CN106455306A - Pad shared structure, PCB (printed circuit board) and mobile terminal - Google Patents
Pad shared structure, PCB (printed circuit board) and mobile terminal Download PDFInfo
- Publication number
- CN106455306A CN106455306A CN201611095643.4A CN201611095643A CN106455306A CN 106455306 A CN106455306 A CN 106455306A CN 201611095643 A CN201611095643 A CN 201611095643A CN 106455306 A CN106455306 A CN 106455306A
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- Prior art keywords
- pad
- shared
- common
- mobile terminal
- pads
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/029—Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
Abstract
The invention discloses a pad shared structure. The pad shared structure comprises a shared pad and a plurality of unshared pads different in parameter, and the unshared pads are distributed around the shared pad so as to mount different components on the shared pad and the different unshared pads. The pad shared structure has the advantages that connection between the shared pad and the unshared pads is not needed, and redundant printed conductors are omitted, so that antenna effect can be avoided and the circuit performance is ensured; multiple pads identical in performance are arranged as one shared pad, so that the space of a PCB (printed circuit board) can be saved and use ratio of the PCB is increased. The invention further discloses the PCB and a mobile terminal.
Description
Technical field
The present invention relates to pad structure technical field, more particularly to a kind of pad sharing structure, pcb board and movement are eventually
End.
Background technology
With the development of electronic information, the use of pcb board is more and more extensive, and all kinds of components and parts on pcb board mainly pass through
The mode of pad solder is fixedly mounted on pcb board.The Copper Foil of fairlead and surrounding on pcb board is referred to as pad.First device
Part pin passes through fairlead, is weldingly fixed on pcb board with scolding tin, by printed conductor, the Copper Foil of pad is coupled together, i.e.,
The electrical connection of components and parts on pcb board is completed, realizes the function of pcb board.Generally in circuit, wire is equal to a certain extent
In antenna, current on the market pcb board pad arrangement is unreasonable to cause printed conductor elongated, produce antenna effect, impact electricity
Road performance.
Content of the invention
Present invention is primarily targeted at providing a kind of pad sharing structure, pcb board and mobile terminal, it is intended to solve existing
There is the problem of longer printed conductor impact circuit performance in technology.
For achieving the above object, the pad sharing structure that the present invention is provided includes to share pad and the weldering of multiple non-common
Disk, the parameter of multiple non-common pads is differed, and multiple non-common pads are distributed centered on the shared pad, with reality
Installation of the existing difference components and parts on shared pad and different non-common pads.
Preferably, the shared pad is that high-pressure side, multiple non-common pads are the low-pressure end of different magnitudes of voltage.
Preferably, the quantity of the non-common pad is two.
Preferably, described two non-common pads are located at the opposite end for sharing pad, and the line of its central point respectively
Through sharing the central point of pad.
Preferably, described two non-common pads are located at the vertical two ends for sharing pad, one of non-common weldering respectively
The line of the central point of disk and shared pad center point is perpendicular to central point and the shared pad center of another non-common pad
The line of point.
Preferably, around the shared pad and multiple non-common pads, silk-screen is provided with.
Preferably, the spacing between the shared pad and multiple non-common pads is equal and equivalently-sized.
Preferably, the shared pad and multiple non-common pads are circular or square.
The present invention also provides a kind of pcb board, including the pad sharing structure described in any of the above-described.
The present invention also provides a kind of mobile terminal, including pcb board described above.
In technical solution of the present invention, the pad sharing structure includes to share pad and multiple non-common pads, multiple
The parameter of non-common pad is differed, and multiple non-common pads are distributed centered on the shared pad.The present invention passes through
Multiple for performance identical pads are set to a shared pad, and the non-common pad of different parameters is arranged on shared pad
Around, when components and parts are installed, it is only necessary to by a pin of components and parts through the fairlead for sharing pad, another pin
Fairlead through pad corresponding with its parameter, you can realize the installation of the components and parts.Shared pad and the weldering of multiple non-common
Need not connect between disk, there is no unnecessary printed conductor, antenna effect can be avoided, it is ensured that circuit performance.While performance phase
Same multiple pads are set to a shared pad, can save the space of pcb board, improve the utilization rate of pcb board.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Accompanying drawing to be used needed for technology description is had to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, acceptable
Structure according to these accompanying drawings obtains other accompanying drawings.
