CN109571945A - A kind of laser deposition planning parameters of scanning paths method - Google Patents
A kind of laser deposition planning parameters of scanning paths method Download PDFInfo
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- CN109571945A CN109571945A CN201811534597.2A CN201811534597A CN109571945A CN 109571945 A CN109571945 A CN 109571945A CN 201811534597 A CN201811534597 A CN 201811534597A CN 109571945 A CN109571945 A CN 109571945A
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- formation zone
- increasing material
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- material manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
- B29C64/141—Processes of additive manufacturing using only solid materials
- B29C64/153—Processes of additive manufacturing using only solid materials using layers of powder being selectively joined, e.g. by selective laser sintering or melting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
- B29C64/386—Data acquisition or data processing for additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention relates to a kind of laser deposition planning parameters of scanning paths methods, backlash is avoided by controlling the sequencing of formation zone using the formation zone that three constituency radius, temperature, distance standards choose execution increasing material manufacturing, heat input is reduced to the greatest extent, improves forming efficiency.By the way that the scanning direction of laser head is adjusted 90 degree of progress increasing material manufacturings, enhances associativity between layers, improve the quality of part.
Description
Technical field
The present invention relates to increases material manufacturing technology field more particularly to a kind of laser deposition planning parameters of scanning paths methods.
Background technique
After being layered, being sliced to part, program automatically to the cutting region auto-sequencing of each slicing layer, default
Sort method irregularities, equipment idle running track is more, and some regions hot stack is serious, influences to shape quick-acting rates and quality, needs
Cutting region sequence is manually adjusted, workload is very big, and the scanning track coincidence factor between original layers and duplicating layer is higher, shadow
Ring the associativity between original layers and duplicating layer.Therefore conventional method has that forming efficiency is low, part quality is poor.
Summary of the invention
In view of the above technical problems, the present invention provides a kind of laser deposition planning parameters of scanning paths method, comprising the following steps:
Threedimensional model is divided into n slicing layer, divided n slicing layer by S1, the threedimensional model for establishing part to be formed
Different laser scanning directions is arranged in class, different types of slicing layer, and n is positive integer, enables i=1；
S2, segmentation spacing is set according to the type of i-th layer of slicing layer adjustment laser scanning direction to i-th layer of progress increasing material manufacturing
Width is split i-th layer of slicing layer, divides m formation zone, m is positive integer；
S3, specified one is chosen from the m formation zone marked off as starting formation zone, starting formation zone is carried out increasing material system
It makes；
S4, next forming for executing increasing material manufacturing is chosen from the formation zone of unfinished increasing material manufacturing according to preset condition
Area；
S5, laser head are moved to selected next formation zone and carry out increasing material manufacturing, and to complete the formation zone of increasing material manufacturing into
Row record；
S6, judge that current layer whether there are also the formation zone for not completing increasing material manufacturing, if it is executes S4, if otherwise executed
S7；
S7, judge whether i is equal to n, if it is execute S9, if otherwise executing S8；
S8, i=i+1 is enabled, executes S2；
S9, end.
Further, step S1 is specifically included:
S101, the threedimensional model that part to be formed is established using three-dimensional software；
S102, threedimensional model is layered and is sliced, be divided into n slicing layer, slicing layer is numbered, n is sliced
Layer is divided into original layers and duplicating layer two types, wherein odd-level is original layers, and even level is duplicating layer；
S103, laser scanning direction, the scanning direction of original layers and the scanning of duplicating layer are arranged to original layers and duplicating layer respectively
Direction is in α degree, 0≤α≤90.
Further, setting segmentation spacing width makes between segmentation specifically, be arranged according to laser spot diameter in step S2
Away from less than or equal to laser spot diameter.
Further, next formation zone for executing increasing material manufacturing is chosen in step S4 specifically:
S401, default constituency radius and temperature threshold；
S402, pass through thermal imaging scan, obtain using the forming district center for being carrying out increasing material manufacturing as the center of circle, be with constituency radius
The temperature value of the formation zone of all unfinished increasing material manufacturings in the region of radius；
S403, the formation zone that the minimum formation zone of temperature value is next execution increasing material manufacturing is chosen；
If there is no the formation zone of unfinished increasing material manufacturing in S404, region, unfinished increasing material manufacturings all to current layer at
Shape area carries out thermal imaging scan, obtains the temperature value of each formation zone, chooses temperature value in temperature threshold formation zone below, surveys
Amount temperature value temperature threshold formation zone below with currently execute increasing material manufacturing formation zone between at a distance from, choose away from
It is next formation zone for executing increasing material manufacturing from shortest formation zone.
