CN109585349A - A kind of wafer transfer platform, high pressure stripping machine and its working method - Google Patents
A kind of wafer transfer platform, high pressure stripping machine and its working method Download PDFInfo
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- CN109585349A CN109585349A CN201811403700.XA CN201811403700A CN109585349A CN 109585349 A CN109585349 A CN 109585349A CN 201811403700 A CN201811403700 A CN 201811403700A CN 109585349 A CN109585349 A CN 109585349A
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- 238000000034 method Methods 0.000 title claims abstract description 115
- 238000012546 transfer Methods 0.000 title claims abstract description 33
- 238000012545 processing Methods 0.000 claims abstract description 77
- 230000005540 biological transmission Effects 0.000 claims abstract description 74
- 235000012431 wafers Nutrition 0.000 claims description 197
- 238000004381 surface treatment Methods 0.000 claims description 20
- 239000013078 crystal Substances 0.000 claims description 13
- 239000000919 ceramic Substances 0.000 abstract description 11
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000012937 correction Methods 0.000 abstract description 2
- 230000008901 benefit Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 241000283086 Equidae Species 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of high pressure stripping machine the invention discloses wafer transfer platform and containing the wafer transfer platform.Wafer transfer platform include at least one be used to pick and place the processing arm that wafer is surface-treated, at least one be used to pick and place the wafer that is disposed transmission arm and at least one for holding the horse of wafer.Utilize the wafer of six inches or eight inches of circulation on the high pressure stripping machine of wafer transfer platform of the invention, it does not need mutually to switch four groups six inches of ceramic arm and four groups of very little ceramic arms, the horse that horse at left and right sides of equipment is changed into correspondingly-sized is not needed yet, reduce the transmission verifying that ceramic arm carries out position correction and equipment platform one by one, reduce the waiting time of technique, simultaneously, reduce the usage quantity of specific dimensions ceramics arm, to reduce the cost of board operation and maintenance.
Description
Technical field
The present invention relates to a kind of semiconductor automation equipment, in particular to a kind of wafer transfer platform and high pressure stripping machine.
Background technique
As shown in Figure 1, high pressure stripping machine is used in semicon industry, it is mainly used for removing degumming process, belongs to equipment wet process
Process equipment, high pressure, which removes machine equipment, has three process cavities, can handle the wafer of six inches and eight inches.As shown in Fig. 2, brilliant
Flow need to be successively by wafer holder, the first process cavity, the second process cavity, third work on the left of equipment on high pressure stripping machine for circle
Horse on the right side of skill chamber and equipment need to include four Duan Hangcheng, correspond to four ceramics on equipment transmission platform by five websites
Arm.The wafer that six inches or eight inches are flowed on high pressure stripping machine, needs four groups six inches of ceramic arm and four groups
Eight inches of ceramic arm switches mutually, while horse at left and right sides of equipment being changed into the six inches of horses or eight English of correspondingly-sized
Very little horse, the transmission for then carrying out position correction and equipment platform one by one to the ceramic arm more finished changing are verified.High pressure removing
Six inches, eight inches mutual handoff procedures of transmission platform of machine take a long time, and process is cumbersome error-prone, and more hand-off every time
After arm, need again to calibrate arm.Therefore, it is badly in need of a kind of six inches of realization high pressure stripping machine, the transmission of eight inch wafers
The compatible technology of platform, reduces the waiting time of technique, improves production efficiency.
Summary of the invention
Goal of the invention: the present invention provides a kind of wafer transfer platform for realizing different size wafer transmission.Of the invention is another
One purpose provide include wafer transfer platform high pressure stripping machine.In addition, the present invention also provides wafer transfer platforms
Working method.
Technical solution: a kind of wafer transfer platform of the present invention includes at least one for picking and placing wafer progress
The processing arm of surface treatment, at least one be used for picks and places the wafer that is disposed transmission arm and at least one be used for hold
The horse of wafer.