Fig. 1 is the hardware architecture diagram for realizing the optional mobile terminal of each embodiment of the present invention one;
Fig. 2 is the wireless communication system schematic diagram of mobile terminal as shown in Figure 1;
Fig. 3 is the structural representation of existing pad structure;
Fig. 4 is the structural representation of the pad sharing structure of one embodiment of the invention;
Fig. 5 is the structural representation of embodiment mounting related components described in Fig. 4;
Fig. 6 is the structural representation of the pad sharing structure of another embodiment of the present invention.
Drawing reference numeral explanation:
Label | Title | Label | Title |
1 | Shared pad | 4 | Silk-screen |
2 | Non-common pad | 5 | Resistance |
3 | Printed conductor |
The realization of the object of the invention, functional characteristics and advantage will be described further in conjunction with the embodiments referring to the drawings.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Base
Embodiment in the present invention, those of ordinary skill in the art obtained under the premise of creative work is not made all its
His embodiment, belongs to the scope of protection of the invention.
It is to be appreciated that institute's directional instruction (such as up, down, left, right, before and after ...) only uses in the embodiment of the present invention
In explaining in the relative position relation under a certain particular pose (as shown in drawings) between each part, motion conditions etc., if should
When particular pose changes, then directionality indicates also correspondingly to change therewith.
In addition, in the present invention such as relating to the description of " first ", " second " etc. be only used for describe purpose, and it is not intended that
Indicate or imply its relative importance or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ",
The feature of " second " can be expressed or implicitly include at least one this feature.In describing the invention, the containing of " multiple "
Justice is at least two, such as two, three etc., unless otherwise expressly limited specifically.
In the present invention, unless otherwise clearly defined and limited, term " connection ", " fixation " etc. should be interpreted broadly,
For example, " fixation " can be fixedly connected, or be detachably connected, or integral;Can be mechanically connected, or
Electrical connection;Can be joined directly together, it is also possible to be indirectly connected to by intermediary, can be the connection or two of two element internals
The interaction relationship of individual element, unless otherwise clearly restriction.For the ordinary skill in the art, can basis
Concrete condition understands above-mentioned term concrete meaning in the present invention.
In addition, the technical scheme between each embodiment of the present invention can be combined with each other, but must be general with this area
Logical technical staff can be implemented as basis, will be understood that when the combination appearance of technical scheme is conflicting or cannot realize this
The combination of technical scheme is not present, also not within the protection domain of application claims.
It should be appreciated that specific embodiment described herein is not intended to limit the present invention only in order to explain the present invention.
The mobile terminal of each embodiment of the present invention is realized referring now to Description of Drawings.In follow-up description, use
For representing the suffix of such as " module ", " part " or " unit " of element only for being conducive to the explanation of the present invention, itself
Not specific meaning.Therefore, " module " mixedly can be used with " part ".
Mobile terminal can be implemented in a variety of manners.For example, the terminal described in the present invention can include such as to move
Phone, smart phone, notebook computer, digit broadcasting receiver, PDA (personal digital assistant), PAD (panel computer), PMP
The mobile terminal of (portable media player), guider etc. and such as numeral TV, desk computer etc. consolidate
Determine terminal.Hereinafter it is assumed that terminal is mobile terminal.However, it will be understood by those skilled in the art that, except being used in particular for movement
Outside the element of purpose, construction according to the embodiment of the present invention can also apply to the terminal of fixed type.
Fig. 1 is that the hardware configuration of the mobile terminal for realizing each embodiment of the present invention is illustrated.
Mobile terminal 1 00 can include wireless communication unit 110, A/V (audio/video) input block 120, user input
Unit 130, sensing unit 140, output unit 150, memorizer 160, interface unit 170, controller 180 and power subsystem 190
Etc..Fig. 1 shows the mobile terminal with various assemblies, it should be understood that being not required for implementing all groups for illustrating
Part.More or less of component can alternatively be implemented.Will be discussed in more detail below the element of mobile terminal.
Wireless communication unit 110 generally includes one or more assemblies, and which allows mobile terminal 1 00 and wireless communication system
Or the radio communication between network.
