CN109545891A - Severing machine structure - Google Patents
Severing machine structure Download PDFInfo
- Publication number
- CN109545891A CN109545891A CN201811353067.8A CN201811353067A CN109545891A CN 109545891 A CN109545891 A CN 109545891A CN 201811353067 A CN201811353067 A CN 201811353067A CN 109545891 A CN109545891 A CN 109545891A
- Authority
- CN
- China
- Prior art keywords
- cylinder
- sucker
- suction cup
- pieces
- side suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052710 silicon Inorganic materials 0.000 abstract description 7
- 239000010703 silicon Substances 0.000 abstract description 7
- 239000012634 fragment Substances 0.000 abstract description 6
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 101100327917 Caenorhabditis elegans chup-1 gene Proteins 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a kind of severing machine structures, are related to silicon wafer and break piece field, including break piece side suction cup, face sucker, cylinder and bracket institution；The bracket institution includes two pieces of support plates, bottom plate, air cylinder fixed plate and cylinder connecting plate；The piece side suction cup of breaking is mounted on two pieces of support plates；The air cylinder fixed plate is mounted on two pieces of support plate sides；The cylinder is mounted in air cylinder fixed plate；The face sucker is connect by cylinder connecting plate with cylinder；Severing machine structure of the invention breaks piece side suction cup and adsorbs vacuum using Bu Nuoli sucker principle, and absorption flow is big, guarantees that silicon wafer fitting is close, reduces the fragment rate broken during piece, fragment rate controls between 0.01%-0.04%；It breaks piece side suction cup and face sucker is worked in coordination, piece uniform force is broken in guarantee；Cylinder drive surface sucker moves up and down, so that breaking, piece is high-efficient, and beat is fast, can achieve 3000PCS/H.
Description
Technical field
Of the invention and a kind of silicon wafer production equipment more particularly to a kind of severing machine structure.
Background technique
Silicon wafer is widely used in semicon industry and microelectronics technology, is a kind of very reliable semiconductor material.
It needs for monolith silicon wafer to be divided into muti-piece chip in process of production, common technique has laser cutting and breaks piece.Current
Silicon wafer, which is broken piece equipment and mostly used, mechanically breaks piece, stretches severing table by cylinder, and the silicon wafer being placed on it is broken piece processing,
This production method be easy to cause die crack, and fragment rate is 0.05% or more.
Summary of the invention
The technical problem to be solved by the present invention is to provide a kind of severing machine structures that fragment rate is low, break piece uniform force.
The technical solution adopted by the present invention to solve the technical problems is: a kind of severing machine structure, including breaks piece side suction cup, face
Sucker, cylinder and bracket institution；Wherein the bracket institution includes that two pieces of support plates, bottom plate, air cylinder fixed plates are connected with cylinder
Plate；The piece side suction cup of breaking is mounted on the upside of two pieces of support plates；The air cylinder fixed plate is mounted on two pieces of support plate sides；It is described
Cylinder is mounted in air cylinder fixed plate；The face sucker is connect by cylinder connecting plate with cylinder.
Further, the piece side suction cup of breaking is using Bu Nuoli sucker principle absorption vacuum.
Further, the face sucker inhales vacuum using vacuum generator.
Further, the face sucker upper level ratio breaks the high 3mm-7mm in piece side suction cup upper surface.
Further, two pieces of support plates are installed on bottom plate and two pieces of support plates are parallel to each other.
Further, there are four fixation holes for setting on the bottom plate.
Vacuum is adsorbed using Bu Nuoli sucker principle the beneficial effects of the present invention are: breaking piece side suction cup, so that breaking piece fitting
Property it is good, can be effectively reduced fragment rate, fragment rate controls between 0.01%-0.04%；It breaks piece side suction cup and face sucker is mutual
Piece uniform force is broken in cooperation, guarantee；It is moved up and down by cylinder driving mechanism, so that breaking, piece is high-efficient, and beat is fast, can achieve
3000PCS/H。
Detailed description of the invention
Fig. 1 is severing machine structure structural schematic diagram；
Fig. 2 is severing machine structure main view.
Figure label are as follows: break piece side suction cup 10, face sucker 20, cylinder 30, support plate 40, air cylinder fixed plate 50, cylinder and connect
Fishplate bar 60, bottom plate 70, fixation hole 71.
Specific embodiment
The present invention is further described with reference to the accompanying drawings and detailed description.
