CN109556767A - A kind of intelligence pressure drag pliable pressure sensor array - Google Patents
A kind of intelligence pressure drag pliable pressure sensor array Download PDFInfo
- Publication number
- CN109556767A CN109556767A CN201811226659.3A CN201811226659A CN109556767A CN 109556767 A CN109556767 A CN 109556767A CN 201811226659 A CN201811226659 A CN 201811226659A CN 109556767 A CN109556767 A CN 109556767A
- Authority
- CN
- China
- Prior art keywords
- intelligent
- sensor
- circuit board
- resistor
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004891 communication Methods 0.000 claims abstract description 31
- 230000000694 effects Effects 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims description 26
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 230000007717 exclusion Effects 0.000 claims description 9
- 230000000087 stabilizing effect Effects 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 4
- 238000001514 detection method Methods 0.000 abstract description 3
- 238000009434 installation Methods 0.000 abstract description 3
- 238000013461 design Methods 0.000 abstract description 2
- 238000005265 energy consumption Methods 0.000 abstract 1
- 230000006698 induction Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- RZKYEQDPDZUERB-UHFFFAOYSA-N Pindone Chemical compound C1=CC=C2C(=O)C(C(=O)C(C)(C)C)C(=O)C2=C1 RZKYEQDPDZUERB-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/205—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using distributed sensing elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
A kind of intelligent pressure drag pliable pressure sensor array proposed by the present invention, belongs to pressure sensing arts, including piezoresistive effect inductor, intelligent sensor circuit plate, communications connector and two inductor connectors；Piezoresistive effect inductor, including having the pressure inductor main body of 23 induction points and positioned at the left electrode and right electrode of the pressure inductor main body two sides, left and right side electrode passes through an inductor connector respectively and is connected with intelligent sensor circuit plate；Two inductor connectors are welded on the intelligent sensor circuit plate；Communications connector is welded on intelligent sensor circuit plate, the connection for external power supply and communication line.This sensor has low in energy consumption, small in size, light weight, and simple installation connects the advantages that reliable, especially suitable for the haptic signal detection under the design of robot delicate, data glove and other complex environment scenes.
Description
Technical Field
The invention relates to the field of pressure detection, in particular to an intelligent piezoresistive flexible pressure array sensor.
Background
The dexterous hand of robot needs to be able to carry out various operations of grabbing, moving, holding between fingers or fixing objects, and the accurate control to the operation strength is realized through the tactile feedback of the dexterous hand in the operation process, thereby avoiding damaging the operated object. The conventional dexterous hand sensors have various types, such as a piezoresistive type, a capacitive type, a photoelectric type and the like, namely the strength of judgment is judged according to the variation of resistance, capacitance and light intensity under the action force. The piezoresistive sensor has the advantages of simple process, low cost, high reliability and the like, so most of the existing pressure acquisition systems adopt the piezoresistive sensor.
However, the following problems generally exist in the current flexible piezoresistive pressure acquisition equipment:
(1) the power consumption is large: the power consumption of a control chip adopted by the sensor is high, so that the problems of poor cruising ability and the like of the conventional piezoresistive acquisition equipment are caused;
(2) the volume is large: the sensor system is limited by material technology, chip packaging, circuit board manufacturing technology and the like, and the volume of the sensor system is large, so that the sensor system is inconvenient or cannot be installed and used in applications with strictly limited volume such as humanoid dexterous hands.
(3) The structure is not convenient to install: although flexible sensors are flexible to some extent, they do not adapt well to applications with special shapes, such as dexterous hands.
