CN109587943A - Zero anchoring wire of differential lines spreads cabling circuit board and electronic device altogether - Google Patents

Zero anchoring wire of differential lines spreads cabling circuit board and electronic device altogether Download PDF

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Publication number
CN109587943A
CN109587943A CN201811328357.7A CN201811328357A CN109587943A CN 109587943 A CN109587943 A CN 109587943A CN 201811328357 A CN201811328357 A CN 201811328357A CN 109587943 A CN109587943 A CN 109587943A
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CN
China
Prior art keywords
pad
pads
circuit board
cabling
spreads
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Pending
Application number
CN201811328357.7A
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Chinese (zh)
Inventor
李靖
封晨霞
陈亮
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Celestica Technology Consultancy Shanghai Co Ltd
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Celestica Technology Consultancy Shanghai Co Ltd
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Priority to CN201811328357.7A priority Critical patent/CN109587943A/en
Publication of CN109587943A publication Critical patent/CN109587943A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/11Printed elements for providing electric connections to or between printed circuits
    • H05K1/111Pads for surface mounting, e.g. lay-out

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The present invention provides a kind of zero anchoring wire of differential lines and spreads cabling circuit board and electronic device altogether, and it includes the first pad module and the second pad module that zero anchoring wire of differential lines spreads cabling circuit board altogether;Wherein, the first pad module and the second pad module are each configured with different bond pad arrangement and Routing models;By changing the pad mounted in the first pad module and the second pad module, different communicating passages is realized.The present invention is on same PCB, by selecting in different location Mount Device, realize the connection in different channels, to obtain different function, it avoids and designs and make different PCB for each application scenarios, the cost of cost PCB cost and MUX device can be reduced with this to avoid using MUX device to come selection signal path simultaneously.

Description

Zero anchoring wire of differential lines spreads cabling circuit board and electronic device altogether
Technical field
The present invention relates to electronic circuit technology fields, more particularly to circuit board trace technical field, specially a kind of difference Zero anchoring wire of separated time spreads cabling circuit board and electronic device altogether.
Background technique
Being routed (Layout) is most basic one of the workmanship of PCB Designer.In PCB design, wiring has been At the important step of product design, the quality of PCB trace directly affects the performance of whole system, is routed in high-speed PCB It is vital.The design process of wiring limits high, and skill is thin, heavy workload.PCB layout has single side wiring, double-sided wiring And multilayer wiring.
The design process of pcb board is a complicated process, and pcb board cabling mainly includes right angle cabling, difference cabling, snake Shape line etc..
Right angle cabling is usually that the case where avoiding as far as possible is required in PCB layout, also almost becomes the mark for measuring wiring quality One of standard, then right angle cabling can transmit signal and generate great influence actually? from the principle, right angle cabling can make to pass The line width of defeated line changes, and causes the discontinuous of impedance.It is not only right angle cabling in fact, angle, acute angle cabling all may The case where causing impedance variations.
Differential signal (Differential Signal) in High-speed Board Design using more and more extensive, so-called difference Sub-signal generally exactly drives end to send the signal of two equivalences, reverse phase, receiving end is by comparing the two voltages Difference comes decision logic state " 0 " still " 1 ".And that a pair of of the cabling for carrying differential signal is known as difference cabling.Difference letter It number is compared with common single-ended signal cabling, most apparent advantage is embodied in following three aspects:
1) strong antijamming capability, it is several when the external world is there are when noise jamming because the coupling between two difference cablings is fine It is the difference for only two signals being coupled in two lines simultaneously, and receiving end is concerned about, so extraneous common-mode noise can To be cancelled completely.
2) EMI can effectively be inhibited, same reason, since the polarity of two signals is on the contrary, their electromagnetism to external radiation Can cancel out each other, coupling it is closer, it is fewer to be released to extraneous electromagnetic energy.
3) timing registration, since the switch change of differential signal is the intersection point positioned at two signals, rather than common For single-ended signal by two threshold voltage judgements of height, thus by technique, the influence of temperature is small, can reduce the error in timing, It is also more suited for the circuit of low amplitude signal simultaneously.Currently a popular LVDS (low voltage differential Signaling) just refer to this small amplitude difference signal technique.