A/V input block 120 is used for receiving audio or video signal.A/V input block 120 can include 121 He of camera
Mike 1220,121 pairs of static maps for being obtained by image capture apparatus in Video Capture pattern or image capture mode of camera
The view data of piece or video is processed.Picture frame after process is may be displayed on display unit 151.At camera 121
Picture frame after reason can be stored in memorizer 160 (or other storage mediums) or carry out via wireless communication unit 110
Send, two or more cameras 1210 can be provided according to the construction of mobile terminal.Mike 122 can be in telephone relation mould
Sound (voice data) is received via mike in formula, logging mode, speech recognition mode etc. operational mode, and can be by
Such acoustic processing is voice data.Audio frequency (voice) data after process can be changed in the case of telephone calling model
For can be sent to the form output of mobile communication base station via mobile communication module 112.Mike 122 can implement all kinds
Noise eliminate (or suppression) algorithm with eliminate noise that (or suppression) is produced during receiving and sending audio signal or
Person disturbs.
User input unit 130 can generate key input data to control each of mobile terminal according to the order of user input
Plant operation.User input unit 130 allows the various types of information of user input, and can include keyboard, metal dome, touch
Plate (resistance that for example, detection causes due to being touched, pressure, the sensitive component of the change of electric capacity etc.), roller, rocking bar etc.
Deng.Especially, when touch pad is superimposed upon on display unit 151 as a layer, touch screen can be formed.
Sensing unit 140 detect mobile terminal 1 00 current state, (for example, mobile terminal 1 00 open or close shape
State), the position of mobile terminal 1 00, user for mobile terminal 1 00 the presence or absence of contact (that is, touch input), mobile terminal
100 orientation, the acceleration or deceleration movement of mobile terminal 1 00 and direction etc., and generate for controlling mobile terminal 1 00
The order of operation or signal.For example, when mobile terminal 1 00 is embodied as sliding-type mobile phone, sensing unit 140 can be sensed
The sliding-type phone is opened or is cut out.In addition, sensing unit 140 can detect power subsystem 190 whether provide electric power or
Whether person's interface unit 170 is coupled with external device (ED).
Interface unit 170 is connected, as at least one external device (ED), the interface that can pass through with mobile terminal 1 00.For example,
External device (ED) can include wired or wireless head-band earphone port, external power source (or battery charger) port, wired or nothing
Line FPDP, memory card port, the port for being used for device of the connection with identification module, audio input/output (I/O) end
Mouth, video i/o port, ear port etc..Identification module can be stored for verifying user using each of mobile terminal 1 00
Kind of information and subscriber identification module (UIM), client identification module (SIM), Universal Subscriber identification module (USIM) can be included
Etc..In addition, the device (hereinafter referred to as " identifying device ") with identification module can take the form of smart card, therefore, know
Other device can be connected with mobile terminal 1 00 via port or other attachment means.Interface unit 170 can be used for receive from
The input (for example, data message, electric power etc.) of external device (ED) and the input for receiving is transferred in mobile terminal 1 00
One or more elements or can be used for transmission data between mobile terminal and external device (ED).
In addition, when mobile terminal 1 00 is connected with external base, interface unit 170 can serve as allowing by which by electricity
Power provides the path of mobile terminal 1 00 from base or can serve as allowing the various command signals from base input to pass through which
It is transferred to the path of mobile terminal.The various command signals being input into from base or electric power may serve as recognizing that mobile terminal is
The no signal being accurately fitted within base.Output unit 150 is configured to defeated with the offer of vision, audio frequency and/or tactile manner
Go out signal (for example, audio signal, video signal, alarm signal, vibration signal etc.).
Memorizer 160 can store software program for the process and control operation for being executed by controller 180 etc., Huo Zheke
Temporarily to store oneself data (for example, telephone directory, message, still image, video etc.) through exporting or will export.And
And, memorizer 160 can be with storage with regard to the vibration of various modes that exports when touching and being applied to touch screen and audio signal
Data.
Memorizer 160 can include the storage medium of at least one type, and the storage medium includes flash memory, hard disk, many
Media card, card-type memorizer (for example, SD or DX memorizer etc.), random access storage device (RAM), static random-access storage
Device (SRAM), read only memory (ROM), Electrically Erasable Read Only Memory (EEPROM), programmable read only memory
(PROM), magnetic storage, disk, CD etc..And, mobile terminal 1 00 can execute memorizer with by network connection
The network storage device cooperation of 160 store function.