The piezoresistive pressure acquisition equipment has the problems of large power consumption, large volume, inconvenient structure installation and the like, so that the development of some applications (such as dexterous robot hands and data gloves) is hindered.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides an intelligent piezoresistive flexible pressure array sensor, and solves the problems of power consumption, volume and structure of the traditional piezoresistive pressure sensor.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides an intelligent piezoresistive flexible pressure array sensor which is characterized by comprising a piezoresistive effect sensor, an intelligent sensor circuit board, a communication connector and two sensor connectors, wherein the piezoresistive effect sensor circuit board is connected with the communication connector;
the piezoresistive effect sensor comprises a pressure sensor main body, a left electrode and a right electrode, wherein the left electrode and the right electrode are positioned on two sides of the pressure sensor main body; the piezoresistive effect sensor main body comprises an upper pressure-sensitive material layer and a lower pressure-sensitive material layer which are coated by a flexible film substrate, wherein the upper pressure-sensitive material layer and the lower pressure-sensitive material layer are provided with 25 intersection points of 5 rows and 5 columns, 2 of the intersection points are invalid, an array with 23 sensing points is formed, and the resistance value of each sensing point is reduced along with the increase of pressure; the left electrode and the right electrode respectively contain 5 electrodes which are respectively led out from the left side and the right side of the piezoresistive effect sensor main body, and each electrode is respectively and electrically connected with one corresponding row or one corresponding column in the upper piezoresistive material layer and the lower piezoresistive material layer; the 5 electrodes on the left side are connected with the intelligent sensor circuit board through first inductor connectors, and the 5 electrodes on the right side are connected with the intelligent sensor circuit board through second inductor connectors;
the sensor connector is welded on the intelligent sensor circuit board and is used for connecting the piezoresistive effect sensor with the intelligent sensor circuit board;
the communication connector is welded on the intelligent sensor circuit board and is used for connecting external power supply and a communication line;
the intelligent sensor circuit board comprises a printed circuit board and a plurality of components welded on the surface of the printed circuit board; the plurality of components include: the device comprises a voltage stabilizing chip, a microcontroller, an LED indicator light and three resistor blocks which are respectively composed of 4 resistors, wherein the total number of the resistor blocks is 12; the voltage stabilizing chip is connected with the microcontroller and is used for providing a power supply for the microcontroller; the input pin and the output pin of the voltage stabilizing chip are respectively connected with one capacitor; the serial port pin of the microcontroller transmits the calculated pressure value to an external control end through the communication connector; the LED indicator light is connected to corresponding pins of the microcontroller through a first resistor and a second resistor in the exclusion group and used for indicating the working state of the intelligent sensor circuit board in communication with the outside; one ends of a third resistor to a seventh resistor in the resistor bank are respectively connected with 5 reference voltage pins DO0-DO4 of the microcontroller, and the other ends of the third resistor to the seventh resistor are respectively connected with 5 digital-to-analog conversion pins AIH0-AIH4 of the microcontroller and a first inductor connector; one ends of the eighth resistor to the twelfth resistor in the exclusion are respectively connected to 5 digital-to-analog conversion pins AI0-AI4 of the microcontroller, and the other ends of the eighth resistor to the twelfth resistor are respectively connected to GND and a second sensor connector.
Compared with the prior art, the invention has the beneficial effects that:
(1) the power consumption is low: the sensor adopts STM32L4 series low power consumption Microcontroller (MCU). The chip has extremely low power consumption, and the power consumption is about 1mA when the chip runs at full speed. The LED also adopts a small-package and small-power model, is connected with a 10K ohm resistor in series, and has the power consumption of about 1 mA.
(2) Small volume, light weight: the inductor is a thin film nanometer material, and the volume and the mass of the inductor are extremely light. The sensor circuit board volume is only 13mm (length) 9mm (width) 0.6mm (thickness). To facilitate connection with the inductor, the thickness becomes 6mm after soldering the connector, still very small.
(3) Simple installation, reliable connection: the shape of the inductor is completely matched with the finger tip, and the electrode for connection is connected with the circuit board through the FPC connector. Because the FPC connector is in compression connection, a reinforcing and thickening material is adhered to the compression part of the inductor, and the connection reliability is greatly improved.
The sensor can be applied to the design of the dexterous robot hand, data gloves and the detection of the touch signal in other complex environment scenes.
Drawings
Fig. 1 is a schematic structural diagram of the pressure sensor of the present invention.
Fig. 2 is a partially enlarged view of a sensing point in the pressure sensor of the present invention.
Fig. 3 is a schematic layout diagram of the sensor connector, the communication connector and the smart sensor circuit board according to the present invention.
Fig. 4 is a schematic circuit diagram of the circuit board of the smart sensor of the present invention.
