CN109570683B

CN109570683B - Lead welding device

Info

Publication number: CN109570683B
Application number: CN201811627465.4A
Authority: CN
Inventors: 赵凡奎; 许秀冬; 程志
Original assignee: Anhui Longxin Microtechnology Co ltd
Current assignee: Anhui Longxin Microtechnology Co ltd
Priority date: 2018-12-28
Filing date: 2018-12-28
Publication date: 2021-06-01
Anticipated expiration: 2038-12-28
Also published as: CN109570683A

Abstract

The invention relates to the technical field of electronic devices, in particular to a lead welding device which comprises an adjusting mechanism for adjusting the depth of a placing hole and a feeding mechanism for placing welding flux and PN junctions into the placing hole. The invention solves the problems of large labor amount and low efficiency of manual solder placement and PN junction in the prior art.

Description

Lead welding device

Technical Field

The invention relates to the technical field of electronic devices, in particular to a lead welding device.

Background

Among electronic devices, a diode is a device having two electrodes, which only allows current to flow in a single direction, and is widely used for circuit rectification.

The diode is provided with a PN junction and two pins, and the two pins are required to be respectively welded on the two sides of the PN junction when the diode is manufactured. However, since the diode pins are too small, the operation is troublesome during soldering, and therefore, in the prior art, the pins 3 are usually arranged on the wiring board 2 as shown in fig. 1 by a wiring machine, a plurality of placing holes 1 are provided on the wiring board 2, and the pins 3 are arranged on the wiring board 2 by suspending the heads of the pins 3 in the placing holes 1.

During actual welding, the welding flux, the PN junction and the welding flux are sequentially placed in the placing hole 1, then the other wire arrangement board 2 with the pins 3 arranged is reversely buckled on the wire arrangement board 2 with the welding flux and the PN junction, and finally the two wire arrangement boards 2 are heated together to weld the two pins 3 together. But all through the manual work in the prior art with solder and PN junction centre gripping to placing hole 1 one by one, not only the amount of labour is big, and efficiency is not high.

Disclosure of Invention

The invention aims to provide a lead welding device to solve the problems that in the prior art, manual placement of welding flux and PN junction labor is large and efficiency is low.

In order to achieve the purpose, the invention provides the following technical scheme:

the lead welding device comprises an adjusting mechanism for adjusting the depth of the placing hole and a feeding mechanism for placing solder and PN junctions into the placing hole.

The principle and the beneficial effect of the scheme are as follows:

the feeding structure is used for placing welding flux and PN junctions into the placing holes in the wire arranging plate, and the adjusting mechanism is used for adjusting the depth of the placing holes, so that only one welding flux or PN junction can be placed into the placing holes at each time. Because place downthehole two solders and a PN knot of holding simultaneously, if do not adjust the degree of depth of placing the hole, lead to one easily when placing first solder to place downthehole two or three solders, also lead to one easily when placing the PN knot and place downthehole two PN knots, this just needs the later stage manual work to inspect and handle, has increased the amount of labour, has reduced work efficiency.

According to the invention, the feeding mechanism is adopted to automatically put the solder and the PN junction into the placing hole, so that the labor amount is reduced, and the working efficiency of pin welding is improved. In addition, the depth of the placing hole is adjusted, so that only one solder or PN junction can be placed in the placing hole each time, the workload of manual later-stage inspection is reduced, and the pin welding efficiency is further improved.

Furthermore, the invention also comprises a support, wherein a plurality of jacks for inserting pins are arranged on the support, and the adjusting mechanism is arranged at the bottom of the support. The support is used for supporting the wiring board, and the jack is used for inserting the pin on the wiring board.

Further, adjustment mechanism includes a supporting bench, is provided with a plurality of fixed orificess that are used for fixed pin on the supporting bench, and the support below is provided with the base, and sliding connection has the support column on the base, is connected with the rack between support column and the support, and the meshing of rack one side has the gear, and gear connection has actuating mechanism. The support table is used for fixing pins and preventing the pins from moving, the base is used for connecting the support columns, the driving mechanism is used for driving the gears to rotate, and the gears drive the racks to move in the vertical direction so that the support moves in the vertical direction; the bracket drives the wire arranging plate to move in the vertical direction, and the pins are inserted into the jacks and do not move, so that the pins move reversely in the placing holes relative to the wire arranging plate, and the depth of the placing holes is adjusted.

Furthermore, the driving mechanism comprises a hand wheel which is coaxially connected with the gear, and scales are arranged on the hand wheel. Because the thickness of the solder and the PN junction is small, the gear needs to be small, the rack moves by the thickness of the solder or the PN junction by controlling the angle of 1 or more teeth of the gear, and the depth of the placing hole is correspondingly adjusted. However, the gear is too small and is not convenient for manual operation, so that the hand wheel is connected for manual holding, the size of the hand wheel is not limited, and the hand wheel can be manufactured according to actual conditions so as to facilitate manual operation. The scale on the hand wheel is set according to the angle that the gear needs to rotate at every turn, and the workman can rotate the hand wheel according to the scale and drive the gear and rotate, has improved the operating accuracy.

