CN109605281A - A kind of thin slice installation system, installation method and computer readable storage medium - Google Patents
A kind of thin slice installation system, installation method and computer readable storage medium Download PDFInfo
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- CN109605281A CN109605281A CN201910020717.5A CN201910020717A CN109605281A CN 109605281 A CN109605281 A CN 109605281A CN 201910020717 A CN201910020717 A CN 201910020717A CN 109605281 A CN109605281 A CN 109605281A
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- thin slice
- array
- carrying mechanism
- suction nozzle
- pallet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
- B25B27/14—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for for assembling objects other than by press fit or detaching same
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- Mechanical Engineering (AREA)
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Abstract
The present invention provides a kind of thin slice installation system, installation method and computer readable storage medium, the installation system includes material tray, carrying mechanism and assembly pallet；The material tray includes that thin slice displays array；The array of displaying includes that more than two thin slices display slot；Groove shape and the size of displaying is matched with the thin slice, facilitates realization to the positioned in alignment for being put into thin slice therein；The carrying mechanism includes suction nozzle array；The suction nozzle array includes more than two suction nozzles, displays that array is corresponding with material tray, thin slice can be displayed to the chip sorption in slot on suction nozzle；The assembly pallet includes fitting opening array, including more than two fitting openings, corresponding with the suction nozzle array of carrying mechanism, can be packed into carrying mechanism and carry the thin slice to come.Compared with prior art, the present invention program expeditiously solve laminar part small in size from pick up, transport to installation to target position process.
Description
Technical field
The present invention relates to micro parts to assemble field, in particular to a kind of thin slice installation system, installation method and computer
Readable storage medium storing program for executing.
Background technique
With the development of industry, many industry products are to the lightening development of miniaturization.More and more products need
In the space of very little or very thin space together by many small assembling parts.Such as the mirror in mobile lens industry
Piece, diaphragm piece are the sheet material part of very thin very little, all there is great difficulty from picking up to installing using traditional manual installation,
Low efficiency simultaneously.
Summary of the invention
The present invention provides a kind of thin slice installation system, have the characteristics that realize thin slice installation process convenient for high efficiency.
The present invention also provides a kind of thin slice installation method, having the characteristics that being capable of high efficiency realization thin slice installation process.
The present invention also provides a kind of computer readable storage medium, have the characteristics that be easy to implement above-mentioned installation method.
A kind of thin slice installation system provided according to the present invention, including material tray, carrying mechanism and assembly pallet；
The material tray includes that thin slice displays array；The array of displaying includes that more than two thin slices display slot；It is described
It displays groove shape and size to match with the thin slice, facilitates realization to the positioned in alignment for being put into thin slice therein；
The carrying mechanism includes suction nozzle array；The suction nozzle array includes more than two suction nozzles, with material tray
It displays that array is corresponding, thin slice can be displayed to the chip sorption in slot on suction nozzle；
The assembly pallet includes fitting opening array, including more than two fitting openings, the suction nozzle with carrying mechanism
Array is corresponding, can be packed into carrying mechanism and carry the thin slice to come.
It further include screening pallet；The screening pallet includes absorption array；The absorption array includes more than two absorption
Device, it is corresponding with the suction nozzle array of carrying mechanism, it can be sucked and fix carrying mechanism and carry the thin slice to come；The screening
Pallet further includes rotating mechanism, can be rotated with the angle of setting and rate, it is impossible to adsorb fixed extra thin slice and gets rid of and falls.
The suction nozzle array of the carrying mechanism is suction type suction nozzle array, by chip sorption in suction nozzle by way of negative pressure
On.
The carrying mechanism is provided with the first step device, can control the vertical and horizontal movement of carrying mechanism.
Adsorbing mechanism is provided in the fitting opening；The adsorbing mechanism can be sucked and fix carrying mechanism and carry
The thin slice come.
The adsorbing mechanism is suction type adsorbing mechanism, by way of negative pressure by chip sorption on adsorbing mechanism.
The adsorbent equipment is suction type adsorbent equipment, by way of negative pressure by chip sorption on adsorbent equipment.
The screening pallet uses conductive material.
The screening pallet includes the second step device, is able to drive rotating mechanism to the direction shifting perpendicular to Plane of rotation
It is dynamic.
The adsorbent equipment is step adsorption structure, and the aperture of adsorption hole is located at the boss that screening tray surface is arranged in
On.
There are three adsorption hole, settings triangular in shape for each adsorbent equipment.
