CN109624111A - A kind of integrated circuit silicon chip splitting equipment - Google Patents

A kind of integrated circuit silicon chip splitting equipment Download PDF

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Publication number
CN109624111A
CN109624111A CN201811221881.4A CN201811221881A CN109624111A CN 109624111 A CN109624111 A CN 109624111A CN 201811221881 A CN201811221881 A CN 201811221881A CN 109624111 A CN109624111 A CN 109624111A
Authority
CN
China
Prior art keywords
chamber body
sliding block
gear
hinged shaft
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811221881.4A
Other languages
Chinese (zh)
Inventor
宣以政
杨康
马成根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhu Hanke Information Technology Co Ltd
Original Assignee
Wuhu Hanke Information Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhu Hanke Information Technology Co Ltd filed Critical Wuhu Hanke Information Technology Co Ltd
Priority to CN201811221881.4A priority Critical patent/CN109624111A/en
Publication of CN109624111A publication Critical patent/CN109624111A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work

Abstract

The present invention relates to a kind of integrated circuit silicon chip splitting equipments, including workbench, top plate, first sliding block, compression bar, pressing plate, transmission gear, motor, rack gear, first hinged shaft, sliding rail, second sliding block, rounding knife, connecting rod, second hinged shaft, connector, pinion, handle, fixed bracket and master gear, rack gear is slidably connected at left side inside the first chamber body by the first sliding block, transmission gear is installed on the output end of motor, compression bar is fixedly connected with the pressing plate, the design is instead of manual fixed, increase safety coefficient, it ensure that segmentation precision simultaneously, second sliding block is slidably connected at sliding rail right side, connecting rod is fixedly connected with rounding knife, connector both ends are rotatably connected on respectively on the first hinged shaft and the second hinged shaft, master gear is rotatably connected on fixed internal stent, handle is fixedly connected with master gear, the design increases The characteristic for moving racing, increases efficiency, it is determined that the motion profile of rounding knife, cutting accuracy are high.

Description

A kind of integrated circuit silicon chip splitting equipment
Technical field
The present invention relates to integrated circuit silicon chip processing equipment field, specially a kind of integrated circuit silicon chip splitting equipment.
Background technique
Chip made of silicon wafer is famous " miraculous foresight ", there is surprising operational capability.No matter how Fu Za mathematics Problem, physical problem and engineering problem, the workload also no matter calculated have it is much, as long as staff pass through computer keyboard handle Problem tells it, and assigns the thinking and instruction solved a problem, and computer can tell you answer in a very short period of time.In this way, Those artificial calculating need the problem of spending several years, tens of years, and computer may only need a few minutes that can solve.Very The problem of result can not be calculated to some manpowers, computer also can tell quickly you answer.
Silicon wafer belongs to part important on integrated circuit board, but different integrated circuit board sizes is different, needs at this time Silicon wafer is divided, to reduce silicon wafer the space occupied, traditional silicon wafer dividing method is that staff holds rounding knife to silicon Piece is split, and this method is excessively high to the firmly size accuracy requirement of staff, is not easy to operate, firmly conference makes silicon wafer Vibration, it is firmly small that segmentation can be made to fail, secondary splitting is needed, another method is to utilize cylinder driving segmentation blade, this method The shortcomings that be not have special pressing device, manual compression safety is low, in conclusion being now badly in need of a kind of integrated circuit silicon chip Splitting equipment is come solve above-mentioned appearance and soil.
Summary of the invention
It is an object of the present invention to provide a kind of integrated circuit silicon chip splitting equipments, to solve biography mentioned above in the background art The silicon wafer dividing method of system is that the hand-held rounding knife of staff is split silicon wafer, and this method is to the firmly big of staff Small required precision is excessively high, is not easy to operate, and firmly conference shakes silicon wafer, firmly small that segmentation can be made to fail, and needs secondary splitting, The shortcomings that another method is to divide blade using cylinder driving, this method is that do not have special pressing device, manual compression The low problem of safety.
To achieve the above object, the invention provides the following technical scheme: a kind of integrated circuit silicon chip splitting equipment, including dress Main body, clamp system and division mechanism are set, described device main body includes workbench, support rod and top plate, and the top plate passes through branch Strut is fixed at workbench top, and the clamp system setting is under the top plate on the left of end face, and the clamp system includes the End face under the top plate is arranged in one sliding block, the first chamber body, compression bar, pressing plate, transmission gear, motor and rack gear, first chamber body Left side, the rack gear are slidably connected at left side inside the first chamber body by the first sliding block, and the motor is located at the first chamber body Inside, the transmission gear are installed on the output end of motor, and the compression bar top is fixed on rack gear bottom end, and compression bar bottom end It across the first chamber body lower end surface, and is fixedly connected with the pressing plate, the division mechanism is arranged on the right side of end face under the top plate, the segmentation Mechanism include the first hinged shaft, the second chamber body, sliding rail, the second sliding block, rounding knife, connecting rod, the second hinged shaft, connector, pinion, Handle, fixed bracket, master gear and connection frame, under the top plate on the right side of end face, the sliding rail setting exists for the second chamber body setting Left side inside second Room body, second sliding block are slidably connected at sliding rail right side, and the connecting rod is fixed on the second sliding block Lower end, and connecting rod extends to the second chamber body bottom face, and is fixedly connected by knife rest with rounding knife, first hinged shaft is fixed It is arranged in pinion left side center, second hinged shaft is fixed on sliding block right side, and the connector both ends turn respectively Dynamic to be connected on the first hinged shaft and the second hinged shaft, the fixed bracket is fixed on inside second Room body, and the master gear rotation connects It connects in fixed internal stent, the master gear is flexibly connected by connection frame with right gear, the handle and the fixed company of master gear It connects, and handle extends on the right side of the second chamber body.
Further, the edges and corners of the workbench lower end surface four are provided with stabilizer blade.
Further, the position that the workbench upper surface corresponds to rounding knife offers the cutter groove for rounding knife movement.
Further, second chamber body lower end surface is provided with the guide sleeve that stretching motion is done for connecting rod.
Further, the master gear is meshed with pinion, and the tooth socket of the transmission gear is mutually nibbled with the tooth socket of rack gear It closes.
Further, the top plate top end face is provided with double control switch, and double control switch and motor are electrically connected.
Further, the pressing plate lower end surface is provided with the cushion for preventing silicon wafer from scratching.
Compared with prior art, the beneficial effects of the present invention are: because the present invention is added to the first sliding block, the first chamber body, pressure Bar, pressing plate, transmission gear, motor and rack gear, the design using motor driving and gear transmission principle, driving pressing plate to Under the fixation of position is carried out to silicon wafer, instead of manual fixed, increase safety coefficient, while ensure that segmentation precision;Yin Ben Invention is added to the first hinged shaft, the second chamber body, sliding rail, the second sliding block, rounding knife, connecting rod, the second hinged shaft, connector, secondary tooth Wheel, handle, fixed bracket, master gear and connection frame, the design are matched using slider-crank mechanism with gear movement pair, are driven Cutter move up and down, and cut to silicon wafer, instead of original cylinder, increase the characteristic of movement racing, on the one hand may be used To move back and forth, it is repeatedly performed cutting operation, increases efficiency, the motion profile of rounding knife, cutting essence has on the other hand been determined Degree is high.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention;
Fig. 2 is the structural schematic diagram of hold-down mechanism in the present invention;
Fig. 3 is the structural schematic diagram of division mechanism in the present invention;
Fig. 4 is the structural schematic diagram of master gear and pinion in division mechanism of the present invention.
In appended drawing reference: 1. workbench;2. support rod;3. clamp system;4. top plate;5. double control switch;6. division mechanism; 7. stabilizer blade;31. the first sliding block;32. the first chamber body;33. compression bar;34. cushion;35. pressing plate;36. transmission gear;37. motor; 38. rack gear;601. first hinged shafts;602. second chamber bodies;603. sliding rail;604. second sliding blocks;605. guide sleeve;606. rounding knife; 607. connecting rod;608. second hinged shafts;609. connector;610. pinion;611. handle;612. fixed brackets;613. main teeth Wheel;614. connection frame.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other Embodiment shall fall within the protection scope of the present invention.
Fig. 1-4 is please referred to, the present invention provides a kind of technical solution: a kind of integrated circuit silicon chip splitting equipment, including device Main body, clamp system 3 and division mechanism 6, apparatus main body include workbench 1, support rod 2 and top plate 4, and top plate 4 passes through support rod 2 It is fixed at 1 top of workbench.
Clamp system 3 is arranged on the left of 4 lower end surface of top plate, and clamp system 3 includes the first sliding block 31, the first chamber body 32, pressure Bar 33, pressing plate 34, transmission gear 35, motor 36 and rack gear 37, the first chamber body 32 are arranged on the left of 4 lower end surface of top plate, rack gear 37 are slidably connected at 32 inside left side of the first chamber body by the first sliding block 31, and motor 36 is located inside the first chamber body 32, pass Moving gear 35 is installed on the output end of motor 36, and 33 top of compression bar is fixed on 37 bottom end of rack gear, and 33 bottom end of compression bar passes through First chamber body, 32 lower end surface, and be fixedly connected with pressing plate 34, which utilizes the driving of motor and the transmission principle of gear, driving Pressing plate 34 carries out downwards the fixation of position to silicon wafer, fixes instead of manual, increases safety coefficient, while ensure that segmentation essence Degree.
Division mechanism 6 be arranged on the right side of 4 lower end surface of top plate, division mechanism 6 include the first hinged shaft 601, the second chamber body 602, Sliding rail 603, the second sliding block 604, rounding knife 606, connecting rod 607, the second hinged shaft 608, connector 609, pinion 610, handle 611, fixed bracket 612, master gear 613 and connection frame 614, the second chamber body 602 are arranged on the right side of 4 lower end surface of top plate, sliding rail 603 It is arranged in 602 inside left side of the second chamber body, the second sliding block 604 is slidably connected at 603 right side of sliding rail, and connecting rod 607 is fixed In 604 lower end of the second sliding block, and connecting rod 607 extends to 602 bottom face of the second chamber body, and solid by knife rest and rounding knife 606 Fixed connection, the first hinged shaft 601 are fixed at 610 left side center of pinion, and the second hinged shaft 608 is fixed on sliding block right end Face, 609 both ends of connector are rotatably connected on respectively on the first hinged shaft 601 and the second hinged shaft 608, and fixed bracket 612 is fixed on the Inside two chamber bodies 602, master gear 613 is rotatably connected on inside fixed bracket 612, and master gear 613 passes through connection frame 614 and right tooth Wheel is flexibly connected, and handle 611 is fixedly connected with master gear 613, and handle 611 extends to 602 right side of the second chamber body, design benefit It is matched with slider-crank mechanism with gear movement pair, driving cutter move up and down, and cut to silicon wafer, instead of original Cylinder, increase movement racing characteristic, on the one hand can move back and forth, be repeatedly performed cutting operation, increase efficiency, separately On the one hand it has been determined that the motion profile of rounding knife 606, cutting accuracy are high.
Workbench 1 lower end surface four edges and corners are provided with stabilizer blade 7, and 1 upper surface of workbench corresponds to the position of rounding knife 606 The cutter groove moved for rounding knife 606 is offered, 602 lower end surface of the second chamber body is provided with leads for 607 stretching motion of connecting rod Set 605, master gear 613 is meshed with pinion 610, and the tooth socket of transmission gear 35 is meshed with the tooth socket of rack gear 37, and top plate 4 pushes up End face is provided with double control switch 5, and double control switch 5 and motor 36 are electrically connected, and 34 lower end surface of pressing plate, which is provided with, prevents silicon wafer The cushion 34 scratched.
The present invention is at work: silicon wafer being placed on workbench 1, the output end that dual control button controls motor 36 is passed through Rotation band nutating gear 35 rotates, and the tooth socket of transmission gear 35 is meshed with the tooth socket of rack gear 37, and rack gear 37 passes engagement force It is handed to the first sliding block 31,31 slide downward of the first sliding block, and is moved down with carry-over bar 37, rack gear 37 pushes pressure by compression bar 33 Plate 34 moves down, 34 cooperating platform 1 of pressing plate to silicon wafer carry out position fix, while cushion 34 prevent silicon wafer because friction by Damage, manual swing handle 611, the rotation of handle 611 drive master gear 613 to rotate, and master gear 613 is meshed with pinion 610, secondary Gear 610 rotates around master gear 613, and connector 609 is rotated by the first hinged shaft 601 and the second hinged shaft 608, works as pinion 610 when from top to bottom rotating, and applies a downward power to the second sliding block 604 by connector 609, pushes the second sliding block 604 Moved down in 603 right side of sliding rail, the second sliding block 604 by connecting rod 607 from guide sleeve 605 be oriented to push rounding knife 606 to Lower movement, rounding knife 606 carries out cutting operation to silicon wafer, right by connector 609 when pinion 610 rotates from the bottom to top Second sliding block 604 applies a upward power, pulls the second sliding block 604 to move up in 603 right side of sliding rail, the second sliding block 604 pull rounding knife 606 to move up by connecting rod 607, and thus back and forth, reusable, Loop partitioning, segmentation finishes Afterwards, stop operating handle 611, and by 5 service meter 36 of double control switch, similarly, pressing plate 34 is separated with silicon wafer, and silicon wafer is taken Out, so that solving traditional silicon wafer dividing method is that the hand-held rounding knife 606 of staff is split silicon wafer, this method It is excessively high to the firmly size accuracy requirement of staff, it is not easy to operate, firmly conference shakes silicon wafer, firmly small to make to divide The shortcomings that failure needs secondary splitting, and another method is to utilize cylinder driving rounding knife 606, this method is that do not have specially The pressing device of door, the low problem of manual compression safety.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention, for this field skill For art personnel, it is clear that invention is not limited to the details of the above exemplary embodiments, and without departing substantially from spirit of the invention or In the case where essential characteristic, the present invention can be realized in other specific forms.Therefore, in all respects, should all incite somebody to action Embodiment regards exemplary as, and is non-limiting, the scope of the present invention by appended claims rather than on state Bright restriction, it is intended that including all changes that fall within the meaning and scope of the equivalent elements of the claims in the present invention It is interior.Any reference signs in the claims should not be construed as limiting the involved claims.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with A variety of variations, modification, replacement can be carried out to these embodiments without departing from the principles and spirit of the present invention by understanding And modification, the scope of the present invention is defined by the appended.

Claims (7)

1. a kind of integrated circuit silicon chip splitting equipment, including apparatus main body, clamp system (3) and division mechanism (6), feature exists In: described device main body includes workbench (1), support rod (2) and top plate (4), and the top plate (4) is fixed by support rod (2) It is arranged on workbench (1) top;
On the left of top plate (4) lower end surface, the clamp system (3) includes the first sliding block (31), for the clamp system (3) setting One chamber body (32), compression bar (33), pressing plate (34), transmission gear (35), motor (36) and rack gear (37), first chamber body (32) on the left of top plate (4) lower end surface, the rack gear (37) is slidably connected at the first chamber body by the first sliding block (31) for setting (32) internal left side, the motor (36) are located at the first chamber body (32) inside, and the transmission gear (35) is installed on electronic On the output end of machine (36), compression bar (33) top is fixed on rack gear (37) bottom end, and compression bar (33) bottom end passes through the first Room Body (32) lower end surface, and be fixedly connected with pressing plate (34);
The division mechanism (6) setting on the right side of top plate (4) lower end surface, the division mechanism (6) include the first hinged shaft (601), Second chamber body (602), sliding rail (603), the second sliding block (604), rounding knife (606), connecting rod (607), the second hinged shaft (608), Connector (609), pinion (610), handle (611), fixed bracket (612), master gear (613) and connection frame (614), it is described Second chamber body (602) setting is on the right side of top plate (4) lower end surface, and sliding rail (603) setting is in the internal left end of the second chamber body (602) Face, second sliding block (604) are slidably connected at sliding rail (603) right side, and the connecting rod (607) is fixed on the second sliding block (604) lower end, and connecting rod (607) extends to the second chamber body (602) bottom face, and fixed by knife rest and rounding knife (606) Connection, first hinged shaft (601) are fixed at pinion (610) left side center, and second hinged shaft (608) is solid It is scheduled on sliding block right side, connector (609) both ends are rotatably connected on the first hinged shaft (601) and the second hinged shaft (608) respectively On, the fixed bracket (612) is fixed on the second chamber body (602) inside, and the master gear (613) is rotatably connected on fixed bracket (612) internal, the master gear (613) is flexibly connected by connection frame (614) with right gear, the handle (611) and main tooth Wheel (613) is fixedly connected, and handle (611) extends on the right side of the second chamber body (602).
2. a kind of integrated circuit silicon chip splitting equipment according to claim 1, it is characterised in that: under the workbench (1) The edges and corners of end face four are provided with stabilizer blade (7).
3. a kind of integrated circuit silicon chip splitting equipment according to claim 1, it is characterised in that: on the workbench (1) The position that end face corresponds to rounding knife (606) offers the cutter groove for rounding knife (606) movement.
4. a kind of integrated circuit silicon chip splitting equipment according to claim 1, it is characterised in that: second chamber body (602) lower end surface is provided with the guide sleeve (605) that stretching motion is done for connecting rod (607).
5. a kind of integrated circuit silicon chip splitting equipment according to claim 1, it is characterised in that: the master gear (613) It is meshed with pinion (610), the tooth socket of the transmission gear (35) is meshed with the tooth socket of rack gear (37).
6. a kind of integrated circuit silicon chip splitting equipment according to claim 1, it is characterised in that: top plate (4) top Face is provided with double control switch (5), and double control switch (5) and motor (36) are electrically connected.
7. a kind of integrated circuit silicon chip splitting equipment according to claim 1, it is characterised in that: pressing plate (34) lower end Face is provided with the cushion (34) for preventing silicon wafer from scratching.
CN201811221881.4A 2018-10-19 2018-10-19 A kind of integrated circuit silicon chip splitting equipment Pending CN109624111A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811221881.4A CN109624111A (en) 2018-10-19 2018-10-19 A kind of integrated circuit silicon chip splitting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811221881.4A CN109624111A (en) 2018-10-19 2018-10-19 A kind of integrated circuit silicon chip splitting equipment

