CN109488899A - 具有散热作用的大功率led灯具 - Google Patents

具有散热作用的大功率led灯具 Download PDF

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CN109488899A
CN109488899A CN201811525404.7A CN201811525404A CN109488899A CN 109488899 A CN109488899 A CN 109488899A CN 201811525404 A CN201811525404 A CN 201811525404A CN 109488899 A CN109488899 A CN 109488899A
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王海军
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Wuxi Jinshun Lighting Technology Co Ltd
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Wuxi Jinshun Lighting Technology Co Ltd
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Priority to US16/411,167 priority patent/US10619842B1/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/713Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements in direct thermal and mechanical contact of each other to form a single system
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/69Details of refractors forming part of the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V13/00Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02Combinations of only two kinds of elements
    • F21V13/04Combinations of only two kinds of elements the elements being reflectors and refractors
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
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    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/502Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/51Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00Refractors for light sources
    • F21V5/04Refractors for light sources of lens shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/642Heat extraction or cooling elements characterized by the shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/648Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

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  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本发明属于大功率LED灯具技术领域,涉及具有散热作用的大功率LED灯具,包括壳体,所述壳体包括散热器主体和盖在散热器主体背面的散热器盖板,在散热器主体和散热器盖板间嵌有若干根导热管,LED芯片放置在散热器主体正面,所述散热器主体放置LED芯片的位置为芯片聚温区,所有导热管均通过芯片聚温区下方,且与芯片聚温区贴紧接触;本发明通过在壳体中设置导热管,且导热管中心位置紧贴芯片聚温区,通过芯片聚温区贮存热量,经导热管将热量有效传递到整个灯体,使灯体为一个完整的散热体,更加有利于灯具散热,同时能承载大功率芯片,降低成本。

Description

具有散热作用的大功率LED灯具
技术领域
本发明涉及一种灯具,具体地说是一种具有散热作用的大功率LED灯具,属于大功率LED灯具技术领域。
背景技术
现有技术中光源模块的主流一般使用SMD单颗的光源模块方式,光源模块中LED芯片的功率在30-50w间。单一光源模组的结构由一个SMD贴片的光源板、一个透镜、一个散热基板组成,散热基板主要是以铝型材作为主要散热结构,如果要加大功率,则需使用多个光源模块加叠在一起;例如:一个整灯的功率需150w,需使用3个50w的光源模块组合,专利申请号为201310189538.7,的专利中有公开,这种结构的光源模块散热不够,光源固定在一块散热板上,并要有一个灯具框架(即壳体)来组合固定光源模块,这增加了整个灯具的制造成本,在实体应用由于有单颗LED环境光感差,要用多个模块来叠加,成本较高,同时自身重量重;
现有技术方案中也有用类似热相变技术的,是用热柱方案的;例如专利申请号为201730529474.X的专利中使用的是热柱方案。虽然也是开始使用COB的芯片热相变的方案,将芯片直接固定在热柱表面,这样灯体本体的导热与散热降底了,存在散热面积利用不足的问题,并且热管是有一部分是暴露在空气中的,很容易出现氧化腐烂漏气的问题,降低灯具的实用寿命。
以上方案都是有共同的问题,就是灯具的壳体是用来固定光源模块的组件,没有散热作用,并且不同功率的光源模块需要有不同的灯具外形尺寸,需要反复开多个模具,增加成本,甚至需要多个组合在一起达到大功率的目的,不仅散热不好,且对于大规模生产,备货会带来很大的麻烦,生产材料成本增加,并且外观不够美观。
发明内容
本发明的目的在于克服现有技术中存在的不足,提供一种具有散热作用的大功率LED灯具,通过在壳体中设置导热管,且导热管中心位置紧贴芯片聚温区,通过芯片聚温区贮存热量,经导热管将热量有效传递到整个灯体,使灯体为一个完整的散热体,更加有利于灯具散热,同时能承载大功率芯片,降低成本。
为实现以上技术目的,本发明的技术方案是:具有散热作用的大功率LED灯具,包括壳体,其特征在于,所述壳体包括散热器主体和盖在散热器主体背面的散热器盖板,在散热器主体和散热器盖板间嵌有若干根导热管,LED芯片放置在散热器主体正面,所述散热器主体放置LED芯片的位置为芯片聚温区,所有导热管均通过芯片聚温区下方,且与芯片聚温区贴紧接触。
进一步地,所述散热器主体和散热器盖板均为一次性铝压铸成型。
进一步地,所述散热器主体包括主体散热片,所述散热器盖板包括盖板散热片,在所述散热器主体背面与芯片聚温区相对应的位置设有凹腔/凸起,所述盖板散热片设有与凹腔/凸起相匹配的凸起/凹腔,同时主体散热片和盖板散热片上均设有若干条用于嵌入导热管的热管通道,且通过螺丝将散热器主体、导热管、散热器盖板固定在一起。
进一步地,所述导热管弯曲形状与热管通道的形状一致,所述热管通道由散热器主体及盖在散热器主体背面的散热器盖板间的空腔组合而成;所述导热管表面涂有导热硅脂,在导热管的端部封有密闭胶,经压紧组装后导热管外表面与外部空气相隔离。
进一步地,所述导热管数量不少于根,且所有导热管弯曲部位的顶部均位于芯片聚温区下方,且与芯片聚温区贴紧接触,所述芯片聚温区的厚度为2mm~20mm。
进一步地,所述主体散热片和盖板散热片均是由若干个散热片连成一片组成。
进一步地,所述散热器主体一侧包括驱动电源盒,所述驱动电源与LED芯片电连接,在所述驱动电源盒上盖有驱动上盖。
进一步地,在所述LED芯片上覆盖有玻璃透镜,在所述玻璃透镜上覆盖有玻璃面罩。
进一步地,所述LED芯片、覆盖在LED芯片上的玻璃透镜、具有防护作用与光学作用的玻璃面罩及散热器主体正面具有反射混光作用的反射面板共同组成一个完整的光学系统。
与现有的LED灯具比较,本发明具有以下优点:
1)本发明灯具通过芯片聚温区进行贮热,且导热管的中心位置紧贴芯片聚温区,能够有效的通过导热通道进行导热,再将热量传递给散热器主板和散热器盖板进行有效散热,且散热器主体与散热器盖板都配合有与导热管相应的弯曲形状,用来加大与导热管的接触面;
2)壳体包括散热器主板和散热器盖板,散热器主板和散热器盖板均含有散热片,且为一体式铝压铸成型,散热片上设有用于嵌入导热管的热管通道,导热管通过热管通道的热管热通道上升区能够更加有效的引导热量传递,并最终将热量传递到壳体进行散热,使整个灯体成为一个散热体,大大提升了散热效果,可以降底壳体的成本,同时壳体的外观设计有了更多的可能性;
3)导热管被散热器主板和散热器盖板(即散热片)包围,且与外界空气相隔离,不仅能够保护导热管被空气氧化损坏,增加导热管的寿命,而且通过导热管将热量传递到壳体,使整个灯具成为一个散热体,提升散热效果,有效的减少了光衰,提高了整灯的使用寿命;
4)散热器主板前方固定LED大功率芯片,LED大功率芯片放置在芯片聚温区,大功率芯片可以设置多种具有不同光效的透镜或反光杯,达到不同的使用目地;
5)本发明灯具由于散热效果良好,能承载较大功率的LED芯片,因此不需要用多个灯组组合,同时不同功率可以使用同一个外壳壳体,不需要反复开多个壳体模具,有效果的利用了灯壳本体,重量轻,大大降低了成本,外型美观;
6)现有的灯具由于内部光源模块和散热组件的限制,外形壳体制作也受到限制,而本发明灯具的壳体本身作为一个散热体,其外形可根据实际应用场景设定,有了更多的可能性,适应范围更大。
附图说明
图1为本发明实施例1灯具的结构示意图。
图2为本发明实施例1灯具的分解结构示意图。
图3为本发明实施例1灯具的分解结构示意图。
图4为本发明实施例2灯具的分解结构示意图。
图5为本发明实施例2灯具的分解结构示意图。
图6为本发明实施例3灯具的分解结构示意图。
图7为本发明实施例4灯具的结构示意图。
图8为本发明实施例4灯具的分解结构示意图。
附图标记说明:1-LED芯片、2-玻璃透镜、3-散热器主体、31-驱动电源、32-驱动上盖、33-主体散热片、4-导热管、41-热管通道、42-热通道上升区、5-散热器盖板、51-盖板散热片、6-铝压环、7-芯片聚温区、8-玻璃面罩。
具体实施方式
以下结合附图对本发明的具体实施方式进行详细说明。应当理解的是,此处所描述的具体实施方式仅用于说明和解释本发明,并不用于限制本发明。
实施例1:如附图1~图3所示,具有散热作用的大功率LED灯具,包括壳体,所述壳体包括散热器主体3、散热器盖板5及嵌在散热器主体3和散热器盖板5间的三根导热管4,所述LED芯片1固定放置在散热器主体3正面的芯片聚温区7, LED芯片1上覆盖有玻璃透镜2,所述玻璃透镜2通过铝压环6压紧固定在散热器主体3上,所述芯片聚温区7的的厚度为2mm~20mm,所有导热管4弯曲部位的顶部均位于散热器主体3背面的芯片聚温区7下方,且与芯片聚温区7贴紧接触,且导热管4表面涂有导热硅脂,在导热管4的端部封有密闭胶,经压紧组装后导热管4外表面与外部空气相隔离;
所述散热器主体3上设有主体散热片33,所述散热器盖板5上设有盖板散热片51,主体散热片33和盖板散热片51均是由若干个散热片连成一片组成,所述主体散热片33与芯片聚温区7相对应的位置设有凹腔,所述盖板散热片51的中心位置设有与凹腔相匹配的凸起,同时主体散热片33和盖板散热片51上均设有若干条用于嵌入导热管4的热管通道41,且通过螺丝将散热器主体3、导热管4、散热器盖板5固定在一起;所述导热管4弯曲形状与热管通道41的形状一致,所述热管通道41的弯曲部位为热管热通道上升区42,用来帮助有效进行导热;
所述散热器主体3一侧还设有驱动电源31所述驱动电源31与LED芯片电连接,在所述驱动电源31上盖有驱动上盖32。
实施例2:如图4和图5所示,具有散热作用的大功率LED灯具,包括壳体,所述壳体包括散热器主体3、盖在散热器主体3背面的散热器盖板5及嵌在散热器主体3和散热器盖板5间的三根导热管4,所述LED芯片1固定放置在散热器主体3内的芯片聚温区7,且芯片聚温区7的厚度为2mm~20mm,所有导热管4弯曲部位的顶部均位于散热器主体3背面的芯片聚温区7下方,且与芯片聚温区7贴紧接触,且导热管4表面涂有导热硅脂,在导热管4的端部封有密闭胶,经压紧组装后导热管4外表面与外部空气相隔离;
所述散热器主体3上设有三条用于嵌入导热管4的热管通道41,所述导热管4弯曲形状与热管通道41的形状一致,所述热管通道41的弯曲部位为热管热通道上升区42,所有导热管4弯曲部位的顶部均位于芯片聚温区7下方并紧贴,所述导热管4两端插在散热器主体3上的热管通道41内,并通过螺丝将散热器主体3、导热管4、及散热器盖板5固定在一起。
实施例3:如图6所示,具有散热作用的大功率LED灯具,包括壳体,所述壳体包括散热器主体3、散热器盖板5及嵌在散热器主体3和散热器盖板5间的三根导热管4,所述LED芯片1固定放置在散热器主体3正面的芯片聚温区7,LED芯片1上覆盖有玻璃透镜2,玻璃透镜2覆盖有玻璃面罩8,所述芯片聚温区7的的厚度为2mm~20mm,所有导热管4中心位置位于散热器主体3背面的芯片聚温区7下方,且与芯片聚温区7贴紧接触,且导热管4表面涂有导热硅脂,在导热管4的端部封有密闭胶,经压紧组装后导热管4外表面与外部空气相隔离;
LED芯片1、覆盖在LED芯片1上的玻璃透镜2、具有防护作用与光学作用的玻璃面罩8及散热器主体3正面具有反射混光作用的反射面板共同组成一个完整的光学系统;
所述散热器主体3上设有三条用于嵌入导热管4的热管通道41,所述导热管4弯曲形状与热管通道41的形状一致,所述热管通道41的弯曲部位为热管热通道上升区42,三根导热管4的一端相分离,中心弯曲部位的顶部均位于芯片聚温区7下方并紧贴,另一端并拢,并全部嵌入热管通道41内,最终通过螺丝将散热器主体3、导热管4、及散热器盖板5固定在一起;
所述散热器盖板5的端部还设有驱动电源31,所述驱动电源31与LED芯片电连接,在所述驱动电源31上盖有驱动上盖32。
实施例4:如图7和图8所示,具有散热作用的大功率LED灯具,包括壳体,所述壳体包括散热器主体3、盖在散热器主体3背面的散热器盖板5及嵌在散热器主体3和散热器盖板5间的三根导热管4,所述LED芯片1固定放置在散热器主体3正面的芯片聚温区7, LED芯片1上覆盖有玻璃透镜2,所述玻璃透镜2通过铝压环6压紧固定在散热器主体3上,所述芯片聚温区7的的厚度为2mm~20mm,所有导热管4中心弯曲部位均位于散热器主体3背面的芯片聚温区7下方,且与芯片聚温区7贴紧接触,且导热管4表面涂有导热硅脂,在导热管4的端部封有密闭胶,经压紧组装后导热管4外表面与外部空气相隔离;
所述散热器主体3上设有三条用于嵌入导热管4的热管通道41,所述导热管4弯曲形状与热管通道41的形状一致,所述热管通道41的弯曲部位为热管热通道上升区42,所有导热管4中心弯曲部位均位于芯片聚温区7下方并紧贴,所述导热管4两端插在热管通道41内,并通过螺丝将散热器主体3、导热管4、及散热器盖板5固定在一起;
所述散热器盖板5的背面安装有驱动电源31,所述驱动电源31与LED芯片电连接,且在所述驱动电源31两端设有支架。
如上实施例中的导热管4包括导热铜管,且散热器主体3和散热器盖板5均为一次性铝压住成型的,其结构均根据具体应用场景而设定,并不局限与实施例中所涉及的结构。
本发明先将LED芯片1固定在散热器主体3正面的芯片聚温区7上,再将玻璃透镜2覆盖在LED芯片1上,并采用铝压环6将其固定在散热器主体3上,由于芯片聚温区7的厚度较厚,LED芯片1工作过程中产生的热量被芯片聚温区7吸收并贮存,在散热器主体3背面设有导热管4和散热器盖板5,导热管4的弯曲部分的顶部贴紧散热器主体3的芯片聚温区7,通过芯片聚温区7将热量传导到导热管4上,并且通过热管热通道上升区42将热量有效的传导至整个灯体及散热片区域,同时散热器主体3(主体散热片33)和散热器盖板5(盖板散热片51)都设有与导热管4配合的凹曲面,用来加大与导热管4的接触面积,并将导热管4全部包裹,进而将导热管4的热量传到整个壳体(或散热片)来进行散热,使整个灯具形成一个散热体。与现有的灯具相比,本发明的灯具能承载较大的功率的LED芯片,因此只需用一个灯组而不需要用多个灯组,有效果的利用了灯壳本体,重量轻,成本较低;大功率的LED芯片1与相对应的玻璃透镜2能达到不同的配光要求;散热器主体3的主体散热片33与散热器盖板5的盖板散热片51相匹配,形成一个完整的曲面,能够有效进行空气对流,进而达到散热的目的;导热管4和导热通道41设计的热管热通道上升区42能够更好的导热,同时利于包裹在导热管4周围的散热片进行散热,进而使整个壳体更好的散热,通过壳体将芯片发出的热均匀分散在整个灯具上,以此达到更好散热的目的。
以上对本发明及其实施方式进行了描述,该描述没有限制性,附图中所示的也只是本发明的实施方式之一,实际结构并不局限于此。总而言之如果本领域的普通技术人员受其启示,在不脱离本发明创造宗旨的情况下,不经创造性的设计出与该技术方案相似的结构方式及实施例,均应属于本发明的保护范围。

Claims (9)

1.具有散热作用的大功率LED灯具,包括壳体,其特征在于,所述壳体包括散热器主体(3)和盖在散热器主体(3)背面的散热器盖板(5),在散热器主体(3)和散热器盖板(5)间嵌有若干根导热管(4),LED芯片放置在散热器主体(3)正面,所述散热器主体(3)放置LED芯片(1)的位置为芯片聚温区(7),所有导热管(4)均通过芯片聚温区(7)下方,且与芯片聚温区(7)贴紧接触。
2.根据权利要求1所述的具有散热作用的大功率LED灯具,其特征在于,所述散热器主体(3)和散热器盖板(5)均为一次性铝压铸成型。
3.根据权利要求1所述的具有散热作用的大功率LED灯具,其特征在于,所述散热器主体(3)包括主体散热片(33),所述散热器盖板(5)包括盖板散热片(51),在所述散热器主体(3)背面与芯片聚温区(7)相对应的位置设有凹腔/凸起,所述盖板散热片(51)设有与凹腔/凸起相匹配的凸起/凹腔,同时主体散热片(33)和盖板散热片(51)上均设有若干条用于嵌入导热管(4)的热管通道(41),且通过螺丝将散热器主体(3)、导热管(4)、散热器盖板(5)固定在一起。
4.根据权利要求3所述的具有散热作用的大功率LED灯具,其特征在于,所述导热管(4)弯曲形状与热管通道(41)的形状一致,所述热管通道(41)由散热器主体(3)及盖在散热器主体(3)背面的散热器盖板(5)间的空腔组合而成;所述导热管(4)表面涂有导热硅脂,在导热管(4)的端部封有密闭胶,经压紧组装后导热管(4)外表面与外部空气相隔离。
5.根据权利要求3所述的具有散热作用的大功率LED灯具,其特征在于,所述导热管(4)数量不少于1根,且所有导热管(4)弯曲部位的顶部均位于芯片聚温区(7)下方,且与芯片聚温区(7)贴紧接触,所述芯片聚温区(7)的厚度为2mm~20mm。
6.根据权利要求3所述的具有散热作用的大功率LED灯具,其特征在于,所述主体散热片(33)和盖板散热片(51)均是由若干个散热片连成一片组成。
7.根据权利要求1所述的具有散热作用的大功率LED灯具,其特征在于,所述散热器主体(3)或散热器盖板(5)包括驱动电源盒(31),所述驱动电源(31)与LED芯片电连接,在所述驱动电源盒(31)上盖有驱动上盖(32)。
8.根据权利要求1所述的具有散热作用的大功率LED灯具,其特征在于,在所述LED芯片(1)上覆盖有玻璃透镜(2),在所述玻璃透镜(2)上覆盖有玻璃面罩(8)。
9.根据权利要求8所述的具有散热作用的大功率LED灯具,其特征在于,所述LED芯片(1)、覆盖在LED芯片(1)上的玻璃透镜(2)、具有防护作用与光学作用的玻璃面罩(8)及散热器主体(3)正面具有反射混光作用的反射面板共同组成一个完整的光学系统。
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Application publication date: 20190319