Three adsorption holes are arranged on the same boss.
A kind of thin slice installation method provided according to the present invention, based on the realization of above-mentioned installation system, including,
Thin slice is put into material tray, makes to display in slot described in thin slice entrance by manual vibration and/or machine vibration；
The thin slice for making the suction nozzle array of carrying mechanism be directed at material tray displays array, by chip sorption in carrying mechanism
In suction nozzle array；
So that the suction nozzle array of carrying mechanism is directed at the fitting opening array of assembly pallet, thin slice is installed to assembly pallet
In fitting opening, to realize the final installation of thin slice.
The method also includes first making the suction nozzle of carrying mechanism before thin slice is installed to assembly pallet by carrying mechanism
The absorption array of array alignment screening pallet；It is fixed on chip sorption on absorption array；The rotating mechanism of pallet is screened to set
Fixed angle and rate rotation, make that fixed extra thin slice cannot be adsorbed to get rid of and fall；Backwardness is got rid of, then will be screened using carrying mechanism
The thin slice adsorbed on pallet is transported to assembly pallet, to realize the final installation of thin slice.
The method also includes being first collapsible into rotating mechanism in screening pallet and carry out again before the rotating mechanism rotation
Rotation.
The method also includes adsorbing the suction nozzle array alignment on lamellated carrying mechanism and on extremely assembly pallet
Fitting opening array set distance after, first open the adsorption function of fitting opening, turn off the absorption of the suction nozzle of carrying mechanism
Function is transferred on assembly pallet so that thin slice is adsorbed.
A kind of computer readable storage medium provided according to the present invention is stored on capable of being loaded and executed by processor
State the computer program of any method.
Compared with prior art, the present invention program expeditiously solves laminar part small in size from picking up, transport
To installation to the process of target position.
Detailed description of the invention
Fig. 1 is the thin slice installation system structural schematic diagram of a wherein embodiment of the invention.
Fig. 2 is the material tray structural schematic diagram of a wherein embodiment of the invention.
Fig. 3 is the carrying mechanism structural schematic diagram of a wherein embodiment of the invention.
Fig. 4 is the assembly tray structure diagram of a wherein embodiment of the invention.
Fig. 5 is the screening tray structure diagram of a wherein embodiment of the invention.
Fig. 6 is the screening pallet adsorption hole structural schematic diagram of a wherein embodiment of the invention.
Fig. 7 is the structural schematic diagram of a wherein application example of the invention.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that described herein, specific examples are only used to explain the present invention, not
For limiting the present invention.
Any feature disclosed in this specification (including abstract and attached drawing) unless specifically stated can be equivalent by other
Or the alternative features with similar purpose are replaced.That is, unless specifically stated, each feature is a series of equivalent or class
Like an example in feature.
A kind of thin slice installation system provided according to the present invention, as shown in Figure 1, include material tray 2, carrying mechanism 1 and
Assemble pallet 4；
The material tray 2 includes that thin slice displays array；The array of displaying includes that more than two thin slices display slot 2-1；
The slot 2-1 form and dimension of displaying is matched with the thin slice, facilitates realization to the positioned in alignment for being put into thin slice therein；
The carrying mechanism 1 includes suction nozzle array；The suction nozzle array includes more than two suction nozzle 1-1, with material support
Disk 2 displays that array is corresponding, and thin slice can be displayed to the chip sorption in slot 2-1 on suction nozzle；
The assembly pallet 4 includes fitting opening array, including more than two fitting opening 4-1, with carrying mechanism 1
Suction nozzle array is corresponding, can be packed into carrying mechanism and carry the thin slice to come.
As shown in Fig. 2, being provided with a large amount of thin slice on the material tray 2 displays slot 2-1 or hole, form and dimension with
The thin slice matches, described to display slot 2-1 or to match be circle in hole for example, if thin slice is circle；If thin slice
It is to be rectangular, then described to display slot 2-1 or to match be rectangular in hole；On the other hand, size matches, to facilitate realization to putting
Enter the positioned in alignment of thin slice therein.Based on above structure, the light-weight thin slice of small size is put into material tray 2, by thick
Slightly manual vibration and/or machine vibration mode, can be realized and the thin slice is put into each array slot 2-1, at this point, each
At least one described thin slice in array slot 2-1, generally multi-disc are stacked in an array slot 2-1.