Furthermore, the feeding mechanism comprises a scraping plate which is arranged in a sliding mode, and one side of the scraping plate is connected with a power mechanism which drives the scraping plate to slide. The power mechanism is used for driving the scraper blade to move, evenly lays the solder or the PN junction at one end of the flat cable arranging plate, then drives the scraper blade to move the solder or the PN junction from one end of the flat cable arranging plate to the other end, on one hand, the solder or the PN junction can enter the placing hole, and on the other hand, redundant solder or PN junction can be scraped from the flat cable arranging plate.

Furthermore, the inclined plate is obliquely arranged at the bottom of the scraper, the protection plates are arranged on two sides of the scraper, a feeding groove for conveying welding flux and PN junctions is formed among the scraper, the inclined plate and the protection plates, and the opening of the feeding groove is far away from the power mechanism. Compared with a vertical scraper plate, the inclined plate can better push solder and PN junctions on the wire arranging plate; the protection plate is used for preventing welding flux or PN junctions from falling off from two sides of the wire arranging plate in the material pushing process.

Furthermore, a feeding channel for conveying the welding flux and the PN junction is formed in the scraper in a hollow mode, and a cleaning plate is arranged on one side, close to the power mechanism, of the scraper. The feeding channel is used for feeding the solder or the PN junction into the placing hole and placing the solder and the PN junction through the feeding channel, so that redundant solder can be prevented from scattering on the wire arranging plate, and the workload of subsequently recovering the solder and the PN junction is reduced; the cleaning plate is used for cleaning a small part of solder or PN junctions which accidentally fall onto the wire arranging plate. Furthermore, a recycling box can be detachably arranged on one side of the support, and the recycling box and the power mechanism are respectively arranged on two sides of the support. The collection box is used for collecting the solder or PN junction scraped from the wire arrangement plate, avoids waste, and does not need manual collection.

Furthermore, a mounting frame is hinged to one side of the support, and the power mechanism is arranged on the mounting frame. The mounting frame is used for mounting the power mechanism, the power mechanism is mounted on the support through the mounting frame, and the power mechanism can move along with the support, so that the scraper plate moves along with the support, the scraper plate is always abutted against the wire arranging plate, the position of the scraper plate does not need to be additionally adjusted, and the operation is convenient; the mounting frame is hinged to the support, after solder and PN junctions are placed and completed, the scraper can leave from the upper portion of the winding displacement plate by rotating the mounting frame, and the winding displacement plate is convenient to take down from the support.

Furthermore, an elastic sleeve is sleeved outside the rack, two ends of the elastic sleeve are respectively connected with the support and the base, and the hand wheel is positioned outside the elastic sleeve. Elastic sleeve can form the lag outside gear and rack, avoids impurity such as dust adhesion on rack or gear, influences its normal operating.

Drawings

FIG. 1 is a schematic diagram of a prior art flat cable arrangement;

FIG. 2 is a longitudinal cross-sectional view of a first embodiment of the present invention;

fig. 3 is a longitudinal sectional view of a second embodiment of the present invention.

Detailed Description

The following is further detailed by way of specific embodiments:

reference numerals in the drawings of the specification include: the device comprises a placing hole 1, a wire arranging plate 2, pins 3, a cylinder 4, a mounting rack 5, a hand wheel 6, an elastic sleeve 7, a base 8, a scraping plate 9, an inclined plate 10, a support 11, a recycling box 12, a rack 13, a gear 14, a support column 15, a fixing hole 16, a support table 17, a cleaning plate 18 and a feeding channel 19.

Example one

As shown in fig. 2, the lead welding device of the invention comprises a bracket 11, wherein the bracket 11 is used for placing a wire arranging plate 2, a plurality of jacks for inserting pins 3 are vertically arranged on the bracket 11, and an adjusting mechanism for adjusting the depth of a placing hole 1 is arranged below the bracket 11. Adjustment mechanism is including setting up a supporting bench 17 in support 11 below, sets up a plurality of fixed orificess 16 that are used for fixed pin 3 on supporting bench 17, and support 11 below still is provided with base 8, and base 8's quantity is two, and equal vertical elastic sleeve 7 that is connected between two bases 8 and the support 11. Equal sliding connection has support column 15 in two bases 8, and support column 15 is located elastic sleeve 7, all is connected with rack 13 between two support columns 15 and the support 11, and two rack 13 right sides all mesh there is gear 14. The gear 14 is connected with a driving mechanism, the driving mechanism comprises a hand wheel 6 which is coaxially connected with the gear 14, and scales are carved on the hand wheel 6.

The support 11 is provided with a feeding mechanism for placing solder and PN junctions into the placing hole 1, the feeding mechanism comprises a scraping plate 9 which is arranged in a sliding manner, the left side of the scraping plate 9 is connected with a power mechanism for driving the scraping plate to slide, and the power mechanism adopts a cylinder 4 in the embodiment. The support 11 left side articulates there is mounting bracket 5, and cylinder 4 installs on mounting bracket 5. Inclined plates 10 are obliquely welded at the bottom of the scraper 9, protective plates (not shown in the figure) are vertically welded at two sides of the scraper 9, and the protective plates are perpendicular to the scraper 9; and a feeding groove for conveying welding materials and PN junctions is formed among the scraping plate 9, the inclined plate 10 and the protection plate, and the opening of the feeding groove faces the right. 11 right sides demountable installation of support has collection box 12, and specific mounting means is: the support 11 is provided with a sliding groove, the bottom of the recycling box 12 is connected with a sliding block in a gluing mode, and the sliding block is connected in the sliding groove in a sliding mode.

In actual use, the wiring board 2 on which the pins 3 are arranged is placed on the bracket 11 so that the placing hole 1 is opened upward, while the pins 3 are inserted through the insertion holes in the bracket 11 and inserted into the fixing holes 16 in the support table 17. Initially, the head of the pin 3 is located at the bottom of the placing hole 1, and the depth of the placing hole 1 is equal to the thickness of two solders plus one PN junction. The depth of placing the hole 1 is changed by adjusting the heights of the bracket 11 and the wire arranging plate 2, and the specific adjusting mode is as follows: the hand wheel 6 is manually held, and the hand wheel 6 is rotated according to the scale on the hand wheel 6, so that the gear 14 coaxially connected with the hand wheel 6 is driven to rotate. The gear 14 drives the rack 13 engaged therewith to move in the vertical direction, thereby driving the bracket 11 to move in the vertical direction, and thus driving the wire arranging plate 2 to move in the vertical direction. Since the pins 3 are merely hung on the wiring board 2 and the pins 3 are inserted into the fixing holes 16, the pins 3 do not move when the wiring board 2 moves, so that the heads of the pins 3 can move in the placing holes 1 relative to the wiring board 2, thereby realizing the adjustment of the depth of the placing holes 1.

In practical application, the gear 14 needs to be manufactured according to the specific thicknesses of the solder and the PN junction, so that the rack 13 can be driven to move by the same height as the thickness of one solder or one PN junction by rotating the gear 14 by one or two teeth, and the depth of the placing hole 1 can be correspondingly adjusted. Because the gear 14 is too small in size and inconvenient to hold manually, the hand wheel 6 is coaxially connected to the gear 14, the size of the hand wheel 6 is not limited, and the size of the hand wheel 6 can be set according to actual conditions so as to facilitate manual holding operation. In addition, the invention also arranges scales on the hand wheel 6 as the standard for workers to rotate the hand wheel 6.

The specific operation of adjusting the depth of the placing hole 1 is as follows:

for the first time: two scales are driven by a worker to rotate anticlockwise according to the scales, the handwheel 6 drives the gear 14 to rotate anticlockwise, the gear 14 drives the rack 13 to move downwards, the downwards moving distance of the rack 13 corresponds to the thickness of one solder plus one PN junction, and therefore the depth of the placing hole 1 is reduced by the distance of the thickness of one solder plus one PN junction, namely the placing hole 1 can only contain one solder at the moment. The placing hole 1 is convenient for placing a solder, and a plurality of solders are prevented from being arranged in the placing hole 1. And (3) for the second time: the hand wheel 6 is rotated clockwise to enable the wire arranging plate 2 to move upwards, so that the depth of the placing hole 1 is increased by the thickness of a PN junction, and the PN junction is conveniently placed into the placing hole 1. And thirdly: clockwise rotation hand wheel 6 drives the winding displacement board 2 rebound once more for place the thickness of the degree of depth increase solder of hole 1, place the hole 1 promptly and become initial degree of depth, can put into placing hole 1 with second solder this moment.

After the first adjustment is completed, the feeding mechanism is started to place the solder into the placing hole 1, and the specific operation is as follows:

the solder is evenly laid at the left end of the wire arranging plate 2 manually, then the cylinder 4 is started to drive the scraper blade 9 to move from the left end to the right end of the wire arranging plate 2, and the scraper blade 9 pushes the solder to move from the left end to the right end of the wire arranging plate 2. The solder can fall into the placing hole 1 when passing through the placing hole 1, and the solder which does not fall into the placing hole 1 is pushed by the scraper 9 to the right side of the bracket 11 and recovered in the recovery box 12. The placement of the solder is thus completed, and since the depth of the placement hole 1 has been adjusted to accommodate only one solder at this time, there is no case where there are a plurality of solders in one placement hole 1. In practical application, the width of the scraper plate 9 is the same as that of the wiring board 2, so that solder is placed in each placing hole 1.

After the second and third adjustments are completed, the above processes are repeated, and then the PN junction and the solder can be placed in the placing hole 1. After the second piece of solder is placed, the mounting bracket 5 is rotated counterclockwise so that the scraper 9 is away from the top of the wire arranging plate 2. Then, another wiring board 2 on which the pins 3 are arranged is rewound on the wiring board 2 so that the heads of the pins 3 on the other wiring board 2 are in contact with the uppermost solder in the placement holes 1. And finally, the two wire arrangement plates 2 are taken down and heated together, so that the pins 3 on the two wire arrangement plates 2 are welded together, and the welding of the pins 3 is completed.

Example two

As shown in fig. 3, the present embodiment is different from the first embodiment in that the interior of the squeegee 9 is hollowed to form a feed passage 19 for solder and a PN junction, and the solder or the PN junction is placed in the feed passage 19 in actual use, and then the squeegee 9 is pushed to move leftward. When the scraper 9 moves to the placing hole 1, the solder or PN junction in the scraper 9 can smoothly drop into the placing hole 1; when the scraper blade 9 is not moved to the placing hole 1, the opening at the bottom of the feeding channel 19 can be blocked by the wire arranging plate 2, and the solder and the PN junction can not fall out, so that the redundant solder is prevented from scattering on the wire arranging plate 2. Of course, the situation that the solder and the PN junction fall onto the flat cable board 2 is inevitably generated in the actual operation process, so the cleaning plate 18 is connected to the left side of the scraper 9, and the cleaning plate 18 can scrape the solder or the PN junction which accidentally falls onto the flat cable board 2 into the recovery box 12 while the scraper 9 moves to the right.

According to the invention, the feeding mechanism is utilized to automatically place the solder or the PN junction into the placing hole 1, so that the labor amount is reduced, and the welding efficiency of the pin 3 is improved. In addition, the depth of the placing holes 1 is adjusted through the adjusting mechanism, redundant solder or PN junctions are prevented from being placed in one placing hole 1, manual post-inspection is not needed, and the welding efficiency of the pins 3 is further improved.

The foregoing is merely an example of the present invention and common general knowledge of known specific structures and features of the embodiments is not described herein in any greater detail. It should be noted that, for those skilled in the art, without departing from the structure of the present invention, several changes and modifications can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the effect of the implementation of the present invention and the practicability of the patent. The scope of the claims of the present application shall be determined by the contents of the claims, and the description of the embodiments and the like in the specification shall be used to explain the contents of the claims.

Claims

1. Lead welding device, its characterized in that: comprises an adjusting mechanism for adjusting the depth of a placing hole and a feeding mechanism for placing solder and a PN junction into the placing hole; the feeding mechanism comprises a scraping plate which is arranged in a sliding manner, and one side of the scraping plate is connected with a power mechanism for driving the scraping plate to slide; an inclined plate is obliquely arranged at the bottom of the scraper, protection plates are arranged on two sides of the scraper, a feeding groove for conveying welding materials and PN junctions is formed among the scraper, the inclined plate and the protection plates, and an opening of the feeding groove is far away from the power mechanism; the adjusting mechanism comprises a supporting table, a plurality of fixing holes for fixing pins are formed in the supporting table, a base is arranged below the support, a supporting column is connected to the base in a sliding mode, a rack is connected between the supporting column and the support, a gear is meshed with one side of the rack, and the gear is connected with a driving mechanism; the scraper blade is hollow inside to form a feeding channel for conveying welding flux and PN junctions, and a cleaning plate is arranged on one side of the scraper blade close to the power mechanism.

2. The wire bonding apparatus of claim 1 wherein: the pin inserting device is characterized by further comprising a support, wherein a plurality of inserting holes for inserting pins are formed in the support, and the adjusting mechanism is arranged at the bottom of the support.

3. The wire bonding apparatus of claim 2 wherein: the driving mechanism comprises a hand wheel coaxially connected with the gear, and scales are arranged on the hand wheel.

4. The wire bonding apparatus of claim 3 wherein: the recycling bin is detachably arranged on one side of the support, and the recycling bin and the power mechanism are respectively arranged on two sides of the support.

5. The wire bonding apparatus of claim 4 wherein: one side of the support is hinged with a mounting frame, and the power mechanism is arranged on the mounting frame.

6. The wire bonding apparatus of claim 5 wherein: the rack is sleeved with an elastic sleeve, two ends of the elastic sleeve are connected with the support and the base respectively, and the hand wheel is located outside the elastic sleeve.