Different wafers are surface-treated in order to realize, the processing arm packet in wafer transfer platform of the present invention
Include the first processing arm for picking and placing the first wafer and the second processing arm for picking and placing the second wafer；The transmission arm
The second transmission arm including the first transmission arm for picking and placing the first wafer and for picking and placing the second wafer；The horse packet
Include the first horse for holding the first wafer and the second horse for holding the second wafer.
A kind of preferred embodiment of the invention is that the processing arm is located at the transmission arm lower layer, can avoid processing arm
When picking and placing wafer, treatment fluid pollutes the transmission arm that treatment process finally uses.
Preferably, the size of first wafer is six inches；The size of second wafer is eight inches.
A kind of another structure of heretofore described wafer transfer platform can carry out surface to various sizes of wafer
Processing, the wafer transfer platform include processing arm, transmission arm and horse；The processing arm includes for picking and placing the
The first processing arm that one wafer is surface-treated and the second processing hand being surface-treated for picking and placing the second wafer
Arm；The transmission arm includes the first transmission arm for picking and placing the first wafer and the second transmission for picking and placing the second wafer
Arm；The horse includes the first horse for holding the first wafer and the second horse for holding the second wafer.
A kind of high pressure stripping machine of the present invention includes above-mentioned wafer transfer platform, realizes crystal column surface processing
Technique.
The working method of above-mentioned high pressure stripping machine are as follows: processing arm takes out wafer from horse, carries out school to processing arm
Quasi- after calibration, is placed the wafer in process cavity, is surface-treated in process cavity to wafer, after being disposed, is utilized
Transmission arm takes out wafer from process cavity, and the wafer that surface treatment finishes then is put into horse by calibration transmission arm,
Complete crystal column surface treatment process.
Above-mentioned high pressure stripping machine is surface-treated various sizes of wafer, and the processing arm includes for picking and placing the
First processing arm of one wafer and the second processing arm for picking and placing the second wafer；The transmission arm includes for picking and placing
First transmission arm of the first wafer and second for picking and placing the second wafer transmit arm；The horse includes for holding
First horse of one wafer and the second horse for holding the second wafer；
The first processing arm takes out the first wafer from the first horse, calibrates, calibrates to the first processing arm
After, the first wafer is put into process cavity, the first wafer is surface-treated in process cavity, after being disposed, benefit
The first wafer is taken out from process cavity with the first transmission arm, calibration the first transmission arm then finishes surface treatment
First wafer is put into the first horse, completes the first crystal column surface treatment process；
The second processing arm takes out the second wafer from the second horse, calibrates to second processing arm, calibration
After, the second wafer is put into process cavity, the second wafer is surface-treated in process cavity, after being disposed, benefit
The second wafer is taken out from process cavity with the second transmission arm, calibration the second transmission arm then finishes surface treatment
Second wafer is put into the second horse, completes the second crystal column surface treatment process.
Further, when wafer need to be surface-treated in different process cavities, specific steps are as follows:
First processing arm takes out the first wafer from the first horse, calibrates to the first processing arm, calibration finishes
Afterwards, the first wafer is put into the first process cavity, the first wafer is surface-treated in the first process cavity, at first
It manages arm to take out the first wafer being disposed in the first process cavity, after calibration the first processing arm, the first wafer is put
Enter in the second process cavity, then take out the wafer being disposed in the second process cavity, above-mentioned processing step is repeated, when first
After crystal column surface is disposed, using first transmission arm by the first wafer Jing Guo last one for the treatment of process from process cavity
It takes out, the first wafer is put into the first horse, completes the first crystal column surface treatment process by calibration the first transmission arm；
The second processing arm takes out the second wafer from the second horse, calibrates to second processing arm, calibration
After, the second wafer is put into the first process cavity, will be disposed in the first process cavity using second processing arm
Second wafer takes out, and after calibrating second processing arm, the second wafer is put into the second process cavity, to the in the second process cavity
Two wafers are surface-treated, and then take out the wafer being disposed in the second process cavity, repeat above-mentioned processing step, place
After reason, the second wafer Jing Guo last one for the treatment of process is taken out from process cavity using the second transmission arm, is completed
Second crystal column surface treatment process.
