CN109551123A - 皮秒激光诱导石英玻璃内部裂纹实现微流控器件制备的方法 - Google Patents

皮秒激光诱导石英玻璃内部裂纹实现微流控器件制备的方法 Download PDF

Info

Publication number
CN109551123A
CN109551123A CN201811539810.9A CN201811539810A CN109551123A CN 109551123 A CN109551123 A CN 109551123A CN 201811539810 A CN201811539810 A CN 201811539810A CN 109551123 A CN109551123 A CN 109551123A
Authority
CN
China
Prior art keywords
quartz glass
picosecond laser
dimensional
micro
picosecond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811539810.9A
Other languages
English (en)
Other versions
CN109551123B (zh
Inventor
程亚
徐剑
李晓龙
林子杰
王振华
柴志方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
East China Normal University
Original Assignee
East China Normal University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by East China Normal University filed Critical East China Normal University
Priority to CN201811539810.9A priority Critical patent/CN109551123B/zh
Publication of CN109551123A publication Critical patent/CN109551123A/zh
Priority to US16/377,138 priority patent/US11203083B2/en
Application granted granted Critical
Publication of CN109551123B publication Critical patent/CN109551123B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/55Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00119Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00523Etching material
    • B81C1/00539Wet etching
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0005Other surface treatment of glass not in the form of fibres or filaments by irradiation
    • C03C23/0025Other surface treatment of glass not in the form of fibres or filaments by irradiation by a laser beam
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00Glass compositions
    • C03C3/04Glass compositions containing silica
    • C03C3/06Glass compositions containing silica with more than 90% silica by weight, e.g. quartz
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/08Geometry, shape and general structure
    • B01L2300/0861Configuration of multiple channels and/or chambers in a single devices
    • B01L2300/0874Three dimensional network
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/50Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/54Glass

Abstract

本发明公开了一种皮秒激光诱导石英玻璃内部裂纹实现微流控器件制备的方法,先利用聚焦的时域调控皮秒激光在石英玻璃中辐照产生空间选择性微纳裂纹区域,然后通过化学腐蚀将辐照区域去除得到中空且连通的三维微结构,从而实现石英玻璃内部微通道结构的三维制备。本发明通过调控皮秒激光的脉冲宽度可实现偏振不敏感的三维均一性腐蚀,同时具有高的化学腐蚀速率和选择性,适用于大尺寸三维微流控系统制造和高精度三维打印玻璃结构等领域。

