CN109623172B - Laser cutting method and device for optical filter - Google Patents
Laser cutting method and device for optical filter Download PDFInfo
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- CN109623172B CN109623172B CN201910099113.4A CN201910099113A CN109623172B CN 109623172 B CN109623172 B CN 109623172B CN 201910099113 A CN201910099113 A CN 201910099113A CN 109623172 B CN109623172 B CN 109623172B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser cutting method and a device of an optical filter, wherein the device comprises the following components: the system comprises an ultrafast laser, a beam shaping module, a focusing objective lens, a visual detection device and a motion platform; the visual detection device is positioned at the upper part of the focusing objective lens, the moving platform is positioned at the lower part of the focusing objective lens and is used for bearing the optical filter to be filtered, and the focusing objective lens is an imaging objective lens of the visual detection device; the ultrafast laser emits an ultrashort pulse laser beam incident beam shaping module, the ultrashort pulse laser beam is shaped by the beam shaping module to form a linear diffraction-free beam with uniformly distributed energy, the linear diffraction-free beam is incident to the focusing objective lens, and the linear diffraction-free beam is focused by the focusing objective lens to form a high-energy-density diffraction-free beam for cutting the optical filter. The cross section, the upper surface and the lower surface of each element obtained after cutting are regularly formed, the straightness is good, the surface film layer is not obviously damaged, and the thickness and the position of the modified layer formed in the cutting process can be selected according to the thickness of the substrate or actual requirements so as to meet the processing requirements of different specifications.
Description
Technical Field
The invention relates to the technical field of laser processing, in particular to a laser cutting method and device for an optical filter.
Background
The optical filter is an optical element capable of realizing passing or cutting of specific wavelength, is a key functional component in the fields of aerospace precision remote sensing, optical communication, high-performance cameras and the like, and can realize detection with higher precision and sensitivity and high-quality information transmission by virtue of the optical filter. For example, in order to realize multiband detection in the aerospace field and inhibit infrared background radiation, a plurality of infrared filter sets with specific waveband ranges are arranged in the adopted multiband infrared visual detection device; in a transceiver module of an optical communication device, communication quality can be remarkably improved by selecting signals with required wavelengths, and noise interference in the transmission process is suppressed; the imaging quality can be improved by adding a specific optical filter in front of the lens of the high-performance camera. In all fields, the filter is assembled by cutting a large filter into smaller single elements according to the required size.
With the development of integration and miniaturization of visual inspection devices, the size of the optical filter to be processed is smaller and smaller, and the requirement for processing quality is increasing. At present, the traditional method for cutting and processing the optical filter mainly comprises wire drawing cutting of a wire wheel and mechanical wheel cutting. The wire wheel wiredrawing cutting is characterized in that a plurality of groups of wire wheels are oppositely arranged in pairs, cutting wires penetrate through the wire wheels to be wound on the wire wheels, and the cutting of the optical filters with different sizes can be realized by controlling the space between the wire wheels. The method can cut a plurality of optical filters with small damage to the optical filters, but is limited by the wire drawing structure of the wire wheel, and the size of the optical filters processed by the method cannot be smaller than the diameter of the wire wheel. The mechanical wheel type cutting is to directly process the optical filter substrate by using a blade, the blade adopted by the method can cause great damage to a surface film layer of the optical filter, and cooling liquid used in the cutting process can pollute the surface film layer.
In summary, the conventional filter processing method has not been able to meet the requirement of forming and cutting in the application. The development of laser technology provides a good solution for the processing of the optical filter. Especially after the continuous accumulation and development of continuous laser and long pulse laser processing technology, the ultra-fast laser (the pulse width is less than 10)-12Seconds) is considered to be a preferred means of relevant material processing. The ultrafast laser can carry out internal modification on the material by virtue of extremely high peak power and a nonlinear absorption effect in the process of acting on the material transparent to the ultrafast laser, and the material is not directly removed in the modification process, so that the ultrafast laser provides possibility for realizing efficient and high-quality cutting processing. However, the modified region obtained by internal modified cutting with the gaussian beam directly output by the laser has only a small width, which results in more cracks after cutting a thicker material (as shown in fig. 5 a).