Fig. 5 is a graph showing the sense point piezoresistive characteristic of the tactile sensor of the present invention. FIG. 5(a) is a graph of sensed point pressure (horizontal axis, in newtons) versus resistance (vertical axis, in kiloohms). FIG. 5(b) is a graph of sensed point pressure (horizontal axis, in newtons) versus the reciprocal of resistance (vertical axis, in kiloohms).
Detailed Description
The intelligent piezoresistive flexible pressure array sensor is further described with reference to the accompanying drawings and the embodiments.
The intelligent piezoresistive flexible pressure array sensor provided by the embodiment of the invention comprises: smart sensor circuit board 300, piezoresistive effect sensors, two sensor connectors 200, communication connector 400; wherein,
piezoresistive effect sensor 100 is shown generally in FIG. 1, and in enlarged detail in FIG. 2. The pressure sensor 100 includes a pressure sensor body 101, and a left electrode 103 and a right electrode 102 disposed on both sides of the pressure sensor body 101, wherein the pressure sensor body 101 is connected to a sensor connector 200 through the left and right electrodes. The piezoresistive effect sensor body 101 includes an upper pressure sensitive material layer 202 and a lower pressure sensitive material layer 203, which are covered by a flexible film substrate 201, and the upper pressure sensitive material layer and the lower pressure sensitive material layer have 25 intersection points of 5 rows × 5 columns, wherein 2 intersection points are invalid (two intersection points of a lower left corner and a lower right corner respectively), so as to form an array having 23 sensing points 204, and each sensing point 204 is a contact point of the upper pressure sensitive material layer 202 and the lower pressure sensitive material layer 203; the resistance value of each sensing point becomes smaller as the pressure increases, and the piezoresistive characteristics of the sensing points measured by a conventional test are shown in fig. 5(a) and 5 (b); from the left and right sides of the piezoresistive effect sensor body 101, 5 electrodes (shown as 102 and 103 in fig. 1) are respectively led out, each electrode being electrically connected to a corresponding row or column of the upper and lower piezoresistive material layers 202 and 203. In this embodiment, the distance between two adjacent electrodes is 1.0mm, the 5 left electrodes 103 are connected to the intelligent sensor circuit board 300 through the first inductor connector, and the 5 right electrodes 102 are connected to the intelligent sensor circuit board 300 through the second inductor connector.
A sensor connector 200 soldered on the smart sensor circuit board 300 for connecting the piezoresistive effect sensor 100 to the smart sensor circuit board 300;
a communication connector 400 soldered on the smart sensor circuit board 300 for connection of an external power supply and a communication line;
the smart sensor circuit board 300 includes a printed circuit board PCB and a plurality of components soldered to a surface of the printed circuit board PCB. The plurality of components include: a 3.3V voltage regulation chip 302 with two capacitors C1, C2(100nF), a Microcontroller (MCU)301, a red-green double-color LED indicator lamp 304, and three 4 resistors, 8 pins, 10K ohm resistor exclusion 304, for a total of 12 resistors; the 3.3V voltage stabilizing chip 302 is connected with the MCU and used for providing power for the MCU; the input pin and the output pin of the 3.3V voltage stabilizing chip 302 are respectively connected with the capacitors C2 and C1; the serial port pin of the MCU transmits the calculated pressure value to the external control terminal via the communication connector 400; the LED indicator lamp 304 is connected to corresponding pins of the MCU through a first resistor and a second resistor in the resistor bank 304 and used for indicating the working state of the intelligent sensor circuit board in communication with the outside; one ends of a third resistor to a seventh resistor in the resistor bank 304 are respectively connected to 5 reference voltage pins DO0-DO4 (each pin provides 3.3V reference voltage for a row to be scanned), and the other ends of the third resistor to the seventh resistor are respectively connected to 5 digital-to-analog conversion pins AIH0-AIH4 (the voltage value of each pin is the voltage value of the row to be scanned) and a first inductor connector of the MCU; one end of the eighth resistor to one end of the twelfth resistor in the exclusion resistor 304 are respectively connected to 5 digital-to-analog conversion pins AI0-AI4 (the voltage value of each pin is the voltage value of each sensing point in the row to be scanned), and the other end of the eighth resistor to the other end of the twelfth resistor are respectively connected to GND and the second sensor connector 200.
The specific implementation modes and functions of the components in the embodiment of the invention are respectively described as follows:
in the piezoresistive effect sensor 100. The piezoresistive effect sensor body 101 is an array distributed flexible film pressure sensor, and is manufactured by transferring a nano force sensitive material onto a common transparent flexible film substrate through a precision printing process, and drying and curing the nano force sensitive material, and the piezoresistive effect sensor body 100 is made of a film nano material, so that the volume and the mass are extremely small. The shape of the piezoresistive effect sensor main body 101 is completely matched with the finger tip, and two end electrodes for connection are connected with the intelligent sensor circuit board through a sensor connector; since sensor connector 200 is a compression connection, a reinforcing and thickening material is affixed to the compression of piezoresistive effect sensor 100, greatly increasing the reliability of the connection.
As shown in fig. 3, the embodiment of the present invention has 2 inductor connectors 200, and each inductor connector 200 is a 5-pin FPC (Flexible Printed Circuit board) connector having a pin pitch of 1.0 mm. The bottom of 2 inductor connectors 200 all with intelligent sensor circuit board 300 upper surface welding. The sensor connector 200 of the present embodiment ensures the reliability of the connection of the piezoresistive effect sensor 100 to the smart sensor circuit board 300.
As shown in fig. 3, communication connector 400 of an embodiment of the present invention is a 4 pin poke-through connector with a pin pitch of 0.8 mm. The bottom end of the communication connector 400 is soldered to the upper surface of the smart sensor circuit board 300. This communication connector 400 has guaranteed this flexible pressure array sensor of intelligence pressure resistance and the reliability of outside other circuit or computer communication, and simultaneously, the outside power supply line also passes through this communication connector, for the power supply of intelligent sensor circuit board.
As shown in FIG. 4, the smart sensor circuit board 300 includes a 3.3V voltage regulator chip 302, two capacitors C1, C2, a Microcontroller (MCU)301, a red-green two-color LED indicator 303, and three 4R8P-10K resistor blocks 304. The 3.3V voltage stabilizing chip 302 provides power for the MCU 301; the MCU301 is used as a main chip and is responsible for collecting the voltage value of the piezoresistive effect sensor 100 and calculating the resistance value, and further calculating the pressure value, and then transmitting the pressure value to an external control terminal from a serial port pin of the MCU via the communication connector 400. The volume of the smart sensor circuit board 300 of this embodiment is only 13mm (length) × 9mm (width) × 0.6mm (thickness), and for the convenience of connection with the piezoresistive effect sensor 100, the thickness becomes 6mm after the sensor connector 200 is soldered to the smart sensor circuit board 300. The MCU of this embodiment adopts STM32L4 series low-power consumption microcontroller, and the power consumption of this chip is extremely low, and the power consumption is about 1mA when the full speed operation. The LED indicator lamp of the embodiment adopts a small-package small-power model (the embodiment adopts a light emitting diode), is connected with two 10K ohm resistors in the resistor pack 304 in series, and has the power consumption of about 1 mA.
Referring to fig. 4, the connection relationship of the components in the smart sensor circuit board 300 is as follows:
the pin OUT of the 3.3V voltage regulator chip 302 outputs a 3.3V voltage, which is connected to the VDD pins of the MCU 301. The pin IN of the 3.3V voltage regulator chip 302 is connected to the pin 1 of the communication connector 400, and the pin 1 is connected to an externally input dc voltage source. The serial port pin TX _ O, RX _ O of the MCU301 is connected to pins 2 and 3 of the communication connector 400, respectively, and pin 4 of the communication connector 400 is connected to GND and an external input ground signal. The LED indicator light 303 is connected with the output pin LED _ G, LED _ R of the MCU301 through two resistors in a series 4R8P-10K resistor exclusion 304. The 4R8P-10K resistor bank 304 comprises 3 resistor banks RP1, RP2 and RP3, each resistor bank comprises 4 resistors, 2 resistors connected with the LED indicator light 303 are removed, and the other 10 resistors are respectively connected with pins DO0-DO4, AIH0-AIH4 and AI0-AI4 of the MCU 301; the concrete connection mode is as follows: one end of each of the 5 resistors is connected to pins DO0-DO4 of the MCU301, and the other end is connected to pins AIH0-AIH4 of the MCU301 and the first inductor connector 200; the other 5 resistors have one end connected to the 5 digital-to-analog conversion pins AI0-AI4 of the MCU301, and the other end connected to GND and the second sensor connector 200.
The working process of the sensor based on piezoresistive effect proposed by the present invention is described as follows: when the surface of the sensing point of the piezoresistive effect sensor contacts an object, the pressure in the vertical direction causes the deformation of the piezoresistive material, thereby causing the change of the resistance value of the sensing point. The electrodes in 5 rows and 5 columns are connected with 10 analog-to-digital conversion pins of the MCU in the intelligent sensor circuit board through the sensor connector 200, each pin is a channel of the analog-to-digital converter of the MCU, and through sequentially scanning the rows and recording the analog-to-digital conversion values of the 5 columns which are intersected with each row, combining with the 4R8P-10K resistor exclusion 304, and then utilizing the measured piezoresistive relation curves shown in the figures 5(a) and 5(b), the stress condition of the sensor is finally calculated. The obtained stress value is sent to the external receiving circuit through the communication connector at 23 points in units of 0.1N.
The specific calculation process is as follows:
pins DOn (n is 0-4) of MCU301 are connected in series (5 in total) with AIHn (n is 0-4) (301) through a 10K resistor, and when scanning the nth row, pin DOn outputs set (providing 3.3V voltage), and the values of AD of pins AIHn row are obtained, and the values of pins AI0-AI4 are read. Since one 10K resistor (5 resistors in total) is connected between the pin AIm (m is 0 to 4) of the MCU301 and GND, assuming that R is an unknown resistance value to be calculated, (AIHn-AIm)/R is AIm/10, R is (AIHn-AIm) × 10/AIm, the unit K ohm, and m is 0 to 4, according to gilgh current law. (DOn, AIHn, AIm and GND are all the symbols in FIG. 4, n is 0-4, m is 0-4, wherein DOn, AIHn and AIm are the reference numbers in 301).
As shown in fig. 5(a) and 5(b), the measured stress F of the piezoresistive effect sensor 100 is in the interval of 0 to 20N, and the 1/R characteristic curve keeps a substantially fixed slope in different sub-intervals of the interval:
in the 0N-5N subinterval, the slope 1/R is about 0.0025, so in this interval, 1/R equals F × 0.0025, F equals 10 × 1/R/0.0025, R equals KOhm, F equals 0.1N, and 0< equalsf < equals5.
In the sub-interval 5N to 10N, the slope is about 0.0049, so that in this interval, 1/R-0.0125 equals F × 0.0049, F equals 10 × ((1/R-0.005263)/0.0049+5), R equals KOhm, F equals 0.1N, and 5< ═ F < 10.
In the 10N to 15N sub-interval, the slope is about 0.0051, so in this interval, 1/R-0.037175 is F × 0.0051, F is 10 × ((1/R-0.037175)/0.0051+10), R is KOhm, F is 0.1N, and 10< ═ F < (15).
In the 15N-20N subinterval, the slope is about 0.0053, so in this interval, 1/R-0.064516 equals F × 0.0053, F equals 10 × ((1/R-0.064516)/0.0053+15), R equals KOhm, F equals 0.1N, and 15< ═ F < (20).
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (7)
1. An intelligent piezoresistive flexible pressure array sensor is characterized by comprising a piezoresistive effect sensor, an intelligent sensor circuit board, a communication connector and two sensor connectors;
the piezoresistive effect sensor comprises a pressure sensor main body, a left electrode and a right electrode, wherein the left electrode and the right electrode are positioned on two sides of the pressure sensor main body; the piezoresistive effect sensor main body comprises an upper pressure-sensitive material layer and a lower pressure-sensitive material layer which are coated by a flexible film substrate, wherein the upper pressure-sensitive material layer and the lower pressure-sensitive material layer are provided with 25 intersection points of 5 rows and 5 columns, 2 of the intersection points are invalid, an array with 23 sensing points is formed, and the resistance value of each sensing point is reduced along with the increase of pressure; the left electrode and the right electrode respectively contain 5 electrodes which are respectively led out from the left side and the right side of the piezoresistive effect sensor main body, and each electrode is respectively and electrically connected with one corresponding row or one corresponding column in the upper piezoresistive material layer and the lower piezoresistive material layer; the 5 electrodes on the left side are connected with the intelligent sensor circuit board through first inductor connectors, and the 5 electrodes on the right side are connected with the intelligent sensor circuit board through second inductor connectors;
the sensor connector is welded on the intelligent sensor circuit board and is used for connecting the piezoresistive effect sensor with the intelligent sensor circuit board;
the communication connector is welded on the intelligent sensor circuit board and is used for connecting external power supply and a communication line;
the intelligent sensor circuit board comprises a printed circuit board and a plurality of components welded on the surface of the printed circuit board; the plurality of components include: the device comprises a voltage stabilizing chip, a microcontroller, an LED indicator light and three resistor blocks which are respectively composed of 4 resistors, wherein the total number of the resistor blocks is 12; the voltage stabilizing chip is connected with the microcontroller and is used for providing a power supply for the microcontroller; the input pin and the output pin of the voltage stabilizing chip are respectively connected with one capacitor; the serial port pin of the microcontroller transmits the calculated pressure value to an external control end through the communication connector; the LED indicator light is connected to corresponding pins of the microcontroller through a first resistor and a second resistor in the exclusion group and used for indicating the working state of the intelligent sensor circuit board in communication with the outside; one ends of a third resistor to a seventh resistor in the resistor bank are respectively connected with 5 reference voltage pins DO0-DO4 of the microcontroller, and the other ends of the third resistor to the seventh resistor are respectively connected with 5 digital-to-analog conversion pins AIH0-AIH4 of the microcontroller and a first inductor connector; one ends of the eighth resistor to the twelfth resistor in the exclusion are respectively connected to 5 digital-to-analog conversion pins AI0-AI4 of the microcontroller, and the other ends of the eighth resistor to the twelfth resistor are respectively connected to GND and a second sensor connector.
2. The intelligent piezoresistive flexible pressure array sensor according to claim 1, wherein the piezoresistive effect sensor, the adjacent two of the left and right electrodes, are spaced apart by 1.0 mm.
3. The intelligent piezoresistive flexible pressure array sensor according to claim 1, wherein said intelligent sensor circuit board, said LED indicator light are red green bi-color LEDs.
4. The intelligent piezoresistive flexible pressure array sensor according to claim 1, wherein said intelligent sensor circuit board, each said exclusion, consists of 4 resistors each of 8 pins and 10K ohms.
5. The intelligent piezoresistive flexible pressure array sensor according to claim 1, wherein said intelligent sensor circuit board, said microcontroller being a microcontroller of the STM32L4 family.
6. The intelligent piezoresistive flexible pressure array sensor according to claim 1, wherein each of said sensor connectors is a FPC connector.
7. The intelligent piezoresistive flexible pressure array sensor according to claim 1, wherein said communication connector is a puncture connector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811226659.3A CN109556767B (en) | 2018-10-22 | 2018-10-22 | Intelligent piezoresistive flexible pressure array sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811226659.3A CN109556767B (en) | 2018-10-22 | 2018-10-22 | Intelligent piezoresistive flexible pressure array sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109556767A true CN109556767A (en) | 2019-04-02 |