Controller 180 generally controls the overall operation of mobile terminal.For example, controller 180 is executed and voice call, data
The related control of communication, video calling etc. and process.In addition, controller 180 can be included for reproducing (or playback) many matchmakers
The multi-media module 1810 of volume data, multi-media module 1810 can be constructed in controller 180, or it is so structured that and control
Device processed 180 is separated.Controller 180 can be with execution pattern identifying processing, by the handwriting input for executing on the touchscreen or figure
Piece is drawn input and is identified as character or image.
Power subsystem 190 receives external power or internal power under the control of controller 180 and provides operation each unit
Appropriate electric power needed for part and component.
Various embodiments described herein can be with using such as computer software, hardware or its any combination of calculating
Machine computer-readable recording medium is implementing.Hardware is implemented, embodiment described herein can be by using application-specific IC
(ASIC), digital signal processor (DSP), digital signal processing device (DSPD), programmable logic device (PLD), scene can
Program gate array (FPGA), processor, controller, microcontroller, microprocessor, be designed to execute function described herein
At least one in electronic unit is implementing, and in some cases, such embodiment can be implemented in controller 180.
Software is implemented, the embodiment of such as process or function can with allow to execute the single of at least one function or operation
Software module is implementing.Software code can be come by the software application (or program) that is write with any appropriate programming language
Implement, software code can be stored in memorizer 160 and be executed by controller 180.
So far, oneself is through describing mobile terminal according to its function.Below, for the sake of brevity, will description such as folded form,
Slide type mobile terminal in various types of mobile terminals of board-type, oscillating-type, slide type mobile terminal etc. is used as showing
Example.Therefore, the present invention can be applied to any kind of mobile terminal, and be not limited to slide type mobile terminal.
As shown in Figure 1 mobile terminal 1 00 may be constructed such that using via frame or packet transmission data all if any
Line and wireless communication system and satellite-based communication system are operating.
Referring now to the communication system that Fig. 2 description is wherein operable to according to the mobile terminal of the present invention.
Such communication system can use different air interfaces and/or physical layer.For example, used by communication system
Air interface includes such as frequency division multiple access (FDMA), time division multiple acess (TDMA), CDMA (CDMA) and universal mobile communications system
System (UMTS) (especially, Long Term Evolution (LTE)), global system for mobile communications (GSM) etc..As non-limiting example, under
The description in face is related to cdma communication system, but such teaching is equally applicable to other types of system.
With reference to Fig. 2, cdma wireless communication system can include multiple mobile terminal 1s 00, multiple base stations (BS) 270, base station
Controller (BSC) 275 and mobile switching centre (MSC) 280.MSC280 is configured to and Public Switched Telephony Network (PSTN)
290 form interface.MSC280 is also structured to form interface with the BSC275 that can be couple to base station 270 via back haul link.
If back haul link can be constructed according to any one in the interface that Ganji knows, the interface includes such as E1/T1, ATM, IP,
PPP, frame relay, HDSL, ADSL or xDSL.It will be appreciated that system can include multiple BSC2750 as shown in Figure 2.
Each BS270 can service one or more subregions (or region), by multidirectional antenna or the day of sensing specific direction
Each subregion that line is covered is radially away from BS270.Or, each subregion can by for diversity reception two or more
Antenna is covered.Each BS270 may be constructed such that the multiple frequency distribution of support, and each frequency is distributed with specific frequency spectrum
(for example, 1.25MHz, 5MHz etc.).
Intersecting that subregion and frequency are distributed can be referred to as CDMA Channel.BS270 can also be referred to as base station transceiver
System (BTS) or other equivalent terms.In this case, term " base station " can be used for broadly representing single
BSC275 and at least one BS270.Base station can also be referred to as " cellular station ".Or, each subregion of specific BS270 can be claimed
For multiple cellular stations.
As shown in Figure 2, broadcast singal is sent to broadcsting transmitter (BT) 295 mobile terminal that operate in system
100.Broadcasting reception module 111 is arranged on to receive the broadcast for being sent by BT295 at mobile terminal 1 00 as shown in Figure 1
Signal.In fig. 2 it is shown that several global positioning system (GPS) satellite 300.Satellite 300 helps position multiple mobile terminals
At least one of 100.
In fig. 2, multiple satellites 300 are depicted, it is understood that be, it is possible to use any number of satellite obtains useful
Location information.GPS module 115 is generally configured to coordinate with satellite 300 to obtain the positioning that wants letter as shown in Figure 1
Breath.Substitute GPS tracking technique or outside GPS tracking technique, it is possible to use can track the position of mobile terminal other
Technology.In addition, at least one gps satellite 300 can optionally or additionally process satellite dmb transmission.