Carrying mechanism 1 can be transported through thin slice.As described in Figure 3, the suction nozzle array and material on the carrying mechanism 1
Array is corresponding for displaying on pallet 2 so that carrying mechanism 1 adsorb material tray 2 on place thin slice when, suction nozzle 1-1 energy
Enough slot 2-1 that displays with material tray are aligned one by one, are adsorbed consequently facilitating carrying out alignment one by one to thin slice.
As shown in figure 4, the fitting opening array on the assembly pallet 4 is corresponding with the suction nozzle array on carrying mechanism 1,
So that carrying mechanism 1 is when the thin slice transhipment that will be adsorbed is placed to fitting opening 4-1, fitting opening 4-1 can be with suction nozzle 1-1 mono-
One aligns, consequently facilitating carrying out alignment one by one to thin slice is placed into the fitting opening 4-1.
The present invention program expeditiously solves laminar part small in size from picking up, and transports installation to target position
Process, realize the high efficiency manipulation of multiple like parts.
As shown in figure 5, further including screening pallet 3 as one embodiment of the present invention；The screening pallet 3 includes
Adsorb array；The absorption array includes more than two adsorbent equipment 3-1, corresponding with the suction nozzle array of carrying mechanism 1, can
It is sucked and fixes carrying mechanism 1 and carry the thin slice to come；The screening pallet 3 further includes rotating mechanism 3-2, can be with setting
Angle and rate rotation, it is impossible to adsorb fixed extra thin slice and get rid of and fall.
The suction nozzle array on absorption array and carrying mechanism 1 on the screening pallet 3 corresponds, on the one hand, so that
The thin slice of absorption is transported on the adsorbent equipment 3-1 of screening pallet 3 by carrying mechanism 1, and adsorbent equipment 3-1 can be with suction nozzle 1-1
It aligns one by one, consequently facilitating thin slice alignment is placed on adsorbent equipment 3-1.In practical transport process, due to thin slice
Feature small in size, frivolous, carrying mechanism 1 is when adsorbing thin slice from material tray 2, it is understood that there may be on each suction nozzle
There is two or more in the thin slice of absorption, therefore, thin slice is first transported to screening pallet 3, screening pallet 3 is adsorbed on absorption
Thin slice on device 3-1 is fallen by the quick rotation of rotating mechanism 3-2 convenient for getting rid of the extra thin slice not adsorbed, from
And guarantee only have a thin slice on each adsorbent equipment 3-1, and position is under the action of adsorbent equipment 3-1 on screening pallet 3
It remains unchanged.Therefore, the absorption array structure of pallet 3 is screened, on the other hand, so that carrying mechanism 1 is on absorption screening pallet 3
When the thin slice of placement, suction nozzle 1-1 can with screening pallet adsorbent equipment 3-1 align one by one, consequently facilitating to thin slice into
Row alignment absorption one by one, to only have one on each suction nozzle 1-1 before guaranteeing that thin slice is transported to assembly pallet 4 by carrying mechanism 1
A thin slice.
As an embodiment of the present invention, 180 degree or 360 degree or other angles are carried out when the rotating mechanism 3-2 rotates
The quick rotation of degree.
As an embodiment of the invention, the suction nozzle array of the carrying mechanism 1 is suction type suction nozzle array, is passed through
The mode of negative pressure is by chip sorption on suction nozzle 1-1.
As an embodiment of the invention, the carrying mechanism 1 is provided with the first step device, can control carrying
The vertical and horizontal movement of mechanism.It can also be realized by the control movement to material tray 2, screening pallet 3 and assembly pallet 4
Transhipment to thin slice.
As an embodiment of the invention, adsorbing mechanism is provided in the fitting opening 4-1；The adsorbing mechanism
It can be sucked and fix carrying mechanism 1 and carry the thin slice to come.
As an embodiment of the invention, the adsorbing mechanism is suction type adsorbing mechanism, by way of negative pressure
By chip sorption on adsorbing mechanism.
As an embodiment of the invention, the adsorbent equipment 3-1 is suction type adsorbent equipment, passes through the side of negative pressure
Formula is by chip sorption on adsorbent equipment.
As an embodiment of the invention, the screening pallet 3 uses conductive material, when the flap contact to sieve
Self-electrostatic is eliminated immediately when selecting pallet 3, prevents multi-disc thin slice because static reason fits together.As a reality of the invention
Example is applied, the use of screening pallet 3 conducts electricity very well and erosion-resisting copper material, external environmental can be resisted, and
The defect that the electrostatic that sheet parts are generated because of friction can be effectively eliminated, is fitted in one for extra so as to be further ensured that
The thin slice risen, which is got rid of, to be fallen.