The utility model has the advantages that wafer transfer platform realizes the circulation of different size wafers in (1) high pressure stripping machine of the present invention；
(2) (2) present invention realizes processing of the wafer in different process chamber using same arm, and it is brilliant to reduce pick-and-place surface treatment processing
Round arm；(3) present invention does not need with four groups eight inches of arm to switch four groups six inches of arm mutually, does not need yet
Equipment two sides horse is changed to the horse of correspondingly-sized into, so that without carrying out position one by one to the arm more finished changing in this technique
Calibration and the transmission of equipment platform verifying, ensure that production efficiency；(4) present invention reduces board operation and maintenance at
This.
Detailed description of the invention
Fig. 1 is the position relationship structural diagram of high pressure stripping machine main component；
Fig. 2 is process flow of the existing high pressure stripping machine to wafer-process；
Fig. 3 is different arm positions relational structure schematic diagram in wafer transfer platform of the present invention；
Fig. 4 is card-house structure schematic diagram in wafer transfer platform of the present invention；
Fig. 5 is wafer transfer platform arm of the present invention and card-house structure schematic diagram；
Fig. 6 is the process flow that high pressure stripping machine of the present invention handles six inch wafers；
Fig. 7 is the process flow that high pressure stripping machine of the present invention handles eight inch wafers.
Specific embodiment
Technical solution of the present invention is further illustrated below with reference to embodiment.
Embodiment 1: a kind of wafer transfer platform of the present invention, including the first processing arm 11, first transmit arm
21 and first horse 31, the first processing arm 11 be placed in the lower layer of the first transmission arm 21, can avoid processing arm pick and place it is brilliant
Bowlder, treatment fluid pollution transmission arm, the size of the first processing arm, the first transmission arm and the first horse processing wafer match
Set, the arm used can be handled the wafer of six inches or eight inches using the wafer transfer platform for ceramic arm.
Utilize the working method of the high pressure stripping machine of the wafer transfer platform of embodiment 1 are as follows:
(1) first processing arm 11 takes out wafer from the first horse 31, arrives to the first processing arm 11 of carrying wafer
Transmission platform is calibrated, and after calibration, is placed the wafer in the first process cavity, carries out table to wafer in the first process cavity
Surface treatment；
(2) after to the technique of the first process cavity, taking-up wafer of the arm 11 in the first process cavity is handled with first,
First processing arm 11 of carrying wafer is calibrated to transmission platform, is then placed the wafer in the second process cavity, in the second work
Wafer is surface-treated in skill chamber；
(3) after to the technique of the second process cavity, taking-up wafer of the arm 11 in the second process cavity is handled with first,
First processing arm 11 of carrying wafer is calibrated to transmission platform, is then placed the wafer in third process cavity, in third work
Wafer is surface-treated in skill chamber；
(4) after to the technique of third process cavity, surface treated wafer is taken out with the first transmission arm 21,
First transmission arm 21 of carrying wafer is calibrated to transmission platform, after calibration, is placed the wafer in the first horse 31, it is complete
At crystal column surface treatment process.
Wafer Jing Guo the process is mutually equal with the wafer quality of the high pressure stripping machine processing Jing Guo the prior art,
But two arms are only used, equipment cost can be significantly reduced, to various sizes of wafer-process, also only needs replacing two hands
Arm, the time recalibrated to two arms also reduce simultaneously, show that the present invention is reducing arm simultaneously, decrease work
The skill period.
Embodiment 2: a kind of wafer transfer platform of the present invention can be handled various sizes of wafer, the crystalline substance
Circle transmission platform includes handling arm 1, transmission arm 2 and horse 3 positioned at processing 1 upper layer of arm, card-house structure such as Fig. 4 institute
Show.