Further, temperature threshold is any value in 280 degrees Celsius to 400 degrees Celsius.
Further, α degree is adjusted in step S103 is specially 90 degree.
By adopting the above technical scheme, the invention has the advantages that:
After the layering of the threedimensional model of the part to be formed to foundation, slice, mark off n slicing layer, to slicing layer into
N slicing layer is divided into the original layers of odd-level and the duplicating layer two types of even level by row number.Increasing material is carried out to i-th layer
Manufacture adjusts laser scanning direction according to the type of i-th layer of slicing layer, segmentation spacing is set according to laser spot diameter, to i-th
Layer slicing layer is split, and marks off m formation zone, chooses specified one in formation zone as starting formation zone, from originate at
Shape area carries out increasing material manufacturing, and next forming for executing increasing material manufacturing is chosen in the continuous formation zone for never completing increasing material manufacturing
Area.Wherein the selection of next formation zone for executing increasing material manufacturing is chosen according to constituency radius, temperature, distance.Later
Judge whether all layerings of threedimensional model all complete increasing material manufacturing again, the scanning direction of laser head is adjusted into α if not
Formation zone is selected to carry out increasing material manufacturing after degree again, until increasing material manufacturing is all completed in all layerings.
This method is simple, easy to operate, reduces working strength, avoids backlash, and utmostly reduce heat input, simultaneously
By controlling the sequencing of formation zone, the input of heat is optimized, the generation of hot stack phenomenon is reduced, improves forming effect
Rate.By controlling the direction of scan path between layers, associativity between layers is enhanced, the matter of part is improved
Amount.
Detailed description of the invention
Fig. 1 shows laser deposition planning parameters of scanning paths method and process flow chart according to an embodiment of the invention；
Fig. 2 shows segmentation schematic diagrames according to an embodiment of the invention；
Fig. 3 shows scanning schematic diagram according to an embodiment of the invention；
Fig. 4 shows the flow chart for choosing next formation zone for executing increasing material manufacturing.
Wherein, 1 is original layers, and 11 be original layers sintering, and 2 be duplicating layer, and 21 be duplicating layer sintering, and 3 between segmentation
Away from 4 be sweep span.
Specific embodiment
With reference to embodiments, the present invention is further described in detail, but not limited to this.
In order to solve the problems such as forming efficiency is low, part quality is poor, the present invention provides a kind of laser deposition scan paths
Planing method.
As shown in Figure 1, a kind of laser deposition planning parameters of scanning paths method provided by the invention, which is characterized in that including with
Lower step:
Threedimensional model is divided into n slicing layer, divided n slicing layer by S1, the threedimensional model for establishing part to be formed
Different laser scanning directions is arranged in class, different types of slicing layer, and n is positive integer, enables i=1；
Wherein, the specific steps of step S1 are as follows:
S101, the threedimensional model that part to be formed is established using three-dimensional software；
S102, threedimensional model is layered and is sliced, be divided into n slicing layer, slicing layer is numbered, n is sliced
Layer is divided into 2 two types of original layers 1 and duplicating layer, wherein odd-level is original layers 1, and even level is duplicating layer 2；
S103, laser scanning direction, scanning direction and the duplicating layer 2 of original layers 1 are arranged to original layers 1 and duplicating layer 2 respectively
Scanning direction is in α degree, 0≤α≤90.
As shown in Figures 2 and 3, after the threedimensional model of part to be formed being layered and is sliced, it is divided into n slice
Layer, is numbered slicing layer, n slicing layer is divided into the original layers 1 of odd-level and 2 liang of types of duplicating layer of even level
Different laser scanning directions is arranged according to different types of slicing layer for type, and n is positive integer at this time, enables i=1.
Using above-mentioned steps, the threedimensional model by treating formation of parts is layered and is sliced, by slicing layer according to rule
Ordered arrangement is restrained, the sequencing of different slicing layer laser scannings is controlled, effectively avoids backlash.If all slices
The scan path of layer is consistent, then the caking property between each slicing layer of part after shaping is poor, and slicing layer is divided into 1 He of original layers
Duplicating layer 2 carries out increasing material manufacturing using different scan paths, has then greatly reinforced the caking property between each layer.This embodiment party
In formula, all slicing layers are divided into 2 two types of original layers 1 and duplicating layer.It in other embodiments, can be by all slices
Layer is divided into three classes, four classes or more, and different scan paths is respectively set in each type, and categorical measure is more, forming zero
Caking property between each layer of part is stronger, does not do excessive restriction herein.
