CN109494169A - LED bonder automatic glue adding device and application method - Google Patents
LED bonder automatic glue adding device and application method Download PDFInfo
- Publication number
- CN109494169A CN109494169A CN201710810187.5A CN201710810187A CN109494169A CN 109494169 A CN109494169 A CN 109494169A CN 201710810187 A CN201710810187 A CN 201710810187A CN 109494169 A CN109494169 A CN 109494169A
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- Prior art keywords
- syringe
- adding device
- crystal
- sheet metal
- bonding adhesive
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- 239000003292 glue Substances 0.000 title claims abstract description 118
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000000853 adhesive Substances 0.000 claims abstract description 57
- 230000001070 adhesive effect Effects 0.000 claims abstract description 56
- 239000004922 lacquer Substances 0.000 claims abstract description 37
- 210000000078 claw Anatomy 0.000 claims abstract description 19
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 88
- 229910052751 metal Inorganic materials 0.000 claims description 88
- 238000001514 detection method Methods 0.000 claims description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 230000006872 improvement Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229920000715 Mucilage Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Coating Apparatus (AREA)
Abstract
The present invention relates to LED bonder automatic glue adding device and application methods.LED bonder automatic glue adding device is provided, the fixing seat on the bracket including being located at carrying die bond lacquer disk(-sc)；The claw being assemblied in fixing seat；The syringe point glue equipment being removably attached on claw is equipped with the piston for sealing and pushing crystal-bonding adhesive with syringe and the syringe needle being located at syringe gum outlet in syringe；The gas outlet of air pressure electromagnetic valve connects syringe point glue equipment by pipeline, and air inlet connects gas compressor by pipeline；The controller being electrically connected with air pressure electromagnetic valve；Controller actuates air pressure electromagnetic valve according to the signal of sensor and opens pressurization, and pneumatically actuates the crystal-bonding adhesive in syringe point glue equipment and be added in die bond lacquer disk(-sc).Additionally provide the method using LED bonder automatic glue adding device.It the invention enables can voluntarily control crystal-bonding adhesive to add glue amount, avoids wasting, solves the problems, such as that crystal-bonding adhesive adds glue to cause LED wafer can not bonding bracket not in time.
Description
Technical field
The present invention relates to LED fields, and in particular to die bond equipment and technology relate more specifically to that LED bonder can be achieved
The device and application method of automatic glue adding.
Background technique
LED bonder is a kind of equipment that can be fixed on LED wafer on LED support.Existing its die bond of LED bonder
Region is provided with collar plate shape die bond lacquer disk(-sc), and die bond lacquer disk(-sc) is used to contain LED crystal-bonding adhesive, takes gluing mechanism from crystal-bonding adhesive convenient for die bond
The bonding operation that a certain amount of crystal-bonding adhesive carries out LED wafer into LED support is transferred in disk.
Existing crystal-bonding adhesive is stored using syringe, is all using artificial hand when carrying out into die bond lacquer disk(-sc) plus glue
Syringe is held to carry out adding glue.Since operating personnel pushes the piston dynamics in syringe inconsistent, crystal-bonding adhesive will lead to out of syringe
The amount being extruded is not easily controlled, few when more when causing the crystal-bonding adhesive being added in lacquer disk(-sc) in this way.When initial job, carry out for the first time
When adding glue manually, die bond lacquer disk(-sc) is rotation, while it is also to rotate synchronously that the disk scraper above die bond lacquer disk(-sc), which is arranged in,.Cause
This, when die bond glue amount is added, the scraper above lacquer disk(-sc) in the course of rotation can wipe extra crystal-bonding adhesive off, to protect
Die bond glue liquid surface in card lacquer disk(-sc) is flushed with crystal-bonding adhesive side surface.Because the crystal-bonding adhesive wiped off by scraper can not be re-used, from
And crystal-bonding adhesive is caused to generate waste.When die bond glue amount adds few, the die bond glue liquid surface in die bond lacquer disk(-sc) cannot be guaranteed and crystal-bonding adhesive
Side surface flushes, and will lead to and is taken when die bond mechanism takes glue less than glue amount or take glue amount very few, so as to cause being transferred in bracket
Glue amount is very few, then makes LED wafer that can not carry out bonding operation with bracket.
