CN109594075A - 基于防腐功能的智能手机壳 - Google Patents
基于防腐功能的智能手机壳 Download PDFInfo
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Abstract
本申请涉及一种基于防腐功能的智能手机壳,该手机壳包括不锈钢层、设于不锈钢层表面的微纳结构层、及设于微纳结构层之上的表面层,该微纳结构层包括铜膜阵列层和SiO2层,该表面层为一种低表面能物质。
Description
技术领域
本申请涉及手机壳领域,尤其涉及一种基于防腐功能的智能手机壳。
背景技术
通讯产业是当今发展最为快速的产业之一,手机终端是当今的常用设备,在手机终端朝着更轻、更薄、更小的方向发展下,要求外壳具有更高强度、更好散热性、更好的防腐性、更好的电磁屏蔽性,传统的PC、ABS塑料已经很难满足要求,金属和合金因具有良好的电磁屏蔽效果,逐渐取代塑料外壳成为主要材料,然而,金属和合金面临的问题在于如何更好的防腐蚀。
发明内容
本发明旨在提供一种基于防腐功能的智能手机壳,能够使手机壳具有更好的防腐性能,以解决上述提出问题。
本发明的实施例中提供了一种基于防腐功能的智能手机壳,该手机壳包括不锈钢层、设于不锈钢层表面的微纳结构层、及设于微纳结构层之上的表面层;该微纳结构层包括铜膜阵列层和SiO2层;该表面层为一种低表面能物质。
本发明的实施例提供的技术方案可以包括以下有益效果:
本发明的手机壳包括不锈钢层、设于不锈钢层表面的微纳结构层、及设于微纳结构层之上的表面层,其中,该微纳结构层包括铜膜阵列层和SiO2层,在铜膜阵列表面设有氧化铜纳米线,铜膜阵列构成第一重微米尺度的粗糙结构,该SiO2层涂覆在铜膜阵列上,利用铜膜阵列的微米尺度,也能够表现为一种微米尺度的凸起阵列,整体上构成超疏水所需要的粗糙结构;此外,由于磁控溅射和电沉积,使得该铜膜阵列和SiO2层与不锈钢层之间、铜膜阵列与SiO2层之间结合紧密,不易脱落,其能隔绝氧气、腐蚀性液体等与不锈钢层的接触,起到防护的作用。
本申请附加的方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本申请的实践了解到。应当理解的是,以上的一般描述和后文的细节描述仅是示例性和解释性的,并不能限制本申请。
附图说明
利用附图对本发明作进一步说明,但附图中的实施例不构成对本发明的任何限制,对于本领域的普通技术人员,在不付出创造性劳动的前提下,还可以根据以下附图获得其它的附图。
图1是本发明手机壳的截面结构示意图。
具体实施方式
这里将详细地对示例性实施例进行说明,其示例表示在附图中。下面的描述涉及附图时,除非另有表示,不同附图中的相同数字表示相同或相似的要素。以下示例性实施例中所描述的实施方式并不代表与本发明相一致的所有实施方式。相反,它们仅是与如所附权利要求书中所详述的、本发明的一些方面相一致的装置和方法的例子。
本申请涉及一种基于防腐功能的智能手机壳,如图1所示,该手机壳包括不锈钢层4、微纳结构层5和表面层6。
金属涂层法是金属防腐蚀应用最广泛的手段之一,对金属采用涂层法进行防护,一般来说,该涂层包括预处理层和表面层,该涂层可以作为物理屏障,来阻挡或减缓水、氧气以及腐蚀性离子渗透到表面,位于金属涂层体系中间的预处理层,其作用在于与金属基底进行良好的结合,防止涂层起泡、剥离或脱落,对整个涂层体系的结合力好坏,起着至关重要的作用。
本申请的手机壳,在不锈钢层4上设有微纳结构层5和涂于微纳结构层5上的表面层6。该微纳结构层5设在不锈钢层4上,包括铜膜阵列层和SiO2层,其中,该铜膜阵列层为紫外光刻结合磁控溅射法制备,该SiO2层为电沉积法制备。
具体的,该铜膜阵列为微纳尺度的阵列,该阵列中单个点阵的长宽高尺度为40×30×2μm,每个点阵之间的上下、左右间隔分别为100μm、60μm;该SiO2层的厚度为5μm。
