CN109494306B - Device packaging method and flexible device - Google Patents
Device packaging method and flexible device Download PDFInfo
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- CN109494306B CN109494306B CN201710812739.6A CN201710812739A CN109494306B CN 109494306 B CN109494306 B CN 109494306B CN 201710812739 A CN201710812739 A CN 201710812739A CN 109494306 B CN109494306 B CN 109494306B
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- H—ELECTRICITY
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- H10K50/84—Passivation; Containers; Encapsulations
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Abstract
The embodiment of the invention provides a device packaging method and a flexible device, which are used for improving the packaging performance of the device and comprise the following steps: step 1, placing a substrate in a growth device, wherein the growth device comprises an upper electrode and a lower electrode; step 2, controlling the growth conditions of the growth device, and generating a reactant into a concave-convex layer positioned on the substrate under the action of the upper electrode and the lower electrode; the reactant is matched with the material of the concave-convex layer, and the shape of the concave-convex layer is determined by the medium array arranged on the lower electrode; and 3, repeating the step 2 until a packaging layer meeting the packaging requirement is generated, wherein the contact concave-convex surfaces in the packaging layer are mutually combined. By adopting the technical scheme, the packaging layer comprising the plurality of concave-convex layers can be obtained, and the concave-convex layers in the packaging layer can fully release stress in the packaging layer, so that the flexibility of the packaging layer is improved.
Description
Technical Field
The invention relates to the technical field of electronic science, in particular to a device packaging method and a flexible device.
Background
Packaging is an important step in the semiconductor manufacturing process, and the performance of the package can seriously affect the performance of the device product. Moreover, for most semiconductor electronic devices, the package is required to provide a relatively stable working environment isolated from the outside, so the package is also a protection for the semiconductor electronic device, for example, the package can isolate the moisture in the air and the oxidation of the air to the device, and delay the aging of the device, or resist the external temperature change, and can delay the aging of the device and ensure the stable working performance of the device.
However, during the period of manufacturing flexible materials, the packaging effect of the existing packaging process is not satisfactory, especially for flexible Organic Light-Emitting diodes (OLEDs), the requirement on the reliability of Thin Film packaging Technology (TFE) is high, and the service life of the OLED display is directly affected by the quality of the packaging. The commonly used packaging technologies at present mainly include single-layer film packaging technology, organic-inorganic composite film packaging technology and inorganic composite film packaging technology.
Fig. 1 is a schematic view of a single-layer film packaging structure in the prior art, and as shown in fig. 1, a single-layer material film is directly covered on an OLED to be packaged, although the packaging manner is simple, the packaging effect is not ideal, the stress in the single-layer material film is large, and the packaging performance cannot meet the packaging requirement of a flexible device.
Fig. 2 is a schematic diagram of a packaging structure of an organic-inorganic composite film in the prior art, and fig. 3 is a schematic diagram of a packaging structure of an inorganic composite film in the prior art, which has a limited effect on stress release, thereby limiting the improvement of packaging performance.
In summary, the conventional flexible device packaging structure has the problem of low packaging performance.
Disclosure of Invention
The invention provides a device packaging method and a flexible device, which are used for improving the packaging performance of the device.
The embodiment of the invention provides a device packaging method, which comprises the following steps:
and 3, repeating the step 2 until a packaging layer meeting the packaging requirement is generated, wherein the contact concave-convex surfaces in the packaging layer are mutually combined.
Optionally, controlling the growth conditions of the growth device comprises:
the lower electrode is provided with a first dielectric array, and the first dielectric array is formed by arranging a plurality of dielectrics according to a first rule;
controlling first growth conditions of the growth apparatus to thereby generate a first relief layer on top of the substrate;
removing the first dielectric array;
controlling second growth conditions of the growth apparatus so as to generate a second relief layer located above the first relief layer, the raised sites of the second relief layer filling the recessed sites of the first relief layer.
Optionally, controlling the growth conditions of the growth device comprises:
the lower electrode is provided with a first dielectric array, and the first dielectric array is formed by arranging a plurality of dielectrics according to a first rule;
controlling first growth conditions of the growth apparatus to thereby generate a first relief layer on top of the substrate;
the lower electrode is provided with a second medium array; the second medium array is formed by arranging a plurality of mediums according to a second rule, and the second rule is opposite to the first rule;
controlling second growth conditions of the growth device so as to generate a second relief layer on top of the first relief layer.