Furthermore in die bond operation process, the crystal-bonding adhesive in die bond lacquer disk(-sc) takes gluing mechanism to be constantly transferred to by die bond
In bracket, die bond glue amount can be gradually decreased, when reaching certain critical quantity, when die bond takes gluing mechanism that can not take glue, and operating personnel
Then need to carry out secondary plus glue, but such situation just needs operating personnel's timing to be monitored lacquer disk(-sc) glue amount, if because of operating personnel
Monitor it is not in place and not in time plus when glue, then will lead to can not bonding LED wafer without crystal-bonding adhesive in LED support.In this way, not only shadow
The continuity and dispensing quality of LED die bond processing step are rung, and will obviously therefore reduce production efficiency and product quality.
Summary of the invention
It is a primary object of the present invention to improve for existing LED die bond equipment and technique, to provide structure letter
Single, design automatic glue adding device reasonable, easy to use and technique, so as to overcome the drawbacks described above and not of the prior art
Foot and other technological deficiencies.
It is special to realize that above and other purpose provides a kind of LED bonder automatic glue adding device according to the present invention
Sign is, comprising: is located on the bracket of carrying die bond lacquer disk(-sc) (101) and can rotatably adjust the fixing seat of its position
(100)；The claw (200) of assembly on the fixing seat；The syringe point mucilage binding being removably attached on the claw (200)
It sets (300), the syringe point glue equipment (300) has syringe (301) and is located at the gum outlet (305) of the syringe (301)
Syringe needle (306), the piston (303) for sealing and pushing crystal-bonding adhesive (302) is equipped in the syringe (301)；
Air pressure electromagnetic valve (700), gas outlet (701) connect the syringe point glue equipment (300), and its air inlet by pipeline
(702) gas compressor (703) are connected by pipeline；With the controller (600) being electrically connected with the air pressure electromagnetic valve (700)；
Wherein, the controller (600) actuates the air pressure electromagnetic valve (700) according to the signal from sensor and opens pressurization, and
The crystal-bonding adhesive pneumatically actuated in the syringe point glue equipment (300) is added in die bond lacquer disk(-sc) (101)；And, wherein described
Sheet metal or metal ball (304) are equipped at piston (303) in the syringe (301) of syringe point glue equipment (300), in the fixation
Seat (100) is equipped with metal sensor (400), consolidating in syringe (301) described in the position alignment of the metal sensor (400)
Brilliant glue the location of sheet metal or metal ball (304) when will exhaust, wherein the metal sensor (400) and institute
It is substantially parallel to state syringe (301).
An embodiment according to the present invention, the bracket have connecting rod rest side wall (102), and the fixing seat (100) is fixed
On the connecting rod rest side wall (102).
According to another embodiment of the present invention, the controller (600) is form control (600), the syringe dispensing
The settable air pressure lid (308) mutually matched therewith of the glue-feeder (307) of the syringe (301) of device (300), wherein the table
The gas outlet (701) of lattice controller (600) is connected to the air pressure lid (308) by pipeline (309).
According to another embodiment of the present invention, the sensor is the holder sensor for detection support charging number
(500)。
According to another embodiment of the present invention, fixing seat (100) top is equipped with first with oval-shaped slot hole (104)
Rectangular sheet metal thin plates (103), the first rectangular sheet metal thin plates (103) cooperate with the connecting rod rest side wall (102),
And perpendicular to the first rectangular sheet metal thin plates (103) direction be equipped with the 2nd L shape narrow side sheet metal thin plates (105), and with the L
The 3rd L shape sheet metal thin plates (106) that the distal end faces of shape narrow side sheet metal thin plates (105) are stretched out in the section of about 45 ° of angles.
According to another embodiment of the present invention, the 3rd L shape sheet metal thin plates (106) are equipped with metal sensor (400).
According to another embodiment of the present invention, the side diagonal line of the 3rd L shape sheet metal thin plates (106) is equipped with belt length
4th rectangle sheet metal thin plates (107) of round slot (104), the claw (200) are described by being assemblied in bolt or screw
At the oblong slot (104) of 4th rectangle sheet metal thin plates (107).
According to another embodiment of the present invention, the claw (200) includes the folder of at least one set of multiple arc-shaped inner concavities
Son.
According to another embodiment of the present invention, the LED bonder automatic glue adding device further includes for the first time plus glue switchs
(900)。
According to another embodiment of the present invention, X1 input terminal (601), X2 are respectively equipped on the form control (600)
Input terminal (602), X3 input terminal (603), Y1 output end (604) and Y2 output end (605), wherein the LED bonder is automatic
The DC power supply (2000) of adhesive dispenser is added to be connected on the form control (600) and supply for it via power switch (3000)
Electricity, described to add glue switch (900) to connect with the X1 input terminal (601) of the form control (600) for the first time, holder sensor
(500) it is connect with the X2 input terminal (602), metal sensor (400) is connect with the X3 input terminal (603), the air pressure
Solenoid valve (700) is connected with the Y1 output end (604), and buzzer (1000) is connected with the Y2 output end (605).
According to the present invention, it also discloses using the method according to above-mentioned LED bonder automatic glue adding device, the method packet
Include following steps: manually boot the LED bonder automatic glue adding device adds glue switch (900) for the first time, is controlled by table
Device (600) actuates air pressure electromagnetic valve (700) and opens pressurization, and pneumatically actuates in the syringe (301) of syringe point glue equipment (300)
A certain amount of crystal-bonding adhesive (302) be added die bond lacquer disk(-sc) 101 in；Number, table are fed by holder sensor (500) detection support
Lattice controller (600) actuates the unlatching and closure of air pressure electromagnetic valve (700) based on the bracket of detection charging number, thus controllably
Crystal-bonding adhesive (302) are added in die bond lacquer disk(-sc) (101) at intervals for ground；By in metal sensor (500) detection syringe (301)
Crystal-bonding adhesive (302) corresponding position when will exhaust sheet metal or metal ball (304), wherein when metal sensor (500) are examined
When measuring sheet metal or metal ball (304) of the corresponding position, form control (600) actuates buzzer (1000) alarm；
Add glue switch (900) for the first time next, manually booting again, and actuate air pressure electromagnetic valve (700) and open pressurization, by syringe
(301) remaining crystal-bonding adhesive (302), which is discharged to, in is added in die bond lacquer disk(-sc) (101).
According to another embodiment of the present invention, remaining crystal-bonding adhesive (302) is discharged to addition die bond in by syringe (301)
After in lacquer disk(-sc) (101), next syringe crystal-bonding adhesive is manually replaced.
More specifically, a kind of LED bonder automatic glue adding device of another disclosure of the invention of the invention, is existing
A fixing seat is arranged in the connecting rod rest side wall that bonder carries die bond lacquer disk(-sc), and fixing seat top is provided with the first rectangular sheet metal thin plates,
Oblong slot is offered on first rectangular sheet metal thin plates, it can be by the assembly of screw rod and nut by thin plate and connecting rod rest side wall phase
Mutually cooperate, may be provided with shape perpendicular to thin plate direction is L shape narrow side sheet metal thin plates, with L shape narrow side sheet metal thin plates end
End face is in the extended another L shape sheet metal thin plates in section of 45 ° of angles, may be provided with a metal sensor, institute on this sheet metal thin plates
Stating may be provided with the second rectangle sheet metal thin plates on the diagonal line of L shape narrow side sheet metal thin plates side, and in the second rectangle sheet metal thin plates
On equally may be provided with oblong slot, it is inwardly in the concave card of circular arc that position corresponding with oblong slot, which may be provided with one group,
Pawl can be cooperated thin plate and claw by the assembly of screw rod and nut.