在该微纳结构层5中,铜膜阵列构成第一重微米尺度的粗糙结构,该SiO2层涂覆在铜膜阵列上,利用铜膜阵列的微米尺度,也能够表现为一种微米尺度的凸起阵列,整体上构成超疏水所需要的粗糙结构;此外,由于磁控溅射和电沉积,使得该铜膜阵列和SiO2层与不锈钢层之间、铜膜阵列与SiO2层之间结合紧密,不易脱落,其能隔绝氧气、腐蚀性液体等与不锈钢层的接触,起到防护的作用。
该表面层6设在SiO2层之上,为一种低表面能物质,其与该微纳结构层5一起构成一种具有超疏水效果的防护层。
在另一种优选地实施方式中,还可以在铜膜阵列表面生长氧化铜纳米线,由于氧化铜纳米线比表面积较大,增大了与SiO2层的结合力,从而大大提高了微纳结构层5与不锈钢层4的结合力。
优选地,该氧化铜纳米线的长度为3~5μm。
氧化铜纳米线具有优良的半导体性能,一般应用于场发射、气体传感器等领域,而本申请中,利用氧化铜纳米线与具有多孔结构的SiO2层构建了一种结合紧密的微纳结构,降低了微纳结构层的孔隙率,大大提高了防腐蚀效果。
实施例1
该手机壳的制备过程为:
步骤1,对不锈钢层进行砂纸打磨,然后将其在丙酮、乙醇、去离子水中超声清洗30min,在干燥箱中放置20h,备用;
步骤2,在不锈钢层表面涂覆一层光刻胶,烘干,经过曝光、显影,然后利用磁控溅射技术,在显影后的光刻胶表面蒸镀一层铜膜,厚度为1μm,然后利用丙酮将光刻胶洗掉,在不锈钢层表面形成了铜膜阵列;
步骤3,将50ml无水乙醇、50ml水、3ml正硅酸乙酯混合,然后用HCl调节pH至3.2左右,在室温下搅拌3h;得到SiO2前驱体溶液;
步骤4,在三电极槽中加入上步配好的前驱体溶液,以不锈钢层作为工作电极,Ag/AgCl作为参比电极,铂作为对电极,控制电位在-1.5V,沉积时间为300s,用去离子水冲洗后50℃烘干,得到SiO2层,铜膜阵列与SiO2层构成微纳结构层;
步骤5,将上述得到的覆盖有微纳结构层的不锈钢层放入1ml的十七氟癸脂三甲基色氨酸硅烷的甲苯溶液(5v%)中,密封,在80℃烘箱中保温5h,完成低表面能物质的修饰。
该手机壳的不锈钢层在经过上述的微纳结构层制备后,显示出微纳尺度的多孔性质,在此基础上涂覆有低表面能物质,疏水性良好,致密性好;使得该手机壳防护性能通过疏水性和耐腐蚀性表现。
对于该手机壳的疏水性,当SiO2层厚度不同时,表现不同的接触角,如下表:
SiO<sub>2</sub>层厚度/μm | 接触角/度 |
0 | 128 |
1 | 133 |
3 | 139 |
5 | 153 |
7 | 151 |
可以看到,当SiO2层厚度为5μm时,疏水效果最好,最大接触角为153度,表现良好的防腐蚀性能,防护能力强。
实施例2
该手机壳的制备过程为:
步骤1,对不锈钢层进行砂纸打磨,然后将其在丙酮、乙醇、去离子水中超声清洗30min,在干燥箱中放置20h,备用;
步骤2,在不锈钢层表面涂覆一层光刻胶,烘干,经过曝光、显影,然后利用磁控溅射技术,在显影后的光刻胶表面蒸镀一层铜膜,厚度为1μm,然后利用丙酮将光刻胶洗掉,在不锈钢层表面形成了铜膜阵列;
步骤3,将该不锈钢层放入管式炉中,在2h内升温到900℃,升温过程中,通入氩气作为保护气体,然后在900℃下保温5h,在保温过程中,通入氢气作为还原气体,然后将管式炉自然降温,在铜膜阵列表面生长有氧化铜纳米线,该氧化铜纳米线长度为3~5μm,直径为150nm。
步骤4,将50ml无水乙醇、50ml水、3ml正硅酸乙酯混合,然后用HCl调节pH至3.2左右,在室温下搅拌3h;得到SiO2前驱体溶液;
步骤5,在三电极槽中加入上步配好的前驱体溶液,以不锈钢层作为工作电极,Ag/AgCl作为参比电极,铂作为对电极,控制电位在-1.5V,沉积时间为300s,用去离子水冲洗后50℃烘干,得到SiO2层,铜膜阵列、氧化铜纳米线与SiO2层共同构成微纳结构层;
步骤6,将上述得到的覆盖有微纳结构层的不锈钢层放入1ml的十七氟癸脂三甲基色氨酸硅烷的甲苯溶液(5v%)中,密封,在80℃烘箱中保温5h,完成低表面能物质的修饰。
该手机壳的不锈钢层在经过上述的微纳结构层制备后,显示出微纳尺度的多孔性质,在此基础上涂覆有低表面能物质,疏水性良好,致密性好;使得该手机壳防护性能通过疏水性和耐腐蚀性表现。