Description

皮秒激光诱导石英玻璃内部裂纹实现微流控器件制备的方法
技术领域
本发明涉及三维微通道和微流控器件的制造方法,特别是一种利用皮秒激光诱导石英玻璃内部裂纹实现微流控器件制备的方法。本发明适用于大尺寸石英玻璃微流控系统制备、高精度三维打印玻璃结构等领域。
背景技术
微流控芯片技术,作为一种革命性的技术,当前已在化学分析、化工合成、生物制药、医疗诊断、光子学等领域展现出重要应用。微通道作为微流控芯片的核心单元,其高性能和多功能制备技术对于提升微流控芯片技术的发展具有重要意义。相对于目前普遍得到应用的二维微通道,三维微通道可为微流控芯片技术的进一步技术革新提供更加灵活、更加高效的微尺度空间流体操控能力。
石英玻璃由于其高的耐热性和化学稳定性,低的热膨胀系数,宽的光谱透射范围和良好的生物相容性,是微流控芯片技术目前广泛采用的基底之一。当前在石英玻璃内部制备三维微通道的最具代表性的技术是飞秒激光三维微加工。通过调控聚焦飞秒激光的脉冲能量可在石英玻璃内部诱导出高度非线性的改性如纳米光栅、微空洞等,进而可通过不同途径制备出三维空间构型灵活可控的微通道结构。其中,利用飞秒激光辐照诱导偏振依赖的化学选择性腐蚀是目前研究最广泛、最具应用前景的技术途径之一。通过调控聚焦线偏振飞秒激光的偏振取向,使得激光偏振方向垂直于激光直写方向时,腐蚀速率可得到大大提升(C. Hnatovsky, et al., Opt. Lett. 2005, 30, 1867–1869; M. Hermans, etal., J. Laser Micro Nanoeng. 2014, 9, 126–131)。但是利用这一技术制备三维微通道时,特征结构空间取向的不同会带来腐蚀速度的很大差异,进而会对影响微通道结构的制备效果,譬如会产生锥状的三维微通道。而利用圆偏振光,虽然可以获得三维的均一性腐蚀效果(X. M. Yu, et al., J. Appl. Phys. 2011, 109, 053114),但是相对于线偏振光而言,腐蚀速率大大降低,不利于微通道的高性能可控制备。而为了获得更高的腐蚀速率,在辐照过程随着直写方向的改变实时变换激光的偏振方向会增加加工系统和加工过程的复杂度。因此,寻求一种简便、可控、三维均一性好的石英玻璃三维微通道制备技术具有重要意义。
发明内容
本发明的目的在于针对当前飞秒激光制备三维微通道的不足,提供一种简便、可控、三维可控的石英玻璃微通道以及微流控器件制备方法。
实现本发明目的的具体技术方案如下:
一种利用皮秒激光诱导石英玻璃内部裂纹实现微流控器件制备的方法,该方法包括下列步骤:
步骤1:皮秒激光辐照
将石英玻璃样品固定在一台可编程三维位移平台上,通过显微物镜将时域调控的皮秒激光聚焦在石英玻璃样品上,驱动位移平台运动同时启动皮秒激光辐照,在石英玻璃样品内部中直写出所需要的内含微纳裂纹的三维微通道图案;
步骤2:选择性化学腐蚀
将皮秒激光辐照后的石英玻璃样品放入化学腐蚀溶液中,对所述的三维微通道图案进行空间选择性腐蚀去除,进而在石英玻璃样品内部获得具有三维几何构型的微通道结构。
所述的时域调控的皮秒激光的脉冲宽度为1-20 ps,重复频率为1-1000 kHz,聚焦物镜的数值孔径为0.1-1.4。
所述的化学腐蚀溶液为5-20 mol/L 氢氧化钾溶液(80-95℃)或1-20% 氢氟酸溶液。
与现有的技术相比较,本发明的优点在于:
1)、对加工用光的偏振不敏感性:采用时域调控的皮秒激光加工产生不同于通常纳米光栅的微纳裂纹区域,不同取向的线偏振光和圆偏振光带来的化学腐蚀速率差异,相对于飞秒激光辅助化学蚀刻微通道的偏振依赖程度大大降低。这种偏振不敏感性将有助于改善化学腐蚀过程控制,用于制备高保真度的三维微通道以及复杂曲面的三维空腔结构。
2)、高的腐蚀速率:由于时域调控的皮秒激光与石英玻璃的非线性作用过程中产生的随机纳米裂纹,在实际腐蚀过程中腐蚀液更容易进入这些裂纹并通过上述裂纹的快速连通从而加快整个腐蚀过程,可获得与飞秒激光微加工方法最快腐蚀速率相当的效果。
3)、三维可控制备:尽管皮秒激光相比飞秒激光与石英玻璃作用过程会具有更多的能量沉积产生较大的热应力,从而影响微通道的制备效果,但是通过调控皮秒激光的辐照参数如脉冲宽度、辐照能量以及辐照时间,在石英玻璃内部可以通过对产生随机纳米裂纹的有效控制稳定实现三维微通道的可控制备。
附图说明
图1是利用皮秒激光诱导石英玻璃内部裂纹实现微流控器件制备的流程示意图;
图2是不同偏振状态的6 ps激光制备微通道的腐蚀对比图;
图3是8 ps激光辐照制备三维微通道网络结构光学显微图(正视图);
图4是8 ps激光辐照制备三维微通道网络结构光学显微图(侧视图)。
具体实施方式
下面结合实施例和附图对本发明作进一步说明,但不应以此限制本发明的保护范围。
实施例1
本实施例包括如下步骤:
步骤1:皮秒激光辐照
如图1所示,取尺寸为20 mm× 10 mm× 2 mm且六面抛光的洁净石英玻璃样品,固定在三维位移台上;激光的中心波长为1026 nm,重复频率为 50 kHz,脉冲宽度为6 ps;采用数值孔径为0.45的显微物镜聚焦激光,聚焦深度为在石英玻璃表面以下300 μm。为评估偏振对腐蚀速率的影响,利用出射激光的本征偏振方向与直写方向平行(图2a)和垂直(图2b)以及在聚焦之前放置四分之一波片调整产生圆偏振光(图2c)三种情况分别来直写图案,平均功率为400 mW,扫描速度为0.5 mm/s。
步骤2:选择性化学腐蚀
将皮秒激光辐照后的石英玻璃样品放入在10 mol/L 氢氧化钾溶液(85℃)中进行超声波辅助腐蚀1 h后取出观察拍照。从图2腐蚀(虚线为腐蚀痕迹)的对比可看出,同等条件下,不同的偏振情况,6 ps的腐蚀速率差异性不大(即偏振不敏感),同时具有较高的腐蚀速率。
实施例2
本实施例包括如下步骤:
步骤1:皮秒激光辐照
如图1所示,取尺寸为5 mm× 5 mm× 5 mm且六面抛光的洁净石英玻璃样品,固定在三维位移台上;激光的中心波长为1026 nm,重复频率为 50 kHz,脉冲宽度为8 ps;采用数值孔径为0.30的显微物镜聚焦,在聚焦之前放置四分之一波片调整产生圆偏振光,在石英玻璃样品内部直写六面贯通的微通道多层网格图案,平均功率为450 mW,扫描速度为0.5 mm/s。
步骤2:选择性化学腐蚀
将皮秒激光辐照后的石英玻璃样品放入在10 mol/L 氢氧化钾溶液(85℃)中进行超声波辅助腐蚀,直至激光辐照的区域完全被去除而在玻璃样品内部形成三维连贯的空心多层微通道网络结构(图3为正视图,图4为侧视图),通道腐蚀的均一性较好,没有明显的锥状结构。