As shown in figure 3, processing arm 1 is placed in transmission 2 lower layer of arm, processing arm 1 is by picking and placing the first of the first wafer
It manages arm 11 and the second processing arm 12 for picking and placing the second wafer forms, the first processing arm 11 can be placed in second processing hand
The upper layer of arm 12 or lower layer；Arm 2 is transmitted by the first transmission arm for picking and placing the first wafer and for picking and placing the second wafer
Second transmission arm composition, first transmission arm 21 can be located at second transmission arm 22 upper layer or lower layer；Horse 3 is by being used for
The first horse 31 of the first wafer and the second horse 32 composition for holding the second wafer are held, the first wafer size is six English
Very little, the second wafer size is eight inches, and the structure of the wafer transfer platform is as shown in Figure 5.
Wafer transfer platform in the present embodiment is used in high pressure stripping machine, various sizes of wafer can be carried out simultaneously
Surface treatment, no replacement is required arm and horse, the working method of the high pressure stripping machine are as follows:
(1) as shown in fig. 6, the first wafer is six inch wafers, corresponding transfer program, specific steps are selected are as follows:
(1a) first handles arm 11 and takes out the first wafer from the first horse 31, the first processing to the first wafer of carrying
Arm 11 is calibrated to transmission platform, after calibration, the first wafer is put into the first process cavity, in the first process cavity
First wafer is surface-treated；
After the technique of (1b) to the first process cavity, with taking-up first of the first processing arm 11 in the first process cavity
Wafer calibrates the first processing arm 11 of the first wafer of carrying to transmission platform, the first wafer is then put into the second technique
In chamber, the first wafer is surface-treated in the second process cavity；
After the technique of (1c) to the second process cavity, with taking-up first of the first processing arm 11 in the second process cavity
Wafer calibrates the first processing arm 11 of the first wafer of carrying to transmission platform, the first wafer is then put into third technique
In chamber, the first wafer is surface-treated in third process cavity；
After the technique of (1d) to third process cavity, arm 21 is transmitted by surface treated first wafer with first
It takes out, to the first transmission arm 21 of the first wafer of carrying to transmission platform calibration, after calibration, the first wafer is put into the
In one horse 31, the first crystal column surface treatment process is completed.
(2) as shown in fig. 7, the second wafer is eight inch wafers, corresponding transfer program, specific steps are selected are as follows:
(2a) second processing arm 12 takes out the second wafer from the second horse 32, to the second processing of the second wafer of carrying
Arm 12 is calibrated to transmission platform, after calibration, the second wafer is put into the first process cavity, in the first process cavity
Second wafer is surface-treated；
After the technique of (2b) to the first process cavity, with taking-up second of the second processing arm 12 in the first process cavity
Wafer calibrates the second processing arm 12 of the second wafer of carrying to transmission platform, the second wafer is then put into the second technique
In chamber, the second wafer is surface-treated in the second process cavity；
After the technique of (2c) to the second process cavity, with taking-up second of the second processing arm 12 in the second process cavity
Wafer calibrates the second processing arm 12 of the second wafer of carrying to transmission platform, the second wafer is then put into third technique
In chamber, the second wafer is surface-treated in third process cavity；
After the technique of (2d) to third process cavity, arm 22 is transmitted by surface treated second wafer with second
It takes out, to the second transmission arm 22 of the second wafer of carrying to transmission platform calibration, after calibration, the second wafer is put into the
In two horses 32, the second crystal column surface treatment process is completed.
Six inches of high pressure stripping machine, eight inch wafer transmission platforms compatibility, the technical side may be implemented by above step
Case has the advantage that
(1) reduce the technique waiting time；(2) cost of board operation and maintenance is reduced, which reduces
The usage quantity of ceramic arm on equipment platform, traditional transmission architecture need 4 ceramic arms, and the present invention only needs 2 potteries
Porcelain arm, so that it may complete whole wafer transmission process.