Optionally, the lower electrode is provided with a second dielectric array, comprising:
the first medium array and the second medium array are positioned on the same template;
the first dielectric array and the second dielectric array are switched by changing the position of the substrate.
Optionally, controlling the growth conditions of the growth device comprises:
determining the thickness ratio of the concave-convex layer meeting the packaging requirement; the thickness ratio is the ratio of the minimum thickness to the maximum thickness of the concave-convex layer;
and determining the growth conditions of the relief layer according to the thickness ratio of the relief layer.
Optionally, the growth device is a plasma enhanced chemical vapor deposition device PECVD.
An embodiment of the present invention provides a flexible device, including:
a substrate and an encapsulation layer;
the packaging layer is positioned on the substrate; the encapsulation layer comprises a plurality of relief layers; the two concave-convex surfaces which are contacted in the packaging layer are mutually combined.
Optionally, one surface of the concave-convex layer away from the concave-convex surface is a plane; the concave-convex layers are combined with the adjacent concave-convex layers through concave-convex surfaces or planes.
Optionally, the thickness ratio of the concave-convex layer is determined according to the packaging requirement, and the thickness ratio is the ratio of the minimum thickness to the maximum thickness of the concave-convex layer.
Optionally, the relief layer is an inorganic layer.
In summary, embodiments of the present invention provide a device packaging method and a flexible device, including: step 1, placing a substrate in a growth device, wherein the growth device comprises an upper electrode and a lower electrode; step 2, controlling the growth conditions of the growth device, and generating a reactant into a concave-convex layer positioned on the substrate under the action of the upper electrode and the lower electrode; the reactant is matched with the material of the concave-convex layer, and the shape of the concave-convex layer is determined by the medium array arranged on the lower electrode; and 3, repeating the step 2 until a packaging layer meeting the packaging requirement is generated, wherein the contact concave-convex surfaces in the packaging layer are mutually combined. By adopting the technical scheme provided by the embodiment of the invention, the packaging layer comprising a plurality of concave-convex layers can be obtained on the substrate, and two concave-convex surfaces which are contacted in the packaging layer are mutually combined. The concave-convex layer in the packaging layer can fully release stress in the packaging layer, so that the flexibility of the packaging layer is improved, and the packaging performance of the device can be improved by adopting the technical scheme provided by the embodiment of the invention for packaging.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
FIG. 1 is a diagram illustrating a single-layer film package structure in the prior art;
FIG. 2 is a schematic diagram of an organic-inorganic composite thin film package structure in the prior art;
FIG. 3 is a schematic diagram of an inorganic composite film package structure in the prior art;
FIG. 4 is a schematic structural diagram of a flexible device according to an embodiment of the present invention;
fig. 5a is a schematic diagram illustrating deformation of a relief layer structure when a device according to an embodiment of the present invention is subjected to compressive stress;
fig. 5b is a schematic diagram illustrating deformation of a relief layer structure when a device according to an embodiment of the present invention is subjected to a tensile stress;
FIG. 6 is a schematic diagram of a water and oxygen invasion path based on a flexible device according to an embodiment of the present invention;
fig. 7 is a schematic illustration of a relief layer thickness ratio definition according to an embodiment of the invention;
FIG. 8 is a flowchart illustrating a device packaging method according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a first dielectric array structure according to an embodiment of the present invention;
FIG. 10 is a side cut view of a growth device according to an embodiment of the present invention;
FIG. 11 is a schematic diagram of a second dielectric array structure corresponding to that of FIG. 9 according to an embodiment of the present invention;
fig. 12 is a schematic diagram illustrating a growth process of an encapsulation layer according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in further detail with reference to the accompanying drawings, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 4 is a schematic structural diagram of a flexible device according to an embodiment of the present invention, and as shown in fig. 4, the flexible device includes:
a substrate and an encapsulation layer;
the packaging layer is positioned on the substrate; the encapsulation layer comprises a plurality of relief layers; the two concave-convex surfaces which are contacted in the packaging layer are mutually combined.