In the background technology, it may be provided with piston above crystal-bonding adhesive filling needle canister portion position, as an improvement, can at piston
A sheet metal or prill are placed, a syringe needle can be added in the gum outlet of syringe, it is settable in the glue-feeder of syringe
One mutually matched air pressure lid, air pressure cap surface may be provided with an air-pressure duct therewith.It in this embodiment, can will be above-mentioned
It improves and is referred to as syringe point glue equipment.
Further, syringe point glue equipment can be placed in claw, rotary pawl and fixing seat fit angle can be passed through
And linear position of the mobile syringe in claw, syringe point glue equipment can be adjusted to suitable position, it is ensured that syringe and metal pass
Sensor position is in parallel, while can guarantee syringe gum outlet position face metal sensor, then rotatable fixing seat and needle
The syringe needle of syringe point glue equipment can be adjusted to right above die bond lacquer disk(-sc) by cylinder point glue equipment and connecting rod rest side wall fit angle.
According to an embodiment, the free end of the air-pressure duct of above-mentioned syringe point glue equipment may be connected to an air pressure electromagnetic valve
Gas outlet above, the air inlet of air pressure electromagnetic valve can pass through a segment pipe and connect a controllable pressure table and and gas compressor
It is connected.
As an improvement, the settable holder sensor of die bond machine support feed end described in the background, is used for
Detection LED support enters the number of bonder operating area.
According to another embodiment, above-mentioned automatic glue adding device may also include that form control, for the first time plus glue trigger switch,
Buzzer, DC power supply and power switch；X1 input terminal is respectively arranged on the form control, X2 input terminal, X3 are defeated
Enter end, Y1 output end, Y2 output end, wherein the power switch and DC power supply are connectable and may be connected to form control
On, it powers for it, for the first time plus glue trigger switch can be connected with the X1 input terminal in form control, and holder sensor can be defeated with X2
Entering end connection, metal sensor can be connected with X3 input terminal, and air pressure electromagnetic valve and controllable pressure table can be connected with Y1 output end,
Air pressure electromagnetic valve can control the time of gas outflow, and controllable pressure table can control atmospheric pressure；Buzzer can be with Y2 output end phase
Even.
Its working principle of automatic glue adding device of the invention is, can start for the first time plus glue switch, pass through form control
Air pressure electromagnetic valve pressurization certain time can be actuated, die bond lacquer disk(-sc) is added to control a certain amount of crystal-bonding adhesive, then can sensed by bracket
Device detection support feeds number, then can intermittent general to control the unlatching and closure that form control actuates air pressure electromagnetic valve
Die bond lacquer disk(-sc), the die bond bonding job requirements of charging support to meet are added in crystal-bonding adhesive.Syringe is detected to metal sensor
When interior crystal-bonding adhesive is in the sheet metal exposed when will exhaust or metal ball, form control can actuate buzzer warning, again
It manually boots for the first time plus glue switchs, pneumatic control valve can be actuated by crystal-bonding adhesive remaining in syringe and be discharged to die bond lacquer disk(-sc), then
Next syringe crystal-bonding adhesive can manually be replaced.
Advantageous effects of the invention include but is not limited to the bonder automatic glue adding device provided through the invention,
Control system can be used carry out the automatic glue adding of crystal-bonding adhesive, solve and manually glue is added to be unable to control glue amount in the prior art
How many problems can avoid the waste problem that artificial plus glue glue amount adds generation, while also can avoid operator and adding glue monitoring not
Cause in place in LED support without crystal-bonding adhesive to can not bonding LED wafer the problem of, etc..
Detailed description of the invention
By reading this specification in conjunction with the following drawings, features, objects and advantages of the invention will become more to show and easy
See, in the accompanying drawings:
Attached drawing 1 is the schematic plan view of automatic glue adding device according to an embodiment of the invention.
Attached drawing 2 is the schematic isometric that syringe point glue equipment according to an embodiment of the invention is assemblied in fixing seat
Figure.
Attached drawing 3 is the schematic perspective view of the fixing seat provided according to one embodiment of present invention and claw assembly.