对于该手机壳的疏水性,当SiO2层厚度不同时,表现不同的接触角,如下表:
SiO<sub>2</sub>层厚度/μm | 接触角/度 |
0 | 131 |
1 | 137 |
3 | 149 |
5 | 164 |
7 | 152 |
可以看到,当SiO2层厚度为5μm时,疏水效果最好,最大接触角为164度,表现良好的防腐蚀性能,防护能力强;并且,相较实施例1中没有氧化铜纳米线的情况下,该实施例中手机壳的最大接触角增大,疏水性增强。
以上所述仅为本发明的较佳方式,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (7)
1.一种基于防腐功能的智能手机壳,其特征在于,该手机壳包括不锈钢层、设于不锈钢层表面的微纳结构层、及设于微纳结构层之上的表面层;该微纳结构层包括铜膜阵列层和SiO2层;该表面层为一种低表面能物质。
2.根据权利要求1所述的手机壳,其特征在于,该铜膜阵列为微纳尺度的阵列,该阵列中单个点阵的长宽高尺度为40×30×2μm,每个点阵之间的上下、左右间隔分别为100μm、60μm。
3.根据权利要求2所述的手机壳,其特征在于,该SiO2层的厚度为5μm。
4.根据权利要求3所述的手机壳,其特征在于,
该手机壳的制备过程为:
步骤1,对不锈钢层进行砂纸打磨,然后将其在丙酮、乙醇、去离子水中超声清洗30min,在干燥箱中放置20h,备用;
步骤2,在不锈钢层表面涂覆一层光刻胶,烘干,经过曝光、显影,然后利用磁控溅射技术,在显影后的光刻胶表面蒸镀一层铜膜,厚度为1μm,然后利用丙酮将光刻胶洗掉,在不锈钢层表面形成了铜膜阵列;
步骤3,将50ml无水乙醇、50ml水、3ml正硅酸乙酯混合,然后用HCl调节pH至3.2左右,在室温下搅拌3h;得到SiO2前驱体溶液;
步骤4,在三电极槽中加入上步配好的前驱体溶液,以不锈钢层作为工作电极,Ag/AgCl作为参比电极,铂作为对电极,控制电位在-1.5V,沉积时间为300s,用去离子水冲洗后50℃烘干,得到SiO2层,铜膜阵列与SiO2层构成微纳结构层;
步骤5,将上述得到的覆盖有微纳结构层的不锈钢层放入1ml的十七氟癸脂三甲基色氨酸硅烷的甲苯溶液(5v%)中,密封,在80℃烘箱中保温5h,完成低表面能物质的修饰。
5.根据权利要求1所述的手机壳,其特征在于,在该铜膜阵列上生长有氧化铜纳米线。
6.根据权利要求5所述的手机壳,其特征在于,该氧化铜纳米线的长度为3~5μm。
7.根据权利要求6所述的手机壳,其特征在于,
该手机壳的制备过程为:
步骤1,对不锈钢层进行砂纸打磨,然后将其在丙酮、乙醇、去离子水中超声清洗30min,在干燥箱中放置20h,备用;
步骤2,在不锈钢层表面涂覆一层光刻胶,烘干,经过曝光、显影,然后利用磁控溅射技术,在显影后的光刻胶表面蒸镀一层铜膜,厚度为1μm,然后利用丙酮将光刻胶洗掉,在不锈钢层表面形成了铜膜阵列;
步骤3,
将该不锈钢层放入管式炉中,在2h内升温到900℃,升温过程中,通入氩气作为保护气体,然后在900℃下保温5h,在保温过程中,通入氢气作为还原气体,然后将管式炉自然降温,在铜膜阵列表面生长有氧化铜纳米线,该氧化铜纳米线长度为3~5μm,直径为150nm。
步骤4,将50ml无水乙醇、50ml水、3ml正硅酸乙酯混合,然后用HCl调节pH至3.2左右,在室温下搅拌3h;得到SiO2前驱体溶液;
步骤5,在三电极槽中加入上步配好的前驱体溶液,以不锈钢层作为工作电极,Ag/AgCl作为参比电极,铂作为对电极,控制电位在-1.5V,沉积时间为300s,用去离子水冲洗后50℃烘干,得到SiO2层,铜膜阵列、氧化铜纳米线与SiO2层共同构成微纳结构层;
步骤6,将上述得到的覆盖有微纳结构层的不锈钢层放入1ml的十七氟癸脂三甲基色氨酸硅烷的甲苯溶液(5v%)中,密封,在80℃烘箱中保温5h,完成低表面能物质的修饰。
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