Used as a typical operation of wireless communication system, BS270 receives the reverse link from various mobile terminal 1s 00
Signal.Mobile terminal 1 00 generally participates in call, information receiving and transmitting and other types of communication.Each of the reception of certain base station 270 is anti-
Processed in specific BS270 to link signal.The data of acquisition are forwarded to the BSC275 of correlation.BSC provides call
Resource allocation and the mobile management function of the coordination including the soft switching process between BS270.BSC275 is also by the number for receiving
According to being routed to MSC280, which provides the extra route service for forming interface with PSTN290.Similarly, PSTN290 with
MSC280 forms interface, and MSC and BSC275 forms interface, and BSC275 correspondingly controls BS270 with by forward link signals
It is sent to mobile terminal 1 00.
Based on above-mentioned mobile terminal hardware configuration, communication apparatus structure, propose the present invention and each embodiment of pad structure shared,
Shared pad structure is a part for mobile terminal.
In an embodiment of the present invention, the pad sharing structure is including sharing pad 1 and multiple non-common pads 2, many
The parameter of individual non-common pad 2 is differed, and multiple non-common pads 2 are distributed centered on the shared pad 1, to realize
Installation of the different components and parts on shared pad 1 and different non-common pads 2.
The pad sharing structure of the present invention is mainly used on pcb board, and pcb board is printed circuit board (PCB), is provided with collection
Become the thin plate of circuit and other electronic building bricks.Pcb board by complicated circuit connection between part and part, through careful neat
After planning, lead to overetched mode and concentrate on one piece of plank, main support of the electronic components when installing with interconnection is provided
Body, is the indispensable fundamental parts of all electronic equipments.Electronic equipment is using after printed board, consistent due to similar printed board
Property, so as to the mistake of artificial wiring is avoided, and can achieve electronic devices and components inserting or attachment, automatically automatic tin soldering, inspection automatically
Survey, it is ensured that the quality of electronic equipment, improve labor productivity, cost is reduced, and be easy to maintenance.
It is divided into according to wiring board number of plies pcb board:It is divided into single sided board, dual platen and multi-layer sheet.Single sided board is most basic PCB
Plate, one side wherein concentrated by part, and wire then concentrates on another side.Because wire only have one side, all wiring between can not intersect and
Single sided board must be caused to have many strict restrictions in designed lines around path alone.Dual platen is that two sides has wiring
Pcb board, and will use two sides wire, need to be attached the circuit between two sides by guide hole.Guide hole be on PCB,
Full of or coated with metal duck eye, it can be connected with the wire on two sides.Because dual platen wire can be detoured by guide hole
Another side, wiring intermeshes, and is suitable for complicated circuit.Multi-layer sheet is that the superposition of polylith single or double plate is used, to increase
Plus layout area.Make with one piece of dual platen that internal layer, two pieces of single sided boards make outer layer or two pieces of dual platens are made internal layer, two pieces of single sided boards and made
The pcb board of outer layer, by alignment system and adhesive material alternately together and conductive pattern is interconnected by design requirement
Pcb board just become four layers, also referred to as six layers of pcb board, multi-layer PCB board.It is independent which floor the number of plies of plank just represents
Wiring layer, the usual number of plies is all even number, and includes outermost two-layer.
In order to components and parts are fixed and attached on pcb board, typically around the fairlead of pcb board, Copper Foil conduct is mounted
Pad, the pin of components and parts is fixed to components and parts on pcb board with scolding tin, while with printed conductor 3 not through after fairlead
Couple together with the Copper Foil between pad, you can realize components and parts are connected and fixed on pcb board.But it is that typically in circuit
In, wire can be equal to antenna to a certain extent, and can collect electric charge (as the charged particle that plasma etching is produced) causes electricity
Position raises.Antenna is longer, and the electric charge of collection is also more, and voltage is higher.Certain part is only connect to the grid circuit of MOS, high
Voltage may puncture thin gate oxide, make circuit malfunction, that is, produce " antenna effect ".With the development of Technology, grid
Size less and less, the number of plies of metal is more and more, occur antenna effect probability bigger.Fig. 3 is refer to, is existed at present
During circuit design, different components and parts are commonly designed the pad of exclusive use, and two adjacent performance identical pads are generally used
Printed conductor 3 is attached, while in order to keep components and parts safe spacing, and cause to connect the print of two performance identical pads
Wire processed 3 is longer, and this longer printed conductor 3 can be produced antenna effect and high-frequency signal is formed and interfere equivalent to antenna, and then
Impact circuit performance.