Serpentine is a kind of cabling mode being commonly used in Layout.Main purpose is exactly in order to adjust delay, completely The requirement of pedal system timing Design.
Currently, the design of each application scenarios needs to make different PCB, pcb board how is improved to different application scene Applicability becomes those skilled in the art's technical problem urgently to be resolved.
Summary of the invention
In view of the foregoing deficiencies of prior art, it altogether spreads the purpose of the present invention is to provide a kind of zero anchoring wire of differential lines Line circuit board and electronic device require to make different pcb boards for solving application scenarios design in the prior art, and pcb board is logical With the problem of property difference.
In order to achieve the above objects and other related objects, the embodiment of the present invention provides a kind of zero anchoring wire of differential lines and spreads altogether Line circuit board, it includes the first pad module and the second pad module that zero anchoring wire of differential lines spreads cabling circuit board altogether;Wherein, institute It states the first pad module and the second pad module is each configured with different bond pad arrangement and Routing models;By changing described the The pad mounted in one pad module and the second pad module, realizes different communicating passages.
In one embodiment of the invention, the bond pad arrangement and Routing models include dual channel mode, the binary channels Mode includes: six pads, horizontally arranged in two rows, and there are three pads by each row;Two via holes are located among two rows of pads, Wherein, the centrally located pad of each row connects via hole by cabling;By choose respectively in same row with middle position The pad that mutually mounts of pad, realize two different channels connections.
In one embodiment of the invention, in addition to the pad in each row middle position, between each pad and adjacent pad Spacing it is isometric.
In one embodiment of the invention, the bond pad arrangement and Routing models include triple channel mode, the triple channel Mode includes: eight pads, wherein four pads, in being vertically arranged, four additional pad, which is square, to be arranged and be located in vertical row The left and right sides of four pads of column;Two via holes, positioned at the middle part of eight pads, respectively be located in the middle two pads and walk Line connection;By choosing the weldering that the nearest pad for being connected with via hole mutually mounts from three pads above with following three pads respectively Disk realizes three different channel connections.
In one embodiment of the invention, superposed four pads and positioned at lower part four pads formed each four The angle of side shape is 90 °.
In one embodiment of the invention, superposed four pads and positioned at lower part four pads formed each four Two relative angles of side shape are 60 °, other two relative angle is 120 °.
In one embodiment of the invention, the bond pad arrangement and Routing models include four-way mode, the four-way Mode includes: 10 pads, and two of them pad is in being vertically arranged, and in addition 8 pads are evenly distributed in vertical row in a ring The surrounding of two pads of column;Two via holes, positioned between two pads being vertically arranged and in horizontally arranged, respectively be in The two pad cablings connection being vertically arranged;By choosing nearest be connected with from four pads above and following four pad respectively The pad that the pad of via hole mutually mounts realizes four different channel connections.
In one embodiment of the invention, the spacing in superposed five pads between two neighboring pad is equal; Spacing between two neighboring pad in five pads of lower part is equal.
In one embodiment of the invention, the bond pad arrangement and Routing models include at least Five-channel mode, it is described extremely Few Five-channel mode includes: 10 pads, two of them pad in being vertically arranged, in addition 8 pads in a ring it is evenly distributed in In the surrounding for two pads being vertically arranged;Two via holes are located on two pads being vertically arranged;By respectively from The pad of the upper surface of upper surface of cabling circuit board four is chosen the nearest pad equipped with via hole with following four pad and is mutually mounted Pad, realize four different channels connections;By respectively from the pad of the upper surface of lower surface of cabling circuit board four under Four, face pad chooses the pad that the nearest pad equipped with via hole mutually mounts, and realizes the different channel connection of four additional;It is logical Four for crossing four different channel connections of the upper surface from cabling circuit board and the lower surface of at least one cabling circuit board Five to eight different channel connections are realized in the selection of different channel connections.
The embodiment of the present invention also provides a kind of electronic device, and the electronic device includes: differential lines zero as described above Anchoring wire spreads cabling circuit board altogether.