Publications (1)

Publication Number Publication Date
CN109624111A true CN109624111A (en) 2019-04-16

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CN201811221881.4A Pending CN109624111A (en) 2018-10-19 2018-10-19 A kind of integrated circuit silicon chip splitting equipment

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112267983A (en) * 2020-09-13 2021-01-26 何景安 Reciprocating motion sliding gear rack pulling and rotating device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101352898A (en) * 2008-09-01 2009-01-28 俞恒庆 Apparatus and method for processing surface of stone
CN204626140U (en) * 2015-05-15 2015-09-09 周志花 Weaving yarn cutting device
CN104999129A (en) * 2015-07-15 2015-10-28 宁波大学 Crank slider type bar hot shearing mechanism driven by deformed elliptical gears
CN106239774A (en) * 2016-08-29 2016-12-21 胡崇北 A kind of food production quick shredding mechanism of waste plastic rubbish
CN106363220A (en) * 2016-10-15 2017-02-01 湖北喵喵智能物联网科技有限公司 Energy-saving type convenient shear plate equipment
JP2017024419A (en) * 2016-09-13 2017-02-02 三星ダイヤモンド工業株式会社 Scribe device
CN207643454U (en) * 2017-11-07 2018-07-24 中山市古镇爱飞朗光电科技厂 A kind of cutter device of LED light LED wafer
CN108527697A (en) * 2018-04-09 2018-09-14 绍兴文理学院 A kind of photovoltaic panel silicon chip cutting device for processing

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101352898A (en) * 2008-09-01 2009-01-28 俞恒庆 Apparatus and method for processing surface of stone
CN204626140U (en) * 2015-05-15 2015-09-09 周志花 Weaving yarn cutting device
CN104999129A (en) * 2015-07-15 2015-10-28 宁波大学 Crank slider type bar hot shearing mechanism driven by deformed elliptical gears
CN106239774A (en) * 2016-08-29 2016-12-21 胡崇北 A kind of food production quick shredding mechanism of waste plastic rubbish
JP2017024419A (en) * 2016-09-13 2017-02-02 三星ダイヤモンド工業株式会社 Scribe device
CN106363220A (en) * 2016-10-15 2017-02-01 湖北喵喵智能物联网科技有限公司 Energy-saving type convenient shear plate equipment
CN207643454U (en) * 2017-11-07 2018-07-24 中山市古镇爱飞朗光电科技厂 A kind of cutter device of LED light LED wafer
CN108527697A (en) * 2018-04-09 2018-09-14 绍兴文理学院 A kind of photovoltaic panel silicon chip cutting device for processing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112267983A (en) * 2020-09-13 2021-01-26 何景安 Reciprocating motion sliding gear rack pulling and rotating device

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Application publication date: 20190416

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