Fig. 4 is refer to, the pad sharing structure of the present invention is shared by multiple for performance identical pads are set to one
Pad 1, and around the non-common pad 2 of different parameters is arranged on centered on sharing pad 1, shared pad 1 and multiple
Need not connect between non-common pad 2, there is no unnecessary printed conductor 3, antenna effect can be avoided, it is ensured that circuit performance.
While the multiple pads of performance identical are set to a shared pad 1, the space of pcb board can be saved, improve the utilization of pcb board
Rate.When components and parts are installed, it is only necessary to which, by a pin of components and parts through the fairlead for sharing pad 1, another pin is worn
Cross the fairlead of pad corresponding with its parameter, you can realize the installation of the components and parts, it is to avoid first device of different performance parameter
The mistake of part is installed, and prevents pad short circuit.Specifically, Fig. 5 refer to, when carrying out the installation of resistance 5, a pin of resistance 5 is installed
On shared pad 1, another pin is on non-common pad 2 corresponding with 5 parameter of resistance.
Further, the shared pad 1 is low pressure of high-pressure side, the multiple non-common pads 2 for different magnitudes of voltage
End.
In a preferred embodiment of the invention, shared pad 1 is set to high-pressure side, multiple non-common pads 2 are set to
The low-pressure end of different magnitudes of voltage, selects magnitude of voltage corresponding with its performance parameter according to the performance parameter of components and parts itself during use
Low-pressure end installed.It should be noted that when active components and parts are installed, needing to be installed to the positive pole of active components and parts
Shared pad 1, negative pole is installed to non-common pad 2, and does not have this restriction for passive component.Specifically, in a pad
In sharing structure, including a high-pressure side A and two low-pressure ends B, C.Wherein high-pressure side A voltage is 24V, two low-pressure ends B, C
Voltage be respectively 10V and 4V, then the pressure reduction between AB be pressure reduction between 14V, AC be 20V.An existing electric capacity and resistance 5,
The rated voltage of wherein electric capacity is 14V, and the rated voltage of resistance 5 is 20V.Then electric capacity can only be installed between AB or by electricity
Resistance 5 is installed between AC, rated voltage of the pressure reduction of 20V more than electric capacity 14V between AC, and electric capacity is installed between AC and may be burnt
Bad, and between AB 14V pressure reduction less than resistance 520V rated voltage, resistance 5 be installed between AB may not normal work,
Even there is idle situation.In other embodiments, it is also possible to which shared pad 1 is set to low-pressure end, multiple non-common
Pad 2 is set to the high-pressure side of different magnitudes of voltage.Now when active components and parts are installed, need to pacify the positive pole of active components and parts
Non-common pad 2 is attached to, negative pole is installed to shared pad 1, and does not have this restriction for components and parts for no reason at all.Because on components and parts
Load voltage value be to determine, and user is readily available, all shared pads 1 and non-common pad 2 use voltage as ginseng
Number embodiments, user using when can be perfectly clear know that components and parts should be installed on that non-common pad 2, people
Property degree height.
Further, the quantity of the non-common pad 2 is two.
In one embodiment of the invention, the quantity of non-common pad 2 is set to two, you can support two kinds of different models
The installation of components and parts.Because pcb board is by complicated circuit connection between part and part, after careful neat planning, lead to
Overetched mode is concentrated on one piece of plank.Therefore the limited area of pcb board, and this pad sharing structure is in order to prevent difference
The mistake of performance parameter components and parts is installed, and can only install a type of components and parts every time, is also implied that every time only using one
Non-common pad 2.Consider this kind of situation, the quantity that non-common pad 2 is arranged is more, the more space of pcb board can be taken, is carried
High cost.But more non-common pad 2 can be set in the embodiment of normal work in other such as testing elements
Quantity, so as to not tested by the components and parts of model.Specifically, have respectively rated voltage parameter for 10V, 12V, 14V,
Six resistance 5 of 16V, 18V and 20V need to test its service behaviour, and pad sharing structure now arranges a shared pad 1
With six non-common pads 2, and the voltage performance parameter of a shared pad 1 and six non-common pads 2 be respectively 36V,
Six resistance 5, during test, are installed to corresponding with its voltage parameter by 26V, 24V, 22V, 20V, 18V and 16V successively respectively
Non-common pad 2 on, to realize its testing requirement.