When α is specially 90 degree, as shown in figure 3, the scanning direction of original layers 1 and the scanning direction of duplicating layer 2 are in 90 degree
When, 1 scanning direction of original layers is parallel to X-axis, and 2 scanning direction of duplicating layer is parallel to Y-axis, by respectively to original layers 1 and duplication
Increasing material manufacturing, the laser scanning of layer 2 are completed to treat the processing of the threedimensional model of formation of parts.In this way, make original layers 1
And the coincidence factor of the scanning track between two layers of duplicating layer 2 reduces, and enhances two layers of associativity, and then improve the matter of part
Amount.Certainly, the degree α of the scanning direction adjustment of laser head can be configured according to the actual situation, be not limited to 90 degree.
S2, segmentation is set according to the type of i-th layer of slicing layer adjustment laser scanning direction to i-th layer of progress increasing material manufacturing
3 width of spacing, is split each slicing layer, marks off m formation zone, and m is positive integer；
As shown in Fig. 2, in the present embodiment, being split to i-th layer of slicing layer, segmentation 3 width of spacing is according to laser facula
Diameter setting, segmentation spacing 3 are less than or equal to laser spot diameter, readily available better cutting effect.Sweep span 4 is by laser
Hot spot determines that laser scanning pitch 4 is less than or equal to laser spot diameter, avoids when using laser scanning to original layers 1 and multiple
Preparative layer 2 damages.By being split to i-th layer of slicing layer, m formation zone is marked off, increasing material is carried out one by one to formation zone
Manufacture effectively avoids backlash, reduces the generation of hot stack phenomenon.
S3, specified one is chosen from the m formation zone marked off as starting formation zone, the starting formation zone is carried out
Increasing material manufacturing；
In the present embodiment, one is specified to be used as original layers sintering 11, duplicating layer sintering in the m formation zone marked off
21, from specified original layers sintering 11, duplicating layer sintering 21 start carry out increasing material manufacturing, make whole operation process more added with
Sequence, rigorous, print scanned process is more accurate.
S4, chosen from the formation zone of unfinished increasing material manufacturing according to preset condition it is next execute increasing material manufacturing at
Shape area；
As shown in Figure 4, wherein next formation zone specific steps for executing increasing material manufacturing are chosen in step S4 are as follows:
S401, default constituency radius and temperature threshold；
In the present embodiment, constituency radius and temperature threshold is set in advance, the constituency radius and temperature threshold that have set are made
For the basis for choosing next formation zone for executing increasing material manufacturing in subsequent step.Wherein temperature threshold is 280 degrees Celsius to 400
Any value in degree Celsius.Preferable temperature threshold value is 350 degrees Celsius, and certainly, temperature threshold can be configured according to the actual situation.
S402, pass through thermal imaging scan, obtain using the forming district center for being carrying out increasing material manufacturing as the center of circle, with constituency half
Diameter is the temperature value of the formation zone of all unfinished increasing material manufacturings in the region of radius；
In the present embodiment, in conjunction with above step, the temperature of the formation zone of all unfinished increasing material manufacturings in predetermined region is determined
Value is carried out in next step based on these temperature values.
S403, the formation zone that the minimum formation zone of temperature value is next execution increasing material manufacturing is chosen；
By adopting the above technical scheme, the input for optimizing heat by controlling the sequencing of formation zone, avoids the occurrence of region thermal reactor
The serious phenomenon of product.
If there is no the formation zone of unfinished increasing material manufacturing in S404, region, unfinished increasing material manufacturings all to current layer
Formation zone carry out thermal imaging scan, obtain the temperature value of each formation zone, choose temperature value in temperature threshold forming below
Area measures temperature value at a distance from temperature threshold formation zone below is between the formation zone for currently executing increasing material manufacturing,
The shortest formation zone of selected distance is next formation zone for executing increasing material manufacturing.
In the present embodiment, in conjunction with above step, if there is no the formation zone of unfinished increasing material manufacturing in region, to current
The formation zone of all unfinished increasing material manufacturings of layer carries out thermal imaging scan, in the unfinished increasing material manufacturing lower than 350 degrees Celsius
In formation zone, the nearest region in the formed region of selected distance is next formation zone for executing increasing material manufacturing.