A kind of severing machine structure as depicted in figs. 1 and 2, including break piece side suction cup 10, face sucker 20, cylinder 30 and timbering machine
Structure；The bracket institution includes two pieces of support plates 40, bottom plate 70, air cylinder fixed plate 50 and cylinder connecting plate 60；It is described to break piece side
Sucker 10 is mounted on two pieces of support plates 40；The air cylinder fixed plate 50 is mounted on two pieces of 40 sides of support plate；The cylinder
30 are mounted in air cylinder fixed plate 50；The face sucker 20 is connect by cylinder connecting plate 60 with cylinder 30.It is described to break the suction of piece side
Disk 10 and face sucker 20 are worked in coordination, and piece uniform force is broken in guarantee；It is moved up and down by 30 driving mechanism of cylinder, so that breaking piece effect
Rate is high, and beat is fast, can reach 3000PCS/H.
On the basis of the above, as depicted in figs. 1 and 2, the piece side suction cup 10 of breaking is adsorbed very using Bu Nuoli sucker principle
It is empty；The piece side suction cup 1 of breaking can also be used vacuum generator to inhale vacuum, but compare Bu Nuoli sucker principle absorption vacuum flow
Not enough.
On the basis of the above, as depicted in figs. 1 and 2, the face sucker 20 inhales vacuum using vacuum generator.
On the basis of the above, as depicted in figs. 1 and 2, the 20 upper level ratio of face sucker breaks table in piece side suction cup 10
The high 3mm-7mm in face；30 drive surface sucker 20 of cylinder is completed to break piece during moving up and down.
On the basis of the above, as depicted in figs. 1 and 2, two pieces of support plates 40 be installed on bottom plate 70 by screw and
Two pieces of support plates 40 are parallel to each other.
On the basis of the above, as depicted in figs. 1 and 2, there are four fixation holes 71 for setting on the bottom plate 70；The fixation hole
71 for promoting the stability of mechanism for 70 fixation of bottom plate.
Particular embodiments described above has carried out further in detail the purpose of the present invention, technical scheme and beneficial effects
It describes in detail bright, it should be understood that the above is only a specific embodiment of the present invention, is not intended to restrict the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution, improvement and etc. done should be included in guarantor of the invention
Within the scope of shield.
Claims (6)
1. a kind of severing machine structure, including break piece side suction cup (10), face sucker (20), cylinder (30) and bracket institution；Its feature exists
In: the bracket institution includes two pieces of support plates (40), bottom plate (70), air cylinder fixed plate (50) and cylinder connecting plate (60)；Institute
It states and breaks piece side suction cup (10) and be mounted on the upside of two pieces of support plates (40)；The air cylinder fixed plate (50) is mounted on two pieces of support plates
(40) side；The cylinder (30) is mounted on air cylinder fixed plate (50)；The face sucker (20) passes through cylinder connecting plate (60)
It is connect with cylinder (30).
2. a kind of severing machine structure according to claim 1, it is characterised in that: described break piece side suction cup (10) are using Bu Nuoli
Sucker principle adsorbs vacuum.
3. a kind of severing machine structure according to claim 1, it is characterised in that: the face sucker (20) uses vacuum generator
Adsorb vacuum.
4. a kind of severing machine structure according to claim 1, it is characterised in that: face sucker (20) the upper level ratio is broken
Piece side suction cup (10) high 3mm-7mm in upper surface.
5. a kind of severing machine structure according to claim 1, it is characterised in that: two pieces of support plates (40) are pacified by screw
Loaded on bottom plate (70)；Two pieces of support plates (40) are parallel to each other.
6. a kind of severing machine structure according to claim 1, it is characterised in that: there are four fixed for setting on the bottom plate (70)
Hole (71).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811353067.8A CN109545891A (en) | 2018-11-14 | 2018-11-14 | Severing machine structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811353067.8A CN109545891A (en) | 2018-11-14 | 2018-11-14 | Severing machine structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109545891A true CN109545891A (en) | 2019-03-29 |
Family
ID=65847328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811353067.8A Pending CN109545891A (en) | 2018-11-14 | 2018-11-14 | Severing machine structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109545891A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106142884A (en) * | 2016-08-23 | 2016-11-23 | 江西伊贝基科技有限公司 | A kind of method using vacuum to fix books archives front cover and locked instrument |
| CN106425130A (en) * | 2016-10-13 | 2017-02-22 | 珠海市粤茂激光设备工程有限公司 | Laser wafer scribing machine |
-
2018
- 2018-11-14 CN CN201811353067.8A patent/CN109545891A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106142884A (en) * | 2016-08-23 | 2016-11-23 | 江西伊贝基科技有限公司 | A kind of method using vacuum to fix books archives front cover and locked instrument |
| CN106425130A (en) * | 2016-10-13 | 2017-02-22 | 珠海市粤茂激光设备工程有限公司 | Laser wafer scribing machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190329 |
|
| RJ01 | Rejection of invention patent application after publication |