Preferably, described two non-common pads 2 are located at the opposite end for sharing pad 1, and the company of its central point respectively
Line is through the central point of shared pad 1.
Specifically refer to Fig. 4, two non-common pads 2 by share pad 1 centered on be distributed in 1 two ends of shared pad with
Shared pad 1 is in alignment.This linear pad had not only facilitated positioning processing but also had facilitated the installation of components and parts, while being also convenient for
Any position for being arranged in pcb board, take pcb board space little.
Further, described two non-common pads 2 are located at the vertical two ends for sharing pad 1, one of non-co- respectively
With the central point of pad 2 and the line of 1 central point of shared pad perpendicular to another non-common pad 2 central point and shared weldering
The line of 1 central point of disk.
In further technical scheme, Fig. 6 is refer to, two non-common pads 2 are located to be located at respectively and share weldering
On the vertical two ends of disk 1, right-angle structure is cooperatively formed with shared pad 1.The pad arrangement of this right-angle structure, is easy to and other yuan
Device arranges in pairs or groups to form rectangular configuration, makes the compact conformation of whole pcb board, save space.
Further, around the shared pad 1 and multiple non-common pads 2, silk-screen 4 is provided with.
Specifically, it is provided with around each pad and bond pad shapes identical silk-screen 4, each pad is being demarcated
Also isolation is formed between two adjacent pads while differentiation.Isolation barrier during welding because of silk-screen 4 is acted on, and even stannum is not allowed
Easily between two neighboring pad, short circuit is formed, reach the effect of continuous tin prevention.
Preferably, the spacing between the shared pad 1 and multiple non-common pads 2 is equal and equivalently-sized.
Understandably, shared pad 1 and multiple non-common pads 2 are set to spacing equal, equivalently-sized can be
By being changed without in the case of other processing unit (plant)s, all pads are processed, improve working (machining) efficiency.Consider different pads
The components and parts of installation are inconsistent, and the difference of components and parts to further relate to pin size inconsistent, so in order to as much as possible and
Hold different components and parts, the fairlead of pad can be arranged according to large-sized components and parts, in order to dissimilar components and parts
Install.
Further, the shared pad 1 and multiple non-common pads 2 are circular or square.
In technical solution of the present invention, shared pad 1 and multiple non-common pads 2 are provided in round or side
To.Circular pad is widely used in the regularly arranged single, double surface printed board of element, in the case of the density of pcb board is allowed, can
By the big of the size setting of circular pad, come off during preventing pad solder.Square pads be widely used in components and parts big and
Less and on the simple pcb board of printed conductor 3.In manual self-control pcb board, circular pad is easiest to realize.In other embodiment party
In formula, the shape of pad can also adopt polygon and ellipse, wherein polygon pad be mainly used in difference external diameter be close to and
The different pad in aperture, is easy to process and assembles;Oval pads are big because of its area, have enough areas strengthen anti-stripping energy
Power, is usually used in dual inline type device.
The present invention also provides a kind of pcb board, including above-mentioned pad sharing structure.The concrete structure ginseng of the pad sharing structure
According to above-described embodiment, as the pad sharing structure employs whole technical schemes of above-mentioned all embodiments, therefore at least have
All beneficial effects that the technical scheme for having above-described embodiment is brought, this is no longer going to repeat them.
The present invention also provides a kind of mobile terminal, including above-mentioned pcb board.The pcb board includes above-mentioned pad sharing structure, should
Concrete structure reference above-described embodiment of pad sharing structure, as the pad sharing structure employs above-mentioned all embodiments
All technical scheme, therefore at least has all beneficial effects that the technical scheme of above-described embodiment is brought, and here is not another
One repeats.
It should be noted that herein, term " including ", "comprising" or its any other variant are intended to non-row
The including of his property, so that a series of process including key elements, method, article or device not only include those key elements, and
And also include other key elements for being not expressly set out, or also include intrinsic for this process, method, article or device institute
Key element.In the absence of more restrictions, the key element for being limited by sentence "including a ...", it is not excluded that including to be somebody's turn to do
Also there is other identical element in the process, method of key element, article or device.
