, and the leveling time is 120s, completes oxidation
The lamination of aluminium ceramic green sheet.
(4) the change aluminium ceramic green sheet after lamination is put into progress dumping sintering in sintering furnace, finished product is obtained after the completion of sintering.
It, can be real under lower temperature and pressure conditions using the laminating method of the electronic ceramic substrate in above-described embodiment
The lamination of existing ceramic green sheet, the ceramic green sheet after bonding is snugly very secured, not stratified, in the electronic ceramics blank after lamination
The three-dimensional chambers structure of small size is not susceptible to deformation, and operating method is very easy, low in cost.
In other embodiments, it may be 1 μm, 20 μm or 1 that printing machine prints the thickness of viscose glue on ceramic green sheet
Other thickness between -20 μm.
In other embodiments, the ceramic green sheet after adhesive stacks can be placed on when being flattened 25 DEG C, 30 DEG C or
Other temperature between 20-30 DEG C of person.
In other embodiments, evener is when flattening the ceramic green sheet after adhesive stacks, and the pressure of leveling is can be with
2MPa, leveling time are 5s；Or the pressure of leveling can be 0.1-2 MPa other numerical value, the leveling time can also be in 5s-
Corresponding adjustment is made between 120s.
Finally, the finished product that the laminating method of electronic ceramic substrate in above-described embodiment is obtained amplifies in depth of field measuring instrument
The discovery of its disconnected section is observed under conditions of 2000 times, adjacent aluminium oxide ceramics blank bonds ten thousand intact, no laminations.
The embodiment of electronic ceramic substrate of the present invention, the laminating method and aforementioned present invention electronics of the ceramic substrate are made pottery
The laminating method of ceramic chip is identical, is not repeated to illustrate.
The embodiment of electronic ceramics pedestal of the present invention, the electronic ceramics pedestal include electronic ceramic substrate, electronic ceramics base
Piece is identical as the embodiment of aforementioned present invention electronic ceramic substrate, is not repeated to illustrate.
Described is only presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (9)
1. the laminating method of electronic ceramic substrate, it is characterised in that at least include the following steps: Step 1: taking required amount of pottery
Porcelain billet piece cuts into identical size, and viscose glue is printed on ceramic green sheet using printing machine, will be attached with the ceramic green sheet of viscose glue according to
Secondary lamination bonding；Step 2: the ceramic green sheet after lamination is bonded is flattened using planisher, lamination is completed；Step 3: will
Ceramic green sheet after lamination is put into sintering furnace and carries out dumping sintering, obtains finished product.
2. the laminating method of electronic ceramics blank according to claim 1, it is characterised in that: printing machine in the step 1
Print glue thickness range on ceramic green sheet is 1-20 μm.
3. the laminating method of electronic ceramics blank according to claim 1 or 2, it is characterised in that: in the step two
Ceramic green sheet after lamination bonding is flattened after temperature is 20-30 DEG C of environment, and leveling pressure is 0.1-2MPa, when leveling
Between be 5-120s.
4. the laminating method of electronic ceramics blank according to claim 1 or 2, it is characterised in that: the ceramic green sheet is
Aluminium oxide ceramics blank.
5. electronic ceramic substrate, including two layers or more of ceramic green sheet, it is characterised in that: the ceramic green sheet uses following steps
Lamination is carried out to print on ceramic green sheet Step 1: required amount of ceramic green sheet is taken to cut into identical size using printing machine
Viscose glue, by the ceramic green sheet for being attached with viscose glue, successively lamination is bonded；Step 2: ceramic green sheet after lamination is bonded use it is smooth
Machine is flattened, and lamination is completed；Step 3: the ceramic green sheet after lamination, which is put into sintering furnace, carries out dumping sintering, finished product is obtained.
6. electronic ceramic substrate according to claim 5, it is characterised in that: printing machine is in ceramic green sheet in the step 1
On print glue thickness range be 1-20 μm.
7. electronic ceramic substrate according to claim 5 or 6, it is characterised in that: in the step two after lamination bonding
Ceramic green sheet flattened after temperature is 20-30 DEG C of environment, leveling pressure is 0.1-2MPa, and the leveling time is 5-
120s。
8. electronic ceramic substrate according to claim 5 or 6, it is characterised in that: the ceramic green sheet is aluminium oxide ceramics
Blank.
9. electronic ceramics pedestal, including electronic ceramic substrate, the electronic ceramic substrate includes two layers or more of ceramic green sheet,
Be characterized in that: the ceramic green sheet using the described in any item electronic ceramic substrates of the claims 1 to 4 laminating method into
Row lamination.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811401740.0A CN109624448A (en) | 2018-11-22 | 2018-11-22 | Electronic ceramics pedestal, electronic ceramic substrate and its laminating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811401740.0A CN109624448A (en) | 2018-11-22 | 2018-11-22 | Electronic ceramics pedestal, electronic ceramic substrate and its laminating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109624448A true CN109624448A (en) | 2019-04-16 |
Family
ID=66068908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811401740.0A Pending CN109624448A (en) | 2018-11-22 | 2018-11-22 | Electronic ceramics pedestal, electronic ceramic substrate and its laminating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109624448A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103342550A (en) * | 2013-06-28 | 2013-10-09 | 沈阳大学 | Bonding method based lamination process of cordierite ceramic blank piece |
-
2018
- 2018-11-22 CN CN201811401740.0A patent/CN109624448A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103342550A (en) * | 2013-06-28 | 2013-10-09 | 沈阳大学 | Bonding method based lamination process of cordierite ceramic blank piece |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190416 |