As described above, zero anchoring wire of differential lines of the invention spreads cabling circuit board and electronic device altogether to be had below beneficial to effect Fruit:
The present invention realizes the connection in different channels in different location Mount Device on same PCB, by selecting, from And different function is obtained, it avoids and is designed for each application scenarios and make different PCB, while can be to avoid using MUX device Part comes selection signal path, and the cost of cost PCB cost and MUX device is reduced with this.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other Attached drawing.
Fig. 1 is shown as the whole schematic illustration that zero anchoring wire of differential lines of the invention spreads cabling circuit board altogether.
Zero anchoring wire of differential lines that Fig. 2 is shown as of the invention spreads dual channel mode bond pad arrangement and cabling in cabling circuit board altogether Schematic illustration.
Zero anchoring wire of differential lines that Fig. 3 is shown as of the invention spreads dual channel mode bond pad arrangement and cabling in cabling circuit board altogether Practical cabling schematic diagram.
Zero anchoring wire of differential lines that Fig. 4 is shown as of the invention spreads triple channel mode bond pad arrangement and cabling in cabling circuit board altogether Schematic illustration.
Zero anchoring wire of differential lines that Fig. 5 is shown as of the invention spreads four-way mode bond pad arrangement and cabling in cabling circuit board altogether Schematic illustration.
Fig. 6 be shown as zero anchoring wire of differential lines of the invention spread in cabling circuit board altogether at least Five-channel mode bond pad arrangement and The schematic illustration of cabling.
Fig. 7 is shown as zero anchoring wire of differential lines of the invention and spreads altogether to configure different bond pad arrangement and cabling in cabling circuit board The schematic diagram of mode.
Fig. 8 is shown as zero anchoring wire of differential lines of the invention and spreads altogether to configure different bond pad arrangement and cabling in cabling circuit board The practical wiring exemplary diagram of mode.
Fig. 9 is shown as zero anchoring wire of differential lines of the invention and spreads altogether to configure different bond pad arrangement and cabling in cabling circuit board Another exemplary diagram of mode.
Component label instructions
100 differential lines, zero anchoring wire spreads cabling circuit board altogether
110 first pad modules
120 second pad modules
130 pads
140 via holes
150 Mount Devices
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from Various modifications or alterations are carried out under spirit of the invention.It should be noted that in the absence of conflict, following embodiment and implementation Feature in example can be combined with each other.
Fig. 1 is please referred to Fig. 9.It should be clear that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to Cooperate the revealed content of specification, so that those skilled in the art understands and reads, being not intended to limit the invention can be real The qualifications applied, therefore do not have technical essential meaning, the tune of the modification of any structure, the change of proportionate relationship or size It is whole, in the case where not influencing the effect of present invention can be generated and the purpose that can reach, it should all still fall in disclosed skill Art content obtains in the range of capable of covering.Meanwhile in this specification it is cited as "upper", "lower", "left", "right", " centre " and The term of " one " etc. is merely convenient to being illustrated for narration, rather than to limit the scope of the invention, relativeness It is altered or modified, under the content of no substantial changes in technology, when being also considered as the enforceable scope of the present invention.
The purpose of the present embodiment is that provide a kind of zero anchoring wire of differential lines spreads cabling circuit board and electronic device altogether, for solving The problem of certainly application scenarios design and require to make different pcb boards in the prior art, pcb board poor universality.
Zero anchoring wire of differential lines of the invention described in detail below spreads the principle and reality of cabling circuit board and electronic device altogether Mode is applied, so that those skilled in the art is not needed creative work and is appreciated that zero anchoring wire of differential lines of the invention spreads cabling electricity altogether Road plate and electronic device.
As shown in Figure 1, the embodiment of the present invention provides a kind of zero anchoring wire of differential lines spreads cabling circuit board 100, the difference altogether It includes the first pad module 110 and the second pad module 120 that zero anchoring wire of separated time spreads cabling circuit board 100 altogether;Wherein, described first Pad module 110 and the second pad module 120 are each configured with the different arrangement of pad 130 and Routing models;By changing institute The pad 130 mounted in the first pad module 110 and the second pad module 120 is stated, realizes different communicating passages.