The embodiments of the present invention are for illustration only, do not represent the quality of embodiment.
The preferred embodiments of the present invention are these are only, the scope of the claims of the present invention is not thereby limited, every using this
Equivalent structure or equivalent flow conversion that bright description and accompanying drawing content are made, or directly or indirectly it is used in other related skills
Art field, is included within the scope of the present invention.
Claims (10)
1. a kind of pad sharing structure, it is characterised in that including sharing pad and multiple non-common pads, multiple non-common welderings
The parameter of disk is differed, and multiple non-common pads are distributed centered on the shared pad, are existed with realizing different components and parts
Installation on shared pad and different non-common pads.
2. pad sharing structure as claimed in claim 1, it is characterised in that the shared pad is high-pressure side, multiple described
Non-common pad is the low-pressure end of different magnitudes of voltage.
3. pad sharing structure as claimed in claim 1, it is characterised in that the quantity of the non-common pad be.
4. pad sharing structure as claimed in claim 3, it is characterised in that described two non-common pads are located at respectively and share
The opposite end of pad, and the line of its central point is through the central point of shared pad.
5. pad sharing structure as claimed in claim 3, it is characterised in that described two non-common pads are located at respectively and share
The vertical two ends of pad, the central point of one of non-common pad is non-perpendicular to another with the line of shared pad center point
The line of the central point of shared pad and shared pad center point.
6. the pad sharing structure as described in claim 1-5 any one, it is characterised in that the shared pad and multiple
Silk-screen is provided with around the non-common pad.
7. the pad sharing structure as described in claim 1-5 any one, it is characterised in that the shared pad and multiple institutes
The spacing that states between non-common pad is equal, and equivalently-sized.
8. the pad sharing structure as described in claim 1-5 any one, it is characterised in that the shared pad and multiple
The non-common pad is circular or square.
9. a kind of pcb board, it is characterised in that the pcb board includes the pad as described in claim 1-8 any one and shares knot
Structure.
10. a kind of mobile terminal, it is characterised in that the mobile terminal will remove the pcb board as described in 9 comprising right such as.
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CN201611095643.4A CN106455306A (en) | 2016-11-30 | 2016-11-30 | Pad shared structure, PCB (printed circuit board) and mobile terminal |
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CN201611095643.4A CN106455306A (en) | 2016-11-30 | 2016-11-30 | Pad shared structure, PCB (printed circuit board) and mobile terminal |
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CN107222971A (en) * | 2017-08-01 | 2017-09-29 | 郑州云海信息技术有限公司 | A kind of PCB, the preparation method of PCB and device |
CN109587943A (en) * | 2018-11-09 | 2019-04-05 | 加弘科技咨询(上海)有限公司 | Zero anchoring wire of differential lines spreads cabling circuit board and electronic device altogether |
CN113395828A (en) * | 2021-05-27 | 2021-09-14 | 合肥鑫晟光电科技有限公司 | Printed circuit board, display panel and electronic equipment |
TWI762685B (en) * | 2018-07-19 | 2022-05-01 | 大陸商鴻富錦精密工業(武漢)有限公司 | Printed circuit board |
WO2024027244A1 (en) * | 2022-08-05 | 2024-02-08 | 荣耀终端有限公司 | Circuit board, circuit board assembly and electronic device |
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CN102970833A (en) * | 2012-11-05 | 2013-03-13 | 杭州华三通信技术有限公司 | Processing method and insert hole structure of printed circuit board (PCB) insert hole |
CN104284517A (en) * | 2014-11-04 | 2015-01-14 | 深圳市华星光电技术有限公司 | Printed circuit board |
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CN101646302A (en) * | 2009-05-14 | 2010-02-10 | 上海闻泰电子科技有限公司 | Circuit board for compatible standby battery and capacitor and method for packaging standby battery |
CN102970833A (en) * | 2012-11-05 | 2013-03-13 | 杭州华三通信技术有限公司 | Processing method and insert hole structure of printed circuit board (PCB) insert hole |
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CN107222971A (en) * | 2017-08-01 | 2017-09-29 | 郑州云海信息技术有限公司 | A kind of PCB, the preparation method of PCB and device |
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WO2024027244A1 (en) * | 2022-08-05 | 2024-02-08 | 荣耀终端有限公司 | Circuit board, circuit board assembly and electronic device |
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