In one embodiment, the substrate is a substrate on which the original device structure has been grown, for example, for a semiconductor laser, the substrate refers to a substrate on which the active region of the laser has been grown. The device is encapsulated by covering the substrate with an encapsulation layer, and covering the original device structure on the substrate under the encapsulation layer.
As shown in fig. 4, the encapsulation layer on the substrate is formed of a plurality of relief layers, each relief layer having a relief surface, wherein two relief surfaces at junctions in the encapsulation layer are bonded to each other. When the flexible device is deformed, the structure of the concave-convex layer is more beneficial to stress release. Fig. 5a is a schematic diagram illustrating deformation of a concave-convex layer structure when a device according to an embodiment of the present invention is subjected to a compressive stress, and as shown in fig. 5a, when the device is subjected to a downward compressive stress, a concave-convex laminated layer with a concave-convex surface facing downward is deformed, and the concave-convex surface releases the downward compressive stress. Fig. 5b is a schematic diagram illustrating deformation of the concave-convex layer structure when a device according to an embodiment of the present invention is subjected to a tensile stress, and as shown in fig. 5b, when the device is subjected to an upward tensile stress, the concave-convex laminated layer with the concave-convex surface facing upward is deformed, and the concave-convex surface releases the upward tensile stress. As can be seen from fig. 5a and 5b, the concave-convex surface structure provided by the embodiment of the present invention is more powerful in stress release, and therefore, is more suitable for a flexible device which is easily subjected to larger deformation, and therefore, the flexible device provided by the embodiment of the present invention has better packaging performance.
In addition to stress relief, the flexible device provided by the embodiment of the invention can better resist the invasion of external impurities. Taking water and oxygen as an example, fig. 6 is a schematic diagram of a water and oxygen invasion path based on the flexible device according to the embodiment of the present invention. As shown by the thick black lines in fig. 6, when the water and oxygen pass through the first concave-convex layer to reach the concave-convex surface, the water and oxygen tend to invade along the concave part of the next concave-convex layer at the joint of the concave-convex surfaces because the next concave-convex layer has a certain thickness difference and the joint of the concave-convex surfaces of the two concave-convex layers is more unstable than the inside of the concave-convex surfaces, and in the prior art, the water and oxygen directly pass through the packaging layer to invade downwards. Compared with the existing device packaged by the non-concave-convex layer, when the external impurities invade the flexible device provided by the embodiment of the invention, the external impurities can penetrate through the packaging layer through a longer invasion path, so that the flexible device provided by the embodiment of the invention can better resist the invasion of the external impurities, the working performance of the device is more stable, the service life of the device is prolonged, and the packaging performance is further improved.
Preferably, one surface of the concave-convex layer away from the concave-convex surface is a plane; the concave-convex layers are combined with the adjacent concave-convex layers through concave-convex surfaces or planes. One surface of the concave-convex layer is a concave-convex surface, the other surface is a plane, the concave-convex surface contacted with the substrate is combined with the substrate through the plane, and the concave-convex surface is combined with the concave-convex layer above the concave-convex surface. After even-number-times of concave-convex layers are grown, the surface of the packaged flexible device is still a plane, and subsequent assembly or attractiveness of the flexible device cannot be influenced by the concave-convex surfaces.
To further illustrate the encapsulation layer of the flexible device provided by the embodiments of the present invention, parameters are defined for the relief layer: the thickness ratio is the ratio of the minimum thickness to the maximum thickness of the relief layer. Fig. 7 is a schematic illustration of a relief layer thickness ratio definition according to an embodiment of the invention, the relief layer shown in fig. 7 having a minimum thickness, i.e. a thickness corresponding to a depression H1; the maximum thickness, i.e. the thickness corresponding to the protrusions, is H2, the thickness ratio of the relief layer shown in fig. 7 is H1/H2. The thickness ratio is an important design parameter of the packaging layer of the flexible device provided by the embodiment of the invention, and is related to the final packaging performance of the device. In general, the thickness ratio of the relief layer is a thickness ratio that can achieve the best stress relief and water oxygen barrier effect, obtained by comprehensively considering various factors such as the kind of material of the relief layer, the packaging requirements, and the like.