In this present embodiment, the arrangement of pad 130 and Routing models include dual channel mode, triple channel mode, four-way mould Formula, and at least Five-channel mode choose any both of which assignment configuration in the first pad module 110 and the second pad Module 120 realizes the connection in different channels in different location Mount Device 150 by selecting on same PCB, thus To different function.It avoids and designs and make different PCB for each application scenarios.Simultaneously can to avoid use MUX device come Selection signal path reduces the cost of cost PCB cost and MUX device with this.
Wherein, Mount Device 150 is but is not limited to capacitor or resistance between two pads.
Below to the dual channel mode of the present embodiment, triple channel mode, four-way mode, and at least Five-channel mode into The detailed specific description of row.
In this present embodiment, the arrangement of pad 130 and Routing models include dual channel mode, as shown in Fig. 2, described double Channel pattern includes: six pads 130, horizontally arranged in two rows, and there are three pads 130 by each row;Two via holes 140, are located at Among two rows of pads 130, wherein the centrally located pad 130 of each row connects via hole 140 by cabling;Pass through difference The pad 130 in same row with the attachment of 130 phase of pad in middle position is chosen, realizes two different channel connections.
Wherein, the spacing etc. in addition to the pad 130 in each row middle position, between each pad 130 and adjacent pad 130 It is long.
That is, other than the spacing of intermediate two pads 130, between pad 130 and nearest pad 130 between Away from must it is isometric, with guarantee welding capacitor or resistance flexibility.
As shown in Fig. 2, six pads 130 (pad a, pad b, pad c, pad d, pad e, pad f), pad a, pads B, pad c, pad d, pad e, pad f is horizontally arranged in two rows, for example, mono- row of pad a, pad c, pad d, pad b, pad E, one row of pad, the centrally located pad of each row: pad a connects via hole 140 by cabling with pad b, in pad c, The pad mounted with pad a phase is chosen in pad d, exports differential signal all the way, selection and pad b phase in pad d, pad e Mounted pad exports another way differential signal, realizes two different channel connections.Wherein, it can only realize that one leads to every time The connection in road.
For example, as shown in Figures 2 and 3, pad a and pad d attachment, pad b and pad d are mounted, the difference to the direction B is formed Separated time signal spreads the channel connection of cabling mode, the influence without anchoring wire (stub) to high-speed-differential line signal integrity altogether.
In this present embodiment, the arrangement of pad 130 and Routing models include triple channel mode, as shown in figure 4, described three Channel pattern includes:
Eight pads 130, wherein four pads 130, in being vertically arranged, four additional pad 130, which is square, to be arranged and be located at In the left and right sides for four pads 130 being vertically arranged, i.e. four intermediate 130 vertical alignments of pad, four pads 130 in left and right Horizontal alignment two-by-two.
Two via holes 140, positioned at the middle part of eight pads 130, respectively be located in the middle two 130 cablings of pad and connect It connects;By the way that nearest 130 phase of pad for being connected with via hole 140 is chosen from three pads 130 above and following three pads 130 respectively Mounted pad 130 realizes three different channel connections.
In this present embodiment, each four side that superposed four pads 130 and four pads 130 positioned at lower part are formed The angle of shape is 90 °.Or each four side that superposed four pads 130 and four pads 130 positioned at lower part are formed Two relative angles of shape are 60 °, other two relative angle is 120 °.
As shown in figure 4, eight pads 130: pad a, pad b, pad c, pad d, pad e, pad f, pad g, pad H, wherein pad a, pad b, in being vertically arranged, pad e, pad g, pad f, pad h are square arrangement simultaneously by pad c, pad d Positioned in the pad a, pad b, pad c that are vertically arranged, the left and right sides of pad d, pad e and pad g are vertically aligned, pad f It is vertically aligned with disk h, pad e and pad horizontal alignment, pad g and disk h horizontal alignment.It is located in the middle two pads: pad B, pad c are connect with two 140 cablings of via hole.The pad mounted with pad b phase is chosen from pad a, pad e, pad f, it is defeated Differential signal, the pad that selection is mounted with pad c phase from pad g, pad d, pad h, output another way difference are believed all the way out Number, the differential lines signal for forming a direction spreads the channel of cabling mode altogether.