Claims (8)
1. a kind of wafer transfer platform, which is characterized in that the wafer transfer platform includes at least one for picking and placing wafer
The processing arm that is surface-treated, at least one be used to pick and place the wafer that is disposed transmission arm and at least one be used for
Hold the horse of wafer.
2. wafer transfer platform according to claim 1, which is characterized in that the processing arm includes for picking and placing first
First processing arm of wafer and the second processing arm for picking and placing the second wafer；The transmission arm includes for picking and placing the
First transmission arm of one wafer and second for picking and placing the second wafer transmit arm；The horse includes for holding first
First horse of wafer and the second horse for holding the second wafer.
3. wafer transfer platform according to claim 1, which is characterized in that the processing arm is located at the transmission arm
Lower layer.
4. wafer transfer platform according to claim 2, which is characterized in that the size of first wafer is six inches；
The size of second wafer is eight inches.
5. a kind of wafer transfer platform, which is characterized in that the wafer transfer platform includes processing arm, transmission arm and piece
Frame；The processing arm includes for picking and placing the first processing arm that the first wafer is surface-treated and for pick-and-place the
The second processing arm that two wafers are surface-treated；The transmission arm includes the first transmission hand for picking and placing the first wafer
Arm and for picking and placing the second wafer second transmission arm；The horse includes the first horse and use for holding the first wafer
In the second horse for holding the second wafer.
6. a kind of high pressure stripping machine, which is characterized in that include wafer transfer platform a method as claimed in any one of claims 1 to 5.
7. a kind of working method using high pressure stripping machine as claimed in claim 6, it is characterised in that: handle arm from horse
Middle taking-up wafer is calibrated processing arm, after calibration, is placed the wafer in process cavity, to wafer in process cavity
It is surface-treated, after being disposed, is taken out wafer from process cavity using transmission arm, calibration transmission arm then will
It is surface-treated the wafer finished to be put into horse, completes crystal column surface treatment process.
8. the working method of high pressure stripping machine according to claim 7, which is characterized in that the processing arm includes being used for
The the first processing arm and the second processing arm for picking and placing the second wafer for picking and placing the first wafer；The transmission arm includes using
Arm is transmitted in pick and place the first wafer first and the second transmission arm for picking and placing the second wafer；The horse includes being used for
Hold the first horse of the first wafer and the second horse for holding the second wafer；
The first processing arm takes out the first wafer from the first horse, calibrates to the first processing arm, calibration finishes
Afterwards, the first wafer is put into process cavity, the first wafer is surface-treated in process cavity, after being disposed, utilize
One transmission arm takes out the first wafer from process cavity, calibration the first transmission arm, then finish surface treatment first
Wafer is put into the first horse, completes the first crystal column surface treatment process；
The second processing arm takes out the second wafer from the second horse, calibrates to second processing arm, calibration finishes
Afterwards, the second wafer is put into process cavity, the second wafer is surface-treated in process cavity, after being disposed, utilize
Two transmission arms take out the second wafer from process cavity, calibration the second transmission arm, then finish surface treatment second
Wafer is put into the second horse, completes the second crystal column surface treatment process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811403700.XA CN109585349A (en) | 2018-11-23 | 2018-11-23 | A kind of wafer transfer platform, high pressure stripping machine and its working method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811403700.XA CN109585349A (en) | 2018-11-23 | 2018-11-23 | A kind of wafer transfer platform, high pressure stripping machine and its working method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109585349A true CN109585349A (en) | 2019-04-05 |
Family
ID=65924146
Family Applications (1)
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|---|---|---|---|
| CN201811403700.XA Pending CN109585349A (en) | 2018-11-23 | 2018-11-23 | A kind of wafer transfer platform, high pressure stripping machine and its working method |
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2018
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|---|---|---|---|---|
| TW461847B (en) * | 1999-03-18 | 2001-11-01 | Applied Materials Inc | Mechanical gripper for wafer handling robots |
| TW490368B (en) * | 2000-04-14 | 2002-06-11 | Applied Materials Inc | Improved robot for handling semiconductor wafers |
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