By adopting the above technical scheme, it reduces and occurs the phenomenon that empty track in equipment, it is serious to avoid the occurrence of region hot stack
The phenomenon that.
S5, laser head are moved to selected next formation zone and carry out increasing material manufacturing, and the forming to increasing material manufacturing is completed
Area is recorded；
In the present embodiment, using above-mentioned steps, precisely, orderly carries out increasing material manufacturing to formation zone, and then completes to each
The increasing material manufacturing of slicing layer improves the quality of forming efficiency and part.
S6, judge that current layer whether there are also the formation zone for not completing increasing material manufacturing, if it is executes S4, if otherwise held
Row S7；
S7, judge whether i is equal to n, if it is execute S9, if otherwise executing S8；
S8, i=i+1 is enabled, executes S2；
Using above-mentioned steps, to i-th layer of slicing layer laser scanning after carry out i+1 layer slicing layer laser scanning, until
N slicing layer scanning is completed.
S9 terminates.
The above, only presently preferred embodiments of the present invention and oneself, be not intended to limit the scope of the present invention.
Claims (6)
1. a kind of laser deposition planning parameters of scanning paths method, which is characterized in that comprising steps of
The threedimensional model is divided into n slicing layer by S1, the threedimensional model for establishing part to be formed, to the n slicing layer
Classify, different laser scanning directions is arranged in different types of slicing layer, and n is positive integer, enables i=1；
S2, segmentation is set according to the type of i-th layer of slicing layer adjustment laser scanning direction to i-th layer of progress increasing material manufacturing
Spacing width is split i-th layer of slicing layer, divides m formation zone, m is positive integer；
S3, specified one is chosen from the m formation zone marked off as starting formation zone, increasing material is carried out to the starting formation zone
Manufacture；
S4, next forming for executing increasing material manufacturing is chosen from the formation zone of unfinished increasing material manufacturing according to preset condition
Area；
S5, laser head are moved to selected next formation zone and carry out increasing material manufacturing, and to complete the formation zone of increasing material manufacturing into
Row record；
S6, judge that current layer whether there are also the formation zone for not completing increasing material manufacturing, if it is executes S4, if otherwise executed
S7；
S7, judge whether i is equal to n, if it is execute S9, if otherwise executing S8；
S8, i=i+1 is enabled, executes S2；
S9, end.
2. the method as described in claim 1, which is characterized in that the step S1 is specifically included:
S101, the threedimensional model that the part to be formed is established using three-dimensional software；
S102, the threedimensional model is layered and is sliced, be divided into n slicing layer, slicing layer is numbered, by n
Slicing layer is divided into original layers and duplicating layer two types, wherein odd-level is the original layers, and even level is the duplicating layer；
S103, laser scanning direction is arranged to the original layers and the duplicating layer respectively, the scanning direction of the original layers with
The scanning direction of the duplicating layer is in α degree, 0≤α≤90.
3. method according to claim 1 or 2, which is characterized in that in the step S2 setting segmentation spacing width specifically,
It is arranged according to laser spot diameter, makes to divide spacing less than or equal to the laser spot diameter.
4. method according to claim 1 or 2, which is characterized in that choose next execution increasing material manufacturing in the step S4
Formation zone specifically:
S401, default constituency radius and temperature threshold；
S402, pass through thermal imaging scan, obtain using the forming district center for being carrying out increasing material manufacturing as the center of circle, with the constituency half
Diameter is the temperature value of the formation zone of all unfinished increasing material manufacturings in the region of radius；
S403, the formation zone that the minimum formation zone of temperature value is next execution increasing material manufacturing is chosen；
If there is no the formation zone of unfinished increasing material manufacturing in S404, region, unfinished increasing material manufacturings all to current layer at
Shape area carries out thermal imaging scan, obtains the temperature value of each formation zone, chooses temperature value in temperature threshold formation zone below, surveys
The temperature value is measured at a distance from temperature threshold formation zone below is between the formation zone for currently executing increasing material manufacturing, choosing
Taking apart from shortest formation zone is next formation zone for executing increasing material manufacturing.
5. method as claimed in claim 4, which is characterized in that the temperature threshold is to appoint in 280 degrees Celsius to 400 degrees Celsius
One value.
6. method the invention according to any one of claims 2 to 5, which is characterized in that α degree is specially 90 in the step S103
Degree.
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| CN112427655A (en) * | 2020-10-20 | 2021-03-02 | 华中科技大学 | Laser selective melting real-time path planning method based on temperature uniformity |
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Application publication date: 20190405 |