The related research results show that the improvement of the cutting section is the key for improving the cutting quality, and the cutting quality can be improved by increasing the thickness of the improved layer to a certain extent. The diffraction-free linear focusing spot attracts attention in the field of processing of related materials by obtaining a wider modified layer, but the energy of the directly generated diffraction-free beam is not uniformly distributed along the propagation direction (as shown in fig. 6a), which means that the section can be free of cracks after being cut by the directly generated diffraction-free beam, but the non-uniform energy distribution of the beam can cause the shape of the modified layer after being cut to be non-uniform (as shown in fig. 5 b).
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the above-mentioned shortcomings of the prior art, the present invention is directed to a method and an apparatus for laser cutting an optical filter, so as to overcome the problem of poor cutting quality of the existing method for cutting an optical filter.
The technical scheme of the invention is as follows:
the invention provides a laser cutting device of an optical filter, which comprises: the system comprises an ultrafast laser, a beam shaping module, a focusing objective lens, a visual detection device and a motion platform;
the visual detection device is positioned at the upper part of the focusing objective lens, the moving platform is positioned at the lower part of the focusing objective lens and is used for bearing the optical filter to be filtered, and the focusing objective lens is an imaging objective lens of the visual detection device;
the ultrafast laser emits an ultrashort pulse laser beam incident beam shaping module, the ultrashort pulse laser beam is shaped by the beam shaping module to form a linear diffraction-free beam with uniformly distributed energy, the linear diffraction-free beam is incident to the focusing objective lens, and the linear diffraction-free beam is focused by the focusing objective lens to form a high-energy-density diffraction-free beam for cutting the optical filter.
Laser cutting device of light filter, wherein, beam shaping module includes:
the non-diffraction beam generation module is used for generating initial non-diffraction beam output by the incident ultra-short pulse laser beam;
and the energy homogenizing and shaping module is used for shaping the initial non-diffraction light beam output by the non-diffraction light beam generating module into a linear non-diffraction light beam with uniformly distributed energy.
The laser cutting device of the optical filter, wherein the energy homogenizing and shaping module comprises: the energy attenuation of the light beam by the middle area is larger than that of the attenuation sheet of the surrounding area.
The laser cutting device of the optical filter is characterized in that the attenuation sheet is rotatably arranged in the output direction of the non-diffraction light beam.
The laser cutting device of the optical filter is characterized in that the non-diffraction beam generation module comprises an axicon.
The laser cutting device of the optical filter is characterized in that the pulse width of an ultra-short pulse laser beam generated by the ultra-fast laser is less than 100 picoseconds.
The laser cutting device of the optical filter further comprises a control system for controlling the ultrafast laser, the beam shaping module, the focusing objective lens, the visual detection device and the motion platform.
The invention also provides a laser cutting method of the optical filter, which comprises the following steps:
providing a laser cutting device as described in any of the above;
after the optical filter is placed on the motion platform, the visual detection device and the motion platform are adjusted to find out the machining surface and the cutting position;
opening an ultrafast laser to emit an ultrashort pulse laser beam, and forming a linear diffraction-free beam with uniformly distributed energy through a beam shaping module to enter a focusing objective lens;
and adjusting the moving platform and the focusing objective lens to carry out accurate focusing, and applying a high-energy-density diffraction-free beam formed by focusing through the focusing objective lens to the selected area of the optical filter to finish laser cutting of the optical filter.
According to the laser cutting method of the optical filter, when the optical filter is subjected to laser cutting, the thickness of the modified layer is adjusted and controlled through the beam shaping module, and the position of the modified layer is adjusted through the focusing objective and the focusing point of the moving platform.
The laser cutting method of the optical filter is characterized in that the distance between points of the optical filter during laser cutting is 4-20 micrometers, and the energy density of the high-energy-density diffraction-free beam is more than 1J/cm2。
The invention has the beneficial effects that:
the invention cuts the optical filter by linear diffraction-free beams with uniformly distributed energy which are formed by the beam shaping module, the cross section, the upper surface and the lower surface of each element obtained after cutting are regularly formed, the straightness is good, the surface film layer is not obviously damaged, and the thickness and the position of the modified layer formed in the cutting process can be selected according to the thickness of the substrate or the actual requirement so as to meet the processing requirements of different specifications.
Drawings
Fig. 1 is a schematic structural diagram of the optical filter.