It should be noted that in the encapsulation layer of the flexible device provided in the embodiment of the present invention, the materials of the concave-convex layers may be the same or different, and preferably, the materials of the concave-convex layers are all inorganic layers. The growth of inorganic package structures is a very mature means in the existing semiconductor package technology, and can be performed by using most growth apparatuses, especially by using Plasma Enhanced Chemical Vapor Deposition (PECVD) equipment. The growth is carried out by PECVD, the growth rate of the packaging layer can be improved, the cost is relatively low, and the industrial generation of the flexible device provided by the embodiment of the invention is more facilitated.
Based on the flexible device, the embodiment of the invention also provides a device packaging method, which can realize packaging of the flexible device. Fig. 8 is a schematic flow chart of a device packaging method according to an embodiment of the present invention, as shown in fig. 8, including:
s801: placing a substrate in a growth apparatus, the growth apparatus comprising an upper electrode and a lower electrode;
s802: controlling the growth conditions of the growth device, and generating a reactant into a concave-convex layer positioned on the substrate under the action of the upper electrode and the lower electrode; the reactant is matched with the material of the concave-convex layer, and the shape of the concave-convex layer is determined by a medium array arranged on the lower electrode;
s803: and repeating the step S802 until a packaging layer meeting the packaging requirement is generated, wherein the contact concave-convex surfaces in the packaging layer are combined with each other.
In the specific implementation process of S801, a dielectric array corresponding to the shape of the concave-convex layer to be obtained is arranged on the lower electrode, and the substrate is placed on the growth apparatus, that is, the substrate is placed on the dielectric array on the lower electrode. The growth apparatus is a growth apparatus comprising an upper electrode and a lower electrode, and the reactant is deposited on the substrate by acting on the reactant through the upper electrode and the lower electrode, and various apparatuses such as PECVD, magnetron sputtering, AMOCVD, and the like can be the growth apparatus according to the embodiment of the present invention.
In the specific implementation of S802, the growth conditions of the growth apparatus include specific parameters related to the growth apparatus, but must include basic conditions such as growth time, growth material, and growth temperature. The specific values of the various parameters in the growth conditions need to be set according to the situation of the relief layer to be grown, for example, if the thickness of the relief layer to be grown is large, the time in the growth conditions is set to be correspondingly long, and for example, if the material of the relief layer to be grown is gallium arsenide, the arsenic source and the gallium source in the growth device need to be set to be turned on. The growth material is matched according to the matching condition between the films such as stress, refractivity and the like. The growth time is related to the thickness of the relief layer, and the thickness ratio of the relief layer is related to the encapsulation performance, so that a reasonable growth time needs to be set according to the type of the medium and the encapsulation requirement to obtain the thickness ratio of the relief layer meeting the encapsulation requirement.
In the growth process of the concave-convex layer, the growth device transmits reactants to the areas where the upper electrode and the lower electrode are located according to the arranged growth materials, and due to the existence of the medium array, the electric field intensity of the reactants is different. The electric field is weaker in the place with the medium, the reactant deposited in the area corresponding to the substrate is less, the electric field is stronger in the place without the medium, and the reactant deposited in the area corresponding to the substrate is more. Finally, under the action of the upper electrode and the lower electrode, the reactant deposits a concave-convex layer on the substrate. Optionally, the medium is a more commonly used ceramic material. The size of the medium, the arrangement mode of the medium array and the like can be adjusted according to the design requirements of the concave-convex layer.
In the specific implementation process of S803, since the encapsulation layer to be grown has a plurality of concave-convex layers, S802 is repeated until an encapsulation layer meeting the encapsulation requirement is generated, and the concave-convex surfaces in contact in the encapsulation layer need to be combined with each other. It is noted that each repetition of S802 requires adjusting the growth conditions, including the dielectric array, according to the relief layer to be grown, in order to meet the requirements of the encapsulation.
By adopting the technical scheme provided by the embodiment of the invention, the packaging layer comprising a plurality of concave-convex layers can be obtained on the substrate, and two concave-convex surfaces which are contacted in the packaging layer are mutually combined. The concave-convex layer in the packaging layer can fully release stress in the packaging layer, so that the flexibility of the packaging layer is improved, and the packaging performance of the device can be improved by adopting the technical scheme provided by the embodiment of the invention for packaging.