Specific embodiment
Below in conjunction with attached drawing in the description of a specific embodiment of the invention, one or more of the invention will be illustrated
The details of embodiment.From these descriptions, attached drawing and claims, other feature of the invention, purpose and excellent can be understood
Point.
Several specific embodiments of the invention will be described in more detail below.But the ordinary skill of this field
Personnel are readily appreciated that, be described below in only for some specific embodiments of the present invention, do not have to the scope of the present invention
Restrictive.
As illustrated in the accompanying drawings from 1 to 3, according to one embodiment of present invention, as shown in Figure 1-3, providing a kind of LED bonder
Automatic glue adding device, it may include fixing seat 100, claw 200, syringe point glue equipment 300, metal sensor 400, bracket sensing
Device 500, form control 600, air pressure electromagnetic valve 700, add glue trigger switch 900, buzzer at controllable pressure table 800 for the first time
1000, DC power supply 2000 and power switch 3000.
Fixing seat 100 may be provided on the connecting rod rest side wall 102 of carrying die bond lacquer disk(-sc) 101 of existing bonder, fixing seat
100 tops may be provided with the first rectangular sheet metal thin plates 103, can be equipped with oblong slot 104 on the first rectangular sheet metal thin plates 103,
The first rectangular sheet metal thin plates 103 and connecting rod rest side wall 102 can be cooperated by the assembly of screw rod and nut, perpendicular to
First rectangular 103 direction of sheet metal thin plates may be provided with shape be L shape narrow side sheet metal thin plates 105, can with L shape narrow side sheet metal thin plates
105 distal end faces stretch out another L shape sheet metal thin plates 106 in the section of 45 ° of angles, can be equipped with metal on this sheet metal thin plates 106 and pass
Sensor 400.It may be provided with another rectangle sheet metal thin plates 107 on 106 side diagonal line of L shape narrow side sheet metal thin plates, and in thin plate
On equally may be provided with oblong slot 104, it is inwardly in that circular arc is recessed that position corresponding with oblong slot 104, which may be provided with one group,
The claw 200 of shape.Thin plate 107 and claw 200 can be cooperated by the assembly of screw rod and nut.
In a preferred embodiment, as an improvement, syringe point glue equipment 300 is the improvement carried out based on existing syringe 301.
For existing syringe 301, a sheet metal or prill 304 can be placed at the piston 303 of crystal-bonding adhesive 302 by sealing, in syringe 301
Gum outlet 305 can add a syringe needle 306, glue-feeder 307 settable one in syringe 301 are mutually matched therewith
Air pressure lid 308, air pressure cap surface may be provided with an air-pressure duct 309.
Furthermore, syringe point glue equipment 300 can be placed in claw 200, can pass through rotary pawl 200 and fixing seat
The linear position of 100 fit angles and mobile syringe point glue equipment 300 in claw 200, can adjust syringe point glue equipment 300
To suitable position, it is ensured that syringe 301 is in parallel with 400 position of metal sensor, while can guarantee 301 gum outlet 304 of syringe
Position face metal sensor 400.Then, rotatable fixing seat 100 and syringe point glue equipment 300 are matched with connecting rod rest side wall 102
The syringe needle 306 of syringe point glue equipment 300 is adjusted to right above die bond lacquer disk(-sc) 101 by close angle degree.
According to an embodiment, the free end of the air-pressure duct 309 of syringe point glue equipment 300 above-mentioned may be connected to gas
Above the gas outlet 701 of pressure electromagnetic valve 700, the air inlet 702 of air pressure electromagnetic valve 700 can connect one controllably by a segment pipe
Air gauge 800, and can be connected with gas compressor 703.
In conjunction with above-described embodiment, as an improvement, die bond machine support feed end that can be described in the background is arranged
One holder sensor 500, the number of bonder operating area is entered for detecting LED support.
In conjunction with another embodiment, above-mentioned automatic glue adding device may also include that form control 600, air pressure electromagnetic valve 700,
Controllable pressure table 800 adds glue trigger switch 900, buzzer 1000, DC power supply 2000 and power switch 3000 for the first time.
X1 input terminal 601, X2 input terminal 602, X3 input terminal 603, Y1 output can be respectively arranged on form control 600
604, Y2 output end 605 are held, wherein the power switch 300 and DC power supply 2000 are connectable and may be connected to form control
It on 600, powers for it, for the first time plus glue trigger switch 900 can be connect with the X1 input terminal 601 in form control 600, and bracket passes
Sensor 500 can be connect with X2 input terminal 602, and metal sensor 400 can be connect with X3 input terminal 603, air pressure electromagnetic valve 700 and
Controllable pressure table 800 can be connected with Y1 output end 604, and buzzer 1000 can be connected with Y2 output end 605.
According to another aspect of the present invention, the application method of automatic glue adding device of the invention is further disclosed.It is excellent according to one
Embodiment is selected, after bonder electric power starting but not yet before progress operation, such as when die bond lacquer disk(-sc) 101 is in rotation status,
Can Manual press add glue trigger switch 900 for the first time, by 601 input signal of X1 input terminal in form control 600, via Y1
Output end 604 issues signal, air pressure electromagnetic valve 700 and the pressurization certain time of controllable pressure table 800 is actuated, to control syringe point
Adhesive dispenser 300 discharges a certain amount of crystal-bonding adhesive 302 and is added in die bond lacquer disk(-sc) 101.As explanation, X1 input terminal 601 is in table control
Certain gentle pressure signal of gas delivery time signal can be preset in device 600 processed.For example, 601 setting signal of X1 input terminal
It can be to be 25 seconds the gas delivery time and atmospheric pressure is 20 pas, the signal that Y1 output end 604 can then be set according to input terminal promotees
Take offence pressure electromagnetic valve 700 and controllable pressure table 800, control syringe point glue equipment 300 complete a certain amount of crystal-bonding adhesive 302 plus
Enter.
After a certain amount of crystal-bonding adhesive 302 is added in die bond lacquer disk(-sc) 101, bonder die bond program can be started, LED support starts
Into board track, holder sensor 500 starts to detect the piece number of bracket injection.Before this, in form control 600
X2 input terminal 602 can be preset after receiving holder sensor 500 and detecting pre-determined number, the outflow of executable gas
Time signal and atmospheric pressure signal, for example, X2 input terminal 602, which receives holder sensor 500, detects bracket injection piece
Number be 3, the preset signal of X2 input terminal 602 can be transferred to Y1 output end 604, come actuate air pressure electromagnetic valve 700 and
Controllable pressure table 800 certain times of pressurization discharge a certain amount of addition of crystal-bonding adhesive 302 die bond to control syringe point glue equipment 300
Lacquer disk(-sc) 101, these 302 glue amounts of crystal-bonding adhesive can for example be just met for 3 plate rack die bond job requirements.
From the above, syringe point glue equipment 300 can be actuated according to the signal that X2 input terminal 602 is set, to complete weight
The movement of multiple plus glue.When the crystal-bonding adhesive 302 in syringe 301 will exhaust, the metal ball or sheet metal of 303 top of cylinder piston
304 can drop to 400 horizontal position of metal sensor, after metal sensor 400 detects metal ball or sheet metal 304 at this time,
Signal is passed to X3 input terminal 603, buzzer 1000 is actuated through Y2 output end 605 and alarms.Receiving 1000 alarm signal of buzzer
After number, can Manual press add glue trigger switch 900 for the first time, by X1 input terminal 601 set signal actuate solenoid valve 700 and
Controllable pressure table 800 discharges the remaining addition of crystal-bonding adhesive 302 die bond lacquer disk(-sc) 101, this movement to control syringe point glue equipment 300
It can repeatedly carry out, to guarantee that crystal-bonding adhesive 302 can be completely released completely in syringe 301, then can manually replace next needle
Cylinder crystal-bonding adhesive.
The beneficial effect that the present invention can be realized includes but is not limited to the bonder automatic glue adding dress provided through the invention
It sets, control system can be used carry out the automatic glue adding of crystal-bonding adhesive, so as to solve manually to add glue can not in the prior art
The how many problem of control rubber quality and thus derivative other technical problems.For example, can avoid manually glue glue amount being added to add generation
Waste problem, meanwhile, also can avoid that operator adds glue monitoring not in place and cause to make in LED support without crystal-bonding adhesive can not nation
The technical issues of determining LED wafer.
Above in conjunction with attached drawing, the section Example of bonder automatic glue adding device and method of the invention has been carried out in detail
Thin description.It will be understood by those skilled in the art, however, that above-described be merely illustrative and describe some specific implementations
Mode to the scope of the present invention, especially the scope of the claims, and does not have any restrictions.Those of ordinary skill in the art
To other modifications or equivalent replacement that technical solution of the present invention is made, spirit without departing from technical solution of the present invention and
Range is intended to be within the scope of the claims of the invention.It is limited only by the claims that follow.
Claims (12)
1. a kind of LED bonder automatic glue adding device, comprising:
It is located on the bracket of carrying die bond lacquer disk(-sc) (101) and can rotatably adjust the fixing seat (100) of its position；
The claw (200) of assembly on the fixing seat；
The syringe point glue equipment (300) being removably attached on the claw (200), syringe point glue equipment (300) tool
The syringe needle (306) for having syringe (301) and being located at the gum outlet (305) of the syringe (301), in the syringe
(301) piston (303) for sealing and pushing crystal-bonding adhesive (302) is equipped in；
Air pressure electromagnetic valve (700), gas outlet (701) connect the syringe point glue equipment (300), and its air inlet by pipeline
Mouth (702) passes through pipeline and connects gas compressor (703)；With
The controller (600) being electrically connected with the air pressure electromagnetic valve (700)；
Wherein, the controller (600) actuates the air pressure electromagnetic valve (700) according to the signal from sensor and opens and adds
Pressure, and pneumatically actuate the crystal-bonding adhesive in the syringe point glue equipment (300) and be added in die bond lacquer disk(-sc) (101)；And
Wherein, sheet metal or metal ball are equipped at the piston (303) in the syringe (301) of the syringe point glue equipment (300)
(304), metal sensor (400) are equipped on the fixing seat (100), the position alignment institute of the metal sensor (400)
The crystal-bonding adhesive in syringe (301) is stated when will exhaust the location of the sheet metal or metal ball (304), wherein the gold
Belong to sensor (400) and the syringe (301) is substantially parallel.
2. LED bonder automatic glue adding device according to any one of the preceding claims, which is characterized in that the bracket
With connecting rod rest side wall (102), the fixing seat (100) is fixed on the connecting rod rest side wall (102).
3. LED bonder automatic glue adding device according to any one of the preceding claims, which is characterized in that the control
Device (600) is form control (600), and the glue-feeder (307) of the syringe (301) of the syringe point glue equipment (300) is settable
Mutually matched air pressure lid (308) therewith, wherein the gas outlet (701) of the form control (600) passes through pipeline (309)
It is connected to the air pressure lid (308).
4. LED bonder automatic glue adding device according to any one of the preceding claims, which is characterized in that the sensing
Device is the holder sensor (500) for detection support charging number.
5. LED bonder automatic glue adding device according to claim 2, which is characterized in that fixing seat (100) top
Equipped with the first rectangular sheet metal thin plates (103) with oval-shaped slot hole (104), the first rectangular sheet metal thin plates (103) with it is described
Connecting rod rest side wall (102) cooperates, and is being equipped with the 2nd L shape perpendicular to the first rectangular sheet metal thin plates (103) direction
Narrow side sheet metal thin plates (105), and stretched with the distal end faces of the L shape narrow side sheet metal thin plates (105) in the section of about 45 ° of angles
The 3rd L shape sheet metal thin plates (106) out.
6. LED bonder automatic glue adding device according to claim 5, which is characterized in that the 3rd L shape sheet metal thin plates
(106) metal sensor (400) are equipped with.
7. LED bonder automatic glue adding device according to claim 5, which is characterized in that the 3rd L shape sheet metal thin plates
(106) side diagonal line is equipped with the 4th rectangle sheet metal thin plates (107) with oval-shaped slot hole (104), the claw (200)
By being assemblied at the oblong slot (104) of the 4th rectangle sheet metal thin plates (107) with bolt or screw.
8. LED bonder automatic glue adding device according to any one of the preceding claims, which is characterized in that the claw
(200) include at least one set of multiple arc-shaped inner concavities clip.
9. LED bonder automatic glue adding device according to any one of the preceding claims, which is characterized in that the LED
Bonder automatic glue adding device further includes for the first time plus glue switchs (900).
10. LED bonder automatic glue adding device according to claim 9, which is characterized in that the form control
(600) it is respectively equipped on X1 input terminal (601), X2 input terminal (602), X3 input terminal (603), Y1 output end (604) and Y2 are defeated
Outlet (605), wherein the DC power supply (2000) of the LED bonder automatic glue adding device via power switch (3000) and
It is connected on the form control (600) and powers for it, it is described to add glue switch (900) and the form control for the first time
(600) X1 input terminal (601) connection, holder sensor (500) are connect with the X2 input terminal (602), metal sensor
(400) it is connect with the X3 input terminal (603), the air pressure electromagnetic valve (700) is connected with the Y1 output end (604), buzzing
Device (1000) is connected with the Y2 output end (605).
11. a kind of method of use LED bonder automatic glue adding device according to any one of the claims 1-10,
It is characterized in that, the described method comprises the following steps:
Manually boot the LED bonder automatic glue adding device adds glue switch (900) for the first time, passes through form control (600)
It actuates air pressure electromagnetic valve (700) and opens pressurization, and pneumatically actuate certain in the syringe (301) of syringe point glue equipment (300)
The crystal-bonding adhesive (302) of amount is added in die bond lacquer disk(-sc) 101；
Number is fed by holder sensor (500) detection support, form control (600) feeds number based on the bracket of detection
The unlatching and closure of air pressure electromagnetic valve (700) are actuated, so that die bond lacquer disk(-sc) controllably is added in crystal-bonding adhesive (302) at intervals
(101) in；
The sheet metal of corresponding position when will be exhausted by the crystal-bonding adhesive (302) in metal sensor (500) detection syringe (301)
Or metal ball (304), wherein when metal sensor (500) detects the sheet metal or metal ball (304) of the corresponding position
When, form control (600) actuates buzzer (1000) alarm；With
Add glue switch (900) for the first time next, manually booting again, and actuate air pressure electromagnetic valve (700) and open pressurization, by syringe
(301) remaining crystal-bonding adhesive (302), which is discharged to, in is added in die bond lacquer disk(-sc) (101).
12. according to the method for claim 11, which is characterized in that the method also includes:
After remaining crystal-bonding adhesive (302) is discharged in addition die bond lacquer disk(-sc) (101) in by syringe (301), under artificial replacement
One syringe crystal-bonding adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710810187.5A CN109494169A (en) | 2017-09-11 | 2017-09-11 | LED bonder automatic glue adding device and application method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710810187.5A CN109494169A (en) | 2017-09-11 | 2017-09-11 | LED bonder automatic glue adding device and application method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109494169A true CN109494169A (en) | 2019-03-19 |
Family
ID=65687192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710810187.5A Pending CN109494169A (en) | 2017-09-11 | 2017-09-11 | LED bonder automatic glue adding device and application method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109494169A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113877770A (en) * | 2021-11-03 | 2022-01-04 | 辽宁优迅科技有限公司 | Air storage quantitative dispensing device and dispensing control method |
-
2017
- 2017-09-11 CN CN201710810187.5A patent/CN109494169A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113877770A (en) * | 2021-11-03 | 2022-01-04 | 辽宁优迅科技有限公司 | Air storage quantitative dispensing device and dispensing control method |
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Application publication date: 20190319 |
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