As an embodiment of the invention, the screening pallet 3 includes the second step device, is able to drive whirler
Structure is mobile to the direction perpendicular to Plane of rotation, consequently facilitating first rotating rotating mechanism before rotating mechanism 3-2 starts rotation
To the lower section of screening pallet, after completing spinning movement, rotating mechanism rotates back to original position, in this way, more on pallet 3 by screening
Remaining thin slice gets rid of the lower section for falling on screening pallet 3.
It is inhaled as an embodiment of the invention as shown in fig. 6, the adsorbent equipment 3-1 is step adsorption structure
The aperture in attached hole is located on the boss that screening tray surface is arranged in, to be easier to separate extra thin slice.
As an embodiment of the invention, as shown in figure 5, there are three adsorption holes for each adsorbent equipment, it is triangular in shape
Setting, so that absorption is more stable.
As an embodiment of the invention, three adsorption holes are arranged on the same boss.In other realities
The mode of applying is also possible to three adsorption holes and is separately positioned on respective boss, forms an adsorbent equipment.
A kind of thin slice installation method provided according to the present invention, based on the realization of above-mentioned installation system, including,
Thin slice is put into material tray 2, makes to display slot 2-1 described in thin slice entrance by manual vibration and/or machine vibration
In；
The thin slice for making the suction nozzle array of carrying mechanism 1 be directed at material tray 2 displays array, by chip sorption in carrying mechanism
Suction nozzle array in；
So that the suction nozzle array of carrying mechanism 1 is directed at the fitting opening array of assembly pallet 4, thin slice is installed to assembly pallet
Fitting opening in, to realize the final installation of thin slice.
As a kind of embodiment of the invention, the shapes and sizes for displaying slot 2-1 of material tray 2 ensure that thin slice
Be accurately positioned, by rough manual vibration and/or machine vibration mode thin slice can be put into it is each display in slot 2-1, it is thin at this time
Piece, which is generally multi-disc and is stacked in one, to be displayed in slot.Mobile carrying mechanism 1 or material tray, make the suction nozzle array of carrying mechanism 1
The thin slice of alignment material tray 2 displays array and close, (as a kind of embodiment of the invention, inhales by adsorption capacity for negative pressure
Attached power) by chip sorption in the suction nozzle array of carrying mechanism 1.Carrying mechanism 1 or assembly pallet 4 are continued to move to, carrying implement is made
The fitting opening array of the suction nozzle array alignment assembly pallet 4 of structure 1 and close to after set distance, releases the suction of carrying mechanism 1
Thin slice is installed in the fitting opening 4-1 of assembly pallet 4, to realize the final installation of thin slice by attached power.
As one embodiment of the present invention, the method also includes being installed to assembly support for thin slice in carrying mechanism 1
Before disk 4, the suction nozzle array of carrying mechanism 1 is first made to be directed at the absorption array of screening pallet 3；Chip sorption is set to be fixed on absorbing array
On column；Angle and the rate rotation that the rotating mechanism of pallet 3 is screened to set, fixed extra thin slice cannot be adsorbed by, which making, gets rid of
It falls；Backwardness is got rid of, then the thin slice adsorbed on pallet 3 will be screened using carrying mechanism 1 and be transported to assembly pallet 4, to realize thin slice
Final installation.
Mobile carrying mechanism 1 and/or screening pallet 3, so that the suction of the suction nozzle array alignment screening pallet 3 of carrying mechanism 1
Attached array and close to behind setting position, first opens the adsorption function of adsorbent equipment 3-1, turns off the adsorption function of suction nozzle 1-1,
It is transferred on screening pallet 3 so that the thin slice (each suction nozzle may be one or more pieces) being adsorbed on suction nozzle 1-1 is adsorbed.It is right
It is quickly rotated in the rotating mechanism 3-2 of the thin slice being adsorbed on screening pallet 3, screening pallet 3 (as of the invention one
Embodiment carries out 180 degree rotation), due to stopping the inertia generating again after the gravity of frivolous part itself and quick rotation, so that
The frivolous part of extra fitting, which is got rid of, to be fallen.Continue so that the suction nozzle array alignment of carrying mechanism 1 screens the absorption array of pallet 3 simultaneously
Close to after setting position, the adsorption function of adsorbent equipment 3-1 is first closed, then opens the adsorption function of suction nozzle 1-1, so that absorption
It is adsorbed and is transferred on carrying mechanism 1 in the thin slice (at this point, each suction nozzle be only adsorbed with a piece of) on adsorbent equipment 3-1.
As one embodiment of the present invention, the method also includes, first will rotation before the rotating mechanism 3-2 rotation
Rotation mechanism 3-2 is collapsible into screening pallet 3 to be rotated again, is fallen under screening pallet so that thin slice is got rid of to get rid of when falling
Rotational structure 3-2 after rotating mechanism stops rotating, then is restored to original position by side.
As one embodiment of the present invention, the method also includes adsorbing the suction nozzle on lamellated carrying mechanism 1
After array alignment and the close fitting opening array set distance on assembly pallet 4, the absorption function of fitting opening 4-1 is first opened
Can, the adsorption function of the suction nozzle 1-1 of carrying mechanism 1 is turned off, is transferred on assembly pallet 4 so that thin slice is adsorbed.As this
The embodiment of invention, after carrying mechanism 1 is directed at arrival setting position with assembly pallet 4, the decline of carrying mechanism 1 or assembly pallet
4 rise to pre-set assembly height, open the adsorption function of fitting opening, close the adsorption function of suction nozzle, thin slice dress
Enter to assemble in the part matched in pallet with thin slice, to realize that thin slice is loaded into assembly.
As one embodiment of the present invention, specific method step includes,
S11 judges whether to receive installation instruction, is then to enter in next step；
S12, control carrying mechanism 1 realize the absorption to thin slice on material tray 2；
The thin slice of absorption is transported to assembly pallet 4 by S13, control carrying mechanism 1.
Wherein, the method and step of the S12 includes,
S1201, control carrying mechanism 1 are moved to the position corresponding with material tray 2 of setting；
S1202 opens the adsorption function of carrying mechanism 1, will be in the chip sorption on material tray 2 to carrying mechanism 1.
The method and step of the S13 includes,
S1301, control carrying mechanism 1 are moved to the position corresponding with assembly pallet 4 of setting；
S1302 opens the adsorption function of assembly pallet 4；
S1303, closes the adsorption function of carrying mechanism 1, so that the thin slice of carrying mechanism be made to be adsorbed to assembly pallet 4
On.
As one embodiment of the present invention, specific method step includes,
S21 judges whether to receive installation instruction, is then to enter in next step；
S22, control carrying mechanism 1 realize the absorption to thin slice on material tray 2；
The thin slice alignment of absorption is placed on screening pallet 3 by S23, control carrying mechanism 1；
S24, control screening pallet 3, which gets rid of extra thin slice, to be fallen；
S25, control carrying mechanism 1 realize the absorption to the thin slice on screening pallet 3；
The thin slice of absorption is transported to assembly pallet 4 by S26, control carrying mechanism 1.
Wherein, the specific method step of the S23 includes,
S2301, control carrying mechanism 1 are moved to the position corresponding with assembly pallet 4 of setting；
S1302 opens the adsorption function of screening pallet 3；
S1303, closes the adsorption function of carrying mechanism 1, so that the thin slice of carrying mechanism be made to be adsorbed to screening pallet 3
On.
The specific method step of the S24 includes,
S2401, control are adsorbed lamellated absorption array and are collapsed into inside screening pallet；
S2402, selected angle, rate and duration rotation of the control absorption array to set, so that extra thin slice is got rid of
It falls；
S2403, after absorption array stops rotating, control absorption array restores the position to before collapsing into inside screening pallet
It sets.
The specific method step of the S25 includes,
S2501, control carrying mechanism 1 are moved to the position corresponding with screening pallet 3 of setting；
S2502 opens the adsorption function of carrying mechanism 1；
S2503 closes the adsorption function of screening pallet 3, will screen in the chip sorption to carrying mechanism 1 on pallet 3.
A kind of computer readable storage medium provided according to the present invention is stored on capable of being loaded and executed by processor
State the computer program of any method.
As shown in fig. 7, being the structural schematic diagram based on present invention diaphragm piece installation system in mobile lens industry.Using
The present invention program, solves laminar part small in size from picking up, transport defect to installation to target position low efficiency, high
Efficiency realizes installation process, and has antistatic absorption in process, prevents multi-disc from laminating the effect of generation.
