CN109579761B - Fingerprint large-plate IC test fixture - Google Patents
Fingerprint large-plate IC test fixture Download PDFInfo
- Publication number
- CN109579761B CN109579761B CN201811540580.8A CN201811540580A CN109579761B CN 109579761 B CN109579761 B CN 109579761B CN 201811540580 A CN201811540580 A CN 201811540580A CN 109579761 B CN109579761 B CN 109579761B
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- plate
- hole
- support plate
- holes
- test
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- 238000012360 testing method Methods 0.000 title claims abstract description 38
- 238000003825 pressing Methods 0.000 claims description 9
- 238000001514 detection method Methods 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 239000002245 particle Substances 0.000 abstract description 5
- 230000005611 electricity Effects 0.000 abstract description 3
- 238000012790 confirmation Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/02—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness
- G01B21/08—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring length, width, or thickness for measuring thickness
Abstract
The application discloses fingerprint large plate IC test fixture, including the layer board, still include the backup pad, be equipped with faller and circuit board in the backup pad, faller and backup pad detachably connect, circuit board and faller electricity are connected; compared with the prior art, the method has the following technical effects: when detecting the large-plate IC, the IC does not need to be cut into single-particle, so that the detection steps of the IC are simplified, a plurality of ICs can be detected simultaneously, and the detection efficiency is effectively improved.
Description
Technical Field
The application belongs to the technical field of fingerprint identification, and specifically relates to a fingerprint large plate IC test fixture.
Background
Along with the development of technology, fingerprint identification technology is widely applied to production life, and the existing fingerprint product is covered with a Coating layer, along with the diversification of colors and structures, the film thickness requirement on the Coating layer is also more and more required, and in order to monitor the influence of film thickness on functions in time, a jig capable of detecting the film thickness function in time is urgently needed. The existing method needs to take out the IC with good large board Coating and cut single grains to carry out first part confirmation and inspection confirmation, so that the feasibility is low, the flow is long, and the monitoring effect is affected.
Disclosure of Invention
In view of this, the technical problem that this application should solve provides a fingerprint big board IC test fixture, need not to carry out the single grain cutting to IC and also can detect thick function of membrane.
In order to solve the technical problem, the application discloses big board IC test fixture of fingerprint, including the layer board, still include the backup pad, be equipped with faller and circuit board in the backup pad, faller and backup pad detachably are connected, circuit board and faller electricity are connected.
More preferably: the supporting plate is provided with a plurality of test holes which are matched with the IC to be tested.
More preferably: the supporting plate is provided with a mounting hole, and the needle plate is detachably connected with the supporting plate through the mounting hole.
More preferably: positioning holes are arranged among the test holes, and the positioning holes and the test holes are distributed in an array.
More preferably: the support plate is also provided with a first alignment hole, the circuit board is provided with a second alignment hole, and the second alignment hole is matched with the first alignment hole.
More preferably: the circuit board is also provided with a pinhole which is matched with the needle plate.
More preferably: the support plate is provided with a first through hole, the support plate is provided with a second through hole, and the first through hole and the second through hole are multiple.
More preferably: the support plate is provided with a first notch, the support plate is provided with a second notch, and the first notch and the second notch are arc-shaped and have different radians.
More preferably: the support plate is provided with a sliding groove, the support plate is provided with a sliding rail matched with the sliding groove, and the support plate is in sliding connection with the support plate.
More preferably: still include the clamp plate, be equipped with the via hole with test hole looks adaptation on the clamp plate.
Compared with the prior art, the method has the following technical effects:
1) When detecting a large-plate IC, the IC does not need to be cut into single grains, so that the detection step of the IC is simplified;
2) The multi-particle IC can be detected simultaneously, and the detection efficiency is effectively improved.
Of course, it is not necessary for any of the products of the present application to be practiced with all of the technical effects described above.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
FIG. 1 is an exploded view of the general structure of an embodiment of the present application;
FIG. 2 is a schematic diagram of a pallet structure according to an embodiment of the present application;
FIG. 3 is a schematic view of a support plate structure according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a circuit board structure according to an embodiment of the present application;
FIG. 5 is an overall structural assembly diagram of an embodiment of the present application;
fig. 6 is a general structural perspective view of an embodiment of the present application.
The figure indicates: 1. the test board comprises a supporting plate, 2, a supporting plate, 3, a needle plate, 4, a circuit board, 5, a pressing plate, 10, a large-plate IC (integrated circuit), 11, a test hole, 12, a positioning hole, 13, a second through hole, 14, a first notch, 21, a mounting hole, 22, a first through hole, 23, a first alignment hole, 24, a second notch, 41, a second alignment hole, 42 and a pinhole.
Detailed Description
The following detailed description will be given with reference to the accompanying drawings and examples, by which the implementation process of how the technical means are applied to solve the technical problems and achieve the technical effects can be fully understood and implemented.