Under the triple channel mode, dividing for no primary and secondary channel can be interconnected arbitrarily, to realize two main channels simultaneously By the demand without interference, and the mode of cabling will not change, only capacitor or the resistance arrangement mode of change, to realize Reduce the demand of cost, the also influence without anchoring wire (stub) to high-speed-differential line signal integrity.
In this present embodiment, as shown in figure 5, the pad 130 arrangement and Routing models include four-way mode, described four Channel pattern includes: 10 pads 130, and two of them pad 130 is in being vertically arranged, and in addition 8 pads 130 are uniformly arranged in a ring It is listed in the surrounding in two pads 130 being vertically arranged;Two via holes 140, positioned between two pads 130 being vertically arranged And in horizontally arranged, it is connect respectively in two 130 cablings of pad being vertically arranged;By respectively from four pads 130 above Choose the pad 130 that the nearest pad 130 for being connected with via hole 140 mutually mounts with following four pad 130, realize four it is different Channel connection.
As shown in figure 5, the four-way mode includes pad a, pad b, pad c, pad d, pad e, pad f, pad G, pad h, pad i, pad j;Wherein, pad a and pad b is in and is vertically arranged, pad c, pad d, pad e, pad f, pad G, pad h, pad i, pad j are evenly distributed in the surrounding in the pad a and pad b being vertically arranged in a ring.
In this present embodiment, the spacing in superposed five pads 130 between two neighboring pad 130 is equal;Position Spacing in five pads 130 of lower part between two neighboring pad 130 is equal, to guarantee that capacitor can be welded between any two Or resistance.Intermediate a pair of of via hole 140 is main channel, other cablings and via hole 140 can be according to circumstances arranged.
Five pads 130 on top: pad a, pad f, pad c, pad d, in pad, the adjacent pad of any two it Between spacing it is equal, i.e. between spacing, pad a between pad a and pad f and the spacing between pad c, pad a and pad e Spacing, the spacing between pad a and pad d, the spacing between pad d and pad c, the spacing between pad d and pad e, Spacing between pad e and pad f does not include the spacing between spacing, pad e and the pad c between pad d and pad f, because It is not belonging to for pad d and pad f, pad e and pad c adjacent defined in the present embodiment.
Pad a connects via hole 140 with pad b difference cabling, chooses and welds from pad c, pad d, pad e and pad f The pad that disk a phase mounts, differential signal is chosen in pad j and is mounted with pad b phase from pad g, pad h, pad i all the way for output Pad, export another way differential signal, the differential lines signal for forming a direction spreads the channel of cabling mode altogether, without anchoring wire (stub) to the influence of high-speed-differential line signal integrity.
In this present embodiment, as shown in fig. 6, the arrangement of the pad 130 and Routing models include at least Five-channel mode, institute Stating at least Five-channel mode includes: 10 pads 130, and two of them pad 130 is in being vertically arranged, and in addition 8 pads 130 are in ring Shape is evenly distributed in the surrounding in two pads 130 being vertically arranged;Two via holes 140 are located in two be vertically arranged On a pad 130;By being selected respectively from the pad 130 of the upper surface of upper surface of cabling circuit board four and following four pad 130 The pad 130 for taking nearest 130 phase of the pad attachment equipped with via hole 140 realizes four different channel connections;By respectively from The pad 130 of the upper surface of lower surface of cabling circuit board four and following four pad 130 choose the nearest weldering equipped with via hole 140 The pad 130 of 130 phase of disk attachment realizes the different channel connection of four additional;By from the four of the upper surface of cabling circuit board A different channel is connected to the selection being connected to four different channels of the lower surface of at least one cabling circuit board, realizes five It is connected to eight different channels.
As shown in figure 5, at least Five-channel mode includes pad a, pad b, pad c, pad d, pad e, pad f, Pad g, pad h, pad i, pad j;Wherein, pad a and pad b is in and is vertically arranged, pad c, pad d, pad e, pad f, Pad g, pad h, pad i, pad j are evenly distributed in the surrounding in the pad a and pad b being vertically arranged in a ring.