Claims (10)
1. a kind of thin slice installation system, which is characterized in that including material tray, carrying mechanism and assembly pallet；
The material tray includes that thin slice displays array；The array of displaying includes that more than two thin slices display slot；
Groove shape and the size of displaying is matched with the thin slice, facilitates realization to the positioned in alignment for being put into thin slice therein；
The carrying mechanism includes suction nozzle array；The suction nozzle array includes more than two suction nozzles, with displaying for material tray
Array is corresponding, and thin slice can be displayed to the chip sorption in slot on suction nozzle；
The assembly pallet includes fitting opening array, including more than two fitting openings, the suction nozzle array with carrying mechanism
It is corresponding, carrying mechanism can be packed into and carry the thin slice to come.
2. installation system according to claim 1, which is characterized in that further include screening pallet；The screening pallet includes
Adsorb array；The absorption array includes more than two adsorbent equipments, corresponding with the suction nozzle array of carrying mechanism, can be sucked
And fixed carrying mechanism carries the thin slice to come；The screening pallet further includes rotating mechanism, can be with the angle and speed of setting
Rate rotation, it is impossible to adsorb fixed extra thin slice and get rid of and fall.
3. installation system according to claim 1 or 2, which is characterized in that the suction nozzle array of the carrying mechanism is negative pressure
Formula suction nozzle array, by way of negative pressure by chip sorption on suction nozzle.
4. installation system according to claim 1 or 2, which is characterized in that the carrying mechanism is provided with the first stepping dress
It sets, the vertical and horizontal movement of carrying mechanism can be controlled.
5. installation system according to claim 1 or 2, which is characterized in that be provided with adsorbing mechanism in the fitting opening；
The adsorbing mechanism, which can be sucked and fix carrying mechanism, carries the thin slice to come.
6. installation system according to claim 1 or 2, which is characterized in that the adsorbing mechanism is suction type adsorbing mechanism,
By way of negative pressure by chip sorption on adsorbing mechanism.
7. a kind of thin slice installation method is realized based on installation system described in one of claims 1 to 6, including,
Thin slice is put into material tray, makes to display in slot described in thin slice entrance by manual vibration and/or machine vibration；
Make carrying mechanism suction nozzle array be aligned material tray thin slice display array, by chip sorption carrying mechanism suction nozzle
In array；
So that the suction nozzle array of carrying mechanism is directed at the fitting opening array of assembly pallet, thin slice is installed to the assembly of assembly pallet
In opening, to realize the final installation of thin slice.
8. installation method according to claim 7, the method also includes being installed to assembly support for thin slice in carrying mechanism
Before disk, the suction nozzle array of carrying mechanism is first made to be directed at the absorption array of screening pallet；Chip sorption is set to be fixed on absorption array
On；Angle and the rate rotation that the rotating mechanism of pallet is screened to set, make that fixed extra thin slice cannot be adsorbed to get rid of and fall；It gets rid of
Fall behind, then assembly pallet is transported to for the thin slice adsorbed on pallet is screened using carrying mechanism, to realize the final installation of thin slice.
9. installation method according to claim 7 or 8, the method also includes adsorbing on lamellated carrying mechanism
After the alignment of suction nozzle array and the close fitting opening array set distance on assembly pallet, the absorption function of fitting opening is first opened
Can, the adsorption function of the suction nozzle of carrying mechanism is turned off, is transferred on assembly pallet so that thin slice is adsorbed.
10. a kind of computer readable storage medium, which is characterized in that simultaneously perform claim requirement can be loaded by processor by being stored with
The computer program of any method in 7 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910020717.5A CN109605281A (en) | 2019-01-09 | 2019-01-09 | A kind of thin slice installation system, installation method and computer readable storage medium |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910020717.5A CN109605281A (en) | 2019-01-09 | 2019-01-09 | A kind of thin slice installation system, installation method and computer readable storage medium |
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| CN109079045A (en) * | 2018-07-13 | 2018-12-25 | 广东天机工业智能系统有限公司 | Slicing apparatus |
| CN210549293U (en) * | 2019-01-09 | 2020-05-19 | 深圳市鑫鼎元光电有限公司 | Sheet mounting system |
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- 2019-01-09 CN CN201910020717.5A patent/CN109605281A/en active Pending
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|---|---|---|---|---|
| JP2000296488A (en) * | 1999-04-14 | 2000-10-24 | Maki Mfg Co Ltd | Suction device for taking out article |
| CN202979576U (en) * | 2011-01-28 | 2013-06-05 | 富士机械制造株式会社 | Part mounting machine |
| CN204666928U (en) * | 2015-06-03 | 2015-09-23 | 深圳市川禾田光电有限公司 | For the anti-dazzling screen loading pallet of mobile terminal camera lens batch assembling |
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