CN105773967B - A kind of strip-type laser beam scan path planing method - Google Patents
A kind of strip-type laser beam scan path planing method Download PDFInfo
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- CN105773967B CN105773967B CN201610120719.8A CN201610120719A CN105773967B CN 105773967 B CN105773967 B CN 105773967B CN 201610120719 A CN201610120719 A CN 201610120719A CN 105773967 B CN105773967 B CN 105773967B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
- B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
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- Manufacturing & Machinery (AREA)
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- Laser Beam Processing (AREA)
Abstract
The invention discloses a kind of strip-type laser beam scan path planing method, including：Short path of crossing in each band subregion in part individual layer section is merged with being located at the scanning pattern on same path with it in adjacent sectors.The present invention is by optionally merging path, laser can effectively be avoided in scanning process, run into short path and do not turned off and open and close the problem of conjunction causes unbalanced stress at part profile boundary, and while part quality is improved, extend the service life of laser.User can also ensure part forming quality according to parts to be processed feature, sets itself shortest path length parameter at the same time.
Description
Technical field
The invention belongs to increases material manufacturing technology field, is related to a kind of strip-type laser beam scan path planing method.
Background technology
Increases material manufacturing technology is to be based on three-dimensional CAD model data, by way of increasing material and successively manufacturing.It is in terms of
Calculation machine Three Dimensional Design Model is source, by the way that software hierarchy is discrete and numerical control molding system, using high energy beam by material carry out by
Layer accumulation, final superposition shaping, produces entity products.
The process of increasing material manufacturing has many kinds, is broadly divided into the manufacture method based on automatic powder feeding system and powdering mode.
Manufacture method based on powdering mode includes selective laser melting process, its process is：First zero is designed on computers
The three-dimensional entity model of part, then carries out slicing delamination to the threedimensional model by cutting software, obtains the number of contours in each section
According to, and each layer cross section to obtaining is scanned path planning, these data are imported increasing material manufacturing equipment, power spreading device afterwards
One layer of powder is laid with shaping cylinder surfaces according to predetermined layer thickness, equipment is melted according to scanning pattern control laser selective
Change each layer dusty material, be progressively stacked into 3 d part.
Wherein, the method for path planning being scanned to each layer cross section of part is：Overall sweep is carried out to part individual layer section
Path planning is retouched, but can so cause forming process stress concentration, influences part forming quality.Produced to alleviate in forming process
Raw stress concentration phenomenon, usually carries out region division to part Single Slice Mode region, and is scanned road respectively to each subregion
Plan that common partitioned mode has strip-type and checkerboard type in footpath.Strip-type partition method is：Whole part individual layer section edge is swept
Retouch direction and be divided into multiple banded zones；Checkerboard type partition method is：Whole part individual layer section is divided into multiple chessboard areas
Domain.
When using strip-type partitioned mode, subarea-scanning path is carried out to the part individual layer section with irregular contour
After planning, its profile border nearby will necessarily produce short path, can be recurred when laser was carrying out short path scanning
Multiple hop, this, which results in laser, needs constantly to open in a short time, closes.It so can not only influence making for laser
It with the service life, while can make to produce stress concentration at part profile boundary, influence processing quality.
The content of the invention
The object of the present invention is to provide a kind of strip-type laser beam scan path planing method, solves existing strip-type laser
Scan method nearby produced the problem of short path causes laser to be constantly opened and closed because of wide border.
The technical solution adopted in the present invention is a kind of strip-type laser beam scan path planing method, including：By part list
Short path of crossing in each band subregion of layer cross section is merged with being located at the scanning pattern on same path with it in adjacent sectors.
The features of the present invention also resides in,
Specifically include following steps：
Step 1：Input three-dimensional part model each layer section file, cut into slices according to design of part feature to each layer of part into
Row strip-type subregion, and parallel line sweeping path planning is carried out to each band subregion；
Step 2：User-defined shortest path length is read in, is denoted as L；
Step 3：On the basis of L in step 2, since the side in part individual layer section, by every in each band subregion
Path length is compared with L, if current path length is less than or equal to L, by the path with being located in adjacent sectors with it
Scanning pattern on same path merges；
Step 4：All section paths of part are traveled through, export scanning pattern, the planning of path scanning pattern.
In step 2, L is less than or equal to single band peak width
Adjacent scan paths direction in each band subregion is identical or opposite.
The beneficial effects of the invention are as follows：A kind of strip-type laser beam scan path planing method, by optionally to path
Merge, can effectively avoid laser in scanning process, ran into short path and do not turn off and open and close conjunction and cause parts profile
The problem of boundary unbalanced stress, while part quality is improved, extend the service life of laser.User goes back at the same time
Part forming quality can be ensured according to parts to be processed feature, sets itself shortest path length parameter.
Brief description of the drawings
Fig. 1 is the schematic diagram that path merges in a kind of strip-type laser beam scan path planing method step 3 of the present invention.
Embodiment
Below in conjunction with the accompanying drawings and embodiment the present invention is described in detail.
A kind of strip-type laser beam scan path planing method of the present invention, will be too short in each band subregion in part individual layer section
Path is merged with being located at the scanning pattern on same path with it in adjacent sectors, wherein, it is adjacent in each band subregion
Scanning pattern direction is identical or opposite；Specific implementation step is as follows：
Step 1：Input three-dimensional part model each layer section file, cut into slices according to design of part feature to each layer of part into
Row strip-type subregion, and parallel line sweeping path planning is carried out to each band subregion；
Step 2：User-defined shortest path length is read in, is denoted as L, wherein, L is less than or equal to single band region
Width
As shown in Figure 1, step 3：On the basis of L in step 2, since the side in part individual layer section, by each band
In subregion per paths length compared with L, if current path length is less than or equal to L, by the path and adjacent sectors
It is interior to be located at the scanning pattern on same path with it and merge；
Step 4：All section paths of part are traveled through, export scanning pattern, the planning of path scanning pattern.
Scan method using the present invention, can effectively solve the problem that laser in scanning process, ran into short path and does not turn off
Conjunction is opened and closed, causes this problem of unbalanced stress at part profile boundary, while part quality is improved, extends laser
The service life of device.In addition, user can also ensure according to parts to be processed feature, sets itself shortest path length parameter
Part forming quality.
Claims (2)
- A kind of 1. strip-type laser beam scan path planing method, it is characterised in that including：By each band subregion in part individual layer section In cross short path merged with being located at the scanning pattern on same path with it in adjacent sectors, specifically include following step Suddenly：Step 1：Each layer section file of three-dimensional part model is inputted, is cut into slices according to design of part feature to each layer of part and carries out bar Belt subregion, and parallel line sweeping path planning is carried out to each band subregion；Step 2：User-defined shortest path length is read in, is denoted as L, L is less than or equal to single band peak widthStep 3：On the basis of L in step 2, since the side in part individual layer section, by every paths in each band subregion Length is compared with L, if current path length is less than or equal to L, the path is same with being located in adjacent sectors with it Scanning pattern on path merges；Step 4：All section paths of part are traveled through, export scanning pattern, the planning of path scanning pattern.
- A kind of 2. strip-type laser beam scan path planing method according to claim 1, it is characterised in that each band Adjacent scan paths direction in subregion is identical or opposite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610120719.8A CN105773967B (en) | 2016-03-03 | 2016-03-03 | A kind of strip-type laser beam scan path planing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201610120719.8A CN105773967B (en) | 2016-03-03 | 2016-03-03 | A kind of strip-type laser beam scan path planing method |
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| CN105773967A CN105773967A (en) | 2016-07-20 |
| CN105773967B true CN105773967B (en) | 2018-04-20 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| EP3520929A1 (en) * | 2018-02-06 | 2019-08-07 | Siemens Aktiengesellschaft | Method for selectively irradiating a material layer, manufacturing method and computer program product |
| CN108941560B (en) * | 2018-07-27 | 2019-06-11 | 中南大学 | A method of it eliminating Rene104 nickel base superalloy laser gain material and manufactures crackle |
| CN109359381B (en) * | 2018-10-16 | 2022-05-17 | 北京星航机电装备有限公司 | Laser path planning method based on voxels |
| CN109226759B (en) * | 2018-10-23 | 2020-07-10 | 大族激光科技产业集团股份有限公司 | Scanning path setting method and device for powder-spreading type laser 3D printing and control equipment |
| CN110053253B (en) * | 2019-03-26 | 2021-06-01 | 大族激光科技产业集团股份有限公司 | Optimization method and device for galvanometer scanning path |
| CN113681894B (en) * | 2020-05-18 | 2023-05-09 | 广东汉邦激光科技有限公司 | Scanning line quality optimization method, scanning line quality optimization device and printer |
| CN114594811B (en) * | 2020-12-03 | 2023-08-25 | 上海飞机制造有限公司 | Temperature adjustment method, device, equipment and storage medium in material laying process |
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| JP5764753B2 (en) * | 2012-07-09 | 2015-08-19 | パナソニックＩｐマネジメント株式会社 | Manufacturing method of three-dimensional shaped object |
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Address after: 710075 Xi'an high tech Zone, Shaanxi science and technology road, No. 48 venture Plaza A0508 Applicant after: Xi'an platinum power technology Limited by Share Ltd Address before: 710075 Xi'an high tech Zone, Shaanxi science and technology road, No. 48 venture Plaza A0508 Applicant before: Xi'an Bright Laser Technology Ltd. |
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