Arranged with the pad 130 of above-mentioned four-way mode identical, difference is, two via holes 140 are respectively arranged at pad a On pad b, the technique for needing to be got on pad 130 (via in pad) with via hole 140, PCB circuit board upper surface realizes four A different channel connection, lower surface are the different channels connection of isostructural realization four, are combined and at most realize eight Different channel connections.What intermediate a pair of of via hole 140 connected is similarly main channel.
In addition, two via holes 140 are respectively arranged on pad a and pad b, anchoring wire (stub) only exists via hole 140 (via) on, the influence by anchoring wire to signal falls below minimum.
Zero anchoring wire of differential lines spreads the first pad module 110 and the second weldering of cabling circuit board 100 altogether in the present embodiment Disk module 120 is each configured with the above-mentioned several different arrangements of pad 130 and Routing models;By changing the first pad mould The pad 130 mounted in block 110 and the second pad module 120, realizes different communicating passages.
As shown in Figure 7 to 9, be shown as zero anchoring wire of differential lines in the present embodiment spread altogether cabling circuit board 100 application show Example.
As shown in Figure 7 and Figure 8, dual channel mode and the arrangement of the pad of triple channel mode 130 and cabling are set to same On circuit board, for example, the first pad module 110 configuration dual channel mode pad 130 arrangement and cabling, second pad The arrangement of triple channel mode pad 130 and cabling are configured in module 120.According to mounted pad 130, realize the interconnection of A to B, C and Interconnection between D.Wherein, A, B, C, D are the devices such as chip or connector.
In addition, as shown in figure 9, the first pad module 110 and the second pad module 120 also may be implemented to interconnect, i.e., It can also be interconnected between the different arrangements of pad 130 and cabling, as shown in Figure 9, realize the interconnection of A to D, the interconnection of C and E. Wherein, A, B, C, D, E are the devices such as chip or connector.
The embodiment of the present invention also provides a kind of electronic device, and the electronic device includes: differential lines zero as described above Anchoring wire spreads cabling circuit board 100100 altogether.It is above-mentioned that the progress of cabling circuit board 100100 is spread altogether to zero anchoring wire of differential lines It is described in detail, details are not described herein.
In this present embodiment, the controller 200 is but is not limited to central controller (CPU), single-chip microcontroller or MCU etc..
In conclusion the present invention on same PCB, by selection in different location Mount Device 150, realizes different logical The connection in road avoids to obtain different function and designs for each application scenarios and make different PCB, while can keep away Exempt to come selection signal path using MUX device, the cost of cost PCB cost and MUX device is reduced with this.So the present invention has Effect overcomes various shortcoming in the prior art and has high industrial utilization value.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause This, includes that institute is complete without departing from the spirit and technical ideas disclosed in the present invention for usual skill in technical field such as At all equivalent modifications or change, should be covered by the claims of the present invention.

Claims (10)

1. a kind of zero anchoring wire of differential lines spreads cabling circuit board altogether, which is characterized in that zero anchoring wire of differential lines spreads cabling circuit altogether Plate includes the first pad module and the second pad module;
Wherein, the first pad module and the second pad module are each configured with different bond pad arrangement and Routing models;
By changing the pad mounted in the first pad module and the second pad module, different communicating passages is realized.
2. zero anchoring wire of differential lines according to claim 1 spreads cabling circuit board altogether, which is characterized in that the bond pad arrangement and Routing models include dual channel mode, and the dual channel mode includes:
Six pads, horizontally arranged in two rows, there are three pads by each row;
Two via holes are located among two rows of pads, wherein the centrally located pad of each row connects via hole by cabling;
By choosing the pad mutually mounted in same row with the pad in middle position respectively, two different channel connections are realized.
3. zero anchoring wire of differential lines according to claim 2 spreads cabling circuit board altogether, which is characterized in that remove each row's interposition Except the pad set, the spacing between each pad and adjacent pad is isometric.
4. zero anchoring wire of differential lines according to claim 1 spreads cabling circuit board altogether, which is characterized in that the bond pad arrangement and Routing models include triple channel mode, and the triple channel mode includes:
Eight pads, wherein four pads are in being vertically arranged, it is in be vertically arranged that four additional pad, which is square and arranges and be located at, The left and right sides of four pads;
Two via holes, positioned at the middle part of eight pads, respectively be located in the middle two pad cablings and connect;
By choosing the pad that the nearest pad for being connected with via hole mutually mounts from three pads above with following three pads respectively, Realize three different channel connections.