Fig. 2 is a schematic structural diagram of a laser cutting apparatus for an optical filter according to an embodiment of the present invention.
Fig. 3 is a schematic structural diagram of a beam shaping module according to an embodiment of the invention.
Fig. 4 is a flowchart of a laser cutting method of an optical filter according to an embodiment of the invention.
Fig. 5 shows the effect of conventional gaussian, non-diffracted beam cutting before shaping.
FIG. 6 is a comparison of the initial energy distribution of a non-diffracted beam and the energy distribution along its direction of propagation after energy homogenization; wherein, (a) is the non-uniform distribution of energy of the non-diffraction light beam along the propagation direction before shaping, and (b) is the non-diffraction light beam which can realize the uniform distribution of energy along the propagation direction after shaping.
FIG. 7 shows the cross-section and cutting effect of the optical filter after adjusting the shape of the different modifying layers; the laser cutting method comprises the following steps of (a) adjusting a beam shaping module to realize cutting of different modified layer widths and point intervals, (b) adjusting the beam shaping module to realize cutting of different modified layer widths and point intervals, (c) cutting the crack straightness before separation after laser cutting, and (d) cutting the front face of the optical filter after mechanical splitting separation.
Detailed Description
The present invention provides a method and an apparatus for laser cutting of an optical filter, which will be described in further detail below with reference to the accompanying drawings and examples in order to make the objects, technical solutions and effects of the present invention clearer and clearer. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 2, a laser cutting apparatus 100 for an optical filter according to an embodiment of the present invention includes: an ultrafast laser 110, a beam shaping module 120, a focusing objective 130, a vision inspection device 200, and a motion platform 210; the visual inspection device 200 is located above the focusing objective 130, the moving platform 210 is located below the focusing objective 130 and is used for bearing the optical filter 300, and the focusing objective 130 is an imaging objective of the visual inspection device 200; the focusing objective 130, the visual detection device 200 and the moving platform 210 form a focusing and positioning system in the processing process, so that cutting positioning and accurate focusing in the processing process of different types of optical filters can be realized; the ultrafast laser 110 emits an ultra-short pulse laser beam incident beam shaping module 120, and the beam shaped beam is shaped into a linear diffraction-free beam with uniformly distributed energy through the beam shaping module 120, and then the linear diffraction-free beam is incident to the focusing objective 130, and is focused through the focusing objective 130 to form a high-energy-density diffraction-free beam for cutting the optical filter 300.
The invention cuts the optical filter by linear diffraction-free beams with uniformly distributed energy which are formed by the beam shaping module, the cross section, the upper surface and the lower surface of each element obtained after cutting are regularly formed, the straightness is good, the surface film layer is not obviously damaged, and the thickness and the position of the modified layer formed in the cutting process can be selected according to the thickness of the substrate or the actual requirement so as to meet the processing requirements of different specifications.
Further, referring to fig. 3, in this embodiment, the beam shaping module 120 at least includes: a non-diffraction beam generation module 121 and an energy homogenizing and shaping module 122; the non-diffraction beam generation module 121 is configured to generate an initial non-diffraction beam output from the incident ultra-short pulse laser beam; the energy homogenizing and shaping module 122 is configured to shape the initial undiffracted light beam output by the undiffracted light beam generating module into a linear undiffracted light beam with uniformly distributed energy along the energy distribution in the propagation direction of the initial undiffracted light beam, and the energy attenuation of the central area of the energy homogenizing and shaping module 122 to the light beam is greater than that of the peripheral area so as to implement the undiffracted light beam with uniformly distributed energy.
Preferably, referring to fig. 3, in this embodiment, the beam shaping module 120 further includes an energy redistribution component 123 located in front of the energy homogenization and shaping module 122, and the linear non-diffracted beams with uniformly distributed energy output by the energy homogenization and shaping module 122 enter the energy redistribution component 123 to converge, and then enter the focusing objective 130. In one embodiment, the energy redistribution element 123 may be a converging lens. The energy homogenizing and shaping module comprises: the attenuation sheet in the middle area attenuates the energy of the light beam more than that in the surrounding area, and the attenuation sheet is an attenuation device with ring-shaped characteristics and stronger attenuation in the middle and outer ring areas. Preferably, the attenuation sheet is rotatably arranged in the output direction of the non-diffracted light beam, so that the uniformity of energy distribution can be further enhanced in a rotating manner, and the light spot with more uniform energy distribution can be shaped.