Claims (3)

1.一种皮秒激光诱导石英玻璃内部裂纹实现微流控器件制备的方法,其特征在于,该方法包括下列步骤:
步骤1:皮秒激光辐照
将石英玻璃样品固定在一台可编程三维位移平台上,通过显微物镜将时域调控的皮秒激光聚焦在石英玻璃样品上,驱动位移平台运动同时启动皮秒激光辐照,在石英玻璃样品内部中直写出所需要的内含微纳裂纹的三维微通道图案;
步骤2:选择性化学腐蚀
将皮秒激光辐照后的石英玻璃样品放入化学腐蚀溶液中,对直写的三维微通道图案进行空间选择性腐蚀去除,进而在石英玻璃样品内部获得具有三维几何构型的微通道结构。
2.根据权利要求1所述的方法,其特征在于,所述的时域调控的皮秒激光的脉冲宽度为1-20 ps,重复频率为1-1000 kHz,聚焦物镜的数值孔径为0.1-1.4。
3.根据权利要求1所述的方法,其特征在于,所述的化学腐蚀溶液为80-95℃的5-20mol/L 氢氧化钾溶液或1-20% 氢氟酸溶液。
CN201811539810.9A 2018-12-17 2018-12-17 皮秒激光诱导石英玻璃内部裂纹实现微流控器件制备的方法 Active CN109551123B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201811539810.9A CN109551123B (zh) 2018-12-17 2018-12-17 皮秒激光诱导石英玻璃内部裂纹实现微流控器件制备的方法
US16/377,138 US11203083B2 (en) 2018-12-17 2019-04-05 Method for fabricating microfluidic devices in fused silica by picosecond laser irradiation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811539810.9A CN109551123B (zh) 2018-12-17 2018-12-17 皮秒激光诱导石英玻璃内部裂纹实现微流控器件制备的方法

Publications (2)