In order to more specifically describe the device packaging method provided by the embodiment of the present invention, the embodiment of the present invention further provides the following specific embodiments, and it should be noted that the following specific embodiments are only provided for describing the device packaging method provided by the embodiment of the present invention, and do not represent that the embodiment of the present invention only includes or only applies to the following specific embodiments.
(embodiment one)
Fig. 9 is a schematic structural diagram of a first dielectric array according to an embodiment of the present invention, where as shown in fig. 9, a black area represents a dielectric, and a white area represents no dielectric. Before starting the growth of the relief layer, a first dielectric array is arranged above the lower electrode. Fig. 10 is a side cut view of a growth device according to an embodiment of the present invention, as shown in fig. 10, a first dielectric array is disposed on a lower electrode, and a substrate is disposed on the first dielectric array. The area corresponding to the medium on the substrate is area A, and the area voltage corresponding to the non-medium is area B. Generally, the environment of the growth device during the growth of the material is a vacuum environment, and the dielectric constant of the medium is higher than the vacuum dielectric constant, so that the voltage of the area a is lower than that of the area B, the number of reactant ions generated in the area a is relatively small, and macroscopically, the thickness of the film generated in the area a is thinner than that generated in the area B, thereby obtaining the first concave-convex layer.
And on the basis of the obtained first concave-convex layer, removing the medium array, growing a second concave-convex layer, wherein the concave positions of the first concave-convex layer are filled with the convex positions of the second concave-convex layer. When the thickness of the second relief layer is sufficiently high, a flat surface can also be obtained on the other side of the relief surface.
(second embodiment)
A first relief layer is obtained also on the basis of the first medium array and the growth means as shown in fig. 9 and 10. Then, a second dielectric array is obtained according to a second arrangement rule opposite to the first arrangement rule of the first dielectric array, as shown in fig. 11, which is a schematic structural diagram of the second dielectric array corresponding to fig. 9 according to the embodiment of the present invention. Since the arrangement rule of the second medium array is exactly opposite to that of the first medium array, the obtained second relief layer can be better combined with the first relief layer, and a larger adjustment space is provided for the thickness of the second relief layer.
(third embodiment)
When the packaging layer grows, the growth environment needs to be kept absolutely clean, and the growth of the concave-convex layer can be influenced by repeatedly adjusting the medium array. Based on the second embodiment, it is preferable that the first dielectric array and the second dielectric array are fabricated on the same array template, and the first dielectric array and the second dielectric array are switched by changing the position of the substrate.
Fig. 12 is a schematic diagram of a growth process of an encapsulation layer according to an embodiment of the present invention, and as shown in fig. 12, the first dielectric array and the second dielectric array are the same dielectric array under the substrate. When the first concave-convex layer is grown, a concave part grows in a region corresponding to a medium on the substrate, a convex part grows in a region corresponding to no medium on the substrate, and at the moment, the corresponding medium array under the substrate is the first medium array. When the growth of the second concave-convex layer is continued, the substrate is moved to change the medium array below the substrate into a second medium array, the second concave-convex layer is continuously grown, the concave-convex surface of the second concave-convex layer is combined with the concave-convex surface of the first concave-convex layer, and the surface of the grown film is a plane; and then, continuously moving the substrate to change the corresponding medium array below the substrate, and repeatedly growing a third concave-convex layer and a later concave-convex layer until n concave-convex layers are obtained, thereby finishing the growth of the packaging layer.
In summary, embodiments of the present invention provide a device packaging method and a flexible device, including: step 1, placing a substrate in a growth device, wherein the growth device comprises an upper electrode and a lower electrode; step 2, controlling the growth conditions of the growth device, and generating a reactant into a concave-convex layer positioned on the substrate under the action of the upper electrode and the lower electrode; the reactant is matched with the material of the concave-convex layer, and the shape of the concave-convex layer is determined by the medium array arranged on the lower electrode; and 3, repeating the step 2 until a packaging layer meeting the packaging requirement is generated, wherein the contact concave-convex surfaces in the packaging layer are mutually combined. By adopting the technical scheme provided by the embodiment of the invention, the packaging layer comprising a plurality of concave-convex layers can be obtained on the substrate, and two concave-convex surfaces which are contacted in the packaging layer are mutually combined. The concave-convex layer in the packaging layer can fully release stress in the packaging layer, so that the flexibility of the packaging layer is improved, and the packaging performance of the device can be improved by adopting the technical scheme provided by the embodiment of the invention for packaging.
