CN109564853A - Base board checking device, substrate board treatment, substrate inspecting method and substrate processing method using same - Google Patents

Base board checking device, substrate board treatment, substrate inspecting method and substrate processing method using same Download PDF

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Publication number
CN109564853A
CN109564853A CN201780047626.XA CN201780047626A CN109564853A CN 109564853 A CN109564853 A CN 109564853A CN 201780047626 A CN201780047626 A CN 201780047626A CN 109564853 A CN109564853 A CN 109564853A
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China
Prior art keywords
substrate
holding portion
image data
base board
checking device
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Granted
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CN201780047626.XA
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Chinese (zh)
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CN109564853B (en
Inventor
柏山真人
C·佩丘莱斯基
森田彰彦
松尾友宏
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements

Abstract

The present invention is kept the substrate by rotating holding portion in a manner of enabling substrate to rotate.When carry out first is shot, the substrate kept by rotating holding portion is shot by shoot part, thus generates the first image data for indicating the image of substrate.After the shooting of carry out first, substrate is set only to rotate prespecified angle by rotating holding portion.When progress second count is taken the photograph after rotating substrate, the substrate kept by rotating holding portion is shot by shoot part, thus generates the second image data for indicating the image of substrate.Based on the first image data and the second image data, determine that the surface state of substrate has zero defect.

Description

Base board checking device, substrate board treatment, substrate inspecting method and processing substrate Method
Technical field
Base board checking device, substrate board treatment, substrate inspecting method of the present invention about a kind of inspection for carrying out substrate And substrate processing method using same.
Background technique
In substrate board treatment, rotate the substrate horizontally supported by rotary chuck.Under the state, by substrate The central portion of upper surface sprays the coating liquids such as resist liquid, and coated film is integrally formed on the surface of the substrate.By that will apply Make its development after film exposure, and forms scheduled pattern in coated film.Herein, if the surface of substrate is non-uniform state, Then the state after each section exposure of substrate generates uneven, and the processing that substrate occurs is bad.Therefore, substrate is carried out sometimes The inspection of surface state.
A kind of substrate board treatment with surface inspection processing unit is described in patent document 1.At surface inspection It manages in unit, illumination light is constantly irradiated to the radius region on substrate, carrys out the reflected light of self-reference substrate by CCD (charge Coupled device: charge-coupled device) line sensor received.Under the state, turned around by substrate rotation, and to substrate Surface overall exposure illumination light, and based on ccd line sensor light income distribution, obtain the reflection of the entire surface of substrate The distribution of the brightness of light is as surface image data.Based on surface image data, determine whether the surface state of substrate is normal.
Patent document 1: Japanese Patent Laid-Open 2011-66049 bulletin.
Summary of the invention
Problem to be solved by the invention
In inspection, the defect of the surface state of substrate is preferably detected with high precision.Thus it would be desirable to achieve can with than with Toward the check device and method of the defect of the surface state of high accuracy detection substrate.
The object of the present invention is to provide the substrate inspections that one kind can detect the defect of the surface state of substrate with high precision Look into device, substrate board treatment, substrate inspecting method and substrate processing method using same.
To the means solved the problems, such as
(1) base board checking device of one embodiment of the present invention, wherein rotating holding portion is included, so that substrate can The mode of rotation keeps the substrate, and shoot part is set as shooting the substrate kept by rotating holding portion, the first shooting control Portion processed controls shoot part, to generate the first image data for indicating the image of substrate, the first rotation when carry out first is shot Turn control unit, control rotating holding portion, to make substrate only rotate prespecified angle, the second shooting after the shooting of carry out first Control unit controls shoot part, to generate for indicating base when progress second count is taken the photograph after the first rotation control unit rotates substrate The second image data and determination unit of the image of plate are based on the first image data and the second image data, determine the table of substrate Surface state has zero defect.
In the base board checking device, the substrate is kept in a manner of enabling substrate to rotate by rotating holding portion.Into When row first is shot, the substrate kept by rotating holding portion is shot, thus generates the of the image for indicating substrate One image data.After the shooting of carry out first, substrate is set only to rotate prespecified angle by rotating holding portion.Revolve substrate When progress second count is taken the photograph after turning, the substrate kept by rotating holding portion is shot, the figure for indicating substrate is thus generated Second image data of picture.Based on the first image data and the second image data, determine that the surface state of substrate has zero defect.
According to this structure, on the surface of the substrate by the first pictorial data representation and by the base of the second pictorial data representation The situation on the surface of plate, gloss etc. is different.Therefore, on the surface of the substrate the situation of existing defects when, which clearly occurs A possibility that in the image by least one of the first image data and the second image data pictorial data representation, improves.It is logical It crosses in such manner, it is possible to detect the defect of the surface state of substrate with high precision.
(2) shoot part is also can include: and light-projecting portion, injection extend to obtain light longer than the diameter of substrate in a first direction, And acceptance part, the reflected light for carrying out self-reference substrate is received, the first image data or the second image data are generated based on light income；Substrate Check device further include: relative movement portion is set as enabling shoot part and rotating holding portion in the intersected with first direction It is relatively moved on two directions or the third direction opposite with second direction, so that the illumination from light-projecting portion is incident upon substrate The entirety in one face, first movement control unit control relative movement portion, to make shoot part and rotation when carry out first is shot Maintaining part relatively moves in a second direction and the second mobile control division, controls relative movement portion, to carry out second count When taking the photograph, move shoot part and rotating holding portion relatively on third direction.
When the situation, substrate is moved back and forth relatively with shoot part by relative movement portion, thus generate the first shooting number According to and the second photographed data.Moreover, small-sized shoot part can be used to shoot the entirety in a face of substrate.Pass through this Sample can obtain the first photographed data and the second photographed data in a short time, and can reduce the volume of base board checking device.
(3) relative movement portion also may include mobile maintaining part, and mobile maintaining part keeps rotating holding portion and keeps rotation Portion is moved up relative to shoot part in second direction or third party.It, can be in simple structure to the one of substrate when the situation The entirety in a face is shot.
(4) light-projecting portion can also separate separate configurations with acceptance part.When the situation, the freedom of the configuration of shoot part can be improved Degree.
(5) base board checking device also may be used further include: direction determining portion determines the court of the substrate kept by rotating holding portion To and the second rotation control unit, rotating holding portion is controlled based on the direction of the substrate that is determined by direction determining portion, with Make substrate towards specific direction before carrying out the first shooting.In this way, uniformly multiple substrates can be checked.
(6) base board checking device also may be used further include: control rotating holding portion, rotate substrate in the second rotation control unit Before, make at least one circle of substrate rotation and recess test section, the recess of the substrate rotated by third rotation control unit is carried out Detection；The rotation angle of substrate when direction determining portion is based on the recess for detecting substrate in recess test section determines substrate Direction.When the situation, the direction of substrate can be accurately determined in simple structure.
(7) first rotation control units control rotating holding portion so that carry out first shoot when substrate direction with Carry out substrate when the second shooting towards not parallel.In this way, on the surface of the substrate the situation of existing defects when, can be into one Step improves a possibility that defect is clearly appeared in by the image of the first image data or the second pictorial data representation.
