CN109585169A - A kind of ceramic capacitor reducing parasitic inductance - Google Patents
A kind of ceramic capacitor reducing parasitic inductance Download PDFInfo
- Publication number
- CN109585169A CN109585169A CN201811571800.3A CN201811571800A CN109585169A CN 109585169 A CN109585169 A CN 109585169A CN 201811571800 A CN201811571800 A CN 201811571800A CN 109585169 A CN109585169 A CN 109585169A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
Abstract
A kind of ceramic capacitor reducing parasitic inductance belongs to the technical field of ceramic capacitor, including the first chip, ceramic dielectric thin slice, the second chip, ground connection dispatch from foreign news agency pole plate and signal dispatch from foreign news agency pole plate；First chip includes electrode in the first ceramic substrate and first, in first on the side of the left and right for extending to the first ceramic substrate two of electrode transverse direction, second chip includes the second ceramic substrate and the second inner electrode, longitudinally extending former and later two sides to the second ceramic substrate of the second inner electrode, it is chip body that first chip and the second chip, which clip ceramic dielectric thin slice interaction cascading, the upper side and lower side difference of chip body is equipped with a ceramic dielectric thin slice, it is grounded dispatch from foreign news agency pole plate and is equipped with two, it is respectively provided at former and later two sides of the second chip, signal dispatch from foreign news agency pole plate sets two, it is respectively provided at the side of left and right two of the first chip.The present invention is a large amount of for solving to there is technical issues that inside ceramic capacitor.
Description
Technical field
The present invention relates to the technical field of ceramic capacitor, specifically a kind of ceramic condenser for reducing parasitic inductance
Device.
Background technique
Currently, used sheet form multilaminate ceramic capacitor is mostly two-terminal electrode structure, structure is shown as, chip
On interior electrode clip ceramic dielectric, in a manner of dislocation interaction be superimposed together, sealed up after high temperature sintering, then at both ends
External electrode.This ceramic capacitor due to being transmitted as one-way transmission in itself inside it, and transmission path is longer, still retains a large amount of
Parasitic inductance, the presence of parasitic inductance will lead to the performance decline of ceramic capacitor.
Summary of the invention
The purpose of the present invention is to provide a kind of ceramic capacitors for reducing parasitic inductance, for solving in ceramic capacitor
Portion there is technical issues that a large amount of.
The technical scheme adopted by the invention to solve the technical problem is that:
A kind of ceramic capacitor reducing parasitic inductance, including the first chip, ceramic dielectric thin slice, the second chip, connect
Ground dispatch from foreign news agency pole plate and signal dispatch from foreign news agency pole plate；First chip includes electrode in the first ceramic substrate and first, in described first
Electrode is located at the first ceramic base plate surface, the side of the left and right for extending to the first ceramic substrate two of electrode transverse direction in described first
On, second chip includes the second ceramic substrate and the second inner electrode, and the second inner electrode is located at the second ceramic substrate table
Face, on longitudinally extending former and later two sides to the second ceramic substrate of the second inner electrode, first chip and second
It is chip body that chip, which clips ceramic dielectric thin slice interaction cascading, and the upper side and lower side difference of chip body is equipped with a ceramic electrical
Media sheet, the ground connection dispatch from foreign news agency pole plate are equipped with two, are respectively provided on former and later two sides of the second chip, are grounded external electrode
The medial surface of plate is in contact with the second inner electrode of the second chip, and the signal dispatch from foreign news agency pole plate is equipped with two, is respectively provided at first
On the side of left and right two of chip, contact electrode in the medial surface of signal dispatch from foreign news agency pole plate and the first of the first chip.
Electrode is rectangular configuration in described first, and electrode is located at the upper surface of the first ceramic substrate in described first, first
The left side and right side of interior electrode are overlapped with the left side of the first ceramic substrate and right side respectively, the longitudinal direction of electrode in first
Longitudinal size of the size less than the first ceramic substrate.
The second inner electrode includes the rectangle knot of longitudinally disposed rectangular configuration and intersection normal thereto being laterally arranged
Structure, the leading flank of longitudinally disposed rectangular configuration and trailing flank are overlapped with the leading flank of the first ceramic substrate and trailing flank respectively,
The rectangular configuration being laterally arranged has certain amount of being laterally extended in the upper surface of the first ceramic substrate.
The lateral surface for the ceramic dielectric thin slice that chip body the upper side and lower side is equipped with is equipped with insulating layer, the ceramic dielectric
The insulating layer of thin slice is externally provided with tin layers.
Ground connection dispatch from foreign news agency pole plate described in two includes first electrode plate and second electrode plate, the first electrode plate and
Two electrode plates are rectangular slab, the upper side of first electrode plate and downside respectively be fixed with a second electrode plate, second
The medial surface of electrode plate is connected on the lateral surface of the ceramic dielectric thin slice of chip body the upper side and lower side setting, first electrode plate
The medial surface rectangular configuration longitudinally disposed with the second inner electrode be in contact.
Signal dispatch from foreign news agency pole plate is rectangular block described in two, and the rectangular block is equipped with groove, and the groove is rectangle
Ceramic dielectric thin slice and the chip body clamping that chip body the upper side and lower side is equipped with are integrated by slot, groove, the medial surface of groove
With first in contact electrode.
The inner surface for being grounded the second electrode plate of dispatch from foreign news agency pole plate is equipped with tin layers.
The inside upper surface of signal dispatch from foreign news agency pole plate and lower surface are equipped with tin layers.
The effect provided in the content of present invention is only the effect of embodiment, rather than invents all whole effects, on
State had the following advantages that in technical solution or the utility model has the advantages that
1, it is provided by the invention it is a kind of reduce parasitic inductance ceramic capacitor, external signal by the first chip left and right two
It holds while inputting, the rear and front end through the second chip exports simultaneously, optimizes the transmission mode of single transmission path, greatly
Reduce signal in the path of ceramic capacitor internal transmission, reduces the presence of endophyte inductance.
2, a kind of ceramic capacitor for reducing parasitic inductance provided by the invention, is grounded dispatch from foreign news agency pole plate and signal dispatch from foreign news agency pole plate
It after the outer surface of ceramic dielectric thin slice can be stuck in, then is welded, positioning welding is convenient.
Detailed description of the invention
Fig. 1 is the schematic diagram of each structure inside the embodiment of the present invention；
Fig. 2 is integrally-built schematic diagram after assembling in Fig. 1；
Fig. 3 is the structural schematic diagram of the first chip in Fig. 1；
Fig. 4 is the structural schematic diagram of the second chip in Fig. 1；
Fig. 5 is the structural schematic diagram that dispatch from foreign news agency pole plate is grounded in Fig. 1；
Fig. 6 is the structural schematic diagram of signal dispatch from foreign news agency pole plate in Fig. 1.
In figure: 1. first chips, 11. first ceramic substrates, electrode in 12. first, 2. ceramic dielectric thin slices, 3. second
Chip, 31. second ceramic substrates, 32. the second inner electrodes, 4. ground connection dispatch from foreign news agency pole plates, 41. first electrode plates, 42. second electrodes
Plate, 5. signal dispatch from foreign news agency pole plates, 51. grooves.
Specific embodiment
In order to clearly illustrate the technical characterstic of this programme, below by specific embodiment, and its attached drawing 1 to 6 is combined,
The present invention will be described in detail.It should be noted that illustrated component is not drawn necessarily to scale in the accompanying drawings.The present invention omits
Known assemblies and well-known technique are described, to avoid being unnecessarily limiting the present invention.
It is a kind of reduce parasitic inductance ceramic capacitor, including the first chip 1, ceramic dielectric thin slice 2, the second chip 3,
It is grounded dispatch from foreign news agency pole plate 4 and signal dispatch from foreign news agency pole plate 5；First chip 1 includes electrode 12 in the first ceramic substrate 11 and first, institute
It states electrode 12 in first and is located at 11 surface of the first ceramic substrate, what electrode 12 was lateral in described first extends to the first ceramic substrate
On 11 side of left and right two, second chip 3 includes the second ceramic substrate 31 and the second inner electrode 32, electricity in described second
Pole 32 is located at 31 surface of the second ceramic substrate, the longitudinally extending front and back two to the second ceramic substrate 31 of the second inner electrode 32
On a side, it is chip body that first chip 1 and the second chip 3, which clip 2 interaction cascading of ceramic dielectric thin slice, chip body
The upper side and lower side respectively be equipped with a ceramic dielectric thin slice 2, there are two the ground connection dispatch from foreign news agency pole plate 4 is set, be respectively provided at the
On former and later two sides of two chips 3, the medial surface of ground connection dispatch from foreign news agency pole plate 4 is in contact with the second inner electrode 32 of the second chip 3,
There are two the signal dispatch from foreign news agency pole plate 5 is set, be respectively provided on the side of left and right two of the first chip 1, signal dispatch from foreign news agency pole plate 5 it is interior
Electrode 12 is in contact in side and the first of the first chip 1.
Electrode 12 is rectangular configuration in described first, and electrode 12 is located at the upper table of the first ceramic substrate 11 in described first
Face, the left side and right side of electrode 12 are overlapped with the left side of the first ceramic substrate 11 and right side respectively in first, and first
Longitudinal size of the longitudinal size of interior electrode 12 less than the first ceramic substrate 11.
The second inner electrode 32 includes the rectangle of longitudinally disposed rectangular configuration and intersection normal thereto being laterally arranged
Structure, the leading flank of longitudinally disposed rectangular configuration and trailing flank are heavy with the leading flank of the first ceramic substrate 11 and trailing flank respectively
It closes, the rectangular configuration being laterally arranged has certain amount of being laterally extended in the upper surface of the first ceramic substrate 11.
The upper side of ceramic dielectric thin slice 2 on the upside of chip body is equipped with insulating layer, the ceramic dielectric on the downside of chip body
The downside of thin slice 2 is equipped with insulating layer, and the insulating layer is convenient for and external insulation, reduces the interference that external environment generates it,
The ceramic dielectric thin slice 2 can play the role of external connection to chip body, outside the insulating layer of the ceramic dielectric thin slice 2
Equipped with tin layers, the tin layers are convenient for welding with ground connection dispatch from foreign news agency pole plate 4 and signal dispatch from foreign news agency pole plate 5.
Ground connection dispatch from foreign news agency pole plate 4 described in two includes first electrode plate 41 and second electrode plate 42, the first electrode
Plate 41 and second electrode plate 42 are rectangular slab, the upper side of first electrode plate 41 and downside respectively be fixed with one second
Electrode plate 42, the medial surface of second electrode plate 42 are connected to the outer of the ceramic dielectric thin slice 2 of chip body the upper side and lower side setting
Side, the rectangular configuration that the medial surface of first electrode plate 41 is longitudinally disposed with the second inner electrode 32 are in contact.
Signal dispatch from foreign news agency pole plate 5 is rectangular block described in two, and the rectangular block is equipped with groove 51, and the groove 51 is
Ceramic dielectric thin slice 2 and the chip body clamping that chip body the upper side and lower side is equipped with are integrated by rectangular channel, groove 51, groove 51
Medial surface be in contact with electrode 12 in first.
Be grounded dispatch from foreign news agency pole plate 4 second electrode plate 42 inner surface be equipped with tin layers, convenient for ceramic dielectric thin slice 2
Tin layers are mutually welded.
The inside upper surface of signal dispatch from foreign news agency pole plate 5 and lower surface are equipped with tin layers, and the tin layers are convenient for and ceramic dielectric
The tin layers of thin slice 2 are mutually welded.
The working principle of the invention:
External signal is led to through through signal dispatch from foreign news agency pole plate 5,12 left and right ends of electrode input simultaneously out of the first chip 1 first
It crosses ceramic dielectric thin slice 2 to be transmitted on the second chip 3, the rectangular configuration being laterally arranged through the second inner electrode 32 is transmitted to vertical
To the rectangular configuration of setting, and final grounded dispatch from foreign news agency pole plate 4 is spread out of, and optimizes the transmission mode of single transmission path, pole
The earth reduces signal in the path of ceramic capacitor internal transmission, reduces the presence of endophyte inductance.
Except for the technical features described in the specification, it all is technically known to those skilled in the art.
Above-mentioned, although the foregoing specific embodiments of the present invention is described with reference to the accompanying drawings, not protects model to the present invention
The limitation enclosed, based on the technical solution of the present invention, those skilled in the art, which do not need to pay for creative labor, to be done
Various modifications or changes out are still within the scope of the present invention.
Claims (8)
1. a kind of ceramic capacitor for reducing parasitic inductance, characterized in that including the first chip, ceramic dielectric thin slice, second
Chip, ground connection dispatch from foreign news agency pole plate and signal dispatch from foreign news agency pole plate；First chip includes electrode in the first ceramic substrate and first, described
Electrode is located at the first ceramic base plate surface in first, the left and right two for extending to the first ceramic substrate of electrode transverse direction in described first
On a side, second chip includes the second ceramic substrate and the second inner electrode, and the second inner electrode is located at the second ceramics
Substrate surface, on longitudinally extending former and later two sides to the second ceramic substrate of the second inner electrode, first chip
Clipping ceramic dielectric thin slice interaction cascading with the second chip is chip body, and the upper side and lower side difference of chip body is equipped with one
Ceramic dielectric thin slice, the ground connection dispatch from foreign news agency pole plate are equipped with two, are respectively provided on former and later two sides of the second chip, are grounded
The medial surface of dispatch from foreign news agency pole plate is in contact with the second inner electrode of the second chip, and the signal dispatch from foreign news agency pole plate is equipped with two, sets respectively
On the side of the left and right of the first chip two, contact electrode in the medial surface of signal dispatch from foreign news agency pole plate and the first of the first chip.
2. a kind of ceramic capacitor for reducing parasitic inductance according to claim 1, characterized in that electrode in described first
For rectangular configuration, electrode is located at the upper surface of the first ceramic substrate in described first, the left side and right side of electrode in first
It is overlapped respectively with the left side of the first ceramic substrate and right side, the longitudinal size of electrode is less than the first ceramic substrate in first
Longitudinal size.
3. a kind of ceramic capacitor for reducing parasitic inductance according to claim 1, characterized in that the second inner electrode
The rectangular configuration being laterally arranged including longitudinally disposed rectangular configuration and intersection normal thereto, longitudinally disposed rectangular configuration
Leading flank and trailing flank are overlapped with the leading flank of the first ceramic substrate and trailing flank respectively, and the rectangular configuration being laterally arranged is first
There is certain amount of being laterally extended in the upper surface of ceramic substrate.
4. a kind of ceramic capacitor for reducing parasitic inductance according to claim 1, characterized in that on the upside of chip body under
The lateral surface for the ceramic dielectric thin slice that side is equipped with is equipped with insulating layer, and the insulating layer of the ceramic dielectric thin slice is externally provided with tin
Layer.
5. a kind of ceramic capacitor for reducing parasitic inductance according to claim 1 or 3, characterized in that described in two
Being grounded dispatch from foreign news agency pole plate includes first electrode plate and second electrode plate, and the first electrode plate and second electrode plate are rectangle
Plate, the upper side of first electrode plate and downside respectively be fixed with a second electrode plate, the medial surface card of second electrode plate
It connects on the lateral surface of the ceramic dielectric thin slice of chip body the upper side and lower side setting, in the medial surface of first electrode plate and second
The longitudinally disposed rectangular configuration of electrode is in contact.
6. a kind of ceramic capacitor for reducing parasitic inductance according to claim 1, characterized in that signal described in two
Dispatch from foreign news agency pole plate is rectangular block, and the rectangular block is equipped with groove, and the groove is rectangular channel, and groove is by chip body upside under
Ceramic dielectric thin slice and the chip body clamping that side is equipped with are integrated, contact electrode in the medial surface of groove and first.
7. a kind of ceramic capacitor for reducing parasitic inductance according to claim 5, characterized in that ground connection dispatch from foreign news agency pole plate
The inner surface of second electrode plate is equipped with tin layers.
8. a kind of ceramic capacitor for reducing parasitic inductance according to claim 6, characterized in that signal dispatch from foreign news agency pole plate
Inside upper surface and lower surface are equipped with tin layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811571800.3A CN109585169A (en) | 2018-12-21 | 2018-12-21 | A kind of ceramic capacitor reducing parasitic inductance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811571800.3A CN109585169A (en) | 2018-12-21 | 2018-12-21 | A kind of ceramic capacitor reducing parasitic inductance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109585169A true CN109585169A (en) | 2019-04-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811571800.3A Pending CN109585169A (en) | 2018-12-21 | 2018-12-21 | A kind of ceramic capacitor reducing parasitic inductance |
Country Status (1)
| Country | Link |
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| CN (1) | CN109585169A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103208366A (en) * | 2013-03-27 | 2013-07-17 | 林伟良 | Novel ceramic capacitor |
| CN103811179A (en) * | 2012-11-07 | 2014-05-21 | 三星电机株式会社 | Multilayered ceramic electronic component and board for mounting the same |
| US20170352479A1 (en) * | 2016-06-06 | 2017-12-07 | Murata Manufacturing Co., Ltd. | Electronic component |
| CN206758271U (en) * | 2017-05-19 | 2017-12-15 | 郑州云海信息技术有限公司 | A kind of three terminal patch capacitors of server Switching Power Supply |
-
2018
- 2018-12-21 CN CN201811571800.3A patent/CN109585169A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811179A (en) * | 2012-11-07 | 2014-05-21 | 三星电机株式会社 | Multilayered ceramic electronic component and board for mounting the same |
| CN103208366A (en) * | 2013-03-27 | 2013-07-17 | 林伟良 | Novel ceramic capacitor |
| US20170352479A1 (en) * | 2016-06-06 | 2017-12-07 | Murata Manufacturing Co., Ltd. | Electronic component |
| CN206758271U (en) * | 2017-05-19 | 2017-12-15 | 郑州云海信息技术有限公司 | A kind of three terminal patch capacitors of server Switching Power Supply |
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Application publication date: 20190405 |