The key element of the non-diffraction beam energy homogenizing treatment device adopted by the embodiment of the invention is an attenuation sheet of which the energy attenuation of the middle area to the beam is larger than that of the peripheral area. The root of the directly formed non-diffraction light beam energy distribution is that the energy of the middle area of the light beam is more concentrated, and the energy distribution can be homogenized by matching with a specific energy attenuation device. In the embodiment, the ring-shaped attenuation devices with stronger attenuation in the middle and outer ring regions are approximately placed at the solid line position in fig. 3, so that the non-diffracted beam with the optimal energy distribution as shown in fig. 6b can be obtained, and the optimal position is half of the length of the initial beam.
Further, in this embodiment, the non-diffraction beam generation module includes an axicon or other components or systems capable of achieving the same effect. The pulse width of the ultra-short pulse laser beam generated by the ultra-fast laser is less than 100 ps. The laser cutting device further comprises a control system 400 (controller) for controlling the ultrafast laser 110, the beam shaping module 120, the focusing objective 130, the vision inspection device 200 and the motion platform 210, wherein the control system 400 can realize automatic control of the cutting positioning and focusing process, and focus the shaped diffraction-free beam to cut the optical filter.
Further, in this embodiment, the visual inspection apparatus is a CCD camera, the CCD camera is located right above the focusing objective, the objective is used as both the laser focusing objective and the imaging objective of the CCD camera, specifically, the numerical aperture value of the objective selected in this embodiment is 0.5, the magnification is 50 times, and the number of pixels of the CCD camera is 40 ten thousand.
In specific implementation, referring to fig. 2, the laser processing system 100 includes an ultrafast laser 110, a beam shaping module 120, a processing objective 130, a first laser transmission element 140 and a second laser transmission element 150, where the first laser transmission element 140 is a reflector and the second laser transmission element 150 is a half-reflecting and half-transmitting mirror to achieve coaxial imaging observation. The ultrafast laser is used for generating an ultrashort pulse laser beam conforming to corresponding characteristics, the generated laser beam initially forms a linear undiffracted beam with highly concentrated energy after passing through the beam shaping module 120, the undiffracted beam generating element selected in the embodiment is an axicon, and the laser generating device outputs a gaussian beam with 532 nm wavelength and 15 picosecond pulse width. The generated Gaussian beam is incident to the axicon which is approximately a plane, and then the generated diffracted light is subjected to wave front interference to generate a non-diffracted light beam, the non-diffracted light beam is generated in a mode that more than 90% of energy of the non-diffracted light beam is uniformly distributed in the linear light spot, and the laser energy distribution is sharply reduced in an area slightly far away from the linear light spot. Further, the initial energy of the light beam which is not uniform along the propagation direction can be respectively shaped into the diffraction-free light beams which are distributed basically uniformly through the selected energy homogenizing and shaping module. Under the condition that the energy distribution form is not changed after the focusing of the processing objective lens, a high-energy-density diffraction-free beam for material processing can be formed.
Referring to fig. 4, an embodiment of the present invention further provides a laser cutting method for an optical filter, where the method includes:
step S100, providing the laser cutting device;
s200, after the optical filter is placed on a motion platform, adjusting a visual detection device and the motion platform, and searching a processing surface and a cutting position;
step S300, opening an ultrafast laser to emit an ultrashort pulse laser beam, and forming a linear diffraction-free beam with uniformly distributed energy by a beam shaping module to enter a focusing objective lens;
and S400, adjusting the motion platform and the focusing objective lens to carry out accurate focusing, and applying a high-energy-density diffraction-free beam formed by focusing through the focusing objective lens to a selected area of the optical filter to finish laser cutting of the optical filter.
The invention provides the method for cutting the optical filter based on the linear focusing non-diffraction beam with uniformly distributed energy, the quality of the modified layer after cutting is greatly improved compared with the quality of a Gaussian beam and the quality of the non-diffraction beam before shaping, and the advantages of the laser technology in the processing application of related materials can be further improved.
The method is based on the non-diffraction light beams with uniformly distributed energy along the linear light spot propagation direction, the light filter is cut, the cross section, the upper surface and the lower surface of each element obtained after cutting are regularly formed, the straightness is good, the surface film layer is not obviously damaged, and the thickness and the position of the modified layer formed in the cutting process can be selected according to the thickness of the substrate or the actual requirement so as to meet the processing requirements of different specifications.
Furthermore, in this embodiment, during laser cutting of the optical filter, the thickness of the modified layer is adjusted and controlled by the beam shaping module, and the position of the modified layer is adjusted by adjusting the focus positions of the focusing objective and the moving platform. The generated energy is uniformly distributed, no-diffraction beams are focused in the optical filter for cutting, and the thickness and the position of the formed modified layer are adjustable. The thickness of the modified layer can be adjusted and controlled through the shaping module, the position of the modified layer can be adjusted and controlled through motion control and the focusing point position of the vision system, and the modified layer can be selected according to actual requirements when the processing effect is ensured.
Further, in this embodiment, when the step S400 is implemented, the optical filter and the objective lens are relatively moved by a set distance, so that the processing beam is focused on a selected area of the optical filter, and the material is cut under the set process parameters. The distance between points of the optical filter during laser cutting is 4-20 microns, and the energy density of the high-energy-density non-diffraction light beam is more than 1J/cm2. The initial laser pulse width generated by the ultrafast laser is less than 100 picoseconds, the wavelength is not limited to 532 nanometers, and the ultrafast laser can be focused inside the optical filter for modification processing.
Further, in this embodiment, referring to fig. 1, the structure of the optical filter may be that an optical film is provided on a surface (an upper surface and a lower surface or only one surface), the substrate is transparent optical glass or colored glass, and other materials with corresponding functions, and the film may be one layer or multiple layers. The filter is transparent to adopted 532 nm wavelength laser (the transmittance is more than 80%), can be a band-pass filter, a cut-off filter, a spectral filter and the like which meet the characteristics according to spectral characteristics, and can also be an ultraviolet filter, a visible filter and an infrared filter which meet the characteristic requirements according to spectral wave bands. After the non-diffraction light beam with uniformly distributed energy is used for processing, a single straight crack can be observed on the surface of the optical filter and can be separated subsequently, and the straightness of two cracks formed after actual vertical cross cutting is kept and perpendicular to each other. The modified layer of the optical filter cut under the optimized processing parameters is well formed, no crack appears except the modified region, the optical performance and the strength of devices outside the cutting region can be ensured under the condition of having an optical film, and the film near the cutting region is not obviously damaged. The method can process the optical filter with higher cutting requirements and more complex structure under the condition of optimizing processing parameters, so the method can also be directly used for cutting transparent materials such as sapphire, common glass and the like.
The upper surface of the cutting sample is found by the CCD and the related detection device, the found position is taken as a focus reference point of cutting movement, cutting parameters and the set relative movement distance are adjusted, the processing technology is optimized, then the cutting sections as shown in figure 7 can be respectively obtained, all the sections have uniform cutting modified layers, and other regions except the modified layers have no cracks. The processing material selected in this example is a glass substrate filter (infrared band cut-off) with a thickness of 0.2 mm and only one surface having a film layer. Particularly, the device and the method can realize the adjustment of the shape of the modified layer through the adjustment and control of the parameters of the shaping module, and can realize the cutting of different modified layer widths and point intervals (only through the correlation of replacing the attenuation sheet) after the adjustment as shown in the attached drawing. And observing the straightness of the cracks before separation (figure 7c) and the front surface of the filter after separation (figure 7d), wherein the edge of the finally obtained single element is basically free from edge breakage, and the surface film layer is well protected. The experimental results show that the method can obviously improve the cutting quality of the optical filter and also provides a complete solution for cutting the optical filters with different specifications.
