CN109490982A - Substrate joining detection device - Google Patents
Substrate joining detection device Download PDFInfo
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- CN109490982A CN109490982A CN201811581078.1A CN201811581078A CN109490982A CN 109490982 A CN109490982 A CN 109490982A CN 201811581078 A CN201811581078 A CN 201811581078A CN 109490982 A CN109490982 A CN 109490982A
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- detection device
- substrate
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- laser
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V8/00—Prospecting or detecting by optical means
- G01V8/10—Detecting, e.g. by using light barriers
- G01V8/12—Detecting, e.g. by using light barriers using one transmitter and one receiver
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- General Life Sciences & Earth Sciences (AREA)
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Abstract
This application involves a kind of substrate joining detection devices comprising distance detection device and processor.The distance detection device is set to the jig platform close to the side of the substrate, for detecting the distance between the distance detection device and the substrate surface.The processor is connect with the distance detection device signal, for according to the distance between the distance detection device and the substrate surface judgement be placed in the jig platform the substrate whether lamination.The case where substrate joining detection device provided by the present application can effectively detect the substrate joining, to prevent the appearance of the not tight situation of fixture substrate clamping described in multi-disc.
Description
Technical field
This application involves ceramic resistor production fields, more particularly to a kind of substrate joining detection device.
Background technique
With the development of science and technology many industries realize production automation.By taking ceramic resistor production process as an example, ceramic electrical
Resistance is to stack multi-disc ceramic substrate layer to be placed in a magazine in process of production, then draws ceramic substrate by manipulator,
And it is transmitted on jig platform.Ceramic substrate is stepped up by fixture in jig platform, and then carries out laser cutting and resistance trimming work.
However, ceramic substrate is very thin, thickness about 0.1mm.In actual production, when manipulator feeding is transported, often go out
The case where existing multi-disc ceramic substrate lamination.This will lead to subsequent fixture and clamps not tight problem to ceramic substrate, and then after influence
The continuous yield that ceramic substrate resistance trimming is cut.
Summary of the invention
Based on this, it is necessary to which above-mentioned technical problem provides a kind of substrate joining detection device.
A kind of substrate joining detection device, for detect be placed in jig platform substrate whether lamination, which is characterized in that packet
It includes:
Distance detection device is set to the jig platform close to the side of the substrate, for detecting the distance inspection
Survey the distance between device and the substrate surface；
Processor is connect with the distance detection device signal, for according to the distance detection device and the substrate
The distance between surface judgement be placed in the jig platform the substrate whether lamination.
The distance detection device is laser displacement sensor in one of the embodiments,.
The distance detection device includes: in one of the embodiments,
Detection probe；
Communication means are connect with the detection probe and the processor signal, are used for transmission the detection probe and institute
State the communication signal between processor；
Power supply is electrically connected with the detection probe and the communication means, is used for the detection probe and the communication
Mechanism power supply.
The detection probe includes: in one of the embodiments,
Laser emitter is used to emit laser to the substrate surface with the power electric connection；
Laser pickoff, and the power electric connection, for receiving the laser reflected through the substrate surface；
Distance exam device is connect, with institute with the laser emitter, the laser pickoff and the communication agency signal
State power electric connection, for according to the time of the laser transmitter projects laser and the laser pickoff receive laser when
Between calculate the distance between the detection probe and the substrate surface.
The communication means include serial converter in one of the embodiments,.
The power supply includes Switching Power Supply in one of the embodiments, the Switching Power Supply and the detection probe and
The communication means electrical connection.
The distance between the distance detection device and the jig platform are 42mm- in one of the embodiments,
52mm。
The substrate joining detection device in one of the embodiments, further include:
Alarm is connect with the processor signal, for when the substrate joining Times for being placed in the jig platform
It is alert.
The alarm is visual alarm in one of the embodiments,.
The substrate joining detection device in one of the embodiments, further include:
Display device is connect with the processor signal.
The substrate joining detection device provided by the embodiments of the present application includes distance detection device and processor.It is described away from
The jig platform is set to close to the side of the substrate from detection device.The distance detection device be able to detect it is described away from
From the distance between detection device and the substrate surface.The processor is connect with the distance detection device signal.It is described
Processing unit can judge to be placed in the jig platform according to the distance between the distance detection device and the substrate surface
The substrate whether lamination.The substrate joining detection device provided by the embodiments of the present application can effectively detect the substrate
The case where lamination, to prevent the appearance of the not tight situation of fixture substrate clamping described in multi-disc.The substrate provided by the present application
Lamination detection device can effectively improve the ceramic substrate resistance trimming cutting yield of ceramic resistor.Meanwhile it being detected by the distance
Device detect the substrate whether lamination, it is practical suitable for the substrate of any material, therefore applied widely.Separately
Outside, the setting structure of distance detection device described in the substrate joining detection device provided in this embodiment is simple, it is easy to accomplish.
Detailed description of the invention
Fig. 1 is the substrate joining structure of the detecting device that provides of the application one embodiment and uses schematic diagram；
Fig. 2 is the distance detection device structural schematic diagram that the application one embodiment provides；
Fig. 3 is the sonde configuration schematic diagram that the application one embodiment provides；
Fig. 4 is the distance detection device electrical block diagram that the application one embodiment provides；
Fig. 5 is the substrate joining structure of the detecting device schematic diagram that the application one embodiment provides；
Fig. 6 is the substrate joining structure of the detecting device that the application one embodiment provides and actual use schematic diagram.
Description of symbols:
Substrate joining detection device 10
Distance detection device 100
Processor 200
Detection probe 110
Laser emitter 111
Laser pickoff 112
Distance exam device 113
Communication means 120
Serial converter 121
Power supply 130
Switching Power Supply 131
Alarm 300
Display device 400
Specific embodiment
In order to which the objects, technical solutions and advantages of the application are more clearly understood, by the following examples, and combine attached
Figure, is further elaborated the substrate joining detection device of the application.It should be appreciated that specific implementation described herein
Example only to explain the application, is not used to limit the application.
It is herein component institute serialization number itself, such as " first ", " second " etc., is only used for distinguishing described object,
Without any sequence or art-recognized meanings.And " connection ", " connection " described in the application, unless otherwise instructed, include directly and
It is indirectly connected with (connection).In the description of the present application, it is to be understood that term " on ", "lower", "front", "rear", " left side ",
The orientation of the instructions such as " right side ", "vertical", "horizontal", "top", "bottom", "inner", "outside", " clockwise ", " counterclockwise " or position are closed
System indicates to be based on the orientation or positional relationship shown in the drawings, being merely for convenience of description the application and simplifying description
Or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot understand
For the limitation to the application.
In this application unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
The application provides a kind of substrate joining detection device 10.The substrate joining detection device 10 is placed in folder for detecting
Have platform 20 substrate 30 whether lamination.The lamination refers to 2 or 2 or more substrate superpositions.It should be noted that
The substrate joining detection device 10 provided by the present application can be applied not only in ceramic resistor production process, can also apply
In other generating process similar with ceramic resistor production reclaiming process.For example, the substrate joining detection device 10 can also be with
During solar energy production, solar energy crystal silicon chip feeding, it is mobile when, detect the solar energy crystal silicon chip whether have it is folded
Layer.
Following embodiment is illustrated the substrate joining detection device 10 by taking ceramic resistor production process as an example.It is making pottery
In porcelain resistance production process, the substrate in the application is ceramic substrate.Multi-disc ceramic substrate is placed in magazine.Manipulator is inhaled
The ceramic substrate is taken, and ceramic substrate movement is placed on jig platform 20.The jig platform 20 clamps described
Ceramic substrate, and the ceramic substrate is adsorbed in by 20 surface of jig platform by vacuum.The jig platform 20 is can
Mobile platform.After the ceramic substrate is adsorbed in 20 surface of jig platform, the jig platform 20 is moved to the base
Immediately below plate lamination detection device 10, the substrate joining detection device 10 examines the substrate for being placed in the jig platform 20
It surveys, it is determined whether have lamination.
Referring to Figure 1, in one embodiment, the substrate joining detection device 10 provided includes distance detection device 100
With processor 200.The distance detection device 100 is set to the jig platform close to the side of the substrate.The distance
Detection device 100 is for detecting the distance between the distance detection device 100 and described 30 surface of substrate.The processor
200 connect with 100 signal of distance detection device.The processor 200 is connect with 100 signal of distance detection device.
The processor 200 is used to be placed according to the judgement of the distance between the distance detection device 100 and described substrate surface described
The substrate 20 of jig platform 20 whether lamination.
Specifically, the distance detection device 100 is set to the top of the jig platform 20, and between the substrate 30
Every being oppositely arranged.The distance detection device 100 is used for detecting distance.The specific structure of the distance detection device 100, shape
Deng without limitation, can select according to actual needs.The information of the output of the distance detection device 100 characterization distance.It is described away from
The signal exported from detection device 100 can be also possible to digital signal with analog signal.
The processor 200 can be the processor of computer equipment, or be capable of handling the chip and electricity of data
Road etc..The input terminal of the processor 200 is connect with the output end of the distance detection device 100.The distance detection device
100 letters for characterizing the distance between the distance detection device 100 and described 30 surface of substrate exported to the processor 200
Breath, the processor 200 is handled the range information according to preset algorithm, and is judged on the jig platform 20
Whether the substrate 30 has lamination.The algorithm of the processor 200 can have multiple.In a specific embodiment, described
Processor 200 is compared according to the range information detected with pre-determined distance, judges the institute on the jig platform 20
State whether substrate 30 has lamination.The pre-determined distance can be between the jig platform 20 and the distance detection device 100
Distance and a piece of substrate 30 the sum of thickness value.For example, it is assumed that 1 substrate 30 with a thickness of 0.1mm.It is described away from
It is 50mm from fixed range preset between detection device 100 and the jig platform 20, then, the pre-determined distance is 50+0.1
=50.1mm.The range information that the processor 200 will test is compared with 50.1mm, if the range information detected is greater than
50.1, then the substrate 30 on the jig platform 20 has lamination.If the range information detected is equal to 50.1, the folder
The substrate 30 having on platform 20 does not have lamination.Certainly, the pre-determined distance and comparison result can set certain error
Range, to improve the accuracy of detection.
In the present embodiment, the substrate joining detection device 10 includes distance detection device 100 and processor 200.It is described
Distance detection device 100 is set to the jig platform 20 close to the side of the substrate 30,100 energy of distance detection device
Enough detect the distance between the distance detection device 100 and described substrate surface.The processor 200 is detected with the distance
The connection of 100 signal of device.The processing unit 200 can be according between the distance detection device 100 and the substrate surface
Distance Judgment be placed in the jig platform 20 the substrate 30 whether lamination.The substrate joining inspection provided in this embodiment
The case where device 10 can effectively detect 30 lamination of substrate is surveyed, to prevent the clamping of fixture substrate 30 described in multi-disc not tight
The appearance of situation.The substrate joining detection device 10 provided by the present application can effectively improve the ceramic substrate tune of ceramic resistor
Resistance cutting yield.Meanwhile by the distance detection device 100 detect the substrate 30 whether lamination, be suitable for any material
The substrate 30, therefore it is applied widely, it is practical.In addition, the substrate joining detection device provided in this embodiment
The setting structure of 10 distance detection devices 100 is simple, it is easy to accomplish.
In one embodiment, the distance detection device 200 is laser displacement sensor.The laser displacement sensor
Model can be but not limited to CD33-L50N-422.The repeatable accuracy of the laser displacement sensor is up to 2.5um, response
Time is up to 12.5ms.The detection accuracy of the laser displacement sensor is high, the response time is fast.Therefore, pass through the laser position
Displacement sensor can simply, quickly and accurately detect the distance between the laser displacement sensor and the substrate 30.
Fig. 2 is referred to, in one embodiment, the distance detection device 100 includes detection probe 110, communication means
120 and power supply 130.The communication means 120 are connect with the detection probe 110 and 200 signal of the processor.The communication
Mechanism 120 is used for transmission the communication signal between the detection probe 110 and the processor 200.The power supply 130 with it is described
Detection probe 110 and the communication means 120 are electrically connected.The power supply 130 is used for the detection probe 110 and the communication
Mechanism 120 powers.
The detection probe 110 is for detecting the distance between the distance detection device 100 and described 30 surface of substrate.
The detection probe 110 can be set in 10 overall structure of substrate joining detection device near the jig platform 10
One end.Concrete model, the structure of the detection probe 110 can select according to actual needs.
The distance information transmission that the communication means 120 detect the detection probe 110 gives the processor
200, it is further processed by the processor 200.
Fig. 3 is referred to, in one embodiment, the distance detection device 100 is laser displacement sensor, the detection
Probe 110 includes laser emitter 111, laser pickoff 112 and distance exam device 113.It is the laser emitter 111, described
Laser pickoff 112 and the distance exam device 113 are connect with the power supply 130, are powered by the power supply 130 for it.Institute
It states distance exam device 113 and the laser emitter 111, the laser pickoff 112 and 120 signal of the communication agency connects
It connects.
The laser emitter 111 can be laser emitting diode.The laser emitter 111 is used for described to being placed in
30 surface-emitting laser of the substrate of jig platform 20.The laser of transmitting dissipates after the reflection of the substrate 30 to all directions
It penetrates.A portion scattering laser is received by the laser pickoff 112.The distance exam device 113 is used to be swashed according to described
The time that optical transmitting set 111 emits the time of laser and the laser pickoff 112 receives laser calculates the detection probe
The distance between 110 and 30 surface of substrate.Specifically, the distance exam device 113 can record the laser hair respectively
Emitter 111 emits the time of laser and the laser pickoff 112 receives the time of laser, and calculates from the Laser emission
Device 111 issues laser and receives the time experienced to the laser pickoff 112.Then in conjunction with the transmission speed of laser, calculate
The distance between the detection probe 110 and 30 surface of substrate out.The distance letter that the distance exam device 113 will test
Breath is transferred to the communication agency 120.
It, can be fast by the laser emitter 111, laser pickoff 112 and distance exam device 113 in the present embodiment
Speed the distance between is accurately detected the detection probe 110 and 30 surface of substrate, and then improves to the substrate
The accuracy of 30 lamination situations detection.
Fig. 4 is referred to, the communication means 120 there can be multiplet.In one embodiment, the communication means
120 include serial converter 121.The model of the serial converter 121 can be but not limited to C2000-C2-SFI0101-
BA1.It can be improved communication data between the detection probe 110 and the processor 200 by the serial converter 121
Efficiency of transmission.
The power supply 130 can may be AC power source for DC power supply.When the power supply 130 provides exchange by alternating current
When electric, the power supply 130 can include but is not limited to leakage circuit breakers, filter etc..In one embodiment, the power supply
130 can also include Switching Power Supply 131.The input terminal of the Switching Power Supply 131 is electrically connected with mains.The Switching Power Supply
131 output end is electrically connected with the detection probe 110 and the communication means 120.The Switching Power Supply 131 is for adjusting institute
The voltage or electric current for stating mains AC make it meet the voltage and current of the detection probe 110 and the communication means 120
Demand.The Switching Power Supply 131 can be but be not limited to bright latitude single group Switching Power Supply.The model of the Switching Power Supply 131 can
To be but not limited to NDR-240-24.In the present embodiment, the detection probe 110 ensure that by the Switching Power Supply 131
With the stability of the equal electricity consumptions of the communication means 120.
In one embodiment, the distance between the distance detection device 100 and the jig platform 20 are 42mm-
52mm.When the distance between the distance detection device 100 and the jig platform 20 are 42mm-52mm, detection range is
10mm, the distance detection device 100 can more accurately detect the distance detection device 100 and 30 table of substrate
The distance between face.
Fig. 5 and Fig. 6 are referred to, in one embodiment, the substrate joining detection device 10 further includes alarm 300.
The alarm 300 is connect with 200 signal of processor.When the substrate 30 being placed on the jig platform 20 is folded
When layer, the processor 200 is to 300 output digit signals of alarm or analog signal, so that the alarm 300 is reported
It is alert, to prompt operator to handle in time the substrate 30 of lamination.The specific structure and circuit of the alarm 300
The application without limitation, can select according to actual needs.The alarm 300 can be visual alarm, or sound
Sound alarm, can also be combined aural and visual alarm.In the present embodiment, the substrate joining is improved by the alarm 300 and is examined
Survey fills 10 intelligence and practicability.
In one embodiment, the substrate joining detection device 10 further includes display device 400.The display device
400 connect with 200 signal of processor.The display device 400 can will be to described in being placed on the jig platform 20
The lamination situation of substrate is shown, so that testing result is more intuitive, is conveniently checked.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The several embodiments of the application above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
The limitation to claim therefore cannot be interpreted as.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the concept of this application, various modifications and improvements can be made, these belong to the protection of the application
Range.Therefore, the scope of protection shall be subject to the appended claims for the application patent.
Claims (10)
1. a kind of substrate joining detection device, for detect be placed in jig platform substrate whether lamination, which is characterized in that packet
It includes:
Distance detection device (100) is set to the jig platform close to the side of the substrate, for detecting the distance inspection
Survey the distance between device (100) and the substrate surface；
Processor (200) is connect with the distance detection device (100) signal, for according to the distance detection device (100)
The distance between described substrate surface judgement be placed in the jig platform the substrate whether lamination.
2. substrate joining detection device according to claim 1, which is characterized in that the distance detection device (200) is
Laser displacement sensor.
3. substrate joining detection device according to claim 2, which is characterized in that distance detection device (100) packet
It includes:
Detection probe (110)；
Communication means (120) connect with the detection probe (110) and the processor (200) signal, are used for transmission the inspection
Communication signal between probing head (110) and the processor (200)；
Power supply (130) is electrically connected with the detection probe (110) and the communication means (120), is used for the detection probe
(110) it powers with the communication means (120).
4. substrate joining detection device according to claim 3, which is characterized in that the detection probe (110) includes:
Laser emitter (111) is electrically connected with the power supply (130), for emitting laser to the substrate surface；
Laser pickoff (112) is electrically connected, for receiving the laser reflected through the substrate surface with the power supply (130)；
Distance exam device (113), with the laser emitter (111), the laser pickoff (112) and the communication agency
(120) signal connects, and is electrically connected with the power supply (130), for emitting the time of laser according to the laser emitter (111)
And the laser pickoff (112) receives between the time calculating detection probe (110) of laser and the substrate surface
Distance.
5. substrate joining detection device according to claim 3 or 4, which is characterized in that the communication means (120) include
Serial converter (121).
6. substrate joining detection device according to claim 3 or 4, which is characterized in that the power supply (130) includes switch
Power supply (131), the Switching Power Supply (131) are electrically connected with the detection probe (110) and the communication means (120).
7. substrate joining detection device according to claim 1, which is characterized in that the distance detection device (100) with
The distance between described jig platform is 42mm-52mm.
8. substrate joining detection device according to claim 1, which is characterized in that further include:
Alarm (300) is connect with the processor (200) signal, for folding when the substrate for being placed in the jig platform
Layer alarm.
9. substrate joining detection device according to claim 8, which is characterized in that the alarm (300) is light report
Alert device.
10. substrate joining detection device according to claim 1, which is characterized in that further include:
Display device (400) is connect with the processor (200) signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811581078.1A CN109490982A (en) | 2018-12-24 | 2018-12-24 | Substrate joining detection device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811581078.1A CN109490982A (en) | 2018-12-24 | 2018-12-24 | Substrate joining detection device |
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| CN109490982A true CN109490982A (en) | 2019-03-19 |
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ID=65711702
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| JP2001118047A (en) * | 1999-10-20 | 2001-04-27 | Ishitobi Seisakusho:Kk | Counting device for folded sheet |
| CN101263382A (en) * | 2005-06-28 | 2008-09-10 | 天鹤加拿大公司 | Method and apparatus for detecting overlapped substrates |
| CN203824527U (en) * | 2014-04-21 | 2014-09-10 | 安泰科技股份有限公司 | Lamination thickness measuring device |
| CN107144229A (en) * | 2017-06-30 | 2017-09-08 | 广东工业大学 | A kind of iron core is laminated automatic correction device |
| CN209514096U (en) * | 2018-12-24 | 2019-10-18 | 深圳市杰普特光电股份有限公司 | Substrate joining detection device |
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2018
- 2018-12-24 CN CN201811581078.1A patent/CN109490982A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001118047A (en) * | 1999-10-20 | 2001-04-27 | Ishitobi Seisakusho:Kk | Counting device for folded sheet |
| CN101263382A (en) * | 2005-06-28 | 2008-09-10 | 天鹤加拿大公司 | Method and apparatus for detecting overlapped substrates |
| CN203824527U (en) * | 2014-04-21 | 2014-09-10 | 安泰科技股份有限公司 | Lamination thickness measuring device |
| CN107144229A (en) * | 2017-06-30 | 2017-09-08 | 广东工业大学 | A kind of iron core is laminated automatic correction device |
| CN209514096U (en) * | 2018-12-24 | 2019-10-18 | 深圳市杰普特光电股份有限公司 | Substrate joining detection device |
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