5. zero anchoring wire of differential lines according to claim 4 spreads cabling circuit board altogether, which is characterized in that superposed four The angle of pad and each quadrangle positioned at four pads formation of lower part is 90 °.
6. zero anchoring wire of differential lines according to claim 4 spreads cabling circuit board altogether, which is characterized in that superposed four Two relative angles of pad and each quadrangle positioned at four pads formation of lower part are 60 °, other two relative angle is 120°。
7. zero anchoring wire of differential lines according to claim 1 spreads cabling circuit board altogether, which is characterized in that the bond pad arrangement and Routing models include four-way mode, and the four-way mode includes:
10 pads, two of them pad is in being vertically arranged, and in addition 8 pads are evenly distributed in two be vertically arranged in a ring The surrounding of a pad;
Two via holes respectively and are in two be vertically arranged positioned at being between two pads being vertically arranged and being in horizontally arranged The connection of pad cabling;
By choosing the pad that the nearest pad for being connected with via hole mutually mounts from four pads above with following four pad respectively, Realize four different channel connections.
8. zero anchoring wire of differential lines according to claim 8 spreads cabling circuit board altogether, which is characterized in that superposed five Spacing in pad between two neighboring pad is equal;Spacing phase between two neighboring pad in five pads of lower part Deng.
9. zero anchoring wire of differential lines according to claim 7 or 8 spreads cabling circuit board altogether, which is characterized in that the pad row Column and Routing models include that at least Five-channel mode, at least Five-channel mode includes:
10 pads, two of them pad is in being vertically arranged, and in addition 8 pads are evenly distributed in two be vertically arranged in a ring The surrounding of a pad;
Two via holes are located on two pads being vertically arranged;
By choosing nearest be equipped with from the pad of the upper surface of upper surface of cabling circuit board four and following four pad respectively The pad that the pad in hole mutually mounts realizes four different channel connections;By respectively from the upper of the lower surface of cabling circuit board Four, face pad chooses the pad that the nearest pad equipped with via hole mutually mounts with following four pad, realizes that four additional is different Channel connection;Pass through the different channel connection of four from the upper surface of cabling circuit board and at least one cabling circuit board Five to eight different channel connections are realized in the selection of the different channel connection of four of lower surface.
10. a kind of electronic device, which is characterized in that the electronic device includes: such as claim 1 to any power of claim 9 Benefit requires zero anchoring wire of differential lines to spread cabling circuit board altogether.
CN201811328357.7A 2018-11-09 2018-11-09 Zero anchoring wire of differential lines spreads cabling circuit board and electronic device altogether Pending CN109587943A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111465214A (en) * 2020-04-26 2020-07-28 杭州迪普科技股份有限公司 Printed circuit board
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CN113365410A (en) * 2020-03-02 2021-09-07 浙江宇视科技有限公司 Printed circuit board and electronic device
CN115775791A (en) * 2022-11-25 2023-03-10 北京斯年智驾科技有限公司 Chip interconnection structure of high-speed circuit

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CN113365410A (en) * 2020-03-02 2021-09-07 浙江宇视科技有限公司 Printed circuit board and electronic device
CN111465214A (en) * 2020-04-26 2020-07-28 杭州迪普科技股份有限公司 Printed circuit board
CN111465214B (en) * 2020-04-26 2021-08-24 杭州迪普科技股份有限公司 Printed circuit board
CN112804813A (en) * 2020-12-31 2021-05-14 西安易朴通讯技术有限公司 High-speed signal routing structure and server
CN112804813B (en) * 2020-12-31 2022-03-01 西安易朴通讯技术有限公司 High-speed signal routing structure and server
CN115775791A (en) * 2022-11-25 2023-03-10 北京斯年智驾科技有限公司 Chip interconnection structure of high-speed circuit
CN115775791B (en) * 2022-11-25 2023-08-11 北京斯年智驾科技有限公司 Chip interconnection structure of high-speed circuit

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