In summary, the present invention provides an ultrafast laser cutting apparatus and method for an optical filter, based on the continuously improved requirements of optical filter processing, the advantages of laser cutting technology, and the promotion space possessed by the current ultrafast laser processing. The device carries out energy homogenization treatment on the directly generated initial non-diffraction light beam with uneven energy distribution based on a specific optical element or device; the method is based on the non-diffraction light beam after the shaping treatment for processing, the processing quality is higher, and the width of the formed modified layer can be adjusted according to the thickness of the substrate or the actual processing requirement so as to meet different actual application requirements.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (9)
1. A laser cutting apparatus for an optical filter, comprising: the system comprises an ultrafast laser, a beam shaping module, a focusing objective lens, a visual detection device and a motion platform;
the visual detection device is positioned at the upper part of the focusing objective lens, the moving platform is positioned at the lower part of the focusing objective lens and is used for bearing the optical filter to be filtered, and the focusing objective lens is an imaging objective lens of the visual detection device;
an ultra-short pulse laser beam emitted by the ultra-fast laser is incident on a beam shaping module, is shaped into a linear diffraction-free beam with uniformly distributed energy through the beam shaping module and then is incident on a focusing objective lens, and is focused through the focusing objective lens to form a high-energy-density diffraction-free beam for cutting the optical filter;
the beam shaping module includes:
the non-diffraction beam generation module is used for generating initial non-diffraction beam output by the incident ultra-short pulse laser beam;
and the energy attenuation of the middle area of the energy homogenizing and shaping module to the light beam is larger than that of the peripheral area, and the initial non-diffracted light beam output by the non-diffracted light beam generating module is shaped into a linear non-diffracted light beam with uniformly distributed energy.
2. The laser cutting device of the filter according to claim 1, wherein the energy homogenizing and shaping module comprises: the energy attenuation of the light beam by the middle area is larger than that of the attenuation sheet of the surrounding area.
3. The laser cutting apparatus for an optical filter according to claim 2, wherein the attenuation sheet is rotatably disposed in an output direction of the non-diffracted beam.
4. The laser cutting apparatus of the optical filter according to claim 1, wherein the non-diffractive beam generating module comprises an axicon.
5. The laser cutting apparatus for optical filter according to claim 1, wherein the ultra-short pulse laser beam generated by the ultra-fast laser has a pulse width of less than 100 picoseconds.
6. The laser cutting device for optical filter as claimed in claim 1, further comprising a control system for controlling the ultrafast laser, the beam shaping module, the focusing objective, the vision inspection device, and the motion platform.
7. A laser cutting method of an optical filter is characterized by comprising the following steps: providing a laser cutting device according to any one of claims 1 to 6;
after the optical filter is placed on the motion platform, the visual detection device and the motion platform are adjusted to find out the machining surface and the cutting position;
opening an ultrafast laser to emit an ultrashort pulse laser beam, and forming a linear diffraction-free beam with uniformly distributed energy through a beam shaping module to enter a focusing objective lens;
and adjusting the moving platform and the focusing objective lens to carry out accurate focusing, and applying a high-energy-density diffraction-free beam formed by focusing through the focusing objective lens to the selected area of the optical filter to finish laser cutting of the optical filter.
8. The laser cutting method of the optical filter as claimed in claim 7, wherein the thickness of the modified layer is adjusted and controlled by the beam shaping module during laser cutting of the optical filter, and the position of the modified layer is adjusted by adjusting the focusing position of the focusing objective and the moving platform.
9. The method for laser cutting an optical filter according to claim 7, wherein the distance between points during laser cutting of the optical filter is 4 to 20 microns, and the energy density of the high-energy-density non-diffracted beam is greater than 1J/cm 2.
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| CN201910099113.4A CN109623172B (en) | 2019-01-31 | 2019-01-31 | Laser cutting method and device for optical filter |
| TW109100097A TWI727592B (en) | 2019-01-31 | 2020-01-02 | Laser cutting method and device for filter |
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| CN201910099113.4A CN109623172B (en) | 2019-01-31 | 2019-01-31 | Laser cutting method and device for optical filter |
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| CN112276344B (en) * | 2019-07-09 | 2022-11-22 | 大族激光科技产业集团股份有限公司 | Focus positioning method for ultrafast laser cutting of transparent material |
| CN112427814A (en) * | 2019-08-23 | 2021-03-02 | 大族激光科技产业集团股份有限公司 | Laser pre-segmentation device and laser pre-segmentation method |
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| TW202030046A (en) | 2020-08-16 |
| CN109623172A (en) | 2019-04-16 |
| TWI727592B (en) | 2021-05-11 |
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