(8) prespecified angle also can be the angle of 90 degree of odd-multiple.When the situation, by the first pictorial data representation Substrate surface the case where, surface with the substrate by the second pictorial data representation the case where have it is more different.In this way, On the surface of the substrate when the situation of existing defects, it can further improve the defect and clearly appear in by the first image data or A possibility that in the image of two pictorial data representations.
(9) substrate board treatment of another embodiment of the present invention, wherein include film forming portion, coating liquid is supplied To the surface of substrate, coated film thus is formed on surface, the base board checking device of one embodiment of the present invention is formed to by film The surface state that portion forms the substrate of coated film is checked and transport mechanism, in film forming portion and base board checking device Between transport substrate.
In the substrate board treatment, coating liquid is supplied to the surface of substrate by film forming portion, is thus formed and is applied on surface Applying film.It is transported on surface by the substrate that film forming portion forms coated film by transport mechanism.By above-mentioned check device pair It is checked by the surface state of the substrate of transport mechanism conveying.
In base board checking device, the substrate is kept in a manner of enabling substrate to rotate by rotating holding portion.Carry out When the first shooting, the substrate kept by rotating holding portion is shot, first for indicating the image of substrate is thus generated Image data.After the shooting of carry out first, substrate is set only to rotate prespecified angle by rotating holding portion.Rotate substrate When progress second count is taken the photograph afterwards, the substrate kept by rotating holding portion is shot, the image for indicating substrate is thus generated The second image data.Based on the first image data and the second image data, determine that the surface state of substrate has zero defect.
According to this structure, on the surface of the substrate by the first pictorial data representation and by the base of the second pictorial data representation The situation on the surface of plate, gloss etc. is different.Therefore, on the surface of the substrate the situation of existing defects when, which clearly occurs A possibility that in the image by least one of the first image data and the second image data pictorial data representation, improves.It is logical It crosses in such manner, it is possible to detect the defect of the surface state of substrate with high precision.
(10) substrate inspecting method of another embodiment of the invention, wherein include: by rotating holding portion so that substrate The mode that can be rotated keeps the substrate, when carry out first is shot, shoots to the substrate kept by rotating holding portion, by This generates the first image data for indicating the image of substrate, after the shooting of carry out first, makes substrate only by rotating holding portion Prespecified angle is rotated, when progress second count is taken the photograph after rotating substrate, the substrate kept by rotating holding portion is carried out Shooting thus generates the second image data for indicating the image of substrate, and is based on the first image data and the second image Data determine that the surface state of substrate has zero defect.
According to the substrate inspecting method, the substrate is kept in a manner of enabling substrate to rotate by rotating holding portion.Into When row first is shot, the substrate kept by rotating holding portion is shot, thus generates the of the image for indicating substrate One image data.After the shooting of carry out first, substrate is set only to rotate prespecified angle by rotating holding portion.Revolve substrate When progress second count is taken the photograph after turning, the substrate kept by rotating holding portion is shot, the figure for indicating substrate is thus generated Second image data of picture.Based on the first image data and the second image data, determine that the surface state of substrate has zero defect.
According to this method, on the surface of the substrate by the first pictorial data representation and by the base of the second pictorial data representation The situation on the surface of plate, gloss etc. is different.Therefore, on the surface of the substrate the situation of existing defects when, which clearly occurs A possibility that in the image by least one of the first image data and the second image data pictorial data representation, improves.It is logical It crosses in such manner, it is possible to detect the defect of the surface state of substrate with high precision.
(11) substrate processing method using same of another embodiment of the invention, wherein include: to be supplied coating liquid by film forming portion To the surface of substrate, coated film thus is formed on surface, coated film is formd by film forming portion on surface by transport mechanism Substrate transported, and to the surface state of the substrate transported by transport mechanism checked as claim 10 base The step of plate inspection method.
According to the substrate processing method using same, coating liquid is supplied to the surface of substrate by film forming portion, is thus formed on surface Coated film.It is transported on surface by the substrate that film forming portion forms coated film by transport mechanism.It is examined by aforesaid substrate Checking method checks the surface state of the substrate transported by transport mechanism.
According to aforesaid substrate inspection method, the substrate is kept in a manner of enabling substrate to rotate by rotating holding portion.? When carrying out the first shooting, the substrate kept by rotating holding portion is shot, to generate the image for indicating substrate First image data.After the shooting of carry out first, substrate is set only to rotate prespecified angle by rotating holding portion.Make substrate When progress second count is taken the photograph after rotation, the substrate kept by rotating holding portion is shot, is thus generated for indicating substrate Second image data of image.Based on the first image data and the second image data, determine that the surface state of substrate has zero defect.
According to this method, on the surface of the substrate by the first pictorial data representation and by the base of the second pictorial data representation The situation of gloss on the surface of plate etc. is different.Therefore, on the surface of the substrate the situation of existing defects when, which clearly goes out Now by the image of at least one of the first image data and the second image data pictorial data representation a possibility that, improves. In this way, the defect of the surface state of substrate can be detected with high precision.
Invention effect
In accordance with the invention it is possible to detect the defect of the surface state of substrate with high precision.
Detailed description of the invention
Fig. 1 is the perspective view for indicating the appearance of base board checking device of one embodiment of the present invention.
Fig. 2 is the schematic side elevation for indicating the composition of inside of base board checking device.
Fig. 3 is the schematic plan for indicating the composition of inside of base board checking device.
Fig. 4 is the block diagram for indicating the composition of the field controller to control base board check device.
Fig. 5 is the figure to illustrate the movement of base board checking device.
Fig. 6 is the figure to illustrate the movement of base board checking device.
Fig. 7 is the flow chart for indicating the movement of the main control unit of field controller of Fig. 4 in inspection processing.
Fig. 8 is the flow chart for indicating the movement of the main control unit of field controller of Fig. 4 in inspection processing.
Fig. 9 is the schematic plan for indicating to have the substrate board treatment of base board checking device of Fig. 1.
Figure 10 is showing for the Inner Constitution of the coating processing unit for indicating Fig. 9, development treatment portion and cleaning-drying processing unit Meaning property side view.
Figure 11 is the top view for indicating the composition of coating processing unit.
Figure 12 is the schematic side elevation for indicating the heat treatment portion of Fig. 9 and being cleaned and dried the Inner Constitution of processing unit.
Figure 13 is the schematic side elevation for indicating the Inner Constitution of conveying unit.
Specific embodiment
(1) composition of base board checking device
Hereinafter, using attached drawing to the base board checking device, substrate board treatment, inspecting substrate of one embodiment of the present invention Method and substrate processing method using same are illustrated.In addition, in the following description, substrate refers to semiconductor substrate, liquid crystal display If standby baseboard, plasma scope substrate, light base-board for plate, substrate for magnetic disc, optomagnetic base-board for plate or photomask are used Substrate etc..Moreover, it is circular peripheral part that substrate used in present embodiment, which has at least part,.For example, except positioning is used Recess outside peripheral part have circle.
Fig. 1 is the perspective view for indicating the appearance of base board checking device 200 of one embodiment of the present invention.Fig. 2 is to indicate The schematic side elevation of the composition of the inside of base board checking device 200.Fig. 3 is the structure for indicating the inside of base board checking device 200 At schematic plan.As shown in Figure 1 and Figure 2, base board checking device 200 includes housing section 210, light-projecting portion 220, reflection Portion 230, acceptance part 240, rotary driving part 250, moving portion 260 and recess test section 270.By light-projecting portion 220, reflecting part 230 and acceptance part 240 constitute shoot part 1.Shoot part 1, rotary driving part 250, moving portion 260 and recess test section 270 It is contained in housing section 210.
As shown in Figure 1, housing section 210 includes the bottom surface sections 211 of substantially rectangular shape and four sides of substantially rectangular shape Portion 212 to 215.Side surface part 212,214 is located at the both ends on the length direction of bottom surface sections 211, and 213,215 points of side surface part It Wei Yu not both ends in the width direction of bottom surface sections 211.In this way, there is housing section 210 top of substantially rectangular shape to open Mouthful.Housing section 210 also can further comprise by the closed upper surface part of upper opening.
Hereinafter, the width direction of bottom surface sections 211 is referred to as width direction, before the length direction of bottom surface sections 211 is referred to as Rear direction.Moreover, will be front from side surface part 214 towards the direction definition of side surface part 212, by its negative side in the longitudinal direction To being defined as rear.In the part from side surface part 212 to the front of side surface part 213, it is formed in the outside of housing section 210 The opening portion 216 of the slit-shaped of substrate W is transported between inside.
Light-projecting portion 220 is installed on housing section 210 for example comprising one or more light sources in a manner of extending in the width direction Side surface part 213,215 inner surface.As be described hereinafter, the base as check object is moved in into housing section 210 from opening portion 216 Plate W passes through the lower section of light-projecting portion 220.Light-projecting portion 220 is by the width band-like light bigger than the diameter of substrate W to rear obliquely downward It projects.
Reflecting part 230 is for example comprising mirror surface, and reflecting part 230 to extend rearward and in the width direction than light-projecting portion 220 Mode is installed on the inner surface of the side surface part 213,215 of housing section 210.As shown in Fig. 2, passing through light-projecting portion 220 to rear obliquely downward The band-like light projected goes up rear reflection to oblique by substrate W.Reflecting part 230 by the band-like light reflected by substrate W from rear to General horizontal direction reflection.
Acceptance part 240 rearward and is installed in the bottom surface sections 211 of housing section 210 than reflecting part 230.Acceptance part 240 For example camera, and include multiple lens and colored CCD (charge-coupled device) line sensor.Acceptance part 240 is received by anti- The band-like light for penetrating the reflection of portion 230 generates image data based on pixel data corresponding with the light income of each pixel.Image data It is made of multiple pixel datas corresponding with multiple pixels.
As shown in Fig. 2, rotary driving part 250 be, for example, rotary chuck, rotary driving part 250 include driving device 251 with And rotating holding portion 252.Driving device 251 is, for example, electric motor, and driving device 251 has rotary shaft 251a.Driving device Encoder (not shown) is provided in 251.Rotating holding portion 252 is installed on the front end of the rotary shaft 251a of driving device 251, It remains and is driven in rotation around vertical axis in the state of the substrate W as check object.
As shown in figure 3, moving portion 260 includes multiple (being two in this example) guiding elements 261 and mobile maintaining part 262.Multiple guiding elements 261 are installed in a manner of extending in parallel and along the longitudinal direction with state separated in the direction of the width In the bottom surface sections 211 of housing section 210.Mobile maintaining part 262 is in the state of keeping rotary driving part 250, along multiple guidance Component 261 moves in the longitudinal direction.
Recess test section 270 is, for example, the reflective photoelectric sensor comprising light-projecting component and light receiving element, is installed on The front upper part of inner surface in the side surface part 215 of housing section 210.It is located at recess in the peripheral part of the substrate W as check object When the lower section of test section 270, recess test section 270 projects downwards light and receives the reflected light for carrying out self-reference substrate W.Herein, exist When forming jagged situation positioned at the part of the substrate W of the lower section of recess test section 270, the light income of recess test section 270 It reduces.Light income of the recess test section 270 based on the substrate W rotated from the portion that is driven in rotation 250, whether there is or not recessed by detection substrate W Mouthful.In addition, also can be used infiltration type photoelectric sensor as recess test section 270.
(2) movement of base board checking device
Fig. 4 is the block diagram for indicating the composition of the field controller 400 to control base board check device 200.Such as Fig. 4 institute Show, field controller 400 includes main control unit 401, storage unit 402, shooting control part 410, rotation control unit 420, mobile control Portion 430, direction determining portion 440 and determining defects portion 450 processed.
Main control unit 401 is for example comprising CPU (central processing unit).Storage unit 402 is for example deposited comprising non-volatile Reservoir or hard disk are stored to execute the inspection program for checking processing.Storage unit 402 is stored in by the execution of main control unit 401 Inspection program, and realize shooting control part 410, rotation control unit 420, mobile control division 430, direction determining portion 440 and The function in determining defects portion 450.
Shooting control part 410 controls the movement of shoot part 1.Drive of the rotation control unit 420 from rotary driving part 250 The encoder of dynamic device 251 (Fig. 2) obtains output signal, and detects the rotation angle (rotation angle of substrate W of driving device 251 Degree), and the judgement result of the direction from the acquisition of direction determining portion 440 substrate W.Moreover, rotation control unit 420 is based on driving dress Set 251 rotation angle or substrate W direction come the movement that controls rotary driving part 250.Mobile control division 430 controls moving portion 260 movement.
The movement of the control of direction determining portion 440 recess test section 270.Moreover, direction determining portion 440 obtains recess test section The testing result of 270 pairs of recesses, and obtain the rotation angle of the driving device 251 detected by rotation control unit 420, base The rotation angle of driving device 251 when detecting the recess of substrate W determines the direction of substrate W.Determining defects portion 450 from Shoot part 1 obtains image data, determines that the surface state of substrate W has zero defect based on image data.Determining defects portion 450 is sentenced Determine result and is stored in storage unit 402.
Fig. 5 and Fig. 6 is the figure being illustrated to the movement to base board checking device 200.(a), (b) in Fig. 5 And (a) in Fig. 6, in (b), left side indicates the top view of base board checking device 200, and right side indicates the base as check object The schematic diagram of plate W.In present embodiment, the substrate W after development treatment is checked.Therefore, as in (a) in Fig. 5~Fig. 6 (b) right side shown in, be formed with multiple chip CH as product on the surface of substrate W.
In the initial state, as shown in (a) in Fig. 5, rotary driving part 250 is located at the front in housing section 210.At this It, will be as inspection by the transport mechanism (such as transport mechanism 137 or transport mechanism 138 of aftermentioned Figure 13) of substrate W under state The substrate W opening 216 of object and move in housing section 210, and kept by rotary driving part 250.
Herein, substrate W rotation is made to turn around by rotary driving part 250 on one side, on one side from recess test section 270 to substrate W's Light is projected in peripheral part, and reflected light is received by recess test section 270.In this way, the recess NT of substrate W is detected.And And determined by direction of the direction determining portion 440 of Fig. 4 to substrate W.Thereafter, with substrate W towards the side in specific direction Formula rotates substrate W by rotary driving part 250.
Next, moving substrate W rearward by moving portion 260 as shown in (b) hollow arrow in Fig. 5.At this point, with Substrate W is by way of the lower section of light-projecting portion 220, by the band-like light projected by light-projecting portion 220 on substrate W on front-rear direction Relatively scan.In this way, the light band-like to the overall exposure of substrate W.The band-like light successively reflected from substrate W is reflected Portion 230 reflects and guides to acceptance part 240.In this way, the first picture number for indicating the image of entire surface of substrate W is generated According to.
Then, as shown in (a) block arrow in Fig. 6, it is rotated by 90 ° substrate W by rotary driving part 250.Thereafter, such as Fig. 6 In (b) hollow arrow shown in, by moving portion 260 make substrate W be moved to front initial position.At this point, substrate W again by The lower section of light-projecting portion 220, and in the same manner as the movement of (b) in Fig. 5 generates the of the image for the entire surface for indicating substrate W Two image datas.Based on the first data generated and the second data, by the determining defects portion 450 of Fig. 4 determine substrate W whether there is or not Defect.The substrate W carried out by determining defects portion 450 has flawless judgement that can also carry out at arbitrary time point.
(3) inspection is handled
Fig. 7 and Fig. 8 is the stream for indicating the movement of the main control unit 401 of field controller 400 of Fig. 4 in inspection processing Cheng Tu.On one side referring to Fig.1 and the base board checking device 200 of Fig. 2, Fig. 4 field controller 400 and Fig. 7 flow chart, one While being illustrated to the inspection processing carried out by main control unit 401.
Firstly, main control unit 401 passes through the front that moving portion 260 is moved to rotary driving part 250 in housing section 210 Initial position (step S1).In addition, omitting step when rotary driving part 250 is located at the situation of initial position in the initial state The processing of S1.Herein, after development treatment as check object substrate W opening 216 and by transport mechanism move in In housing section 210.Main control unit 401 keeps moved in substrate W (step S2) by rotary driving part 250.
Main control unit 401 makes substrate W rotate (step S3) using rotary driving part 250, and detects the rotation angle of substrate W It spends (step S4).Moreover, main control unit 401 utilizes recess test section 270, to the peripheral part irradiation light (step S5) of substrate W, and And receive the light (step S6) for carrying out self-reference substrate W.The processing of step S3 to step S6 substantially carries out simultaneously.
Processing of the main control unit 401 based on step S3 to step S6 as a result, determining whether to be detected by recess test section 270 To the recess NT (step S7) of substrate W.In the situation of recess NT for detecting substrate W, main control unit 401 is based on detecting recessed The rotation angle of substrate W when mouthful NT come determine substrate W towards (step S8).In step S7, the recessed of substrate W is being not detected When the situation of mouth NT, step S9 is entered to.
In step s 9, main control unit 401 determines whether substrate W has been rotated by 360 ° (step S9).It is not rotated in substrate W When 360 degree of situation, step S3 is returned to, repeats the processing of step S3 to step S8.In the situation that substrate W has been rotated by 360 °, Main control unit 401 rotates substrate W using rotary driving part 250, so that substrate W is towards specific direction (step S10).
Next, main control unit 401 moves substrate W rearward together with rotary driving part 250 using moving portion 260 (step S11).Herein, substrate W passes through the lower section of light-projecting portion 220.Main control unit 401 irradiates substrate W using shoot part 1 band-like Light (step S12), and receive come self-reference substrate W band-like light (step S13).The processing of step S11 to step S13 is substantially Simultaneously carry out.Processing of the main control unit 401 based on step S11 to step S13 as a result, utilize shoot part 1 generate the first figure As data (step S14).In turn, main control unit 401 makes substrate W be rotated by 90 ° (step S15) using rotary driving part 250.
Then, substrate W and rotary driving part 250 (initial position) mobile (step forwards together are made by moving portion 260 S16).Herein, substrate W again by light-projecting portion 220 lower section.Main control unit 401 irradiates substrate W using shoot part 1 band-like Light (step S17), and receive come self-reference substrate W band-like light (step S18).The processing of step S16 to step S18 is substantially Simultaneously carry out.Processing of the main control unit 401 based on step S16 to step S18 as a result, utilize shoot part 1 generate the second figure As data (step S18).
Main control unit 401 is based on the first image data generated and the second image data, to determine the surface shape of substrate W State has zero defect (step S20).Finally, the surface state about substrate W is had flawless judgement result to deposit by main control unit 401 It is stored in the storage unit 402 (step S21) of Fig. 4, terminates inspection processing.
(4) substrate board treatment
Fig. 9 is the schematic plan for having the substrate board treatment 100 of base board checking device 200 of Fig. 1.Fig. 9 with And it in later scheduled figure, marks for clear positional relationship for indicating orthogonal X-direction, Y-direction and Z The arrow in direction.X-direction and Y-direction are orthogonal in the horizontal plane, and Z-direction is equivalent to vertical direction.
As shown in figure 9, substrate board treatment 100 has index module 11, coating module 12, visualization module 13, cleans and do Dry processing module 14A and carrying-in/carrying-out module 14B.It is made of cleaning-drying processing module 14A and carrying-in/carrying-out module 14B Interface module 14.Exposure device 15 is configured in a manner of with carrying-in/carrying-out module 14B adjoining.
Index module 11 includes multiple carrier placement sections 111 and conveying unit 112.It is placed in each carrier placement section 111 Point multilayer stores the carrier 113 of multiple substrate W.Master controller 114 and transport mechanism 115 are set in conveying unit 112.Main control The various constituent elements of 114 control base board processing unit 100 of device.Transport mechanism 115 is to transport the base while keeping substrate W Plate W.
Coating module 12 includes coating processing unit 121, conveying unit 122 and heat treatment portion 123.Apply processing unit 121 with And heat treatment portion 123 across the opposite mode of conveying unit 122 to be arranged.Between conveying unit 122 and index module 11, it is provided with The substrate placement section PASS1 to PASS4 (referring to Fig.1 3) that substrate W is placed.Conveying unit 122 is provided with removing for conveying substrate W Send mechanism 127,128 (referring to Fig.1 3).
Visualization module 13 includes development treatment portion 131, conveying unit 132 and heat treatment portion 133.Development treatment portion 131 with And heat treatment portion 133 across the opposite mode of conveying unit 132 to be arranged.It is arranged between conveying unit 132 and conveying unit 122 useful In the substrate placement section PASS 5 to PASS8 (referring to Fig.1 3) for placing substrate W.It is provided in conveying unit 132 for transporting substrate W Transport mechanism 137,138 (referring to Fig.1 3).
Being cleaned and dried processing module 14A includes to be cleaned and dried processing unit 161,162 and conveying unit 163.At cleaning-drying Reason portion 161,162 across the opposite mode of conveying unit 163 to be arranged.Conveying unit 163 is provided with transport mechanism 141,142.
Placement and buffer area portion P-BF1, P-BF2 (referring to Fig.1 3) are provided between conveying unit 163 and conveying unit 132.It puts It sets and buffer area portion P-BF1, P-BF2 is configured to accommodate multiple substrate W.
Moreover, being provided with substrate between transport mechanism 141,142 in a manner of with carrying-in/carrying-out module 14B adjoining and putting Set portion PASS 9 and aftermentioned placement and cooling end P-CP (referring to Fig.1 3).Placement and cooling end P-CP have substrate W is cold But function (for example, coldplate).In placing simultaneous cooling end P-CP, substrate W is cooled to the temperature for being suitable for exposure-processed. Carrying-in/carrying-out module 14B is provided with transport mechanism 143.Substrate W is moved in and is moved out exposure device 15 by transport mechanism 143.
(5) processing unit and development treatment portion are applied
Figure 10 is coating processing unit 121, development treatment portion 131 and the inside for being cleaned and dried processing unit 161 for indicating Fig. 9 The schematic side elevation of composition.As shown in Figure 10, be provided with to sublevel layer in coating processing unit 121 coating process chamber 21,22, 23,24.Coating processing unit 129 is provided in each coating process chamber 21,22,23,24.Divide in development treatment portion 131 Stratum it is provided with development treatment room 31,32,33,34.Development treatment is provided in each development treatment room 31,32,33,34 Unit 139.
Figure 11 is the top view for indicating the composition of coating processing unit 129.As shown in figs.10 and 11, each coating processing Unit 129 has standby unit 20, multiple rotary chucks 25, multiple shields 27, multiple processing nozzle for liquid 28, nozzle transport mechanism 29 And multiple rim wash nozzles 30.In the present embodiment, rotary chuck 25, shield 27 and rim wash nozzle 30 are each Two are each provided in coating processing unit 129.
Each rotary chuck 25 is rotated in the state of keeping substrate W by not shown driving device (such as electric motor) Driving.Shield 27 is arranged in the mode surrounded around rotary chuck 25.Pass through treatment fluid from treatment fluid reservoir (not shown) It is piped to each processing nozzle for liquid 28 and supplies various treatment fluids.Not to substrate W supply treatment fluid it is standby when, respectively handle nozzle for liquid 28 are inserted into standby unit 20.When supplying treatment fluid to substrate W, any processing nozzle for liquid 28 in standby unit 20 is removed by nozzle It send mechanism 29 to keep and is transported to the top of substrate W.
Rotary chuck 25 follows processing nozzle for liquid 28 while rotating and sprays treatment fluid, in this way in the substrate W of rotation Upper coating treatment fluid.In the present embodiment, the coating processing unit 129 of the coating process chamber 22,24 of Figure 10 is by antireflection film Treatment fluid (hereinafter referred to as antireflection liquid) is from the supply of processing nozzle for liquid 28 to substrate W.At the coating for applying process chamber 21,23 Unit 129 is managed by the treatment fluid (hereinafter referred to as resist liquid) of etchant resist from the supply of processing nozzle for liquid 28 to substrate W.
Rim wash nozzle 30 is near the peripheral part that scheduled position of readiness is moved to substrate W.Herein, substrate W Peripheral part refers to the region on the surface of substrate W along the fixed width of the peripheral part of substrate W.Rotary chuck 25 rotates one on one side While spraying flushing liquor, in this way, the place coated on substrate W from rim wash nozzle 30 towards the peripheral part of the substrate W of rotation The peripheral part for managing liquid is dissolved.In this way, the treatment fluid of the peripheral part of substrate W is removed.
As shown in Figure 10, development treatment unit 139 has multiple rotary chucks 35 in the same manner as coating processing unit 129 And multiple shields 37.Moreover, as shown in figure 9, development treatment unit 139 have spray developer solution two gap nozzles 38 with And the mobile mechanism 39 for moving these gap nozzles 38 in X direction.Development treatment unit 139 utilizes not shown driving device Rotate rotary chuck 35.In this way, substrate W is rotated.Gap nozzle 38 supplies while moving to each substrate W of rotation To developer solution.In this way, the development treatment of substrate W is carried out.
It is provided with multiple (being 4 in this example) in being cleaned and dried processing unit 161 and is cleaned and dried processing unit SD1.Clear It washes and is dried in cell S D1, the cleaning and drying process of the substrate W before being exposed processing.
(6) heat treatment portion
Figure 12 is the schematic of the Inner Constitution for indicating the heat treatment portion 123,133 of Fig. 9 and being cleaned and dried processing unit 162 Side view.As shown in figure 12, heat treatment portion 123 has the top heat treatment portion 101 for being set to top and is set to lower section Lower part heat treatment portion 102.Multiple thermal treatment units are provided in top heat treatment portion 101 and lower part heat treatment portion 102 PHP, multiple adherency intensive treatment unit PAHP and multiple cooling unit CP.
Topmost in heat treatment portion 123 is provided with field controller 300.Field controller 300 is based on the master from Fig. 9 The instruction of controller 114, control coating processing unit 121, conveying unit 122 and the movement in heat treatment portion 123.
In thermal treatment unit PHP, the heat treatment and cooling treatment of substrate W are carried out.In adherency intensive treatment unit In PAHP, the adherency intensive treatment to improve the adhesiveness of substrate W and antireflection film is carried out.Specifically, strengthening in adherency In processing unit PAHP, the adherency such as HMDS (hexamethyldisilazane) hardening agent is applied on substrate W, and carry out to substrate W Heat treatment.The cooling treatment of substrate W is carried out in cooling unit CP.
The lower part heat treatment that heat treatment portion 133 has the top heat treatment portion 103 for being set to top and is set to lower section Portion 104.Cooling unit CP, multiple thermal treatment units are provided in top heat treatment portion 103 and lower part heat treatment portion 104 PHP, edge exposure portion EEW and base board checking device 200.At the heat in top heat treatment portion 103 and lower part heat treatment portion 104 Reason unit PHP is configured to substrate W moving in thermal treatment unit PHP from processing module 14A is cleaned and dried.
Topmost in heat treatment portion 133 is provided with the field controller 400 of Fig. 4.Field controller 400 is based on from figure The instruction of 9 master controller 114, the movement of control base board check device 200, and control development treatment portion 131, conveying unit 132 and heat treatment portion 133 movement.
In edge exposure portion EEW, the exposure-processed (edge exposure processing) of the peripheral part of substrate W is carried out.By to base Plate W carries out edge exposure processing, and when development treatment afterwards, the etchant resist on the peripheral part of substrate W is removed.Pass through this Sample when the situation contacted with other parts in the peripheral part of substrate W, prevents anti-on the peripheral part of substrate W after development treatment It loses film stripping and becomes particle.In base board checking device 200, the surface state of the substrate W after checking development treatment.
It is provided with multiple (being five in this example) in being cleaned and dried processing unit 162 and is cleaned and dried processing unit SD2.Clear It washes and is dried in cell S D2, the cleaning and drying process of the substrate W that is exposed that treated.
(7) conveying unit
Figure 13 is the schematic side elevation for indicating the Inner Constitution of conveying unit 122,132,163.As shown in figure 13, conveying unit 122 have top carrying room 125 and lower part carrying room 126.There is conveying unit 132 top carrying room 135 and lower part to transport Room 136.The transport mechanism 127 in the setting of top carrying room 125, is arranged transport mechanism 128 in lower part carrying room 126.Moreover, Transport mechanism 137 is set in top carrying room 135, transport mechanism 138 is set in lower part carrying room 136.
It is opposite across top carrying room 125 to apply process chamber 21,22 (Figure 10) and top heat treatment portion 101 (Figure 12), applies It is opposite across lower part carrying room 126 to apply process chamber 23,24 (Figure 10) and lower part heat treatment portion 102 (Figure 12).Development treatment room 31, 32 (Figure 10) and top heat treatment portion 103 (Figure 12) are opposite across top carrying room 135, development treatment room 33,34 (Figure 10) with Lower part heat treatment portion 104 (Figure 12) is opposite across lower part carrying room 136.
Substrate placement section PASS 1, PASS 2 are provided between conveying unit 112 and top carrying room 125, in conveying unit Substrate placement section PASS 3, PASS 4 are provided between 112 and lower part carrying room 126.On top, carrying room 125 and top are transported It is provided with substrate placement section PASS 5, PASS 6 between room 135, is arranged between lower part carrying room 126 and lower part carrying room 136 There are substrate placement section PASS 7, PASS 8.
Placement and buffer area portion P-BF1 are provided between top carrying room 135 and conveying unit 163, in lower part carrying room Placement and buffer area portion P-BF2 are provided between 136 and conveying unit 163.In conveying unit 163, with carrying-in/carrying-out module 14B Adjacent mode is provided with substrate placement section PASS 9 and multiple placements and cooling end P-CP.
Place and buffer area portion P-BF1 be configured to be moved in by transport mechanism 137 and transport mechanism 141 (Fig. 9) with And move out substrate W.It places and buffer area portion P-BF2 is configured to be removed by transport mechanism 138 and transport mechanism 141 (Fig. 9) Enter and move out substrate W.Moreover, substrate placement section PASS 9 and placement and cooling end P-CP are configured to by transport mechanism 141, substrate W is moved in and moved out to 142 (Fig. 9) and transport mechanism 143.
It is placed in substrate placement section PASS 1 and substrate placement section PASS 3 by from index module 11 to coating mould Block 12 transport substrate W, be placed in substrate placement section PASS 2 and substrate placement section PASS4 by from coating module 12 to The substrate W that index module 11 transports.
It is placed in substrate placement section PASS 5 and substrate placement section PASS 7 by from coating module 12 to development mould Block 13 transport substrate W, be placed in substrate placement section PASS 6 and substrate placement section PASS8 by from visualization module 13 to The substrate W that coating module 12 transports.
It is placed in placing simultaneous buffer area portion P-BF1, P-BF2 by from visualization module 13 to cleaning-drying processing module The substrate W of 14A conveying.It is placed in placing simultaneous cooling end P-CP by from processing module 14A is cleaned and dried to carrying-in/carrying-out mould The substrate W of block 14B conveying.It is placed in substrate placement section PASS 9 and is handled from carrying-in/carrying-out module 14B to cleaning-drying The substrate W of module 14A conveying.
Transport mechanism 127 is in coating process chamber 21,22 (Figure 10), substrate placement section PASS 1, PASS2, PASS 5, PASS Join substrate W between 6 and top heat treatment portion 101 (Figure 12).Transport mechanism 128 is in coating process chamber 23,24 (Figure 10), base Join substrate W between plate placement section PASS 3, PASS 4, PASS7, PASS 8 and lower part heat treatment portion 102 (Figure 12).
Transport mechanism 137 is in development treatment room 31,32 (Figure 10), substrate placement section PASS 5, PASS6, placement and buffering Join substrate W between portion, area P-BF1 and top heat treatment portion 103 (Figure 12).Transport mechanism 138 is in development treatment room 33,34 (Figure 10), substrate placement section PASS 7, PASS 8, place and buffer area portion P-BF2 and lower part heat treatment portion 104 (Figure 12) it Between join substrate W.
(8) processing substrate
On one side referring to Fig. 9, Figure 10, Figure 12 and Figure 13, processing substrate is illustrated on one side.In the load of index module 11 Body placement section 111 (Fig. 9) is placed with the carrier 113 for accommodating untreated substrate W.Transport mechanism 115 is from carrier 113 to substrate Placement section PASS 1, PASS 3 (Figure 13) transport untreated substrate W.Then, transport mechanism 115 will be placed in substrate placement section Processed substrate W in PASS 2, PASS 4 (Figure 13) is transported to carrier 113.
In coating module 12, transport mechanism 127 (Figure 13) will be placed in untreated in substrate placement section PASS 1 Substrate W is successively transported to adherency intensive treatment unit PAHP (Figure 12), cooling unit CP (Figure 12) and the coating (figure of process chamber 22 10).Next, transport mechanism 127 successively transports the substrate W applied in process chamber 22 to thermal treatment unit PHP (Figure 12), cold But unit CP (Figure 12), coating process chamber 21 (Figure 10), thermal treatment unit PHP (Figure 12) and (figure of substrate placement section PASS 5 13)。
When the situation, after carrying out adherency intensive treatment to substrate W in adherency intensive treatment unit PAHP, in cooling unit Substrate W is cooled to the temperature for being suitable for forming antireflection film in CP.Next, being handled in coating process chamber 22 by coating Unit 129 (Figure 10) forms antireflection film on substrate W.Then, the heat treatment of substrate W has been carried out in thermal treatment unit PHP Afterwards, substrate W is cooled to the temperature for being suitable for forming etchant resist in cooling unit CP.Next, in coating process chamber 21, Etchant resist is formed on substrate W by coating processing unit 129 (Figure 10).Thereafter, carry out substrate W's in thermal treatment unit PHP Heat treatment, and substrate W is placed in substrate placement section PASS 5.
Moreover, transport mechanism 127 will be placed in development treatment and inspection department in substrate placement section PASS 6 (Figure 13) Substrate W after reason is transported to substrate placement section PASS 2 (Figure 13).
Transport mechanism 128 (Figure 13) by the untreated substrate W being placed in substrate placement section PASS 3 successively transport to Adhere to intensive treatment unit PAHP (Figure 12), cooling unit CP (Figure 12) and coating process chamber 24 (Figure 10).Next, conveying The substrate W for applying process chamber 24 is successively transported to thermal treatment unit PHP (Figure 12), cooling unit CP (Figure 12), is applied by mechanism 128 Apply process chamber 23 (Figure 10), thermal treatment unit PHP (Figure 12) and substrate placement section PASS 7 (Figure 13).
Moreover, transport mechanism 128 (Figure 13) will be placed in development treatment in substrate placement section PASS 8 (Figure 13) and Check that treated that substrate W is transported to substrate placement section PASS 4 (Figure 13).Apply process chamber 23,24 (Figure 10) and lower part heat The process content of substrate W in processing unit 102 (Figure 12) respectively with above-mentioned coating process chamber 21,22 (Figure 10) and top Re Chu The process content of substrate W in reason portion 101 (Figure 12) is identical.
In visualization module 13, transport mechanism 137 (Figure 13) will be placed in the etchant resist shape in substrate placement section PASS 5 Substrate W after is successively transported to edge exposure portion EEW (Figure 12) and placed and buffer area portion P-BF1 (Figure 13).The situation When, edge exposure processing is carried out to substrate W in edge exposure portion EEW.By edge exposure treated substrate W is placed in place it is simultaneous Buffer area portion P-BF1.
Moreover, transport mechanism 137 (Figure 13) (is schemed from the thermal treatment unit PHP adjacent with processing module 14A is cleaned and dried 12) the substrate W after taking-up exposure-processed and after being heat-treated.Transport mechanism 137 successively transports substrate W to cooling unit CP Any one development treatment room, thermal treatment unit PHP (Figure 12), substrate inspection in (Figure 12), development treatment room 31 and 32 (Figure 10) Look into device 200 (Figure 12) and substrate placement section PASS 6 (Figure 13).
When the situation, in cooling unit CP, after substrate W is cooled to the temperature for being suitable for development treatment, developing The development treatment of substrate W is carried out in any one development treatment room in process chamber 31,32 by development treatment unit 139.Thereafter, exist The heat treatment of substrate W is carried out in thermal treatment unit PHP.Then, the inspection processing of substrate W is carried out in base board checking device 200, Substrate W is placed in substrate placement section PASS 6.
Transport mechanism 138 (Figure 13) etchant resist being placed in substrate placement section PASS 7 is formed after substrate W successively Conveying is to edge exposure portion EEW (Figure 12) and places simultaneous buffer area portion P-BF2 (Figure 13).
Moreover, transport mechanism 138 (Figure 13) takes out exposure from the adjacent thermal treatment unit PHP (Figure 12) of interface module 14 Substrate W after processing and after being heat-treated.Transport mechanism 138 successively transports substrate W to cooling unit CP (Figure 12), development Any one development treatment room, thermal treatment unit PHP (Figure 12), (figure of base board checking device 200 in reason room 33,34 (Figure 10) And substrate placement section PASS 8 (Figure 13) 12).Development treatment room 33,34 and the substrate W's in lower part heat treatment portion 104 Process content is identical as the process content of substrate W in above-mentioned development treatment room 31,32 and top heat treatment portion 103 respectively.
Be cleaned and dried processing module 14A in, transport mechanism 141 (Fig. 9) will be placed in placement and buffer area portion P-BF1, The substrate W of P-BF2 (Figure 13) is successively transported to cleaning-drying processing unit SD1 (Figure 10) and placed and cooling end P-CP (figure 13).It is simultaneous cold placing after cleaning and drying process that substrate W is carried out in being cleaned and dried processing unit SD1 when the situation But substrate W is cooled in portion P-CP and is suitable for the temperature that exposure device 15 (Fig. 9) is exposed processing.
Transport mechanism 142 (Fig. 9) will be placed in the substrate W after the exposure-processed in substrate placement section PASS 9 (Figure 13) according to Secondary conveying is extremely cleaned and dried the heat treatment in processing unit SD2 (Figure 12) and top heat treatment portion 103 or lower part heat treatment portion 104 Unit PHP (Figure 12).When the situation, after cleaning and drying process that substrate W is carried out in being cleaned and dried processing unit SD2, (PEB, post exposure bake) processing is toasted after being exposed in thermal treatment unit PHP.
In carrying-in/carrying-out module 14B, transport mechanism 143 (Fig. 9) will be placed in placement and cooling end P-CP (Figure 13) Exposure-processed before substrate W transport to exposure device 15.Then, transport mechanism 143 (Fig. 9) takes out from exposure device 15 and exposes Treated substrate W, and substrate W is transported to substrate placement section PASS 9 (Figure 13).
(9) effect
In the base board checking device 200 of present embodiment, by being kept using shoot part 1 to by rotating holding portion 252 Substrate W shot and generate the first image data.Then, to rotate substrate W using rotating holding portion 252 prespecified Angle.After substrate W rotation, generated and being shot using shoot part 1 to the substrate W kept by rotating holding portion 252 Second image data.Based on the first image data and the second image data, determine that the surface state of substrate W has zero defect.
According to this constitution, on the surface of the substrate W by the first pictorial data representation and by the base of the second pictorial data representation The situation on the surface of plate W, gloss etc. is different.Therefore, in the situation of the surface existing defects of substrate W, which clearly goes out Now by the image of at least one of the first image data and the second image data pictorial data representation a possibility that, improves. In this way, the defect of the surface state of substrate W can be detected with high precision.Moreover, checking is in multiple substrate W towards right It carries out, thus uniformly multiple substrate W can be checked in the state of neat.
Moreover, in the present embodiment, by making substrate W and shoot part 1 along the longitudinal direction relatively using moving portion 260 It moves back and forth, to generate the first photographed data and the second photographed data.In turn, it can be used small-sized shoot part 1 to substrate W's The entirety in one face is shot.In this way, the first photographed data and the second photographed data can be obtained in a short time, and The volume of base board checking device 200 can be reduced.
(10) other embodiments
(a) in the above-described embodiment, inspection processing is carried out after development treatment, however, the present invention is not limited thereto.It checks Processing can also carry out before or after the processing of such as edge exposure, can also carry out at other times.
(b) in the above-described embodiment, the rotation angle of the substrate W in the processing of step S15 is 90 degree, but the present invention It is without being limited thereto.The rotation angle of substrate W also can be desired angle.When the situation, the rotation angle of substrate W preferably in addition to Angle other than the angle of the integral multiple of 180 degree, the angle of more preferably 90 degree of odd-multiple.
When the situation, by the substrate W of the first pictorial data representation surface the case where, with by the second pictorial data representation , there is relatively big difference in the case where surface of substrate W.In this way, it in the situation of the surface existing defects of substrate W, can further mention Height is by clearly there is a possibility that defect in the image of the first image data or the second pictorial data representation.
(c) in the above-described embodiment, substrate W is rotated, However, the present invention is not limited thereto.Substrate board treatment 100 be configured to move in substrate W in the state of towards specific direction to When the situation of base board checking device 200, the processing of step S3 to step S10 can be omitted, can not also be set in base board checking device 200 Set recess test section 270.Similarly, when can be by situation of the substrate W to carry out inspection processing towards the state in arbitrary direction, The processing of step S3 to step S10 can be omitted, can also be not provided with recess test section 270 in base board checking device 200.
(d) in the above-described embodiment, the light-projecting portion 220 of shoot part 1 and acceptance part 240 are separated into independent composition, but this It invents without being limited thereto.The light-projecting portion 220 and acceptance part 240 of shoot part 1 can be also integrally formed.
(e) in the above-described embodiment, reflecting part 230, however, the present invention is not limited thereto are set in shoot part 1.In light When portion 240 is configured to directly receive the situation for carrying out the band-like light of self-reference substrate W, reflecting part 230 can be also not provided in shoot part 1.
(f) in the above-described embodiment, moving portion 260 is to be configured to make rotary driving part 250 (substrate W) relative to shooting Portion 1 moves along the longitudinal direction, however, the present invention is not limited thereto.Moving portion 260 also may be configured as making shoot part 1 and rotary driving part 250 relatively move along the longitudinal direction.Therefore, moving portion 260 also may be configured as making shoot part 1 relative to rotary driving part 250 It moves along the longitudinal direction.
(g) in the above-described embodiment, shoot part 1 and rotary driving part 250 relatively move, however, the present invention is not limited thereto. In the situation of entire surface of the shooting area of shoot part 1 greater than substrate W, shoot part 1 also can not phase with rotary driving part 250 To movement, moving portion 260 can be also not provided in base board checking device 200.
(h) in the above-described embodiment, base board checking device 200 is set to the heat treatment portion of substrate board treatment 100 133, however, the present invention is not limited thereto.The coating module 12 that base board checking device 200 also may be disposed at substrate board treatment 100 waits it His position.Alternatively, base board checking device 200 can be also not provided in substrate board treatment 100, in order to carry out inspection processing to substrate And it is separately provided.
(11) corresponding relationship of each element of each component of scheme and embodiment
Hereinafter, being illustrated to the corresponding example of each element of each component and embodiment of scheme, but this hair It is bright to be not limited to following examples.
In the above-described embodiment, substrate W is the example of substrate, and rotating holding portion 252 is the example of rotating holding portion, is clapped The example that portion 1 is shoot part is taken the photograph, shooting control part 410 is the example of the first shooting control part and the second shooting control part.Rotation Control unit 420 is example of first rotation control unit to third rotation control unit, and determining defects portion 450 is the example of determination unit, Base board checking device 200 is the example of base board checking device, and light-projecting portion 220 is the example of light-projecting portion, and acceptance part 240 is acceptance part Example.
Moving portion 260 is the example in relative movement portion, and mobile control division 430 is first movement control unit and the second mobile control The example in portion processed, mobile maintaining part 262 are the example of mobile maintaining part, and direction determining portion 440 is the example in direction determining portion.It is recessed Mouthful test section 270 is the example of recess test section, and coating processing unit 129 is the example of film forming portion, transport mechanism 127, 128,137,138 be transport mechanism example, substrate board treatment 100 be substrate board treatment example.
As each component of scheme, other that also can be used with structure or function documented by scheme various are wanted Element.
Industrial availability
The present invention is effectively used for the inspection on the surface of various substrates.

Claims (11)

1. a kind of base board checking device, wherein include
Rotating holding portion keeps the substrate in a manner of enabling substrate to rotate,
Shoot part is set as shooting the substrate kept by the rotating holding portion,
First shooting control part controls the shoot part, to generate the image for indicating substrate when carry out first is shot First image data,
First rotation control unit controls the rotating holding portion, rotate substrate only in advance after carrying out first shooting Defined angle,
Second shooting control part controls the shoot part, to carry out second after first rotation control unit rotates substrate When shooting, the second image data for indicating the image of substrate is generated, and
Determination unit is based on the first image data and second image data, determines that the surface state of substrate has zero defect.
2. base board checking device as described in claim 1, wherein
The shoot part includes:
Light-projecting portion, injection extend to obtain light longer than the diameter of substrate in a first direction, and
Acceptance part receives the reflected light for carrying out self-reference substrate, generates the first image data or second image based on light income Data；
The base board checking device further include:
Relative movement portion is set as enabling the shoot part and the rotating holding portion in the intersected with the first direction It is relatively moved on two directions or the third direction opposite with the second direction, so that the light from the light-projecting portion irradiates To the entirety in a face of substrate,
First movement control unit controls the relative movement portion, to make the shoot part and institute when carrying out the described first shooting Rotating holding portion is stated relatively to move in this second direction, and
Second mobile control division controls the relative movement portion, to make the shoot part and institute when carrying out the described second shooting Rotating holding portion is stated relatively to move on the third direction.
3. base board checking device as claimed in claim 2, wherein
The relative movement portion includes mobile maintaining part, and the mobile maintaining part keeps the rotating holding portion and makes the rotation Maintaining part is moved up relative to the shoot part in the second direction or the third party.
4. base board checking device as claimed in claim 2 or claim 3, wherein
The light-projecting portion separates separate configurations with the acceptance part.
5. base board checking device according to any one of claims 1 to 4, wherein further include:
Direction determining portion determines the direction of the substrate kept by the rotating holding portion, and
Second rotation control unit is controlled the rotation based on the direction of the substrate determined by the direction determining portion and kept Portion, to make substrate towards specific direction before carrying out first shooting.
6. base board checking device as claimed in claim 5, wherein further include:
Third rotation control unit controls the rotating holding portion, to make before second rotation control unit rotates substrate At least one circle of substrate rotation, and
Recess test section detects the recess of the substrate rotated by the third rotation control unit；
Sentenced based on the rotation angle of the substrate when the recess test section detects the recess of substrate in the direction determining portion Determine the direction of substrate.
7. such as base board checking device described in any one of claims 1 to 6, wherein
First rotation control unit controls the rotating holding portion, so that the direction of the substrate when carrying out the described first shooting With the substrate when carrying out the described second shooting towards not parallel.
8. the base board checking device as described in any one of claims 1 to 7, wherein
The angle for the odd-multiple that the prespecified angle is 90 degree.
9. a kind of substrate board treatment, wherein include
Coating liquid is supplied to the surface of substrate, thus forms coated film on surface by film forming portion,
Such as base board checking device described in any item of the claim 1 to 8, to the base for foring coated film by the film forming portion The surface state of plate checked, and
Transport mechanism transports substrate between the film forming portion and the base board checking device.
10. a kind of substrate inspecting method, wherein include:
The substrate is kept in a manner of enabling substrate to rotate by rotating holding portion,
When carry out first is shot, the substrate kept by the rotating holding portion is shot, is thus generated for indicating base First image data of the image of plate,
After carrying out first shooting, substrate is set only to rotate prespecified angle by the rotating holding portion,
When progress second count is taken the photograph after rotating substrate, the substrate kept by the rotating holding portion is shot, is thus given birth to At the second image data for indicating the image of substrate, and
Based on the first image data and second image data, determine that the surface state of substrate has zero defect.
11. a kind of substrate processing method using same, wherein include:
Coating liquid is supplied to the surface of substrate by film forming portion, thus forms coated film on surface,
It is transported on surface by the substrate that the film forming portion forms coated film by transport mechanism, and
The inspecting substrate side described in any one of claim 10 that the surface state of the substrate transported by the transport mechanism is checked The step of method.
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