Publication Number Publication Date
CN109551123A true CN109551123A (zh) 2019-04-02
CN109551123B CN109551123B (zh) 2021-08-24

Family

ID=65870059

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811539810.9A Active CN109551123B (zh) 2018-12-17 2018-12-17 皮秒激光诱导石英玻璃内部裂纹实现微流控器件制备的方法

Country Status (2)

Country Link
US (1) US11203083B2 (zh)
CN (1) CN109551123B (zh)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111168233A (zh) * 2020-02-14 2020-05-19 南京理工大学 皮秒激光诱导光学玻璃表面周期性结构的方法
CN111408856A (zh) * 2020-04-15 2020-07-14 华东师范大学重庆研究院 一种飞秒等离子体光栅制造微流控芯片方法及其装置
CN111474622A (zh) * 2020-04-16 2020-07-31 华东师范大学 一种在透明材料内制备三维光波导及光子器件结构的方法
CN112894146A (zh) * 2019-12-04 2021-06-04 大族激光科技产业集团股份有限公司 玻璃基板通孔的激光加工方法和装置
CN113547223A (zh) * 2021-07-21 2021-10-26 中国人民解放军国防科技大学 一种平面化圆片级熔融石英mems陀螺仪的制作方法
CN113825585A (zh) * 2019-05-15 2021-12-21 Uab阿尔特克纳研究与开发所 用于透明材料的激光加工的方法和装置
CN113893798A (zh) * 2021-11-26 2022-01-07 合臣科技(上海)有限公司 一种光催化微反应芯片的制备方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112570897B (zh) * 2020-11-17 2023-03-24 华东师范大学重庆研究院 飞秒脉冲簇产生方法及石英微流控芯片制造装置
CN115055137B (zh) * 2022-08-04 2024-02-06 之江实验室 一种微反应器的加工方法
CN116374947B (zh) * 2023-06-02 2023-08-25 中国工程物理研究院电子工程研究所 一种熔石英悬臂梁-质量块结构及其加工方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1297799A (zh) * 1999-11-30 2001-06-06 佳能株式会社 激光腐蚀方法及其装置
JP4686751B1 (ja) * 2010-01-12 2011-05-25 独立行政法人 日本原子力研究開発機構 冷間加工応力腐食割れ防止方法
US20120067858A1 (en) * 2009-06-04 2012-03-22 Corelase Oy Method and apparatus for processing substrates using a laser
CN103969735A (zh) * 2013-01-29 2014-08-06 肖特公开股份有限公司 集光器或配光器
CN106041313A (zh) * 2016-06-22 2016-10-26 中南大学 一种透明介质微结构均匀改性加工的方法
CN106891092A (zh) * 2015-12-15 2017-06-27 航天科工惯性技术有限公司 一种玻璃微结构加工方法
CN206611009U (zh) * 2017-03-31 2017-11-03 科大国盾量子技术股份有限公司 一种基于双通道延时芯片的脉宽可调的激光器

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10611667B2 (en) * 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1297799A (zh) * 1999-11-30 2001-06-06 佳能株式会社 激光腐蚀方法及其装置
US20120067858A1 (en) * 2009-06-04 2012-03-22 Corelase Oy Method and apparatus for processing substrates using a laser
JP4686751B1 (ja) * 2010-01-12 2011-05-25 独立行政法人 日本原子力研究開発機構 冷間加工応力腐食割れ防止方法
CN103969735A (zh) * 2013-01-29 2014-08-06 肖特公开股份有限公司 集光器或配光器
CN106891092A (zh) * 2015-12-15 2017-06-27 航天科工惯性技术有限公司 一种玻璃微结构加工方法
CN106041313A (zh) * 2016-06-22 2016-10-26 中南大学 一种透明介质微结构均匀改性加工的方法
CN206611009U (zh) * 2017-03-31 2017-11-03 科大国盾量子技术股份有限公司 一种基于双通道延时芯片的脉宽可调的激光器