Example 1: the fingerprint large-plate IC test fixture as shown in figures 1 and 2 comprises a supporting plate for placing a large-plate IC, wherein a supporting plate is arranged below the supporting plate, three mounting holes which are arrayed in a shape of one line and can be detachably connected with a needle plate are formed in the supporting plate;
the specific implementation mode of the technical scheme is as follows: the method comprises the steps that a large-plate IC after Coating spraying is placed on a supporting plate, because single-particle ICs in the technical scheme are arranged in an array and are arranged on the lower end face of the large-plate IC, a plurality of test holes vertically penetrating through a carriage are formed in the end face of the supporting plate, which is abutted against the lower end face of the large-plate IC, and the test holes can be matched with the ICs to be tested, namely, when the lower end face of the large-plate IC is abutted against the supporting plate, the ICs to be tested of the lower end face of the large-plate IC are embedded in the test holes, so that the large-plate IC is fixed on the upper end face of the supporting plate, at the moment, the pressing plate is pressed on one end face of the large-plate IC, so that the large-plate IC is fixed between the pressing plate and the supporting plate, at the moment, the whole test jig is connected with a power supply, and the circuit board can transmit electric energy to drive a test rubber head on a needle plate to detect the single-particle ICs on the large-plate IC; the IC with good Coating of the large plate in the traditional detection jig is eliminated, and the single-grain cutting is carried out to carry out the first part confirmation and the inspection confirmation.
Referring to fig. 1, the technical scheme adopted by the invention for solving the problems is as follows: the utility model provides a big board IC test fixture of fingerprint, includes layer board 1, still includes backup pad 2, is equipped with faller 3 and circuit board 4 in the backup pad 2, and faller 3 is connected with backup pad 2 detachably, and circuit board 4 is connected with faller 3 electricity.
Compared with the prior art, the technical scheme has the following advantages:
1) When detecting a large-plate IC, the IC does not need to be cut into single grains, so that the detection step of the IC is simplified;
2) The multi-particle IC can be detected simultaneously, and the detection efficiency is effectively improved.
More preferably: the supporting plate 1 is provided with a plurality of test holes 11, and the test holes 11 are matched with the IC to be tested; because the single IC in the technical scheme is arranged in an array and is arranged on the lower end face of the large plate, a plurality of test holes which vertically penetrate through the carriage are arranged on the end face of the supporting plate, which is propped against the lower end face of the large plate IC, and the test holes can be matched with the ICs to be tested, namely, when the lower end face of the large plate IC is propped against the supporting plate, the ICs to be tested on the lower end face of the large plate IC are embedded into the test holes, so that the large plate IC is fixed on the upper end face of the supporting plate; thereby preventing the large IC from easily generating displacement and sliding on the supporting plate.
More preferably: the supporting plate 2 is provided with a mounting hole 21, and the needle plate 3 is detachably connected with the supporting plate 2 through the mounting hole 21; in the embodiment, the mounting holes are three mounting holes which are arranged in parallel in a straight line, and in the embodiment, three single ICs on the lower end face of the large-plate IC can be detected simultaneously, so that the detection efficiency is improved, and meanwhile, the phenomenon that the needle plate is easily displaced during detection due to an inserting structure between the mounting holes and the needle plate is prevented; the working stability of the detection jig is improved.
More preferably: positioning holes 12 are arranged between the test holes 11, and the positioning holes 12 and the test holes 11 are distributed in an array.
More preferably: the support plate 2 is also provided with a first alignment hole 23, the circuit board 4 is provided with a second alignment hole 41, and the second alignment hole 41 is matched with the first alignment hole 23; the first alignment hole and the second alignment hole are set to ensure the fixed connection between the circuit board and the supporting plate, so that the phenomenon that the circuit board slides off on the supporting plate is prevented, and the stability of the whole test fixture is improved.
More preferably: the circuit board 4 is also provided with a pinhole 42, and the pinhole 42 is matched with the needle plate 3; the pin hole connection structure between the pin plate and the circuit board ensures that the circuit board can be fixedly connected with the pin plate, and improves the stability of pin plate detection.
More preferably: the support plate 2 is provided with a first through hole 22, the support plate 1 is provided with a second through hole 13, and the number of the first through holes 22 and the second through holes 13 is multiple; in this embodiment, the number of the first through holes and the second through holes may be 7; and the arrangement positions of the first through hole and the second through hole are the same.
More preferably: the supporting plate 1 is provided with a first notch 14, the supporting plate 2 is provided with a second notch 24, and the first notch 14 and the second notch 24 are arc-shaped and have different radians.
More preferably: the support plate 2 is provided with a chute, the support plate 1 is provided with a slide rail matched with the chute, and the support plate 1 is in sliding connection with the support plate 2; the setting of the sliding groove and the sliding rail further ensures that the combination of the supporting plate and the large-plate IC can freely slide on the supporting plate.
More preferably: the test device also comprises a pressing plate 5, wherein a via hole matched with the test hole 11 is arranged on the pressing plate 5; the through holes are arranged so that when gaps appear in the connection between the large-plate IC and the supporting plate in the detection process, a user can pass through the through holes through a pushing device so as to push the large-plate IC below the pressing plate, and therefore the large-plate IC is tightly attached to the supporting plate; because the gap between the large-plate IC and the supporting plate can influence the detection accuracy of the single IC, the through holes on the pressing plate improve the detection accuracy of the whole detection jig.
Of course, it is not necessary for any of the products of the present application to be practiced with all of the technical effects described above.
While the foregoing description illustrates and describes the preferred embodiments of the present invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as limited to other embodiments, and is capable of numerous other combinations, modifications and environments and is capable of changes or modifications within the scope of the inventive concept as described herein, either as a result of the foregoing teachings or as a result of the knowledge or technology in the relevant art. And that modifications and variations which do not depart from the spirit and scope of the invention are intended to be within the scope of the appended claims.
Claims (3)
1. The utility model provides a big board IC test fixture of fingerprint, includes layer board (1), its characterized in that: the device further comprises a support plate (2), wherein the support plate (2) is provided with a needle plate (3) and a circuit board (4), the needle plate (3) is detachably connected with the support plate (2), and the circuit board (4) is electrically connected with the needle plate (3); the support plate (1) is provided with a plurality of test holes (11), and the test holes (11) are matched with the IC to be tested; the needle plate (3) is detachably connected with the supporting plate (2) through the mounting holes (21); positioning holes (12) are formed among the test holes (11), and the positioning holes (12) and the test holes (11) are distributed in an array; the support plate (2) is also provided with a first alignment hole (23), the circuit board (4) is provided with a second alignment hole (41), and the second alignment hole (41) is matched with the first alignment hole (23); the circuit board (4) is also provided with a needle hole (42), and the needle hole (42) is matched with the needle plate (3); the support plate (2) is provided with a first through hole (22), the support plate (1) is provided with a second through hole (13), and the number of the first through holes (22) and the number of the second through holes (13) are multiple; be equipped with first breach (14) on layer board (1), be equipped with second breach (24) on backup pad (2), first breach (14) are convex and the radian is different with second breach (24).
2. The fingerprint large panel IC test fixture of claim 1, wherein: the support plate (2) is provided with a sliding groove, the support plate (1) is provided with a sliding rail matched with the sliding groove, and the support plate (1) is in sliding connection with the support plate (2).
3. The fingerprint large panel IC test fixture of claim 1, wherein: the test device also comprises a pressing plate (5), wherein a via hole matched with the test hole (11) is formed in the pressing plate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811540580.8A CN109579761B (en) | 2018-12-17 | 2018-12-17 | Fingerprint large-plate IC test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811540580.8A CN109579761B (en) | 2018-12-17 | 2018-12-17 | Fingerprint large-plate IC test fixture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109579761A CN109579761A (en) | 2019-04-05 |
| CN109579761B true CN109579761B (en) | 2024-04-09 |
Family
ID=65930442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811540580.8A Active CN109579761B (en) | 2018-12-17 | 2018-12-17 | Fingerprint large-plate IC test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109579761B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202502216U (en) * | 2012-02-21 | 2012-10-24 | 苏州莹琦电子科技有限公司 | IC unwelding detection device free of springs |
| CN205562747U (en) * | 2016-03-24 | 2016-09-07 | 东莞市紫桢电子有限公司 | Automatic IC chip test fixture |
| CN206311724U (en) * | 2016-12-27 | 2017-07-07 | 江苏凯尔生物识别科技有限公司 | Smart mobile phone fingerprint module justifying measurement jig |
| CN108738295A (en) * | 2018-05-22 | 2018-11-02 | 江西合力泰科技有限公司 | A kind of preparation process for the metal ring on the big plate of fingerprint recognition |
| CN209166393U (en) * | 2018-12-17 | 2019-07-26 | 江西合力泰科技有限公司 | A kind of finger grain large board IC test fixture |
-
2018
- 2018-12-17 CN CN201811540580.8A patent/CN109579761B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202502216U (en) * | 2012-02-21 | 2012-10-24 | 苏州莹琦电子科技有限公司 | IC unwelding detection device free of springs |
| CN205562747U (en) * | 2016-03-24 | 2016-09-07 | 东莞市紫桢电子有限公司 | Automatic IC chip test fixture |
| CN206311724U (en) * | 2016-12-27 | 2017-07-07 | 江苏凯尔生物识别科技有限公司 | Smart mobile phone fingerprint module justifying measurement jig |
| CN108738295A (en) * | 2018-05-22 | 2018-11-02 | 江西合力泰科技有限公司 | A kind of preparation process for the metal ring on the big plate of fingerprint recognition |
| CN209166393U (en) * | 2018-12-17 | 2019-07-26 | 江西合力泰科技有限公司 | A kind of finger grain large board IC test fixture |
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| Publication number | Publication date |
|---|---|
| CN109579761A (en) | 2019-04-05 |
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