The present invention is described with reference to flowchart illustrations and/or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each flow and/or block of the flow diagrams and/or block diagrams, and combinations of flows and/or blocks in the flow diagrams and/or block diagrams, can be implemented by computer program instructions. These computer program instructions may be provided to a processor of a general purpose computer, special purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing apparatus to function in a particular manner, such that the instructions stored in the computer-readable memory produce an article of manufacture including instruction means which implement the function specified in the flowchart flow or flows and/or block diagram block or blocks.
These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer implemented process such that the instructions which execute on the computer or other programmable apparatus provide steps for implementing the functions specified in the flowchart flow or flows and/or block diagram block or blocks.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (5)
1. A device packaging method, comprising:
step 1, placing a substrate in a growth device, wherein the growth device comprises an upper electrode and a lower electrode;
step 2, the lower electrode is provided with a first medium array, and the first medium array is formed by arranging a plurality of media according to a first rule;
controlling first growth conditions of the growth apparatus so as to generate a first relief layer on top of the substrate;
removing the first dielectric array;
controlling second growth conditions of the growth apparatus so as to generate a second relief layer on the first relief layer, wherein the raised sites of the second relief layer fill the recessed sites of the first relief layer, and under the action of the upper electrode and the lower electrode, reactants are generated into the relief layer on the substrate; the reactant is matched with the material of the concave-convex layer, the shape of the concave-convex layer is determined by a medium array arranged on the lower electrode, and the concave-convex layer is made of an inorganic material;
and 3, repeating the step 2 until a packaging layer meeting the packaging requirement is generated, wherein the contact concave-convex surfaces in the packaging layer are mutually combined.
2. A device packaging method, comprising:
step 1, placing a substrate in a growth device, wherein the growth device comprises an upper electrode and a lower electrode;
step 2, the lower electrode is provided with a first medium array, and the first medium array is formed by arranging a plurality of media according to a first rule;
controlling first growth conditions of the growth apparatus so as to generate a first relief layer on top of the substrate;
the lower electrode is provided with a second medium array; the second medium array is formed by arranging a plurality of mediums according to a second rule, and the second rule is opposite to the first rule;
controlling second growth conditions of the growth apparatus so as to produce a second relief layer on top of the first relief layer, the reactants being produced by the upper and lower electrodes into a relief layer on top of the substrate; the reactant is matched with the material of the concave-convex layer, the shape of the concave-convex layer is determined by a medium array arranged on the lower electrode, and the concave-convex layer is made of an inorganic material;
and 3, repeating the step 2 until a packaging layer meeting the packaging requirement is generated, wherein the contact concave-convex surfaces in the packaging layer are mutually combined.
3. The method of claim 2, wherein the lower electrode is provided with a second dielectric array comprising:
the first dielectric array and the second dielectric array are located on the same template;
switching between the first dielectric array and the second dielectric array is achieved by changing the position of the substrate.
4. A method according to any one of claims 1 to 3, wherein controlling the growth conditions of the growth apparatus comprises:
determining the thickness ratio of the relief layer meeting the encapsulation requirements; the thickness ratio is the ratio of the minimum thickness to the maximum thickness of the relief layer;
determining growth conditions of the relief layer according to the thickness ratio of the relief layer.
5. The method of claim 1, comprising:
the growth device is a Plasma Enhanced Chemical Vapor Deposition (PECVD) device.
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| CN105206763A (en) * | 2015-10-21 | 2015-12-30 | 京东方科技集团股份有限公司 | Flexible displayer and production method thereof |
| CN106328826A (en) * | 2016-10-24 | 2017-01-11 | 武汉华星光电技术有限公司 | OLED display device and fabrication method thereof |
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