| CN109556767B CN109556767B (en) | 2020-10-16 |
Family
ID=65864960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811226659.3A Active CN109556767B (en) | 2018-10-22 | 2018-10-22 | Intelligent piezoresistive flexible pressure array sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109556767B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110779965A (en) * | 2019-10-22 | 2020-02-11 | 电子科技大学 | Flexible detection device of large tracts of land surface damage |
| CN114061798A (en) * | 2021-11-15 | 2022-02-18 | 南昌黑鲨科技有限公司 | Pressure sensor and system of intelligent terminal |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101201277A (en) * | 2007-11-23 | 2008-06-18 | 清华大学 | Array type ultra-thin submissive force sensor and preparation method thereof |
| CN203824682U (en) * | 2014-05-12 | 2014-09-10 | 昆明理工大学 | Flexible array sensor based on conductive rubber |
| CN204286650U (en) * | 2014-12-24 | 2015-04-22 | 广东省自动化研究所 | A kind of piezoelectricity pressure drag composite and flexible force-sensing sensor |
| CN106092389A (en) * | 2016-05-27 | 2016-11-09 | 电子科技大学 | A kind of novel array-type flexible pressure transducer |
| CN205826179U (en) * | 2016-07-19 | 2016-12-21 | 中国科学院沈阳自动化研究所 | Flexible array pressure measurement sensor based on piezoresistive effect |
| CN107631818A (en) * | 2016-07-19 | 2018-01-26 | 中国科学院沈阳自动化研究所 | Flexible array pressure measurement sensor and its measuring method based on piezoresistive effect |
| CN209437612U (en) * | 2018-10-22 | 2019-09-27 | 清瑞博源智能科技河北有限责任公司 | A kind of active booster type finger movement device |
-
2018
- 2018-10-22 CN CN201811226659.3A patent/CN109556767B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101201277A (en) * | 2007-11-23 | 2008-06-18 | 清华大学 | Array type ultra-thin submissive force sensor and preparation method thereof |
| CN203824682U (en) * | 2014-05-12 | 2014-09-10 | 昆明理工大学 | Flexible array sensor based on conductive rubber |
| CN204286650U (en) * | 2014-12-24 | 2015-04-22 | 广东省自动化研究所 | A kind of piezoelectricity pressure drag composite and flexible force-sensing sensor |
| CN106092389A (en) * | 2016-05-27 | 2016-11-09 | 电子科技大学 | A kind of novel array-type flexible pressure transducer |
| CN205826179U (en) * | 2016-07-19 | 2016-12-21 | 中国科学院沈阳自动化研究所 | Flexible array pressure measurement sensor based on piezoresistive effect |
| CN107631818A (en) * | 2016-07-19 | 2018-01-26 | 中国科学院沈阳自动化研究所 | Flexible array pressure measurement sensor and its measuring method based on piezoresistive effect |
| CN209437612U (en) * | 2018-10-22 | 2019-09-27 | 清瑞博源智能科技河北有限责任公司 | A kind of active booster type finger movement device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110779965A (en) * | 2019-10-22 | 2020-02-11 | 电子科技大学 | Flexible detection device of large tracts of land surface damage |
| CN110779965B (en) * | 2019-10-22 | 2022-08-02 | 电子科技大学 | Flexible detection device of large tracts of land surface damage |
| CN114061798A (en) * | 2021-11-15 | 2022-02-18 | 南昌黑鲨科技有限公司 | Pressure sensor and system of intelligent terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109556767B (en) | 2020-10-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109238519B (en) | Hybrid flexible touch sensor | |
| CN103329076B (en) | Coordinate input device | |
| CN110413146B (en) | Input sensing device and display device including the same | |
| CN109556767B (en) | Intelligent piezoresistive flexible pressure array sensor | |
| CN1653414A (en) | Capacitive touch screen with conductive polymer | |
| US20080136787A1 (en) | Touchpad having Single Layer Layout | |
| TWI474241B (en) | Capacitive touch panel and method for manufacturing capacitive touch panel | |
| CN106525296A (en) | Electronic skin for touch detection | |
| CN106066712B (en) | Force sensing module | |
| CN107545231A (en) | Fingerprint identification device and manufacturing method thereof | |
| CN108008852A (en) | Touch panel controller | |
| CN208780370U (en) | A kind of planar array column shearing force touch sensor | |
| CN106095204A (en) | Touch sensor apparatus | |
| CN103942534A (en) | Biometric feature recognition sensor and electronic equipment comprising same | |
| CN103677467A (en) | Touch sensitive device | |
| CN103713783A (en) | Touch sensing device and circuit board | |
| CN203759716U (en) | Biological characteristic identification sensor and electronic device including the same | |
| CN107340897A (en) | Pressure-sensing module and touch display substrate | |
| TWI603237B (en) | One-layer multi-touch sensor device with active components | |
| CN103091005B (en) | Pressure sensing component | |
| CN202142030U (en) | Capacitive touch control panel and touch control module thereof | |
| CN101782826A (en) | Capacitance type touch pad and module thereof | |
| US11216143B1 (en) | Force sensing module and method of manufacturing the same and electronic device | |
| CN201425869Y (en) | Force sensing resistor | |
| CN109060200B (en) | Planar array type shear force touch sensor and shear force parameter detection method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |