CN109492487A - Ultrasonic fingerprint identifies mould group and electronic equipment - Google Patents
Ultrasonic fingerprint identifies mould group and electronic equipment Download PDFInfo
- Publication number
- CN109492487A CN109492487A CN201710819501.6A CN201710819501A CN109492487A CN 109492487 A CN109492487 A CN 109492487A CN 201710819501 A CN201710819501 A CN 201710819501A CN 109492487 A CN109492487 A CN 109492487A
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- Prior art keywords
- ultrasonic
- mould group
- ultrasonic sensor
- shell
- encapsulating housing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention relates to a kind of ultrasonic fingerprint identification mould group and electronic equipment, ultrasonic fingerprint identifies that mould group includes encapsulating housing, the circuit board that ultrasonic sensor is equipped in the encapsulating housing and is electrically connected with the ultrasonic sensor.The encapsulating housing structure opposite with the ultrasonic sensor top surface being capable of conduct ultrasound.The ultrasonic sensor can emit ultrasonic wave, and be able to detect the ultrasonic wave of reflection.The ultrasonic fingerprint identifies that ultrasonic sensor and circuit board package are independent monomer by mould group, so as to be directly mounted in the electronic equipments such as mobile phone, notebook, lock, automobile, improves the convenience of ultrasonic fingerprint identification mould group installation.
Description
Technical field
The present invention relates to fingerprint identification technology fields, identify that mould group and electronics are set more particularly to a kind of ultrasonic fingerprint
It is standby.
Background technique
Ultrasonic fingerprint identification technology is the ability for having penetrable material using ultrasonic wave, and is generated greatly with the different of material
Small different echo (when i.e. ultrasonic wave reaches unlike material surface, the ultrasonic energy that is reflected back toward and after distance not
Carry out fingerprint recognition together).Therefore, using skin and air for the difference of sound impedance, so that it may distinguish fingerprint ridge with
Position where fingerprint valley.Ultrasonic fingerprint identification technology fingerprint can be carried out deeper into analytical sampling, or even can permeate
The unique three-dimensional feature of fingerprint is identified under to skin surface.Moreover, because ultrasonic wave has certain penetrability, therefore in hand
Finger remains to work in the case where having a small amount of dirt or humidity, can penetrate the equipment such as glass, aluminium, stainless steel, sapphire and be known
Not.Therefore, ultrasonic fingerprint identification technology is increasingly valued by people.However, increasing with electronic equipment type, such as
The convenience what improves ultrasonic fingerprint identification mould group installation is a problem to be solved.
Summary of the invention
Based on this, it is necessary to aiming at the problem that how to improve ultrasonic fingerprint identification mould group installation convenience, provide one kind
Ultrasonic fingerprint identifies mould group and electronic equipment.
A kind of ultrasonic fingerprint identification mould group, including encapsulating housing, are equipped with supersonic sensing in the encapsulating housing
Device and the circuit board being electrically connected with the ultrasonic sensor；The encapsulating housing is opposite with the ultrasonic sensor top surface
Structure being capable of conduct ultrasound；The ultrasonic sensor can emit ultrasonic wave, and be able to detect the ultrasonic wave of reflection.This is super
Ultrasonic sensor and circuit board package are independent monomer by sound wave fingerprint recognition mould group, so as to be directly mounted at hand
In the electronic equipments such as machine, notebook, lock, automobile, the convenience of ultrasonic fingerprint identification mould group installation is improved.
Reinforcement elements are additionally provided in the encapsulating housing in one of the embodiments,；The reinforcement elements are set to described
The bottom of ultrasonic sensor, and for protecting the ultrasonic sensor and decrease to be generated and passed by the ultrasonic sensor
Broadcasting direction is the ultrasonic wave in addition to other directions towards the ultrasonic sensor top surface.By the way that reinforcement elements are arranged, thus
It can decay to the ultrasonic wave towards propagation below ultrasonic sensor, that is, weaken the energy of these ultrasonic waves, reduce to the greatest extent
These ultrasonic reflections are back to the probability of ultrasonic sensor, interfere to avoid to ultrasonic sensor, refer to improve
The accuracy of line identification.
The reinforcement elements include protection structure, and the protection structure and the ultrasound in one of the embodiments,
There are gaps between wave sensor bottom；Substance in the gap can weaken ultrasonic wave.
The protection structure includes first shell and second shell interconnected in one of the embodiments,；It is described
One end of first shell is pasted on the bottom of the ultrasonic sensor, the other end of the first shell by the first adhesive
Connect one end of the second shell；The other end of the second shell is pasted on the encapsulating housing by the second adhesive
Inside.The biggish gap in a space is collectively formed in the protection structure, so as to enhance the ability to ultrasonic attenuation.
The first shell and the second shell are metal material in one of the embodiments,.First shell and
Second shell can not only block extraneous light, additionally it is possible to shield the interference of external electromagnetic waves.
The reinforcement elements are polyurethane cellular foam in one of the embodiments,.
Laminating layer is additionally provided in the encapsulating housing in one of the embodiments,；The laminating layer is used for will be described super
Sonic sensor fits in the encapsulating housing, and for carrying out acoustic resistance matching.Laminating layer is in addition to the matched effect of acoustic resistance
Fruit can also fill offset, to improve the validity of ultrasonic transmission.
The laminating layer is OCA solid-state glue or glue in one of the embodiments,.
The material of the encapsulating housing structure opposite with the ultrasonic sensor top surface in one of the embodiments,
For glass, ceramics, sapphire, acrylic or aluminium.
A kind of electronic equipment, including the ultrasonic fingerprint identify mould group.
In above-mentioned ultrasonic fingerprint identification mould group and electronic equipment, be equipped in encapsulating housing ultrasonic sensor and with it is super
The circuit board of sonic sensor electrical connection, and the encapsulating housing structure opposite with ultrasonic sensor top surface can conduct ultrasound
Wave, thus guarantee ultrasonic wave can normal conduction on the outside of encapsulating housing, therefore, which identifies mould group by ultrasonic wave
Sensor and circuit board package are independent monomer, set so as to be directly mounted at the electronics such as mobile phone, notebook, lock, automobile
In standby, the convenience of ultrasonic fingerprint identification mould group installation is improved.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The attached drawing of other embodiments is obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram that the ultrasonic fingerprint that an embodiment provides identifies mould group；
Fig. 2 is the structural schematic diagram that the ultrasonic fingerprint that another embodiment provides identifies mould group.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give presently preferred embodiments of the present invention.But the invention can be realized in many different forms, however it is not limited to this paper institute
The embodiment of description.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more thorough
Comprehensively.
Unless otherwise defined, the skill of all technical and scientific terms used herein and the technical field for belonging to invention
The normally understood meaning of art personnel is identical.It is specific that description is intended merely in the term used in the description of invention herein
The purpose of embodiment, it is not intended that the limitation present invention.Term as used herein "and/or" includes one or more relevant institutes
Any and all combinations of list of items.
One embodiment provides a kind of ultrasonic fingerprint identification mould group, can utilize the fingerprint of ultrasonic scanning user,
And fingerprint is identified, it can be installed in electronic equipment.Wherein, electronic equipment is, for example, mobile phone, notebook, lock, automobile
Deng.
Referring to FIG. 1, ultrasonic fingerprint identification mould group includes encapsulating housing 100, it is equipped in encapsulating housing 100 super
Sonic sensor 200 and the circuit board 300 being electrically connected with ultrasonic sensor 200.Wherein, encapsulating housing 100 and ultrasonic wave pass
The opposite structure in 200 top surface of sensor being capable of conduct ultrasound.Ultrasonic sensor 200 can emit ultrasonic wave, and be able to detect
The ultrasonic wave of reflection.
The structure opposite with 200 top surface of ultrasonic sensor of encapsulating housing 100 refers to that ultrasonic wave is conducted towards contact object
When the structure (being the structure located above of encapsulating housing 100 in Fig. 1) of encapsulating housing 100 that need to pass through.It is super for that can conduct
The structure of sound wave, the i.e. acoustic impedance of the structure are less than given threshold (such as acoustic impedance and the acoustic impedance of glass approach), so as to
To guarantee conduct ultrasound.
In addition, penetrating readily through the performance of object based on ultrasonic wave, the material of encapsulating housing 100 is allowed to have wider choosing
Select range, such as: the material of the structure opposite with 200 top surface of ultrasonic sensor be glass, ceramics, sapphire, acrylic or
Aluminium.Wherein, if it is glass, thickness is up to 800 μm；If it is aluminium, thickness is up to 650 μm；If it is sapphire, thickness can
Up to 350 μm.In addition, 100 outer surface of encapsulating housing can also realize various customization effects by printing or spraying process, so as to
Mould group is identified in distinguishing each ultrasonic fingerprint being suitable under different scenes.Such as: if two ultrasonic fingerprints identify mould group
It is respectively suitable for automobile, lock, then difference is printed respectively to the outer surface of the two ultrasonic fingerprints identification module packaging shell 100
Pattern, in order to distinguish.
Circuit board 300 is placed in ultrasonic wave and conducts to except contact object paths traversed, i.e., ultrasonic wave is to contact
Without going past circuit board 300 during object conduction, so as to avoid circuit board 300 from causing shadow to the conduction of ultrasonic wave
It rings.
In addition, circuit board 300 is equipped with driving chip, driving chip is, for example, ASIC (Application Specific
Integrated Circuit) chip.Driving chip to ultrasonic sensor 200 provide control signal (such as to ultrasonic wave pass
Sensor 200 sends high frequency electrical signal) so that ultrasonic sensor 200 emits ultrasonic wave.Also, driving chip also receives super
The electric signal that the ultrasonic wave of reflection is converted to by sonic sensor 200, to be identified to fingerprint.
Ultrasonic sensor 200 includes TFT substrate, electrode layer and piezoelectric layer.Electrode layer and piezoelectric layer are sequentially arranged in TFT base
On plate.Wherein, TFT substrate includes several thin film transistor (TFT)s arranged according to array manner, also, TFT substrate can be to piezoelectricity
Layer the processing such as amplifies according to the electric signal that the ultrasonic wave of reflection is converted to.Electrode layer is constructed from a material that be electrically conducting, conduction material
Material for example, silver paste.Piezoelectric layer is made of piezoelectric material.Piezoelectric material is, for example, ferroelectricity high molecular polymer P (VDF-TrFE).
In addition, TFT substrate and electrode layer are electrically connected with above-mentioned driving chip.Specifically, circuit board 300 is flexible circuit board.
The working principle of above-mentioned ultrasonic sensor 200 are as follows: driving chip applies corresponding high frequency electrical signal to electrode layer.
After electrode layer has been applied high frequency electrical signal, high frequency electrical signal is conducted to piezoelectric layer, so that piezoelectric layer transmitting ultrasound
Wave.Ultrasonic wave is reflected after upwardly propagating until reaching contact object, and piezoelectric layer receives ultrasonic wave and the conversion of reflection later
For electric signal, which is sent in driving chip after corresponding processing (such as amplification) through TFT substrate is converted to again
Image, to be identified to fingerprint.
In conclusion above-mentioned ultrasonic fingerprint identification mould group passes through encapsulating housing 100 for ultrasonic sensor 200 and circuit
The encapsulation of plate 300 is independent monomer, so as to be directly mounted in the electronic equipments such as mobile phone, notebook, lock, automobile, improves
The convenience of ultrasonic fingerprint identification mould group installation.
In one of the embodiments, with continued reference to FIG. 1, being additionally provided with reinforcement elements 400 in encapsulating housing 100.It reinforces
Unit 400 is set to the bottom of ultrasonic sensor 200, and for protecting ultrasonic sensor 200 and weakening by supersonic sensing
Device 200 generates and the direction of propagation is in addition to other directions towards 200 top surface of ultrasonic sensor (such as propagate to ultrasonic wave and pass
The lower section of sensor 200) ultrasonic wave.Specifically, reinforcement elements 400 can use the modes such as diffusion, scattering or absorption to weaken and pass
Broadcast unfavorable ultrasonic wave.
In ultrasonic fingerprint identification mould group, the ultrasonic wave that ultrasonic sensor 200 generates multidirectional can be propagated, ultrasound
Wave can not only reach contact object to propagation above ultrasonic sensor 200, but also can be to 200 lower section of ultrasonic sensor
It propagates.It wherein, is useful ultrasonic wave towards the ultrasonic wave propagated above ultrasonic sensor 200, after propagating to contact object
After being reflected back and being received by ultrasonic sensor 200, fingerprint recognition can be carried out.It is passed below towards ultrasonic sensor 200
The ultrasonic wave broadcast is unfavorable ultrasonic wave, once these ultrasonic waves encounter foreign matter, dirty or other barriers can also be reflected
It is back to ultrasonic sensor 200, ultrasonic sensor 200 will be interfered, influence the accuracy of fingerprint recognition.Therefore,
In the present embodiment, by the way that reinforcement elements 400 are arranged, so as to towards the ultrasonic wave propagated below ultrasonic sensor 200 into
Row decaying, that is, weaken the energy of these ultrasonic waves, reduce these ultrasonic reflections to the greatest extent and be back to the general of ultrasonic sensor 200
Rate interferes to avoid to ultrasonic sensor 200, to improve the accuracy of fingerprint recognition.
In one of the embodiments, with continued reference to FIG. 1, reinforcement elements 400 include protection structure 410, and protect knot
There are gaps 420 between 200 bottom of structure 410 and ultrasonic sensor.Substance in gap 420 can weaken ultrasonic wave.
Specifically, the substance in gap 420 can be air.Due to the reality of viscosity, heat transfer, medium based on medium
The factors such as relaxation effect caused by during the micro kinetics of border structure and medium determine ultrasonic wave in gas, liquid, solid
When propagating in body, attenuation degree is respectively most severe, weaker, minimum (i.e. air is maximum to the attenuation degree of ultrasonic wave), therefore,
In the present embodiment, the ultrasonic wave propagated towards 200 lower section of ultrasonic sensor or other directions enters the gap 420 with air
Afterwards, it can will remove as much as possible and be not required to by attenuation of air, and since attenuation degree of the air to ultrasonic wave is larger
The ultrasonic wave wanted further increases the accuracy of fingerprint recognition.
Specifically, with continued reference to FIG. 1, above-mentioned protection structure 410 includes first shell 411 interconnected and second shell
Body 412.One end of first shell 411 is pasted on the bottom of ultrasonic sensor 200, first shell by the first adhesive 510
One end of 411 other end connection second shell 412.The other end of second shell 412 is pasted on envelope by the second adhesive 520
Fill the inside of shell 100.
Specifically, the thickness of first shell 411 is between 100 microns to 300 microns.When the thickness of first shell 411
Lower than 100 microns, the intensity of entire ultrasonic fingerprint identification mould group is inadequate, and reliability is low.When the thickness of first shell 411 is higher than
300 microns, thickness is too thick, and is not able to satisfy consumer's need lightening to ultrasonic fingerprint identification mould group and its electronic equipment
It asks.
Wherein, first shell 411 and second shell 412 are for example plate.Material is for example metal material.In this way,
First shell 411 and second shell 412 can not only block extraneous light, additionally it is possible to shield the interference of external electromagnetic waves.It is preferred that
Ground, first shell 411 are mutually perpendicular to second shell 412, in order to process.Specifically, the first adhesive 510 is double-sided adhesive.
Double-sided adhesive will not there is a situation where excessive glues to 200 bottom of ultrasonic sensor, causes to do to avoid to ultrasonic sensor 200
It disturbs, to improve the accuracy of fingerprint recognition.Specifically, the second adhesive 520 is liquid glue.Further, the second adhesive
520 be preferably UV glue, and UV adhesive curing speed is fast, can effectively improve production efficiency.
In above-mentioned protection structure 410, the first adhesive 510, first shell 411 are in addition to being coated with the first adhesive 510
The biggish gap 420 in a space is collectively formed in rest part, the bottom of ultrasonic sensor 200 and second shell 412, thus
The ability to ultrasonic attenuation can be enhanced.
It is understood that the specific implementation of reinforcement elements 400 is not limited to above situation, such as referring to FIG. 2, plus
Gu unit 400 can also be polyurethane cellular foam.
Further, please continue to refer to Fig. 1, Fig. 2, laminating layer 600 is additionally provided in encapsulating housing 100.Laminating layer 600 is used for
Ultrasonic sensor 300 is fitted in encapsulating housing 100, and for carrying out acoustic resistance matching.
Wherein, laminating layer 600 carries out acoustic resistance matching, can reduce the piezoelectric layer and contact object of ultrasonic sensor 200
Between acoustic resistance it is poor so that ultrasonic wave can be transmitted effectively.Specifically, laminating layer 600 is, for example, OCA solid-state glue or glue
Water.
In addition, laminating layer 600 can be located on the same floor with circuit board 300, to make up ultrasonic sensor 200 and circuit
Existing ladder offset between plate 300.Therefore, laminating layer 600 be in addition to that can also fill offset with the matched effect of acoustic resistance,
To improve the validity of ultrasonic transmission.
Another embodiment provides a kind of electronic equipment, such as can be mobile phone, notebook, lock, automobile etc..The electronics
Equipment includes the ultrasonic fingerprint identification mould group that above embodiment provides.
It should be noted that the ultrasonic fingerprint identification mould group and upper one in the electronic equipment that present embodiment provides is implemented
The principle of mode is identical, just repeats no more here.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of ultrasonic fingerprint identifies mould group, which is characterized in that including encapsulating housing, be equipped in the encapsulating housing super
Sonic sensor and the circuit board being electrically connected with the ultrasonic sensor；The encapsulating housing and the ultrasonic sensor top
The opposite structure in face being capable of conduct ultrasound；The ultrasonic sensor can emit ultrasonic wave, and be able to detect the super of reflection
Sound wave.
2. ultrasonic fingerprint according to claim 1 identifies mould group, which is characterized in that be additionally provided with and add in the encapsulating housing
Gu unit；The reinforcement elements are set to the bottom of the ultrasonic sensor, and for protecting the ultrasonic sensor and subtracting
It is weak generated by the ultrasonic sensor and the direction of propagation be in addition to other directions towards the ultrasonic sensor top surface
Ultrasonic wave.
3. ultrasonic fingerprint according to claim 2 identifies mould group, which is characterized in that the reinforcement elements include protection knot
Structure, and there are gaps between the protection structure and the ultrasonic sensor bottom；Substance in the gap can weaken
Ultrasonic wave.
4. ultrasonic fingerprint according to claim 3 identifies mould group, which is characterized in that the protection structure includes mutually interconnecting
The first shell and second shell connect；One end of the first shell is pasted on the ultrasonic sensor by the first adhesive
Bottom, the other end of the first shell connects one end of the second shell；The other end of the second shell passes through the
Two adhesive are pasted on the inside of the encapsulating housing.
5. ultrasonic fingerprint according to claim 4 identifies mould group, which is characterized in that the first shell and described second
Shell is metal material.
6. ultrasonic fingerprint according to claim 2 identifies mould group, which is characterized in that the reinforcement elements are that polyurethane is more
Hole foam.
7. identifying mould group to ultrasonic fingerprint described in any one of 6 claims according to claim 1, which is characterized in that institute
It states and is additionally provided with laminating layer in encapsulating housing；The laminating layer is used to the ultrasonic sensor fitting in the encapsulating housing
It is interior, and for carrying out acoustic resistance matching.
8. ultrasonic fingerprint according to claim 7 identifies mould group, which is characterized in that the laminating layer is OCA solid-state glue
Or glue.
9. identifying mould group to ultrasonic fingerprint described in any one of 6 claims according to claim 1, which is characterized in that institute
State the encapsulating housing structure opposite with the ultrasonic sensor top surface material be glass, ceramics, sapphire, acrylic or
Aluminium.
10. a kind of electronic equipment, which is characterized in that refer to including ultrasonic wave described in any one of claim 1-9 claim
Line identifies mould group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710819501.6A CN109492487A (en) | 2017-09-12 | 2017-09-12 | Ultrasonic fingerprint identifies mould group and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710819501.6A CN109492487A (en) | 2017-09-12 | 2017-09-12 | Ultrasonic fingerprint identifies mould group and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109492487A true CN109492487A (en) | 2019-03-19 |
Family
ID=65689075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710819501.6A Withdrawn CN109492487A (en) | 2017-09-12 | 2017-09-12 | Ultrasonic fingerprint identifies mould group and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109492487A (en) |
-
2017
- 2017-09-12 CN CN201710819501.6A patent/CN109492487A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant before: OFilm Microelectronics Technology Co.,Ltd. Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Applicant after: OFilm Microelectronics Technology Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Applicant before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. |
|
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190319 |