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
李林: "《现代光学设计方法(第3版)》", 30 September 2018, 北京理工大学出版社 *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113825585A (zh) * 2019-05-15 2021-12-21 Uab阿尔特克纳研究与开发所 用于透明材料的激光加工的方法和装置
CN113825585B (zh) * 2019-05-15 2024-03-26 Uab阿尔特克纳研究与开发所 用于透明材料的激光加工的方法和装置
CN112894146A (zh) * 2019-12-04 2021-06-04 大族激光科技产业集团股份有限公司 玻璃基板通孔的激光加工方法和装置
CN111168233A (zh) * 2020-02-14 2020-05-19 南京理工大学 皮秒激光诱导光学玻璃表面周期性结构的方法
CN111408856A (zh) * 2020-04-15 2020-07-14 华东师范大学重庆研究院 一种飞秒等离子体光栅制造微流控芯片方法及其装置
CN111474622A (zh) * 2020-04-16 2020-07-31 华东师范大学 一种在透明材料内制备三维光波导及光子器件结构的方法
CN111474622B (zh) * 2020-04-16 2022-08-16 华东师范大学 一种在透明材料内制备三维光波导及光子器件结构的方法
CN113547223A (zh) * 2021-07-21 2021-10-26 中国人民解放军国防科技大学 一种平面化圆片级熔融石英mems陀螺仪的制作方法
CN113547223B (zh) * 2021-07-21 2022-04-22 中国人民解放军国防科技大学 一种平面化圆片级熔融石英mems陀螺仪的制作方法
CN113893798A (zh) * 2021-11-26 2022-01-07 合臣科技(上海)有限公司 一种光催化微反应芯片的制备方法

Also Published As

Publication number Publication date
US11203083B2 (en) 2021-12-21
US20200189028A1 (en) 2020-06-18
CN109551123B (zh) 2021-08-24

Similar Documents

Publication Publication Date Title
CN109551123A (zh) 皮秒激光诱导石英玻璃内部裂纹实现微流控器件制备的方法
Ross et al. Optimisation of ultrafast laser assisted etching in fused silica
Lei et al. Ultrafast laser applications in manufacturing processes: A state-of-the-art review
Guo et al. Femtosecond laser micro/nano-manufacturing: theories, measurements, methods, and applications
Sugioka et al. Femtosecond laser three-dimensional micro-and nanofabrication
Sugioka et al. Ultrafast lasers—reliable tools for advanced materials processing
US11370657B2 (en) Method and apparatus for manufacturing microfluidic chip with femtosecond plasma grating
CN102351406B (zh) 利用飞秒激光在玻璃内部直写微机械零件的方法
CN103706955A (zh) 一种利用电子动态调控制备高深径比三维微通道的方法
CN105458529A (zh) 一种高效制备高深径比微孔阵列的方法
CN106735947A (zh) 一种高效可控加工大面积硅微纳结构的方法
Cerami et al. Femtosecond laser micromachining
US20210283722A1 (en) Device and method for precessing micro-channel on microfluidic chip using multi-focus ultrafast laser
CN102601529A (zh) 一种提高飞秒激光制备微通道加工效率的方法
Dogan et al. Optimization of ultrafast laser parameters for 3D micromachining of fused silica
CN106744662A (zh) 一种利用电子动态调控制备硅纳米线结构的方法
Smith et al. Advances in femtosecond micromachining and inscription of micro and nano photonic devices
Luo et al. Fabrication of glass micro-prisms using ultra-fast laser pulses with chemical etching process
Zheng et al. Femtosecond laser internal manufacturing of three-dimensional microstructure devices
Wang et al. Fabrication of microhole arrays on coated silica sheet using femtosecond laser
Shen et al. Fabrication of microgrooves in PMN-PT using femtosecond laser irradiation and acid etching
Sugioka Ultrafast Laser Micro-and Nano-processing of Glasses
Jiang et al. Microchannels on aluminosilicate glass fabricated by selective laser etching
CN109701673B (zh) 三维大尺寸高精度微流控通道的制备方法
Yang et al. Rapid Fabrication of Yttrium Aluminum Garnet Microhole Array Based on Femtosecond Bessel Beam

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant