CN109486336A - A kind of illuminative high-power LED light source and preparation method thereof that heat dissipation performance is outstanding - Google Patents
A kind of illuminative high-power LED light source and preparation method thereof that heat dissipation performance is outstanding Download PDFInfo
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- CN109486336A CN109486336A CN201811377078.XA CN201811377078A CN109486336A CN 109486336 A CN109486336 A CN 109486336A CN 201811377078 A CN201811377078 A CN 201811377078A CN 109486336 A CN109486336 A CN 109486336A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
- C09D151/04—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to rubbers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention discloses a kind of illuminative high-power LED light source preparation methods that heat dissipation performance is outstanding; it include: to stir collagen, potassium sulfite, ammonium persulfate, deionized water under nitrogen protection; ammonia water conditioning system pH value is added to 8.2-8.8; stirring; liquid nitrile rubber, styrene, butyl acrylate stirring is added, obtains first material；Vinyl-terminated silicone fluid, glass fibre, calcined kaolin, powdered whiting, nano talc, porous konilite, aluminium borate whisker, blanc fixe, nano-titanium dioxide, dispersing agent, defoaming agent, wetting agent is added under stirring into first material, continues to stir to get second material after being added completely；Trimethylhexane diamine is added into second material to be uniformly mixed, stands, is coated in aluminum alloy base material surface, solidification is dried to obtain LED backplane, then high-power LED chip package is obtained to the outstanding illuminative high-power LED light source of heat dissipation performance in LED backplane.
Description
Technical field
The present invention relates to LED technology field more particularly to a kind of illuminative high-power LED light source that heat dissipation performance is outstanding and
Preparation method.
Background technique
Light emitting diode (LED, LightEmittingDiode) is a kind of semiconducting solid luminescent device, utilizes and partly leads
Body PN junction can directly convert the electricity into light as luminescent material.After the both ends of semiconductor PN add forward voltage, injection
Minority carrier and majority carrier generation in PN junction is compound, releases superfluous energy and photon is caused to emit, directly issue
Color is the light of red, orange, yellow, green, blue, blue, purple.LED light source due to having many advantages, such as that high energy conservation, service life are long, being conducive to environmental protection, and
As the hot spot studied at present, it is widely used in illuminator, and is considered as next-generation light source.
High-power LED chip for illumination will generate a large amount of heat in use, such as not in time dissipate heat
Out, it will be unable to obtain stable light output, and the service life of LED chip can be seriously affected, in order to extend making for LED chip
With the service life, it usually needs LED chip is encapsulated on backboard, the heat for being generated LED chip in use by backboard
It sheds.Currently in order to improving the heat dissipation performance of backboard, heat radiation coating, current illuminative high-power usually are coated in back plate surface
LED light source still has the insufficient technical problem of heat dissipation, therefore, it is necessary to carry out to existing illuminative high-power LED light source
It improves.
Summary of the invention
Technical problems based on background technology, the invention proposes a kind of illuminative high-powers that heat dissipation performance is outstanding
LED light source and preparation method thereof is suitable for various environment and temperature, can avoid causing LED to carry on the back because the time is long placed in hot environment
The defects of plate epidermis is tilted, is fallen off, and impact resistance and acid and alkali-resistance effect are good, while the adhesion strength of LED backplane is high, elasticity
It is good, long service life.
A kind of outstanding illuminative high-power LED light source preparation method of heat dissipation performance proposed by the present invention, including walk as follows
It is rapid:
Collagen, potassium sulfite, ammonium persulfate, deionized water are stirred under S1, nitrogen protection, ammonium hydroxide is added and adjusts body
It is pH value to 8.2-8.8, stirring is added liquid nitrile rubber, styrene, butyl acrylate stirring, obtains first material；
Vinyl-terminated silicone fluid, glass fibre, calcined kaolin, heavy carbon is added under S2, stirring into first material
Sour calcium, nano talc, porous konilite, aluminium borate whisker, blanc fixe, nano-titanium dioxide, dispersing agent, defoaming agent,
Wetting agent continues to stir to get second material after being added completely；
S3, into second material, addition trimethylhexane diamine is uniformly mixed, and is stood, is coated in aluminum alloy base material surface, Gu
Change, be dried to obtain LED backplane, then high-power LED chip package is obtained into the outstanding illumination of heat dissipation performance with greatly in LED backplane
Power LED light source.
Preferably, in S1, liquid nitrile rubber, styrene, butyl acrylate is added and stirs 12-30min, whipping temp is
80-90℃。
Preferably, in S1, collagen, potassium sulfite, ammonium persulfate, deionized water, liquid nitrile rubber, styrene,
The weight ratio of butyl acrylate is 10-30:0.2-0.6:0.02-0.08:80-120:40-80:3-8:1-5.
Preferably, in S2, first material, vinyl-terminated silicone fluid, glass fibre, calcined kaolin, powdered whiting, nanometer
Talcum powder, porous konilite, aluminium borate whisker, blanc fixe, nano-titanium dioxide, dispersing agent, defoaming agent, wetting agent weight
Amount is than being 100-160:2-8:12-18:4-10:10-18:4-12:1-6:2-8:1-4:2-6:0.4-1: 1-2:1-1.6.
Preferably, in S3, time of repose 10-20min.
Preferably, in S3, second material, the weight ratio of trimethylhexane diamine are 120-180:2-4.
A kind of outstanding illuminative high-power LED light source of heat dissipation performance proposed by the present invention, it is excellent using above-mentioned heat dissipation performance
Elegant illuminative high-power LED light source preparation method is made.
The present invention by collagen after potassium sulfite scission of link, with liquid nitrile rubber, styrene, butyl acrylate
Compatibility is fabulous, carries out being cross-linked into graft polymers under the initiation of ammonium persulfate, can not only enhance film slickness, Er Qiejiao
The homogeneous structural that connection is formed can effectively enhance the thermally conductive and impact resistant strength of film, and glass fibre, calcined kaolin, heavy carbon
Sour calcium is dispersed in first material under the cooperation of vinyl-terminated silicone fluid, can guarantee glass fibre, calcined kaolin, heavy carbon
On the basis of sour calcium is not reunited, storeroom favorable dispersibility, mutual coating function is good, on the one hand can enhance the resistance to punching of film
Hit intensity, another aspect acid and alkali-resistance effect is good, while porous konilite, aluminium borate whisker contain a large amount of small passage of heat,
With unique skin effect, the heat on aluminum alloy base material surface can be conducted in time, not only excellent thermal conductivity, but also
Rationally control ratio, can effectively reduce LED backplane hardness, elasticity is good, and hardness is moderate.
The present invention is suitable for various environment and temperature, can avoid causing LED backplane epidermis because the time is long placed in hot environment
The defects of tilting, falling off, and impact resistance and acid and alkali-resistance effect are good, while the adhesion strength of LED backplane is high, and elasticity is good, uses
Service life is long.
Specific embodiment
In the following, technical solution of the present invention is described in detail by specific embodiment.
Embodiment 1
A kind of illuminative high-power LED light source preparation method that heat dissipation performance is outstanding, includes the following steps:
By 10kg collagen, 0.6kg potassium sulfite, 0.02kg ammonium persulfate, 120kg deionization under S1, nitrogen protection
Water stirs 4min, and ammonia water conditioning system pH value is added to 8.2-8.8, stirs 35min, 40kg liquid nitrile rubber, 8kg benzene is added
Ethylene, 1kg butyl acrylate stir 30min, and whipping temp is 80 DEG C, obtain first material；
2kg vinyl-terminated silicone fluid, 18kg glass fibre, 4kg is added under S2, stirring into 160kg first material to forge
Burn kaolin, 18kg powdered whiting, 4kg nano talc, the porous konilite of 6kg, 2kg aluminium borate whisker, 4kg sulfate precipitate
Barium, 2kg nano-titanium dioxide, 1kg dispersing agent, 1kg defoaming agent, 1.6kg wetting agent continue to stir 20min after being added completely, obtain
To second material；
S3, into 180kg second material, addition 2kg trimethylhexane diamine is uniformly mixed, and stands 20min, is coated in aluminium and is closed
Golden substrate surface, solidification, is dried to obtain LED backplane, then high-power LED chip package is obtained heat dissipation performance in LED backplane
Outstanding illuminative high-power LED light source.
Embodiment 2
A kind of illuminative high-power LED light source preparation method that heat dissipation performance is outstanding, includes the following steps:
By 30kg collagen, 0.2kg potassium sulfite, 0.08kg ammonium persulfate, 80kg deionized water under S1, nitrogen protection
12min is stirred, ammonia water conditioning system pH value is added to 8.2-8.8, stirs 14min, 80kg liquid nitrile rubber, 3kg benzene is added
Ethylene, 5kg butyl acrylate stir 12min, and whipping temp is 90 DEG C, obtain first material；
8kg vinyl-terminated silicone fluid, 12kg glass fibre, 10kg is added under S2, stirring into 100kg first material to forge
Burn kaolin, 10kg powdered whiting, 12kg nano talc, the porous konilite of 1kg, 8kg aluminium borate whisker, 1kg precipitated sulfur
Sour barium, 6kg nano-titanium dioxide, 0.4kg dispersing agent, 2kg defoaming agent, 1kg wetting agent continue to stir 40min after being added completely,
Obtain second material；
S3, into 120kg second material, addition 4kg trimethylhexane diamine is uniformly mixed, and stands 10min, is coated in aluminium and is closed
Golden substrate surface, solidification, is dried to obtain LED backplane, then high-power LED chip package is obtained heat dissipation performance in LED backplane
Outstanding illuminative high-power LED light source.
Embodiment 3
A kind of illuminative high-power LED light source preparation method that heat dissipation performance is outstanding, includes the following steps:
By 15kg collagen, 0.5kg potassium sulfite, 0.04kg ammonium persulfate, 110kg deionization under S1, nitrogen protection
Water stirs 6min, and ammonia water conditioning system pH value is added to 8.2-8.8, stirs 30min, 50kg liquid nitrile rubber, 6kg benzene is added
Ethylene, 2kg butyl acrylate stir 26min, and whipping temp is 82 DEG C, obtain first material；
4kg vinyl-terminated silicone fluid, 16kg glass fibre, 6kg is added under S2, stirring into 140kg first material to forge
Burn kaolin, 16kg powdered whiting, 6kg nano talc, the porous konilite of 4kg, 4kg aluminium borate whisker, 3kg sulfate precipitate
Barium, 3kg nano-titanium dioxide, 0.8kg dispersing agent, 1.3kg defoaming agent, 1.4kg wetting agent continue to stir after being added completely
25min obtains second material；
S3, into 160kg second material, addition 2.5kg trimethylhexane diamine is uniformly mixed, and is stood 18min, is coated in aluminium
Alloy substrate surface, solidification, is dried to obtain LED backplane, then high-power LED chip package is obtained thermal diffusivity in LED backplane
The outstanding illuminative high-power LED light source of energy.
Embodiment 4
A kind of illuminative high-power LED light source preparation method that heat dissipation performance is outstanding, includes the following steps:
By 25kg collagen, 0.3kg potassium sulfite, 0.06kg ammonium persulfate, 90kg deionized water under S1, nitrogen protection
10min is stirred, ammonia water conditioning system pH value is added to 8.2-8.8, stirs 20min, 70kg liquid nitrile rubber, 4kg benzene is added
Ethylene, 4kg butyl acrylate stir 16min, and whipping temp is 88 DEG C, obtain first material；
6kg vinyl-terminated silicone fluid, 14kg glass fibre, 8kg is added under S2, stirring into 120kg first material to forge
Burn kaolin, 12kg powdered whiting, 10kg nano talc, the porous konilite of 2kg, 6kg aluminium borate whisker, 2kg precipitated sulfur
Sour barium, 5kg nano-titanium dioxide, 0.6kg dispersing agent, 1.7kg defoaming agent, 1.2kg wetting agent continue to stir after being added completely
35min obtains second material；
S3, into 140kg second material, addition 3.5kg trimethylhexane diamine is uniformly mixed, and is stood 12min, is coated in aluminium
Alloy substrate surface, solidification, is dried to obtain LED backplane, then high-power LED chip package is obtained thermal diffusivity in LED backplane
The outstanding illuminative high-power LED light source of energy.
Embodiment 5
A kind of illuminative high-power LED light source preparation method that heat dissipation performance is outstanding, includes the following steps:
By 20kg collagen, 0.4kg potassium sulfite, 0.05kg ammonium persulfate, 100kg deionization under S1, nitrogen protection
Water stirs 8min, and ammonia water conditioning system pH value is added to 8.2-8.8, stirs 25min, 60kg liquid nitrile rubber, 5kg benzene is added
Ethylene, 3kg butyl acrylate stir 21min, and whipping temp is 85 DEG C, obtain first material；
5kg vinyl-terminated silicone fluid, 15kg glass fibre, 7kg is added under S2, stirring into 130kg first material to forge
Burn kaolin, 14kg powdered whiting, 8kg nano talc, the porous konilite of 3kg, 5kg aluminium borate whisker, 2.5kg precipitated sulfur
Sour barium, 4kg nano-titanium dioxide, 0.7kg dispersing agent, 1.5kg defoaming agent, 1.3kg wetting agent continue to stir after being added completely
30min obtains second material；
S3, into 150kg second material, addition 3kg trimethylhexane diamine is uniformly mixed, and stands 15min, is coated in aluminium and is closed
Golden substrate surface, solidification, is dried to obtain LED backplane, then high-power LED chip package is obtained heat dissipation performance in LED backplane
Outstanding illuminative high-power LED light source.
5 gained LED backplane of embodiment is tested for the property, result is as follows:
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (7)
1. a kind of illuminative high-power LED light source preparation method that heat dissipation performance is outstanding, which comprises the steps of:
Collagen, potassium sulfite, ammonium persulfate, deionized water are stirred under S1, nitrogen protection, ammonia water conditioning system pH is added
Value to 8.2-8.8, stirring is added liquid nitrile rubber, styrene, butyl acrylate stirring, obtains first material；
Under S2, stirring into first material be added vinyl-terminated silicone fluid, glass fibre, calcined kaolin, powdered whiting,
Nano talc, porous konilite, aluminium borate whisker, blanc fixe, nano-titanium dioxide, dispersing agent, defoaming agent, wetting
Agent continues to stir to get second material after being added completely；
S3, into second material, addition trimethylhexane diamine is uniformly mixed, and is stood, is coated in aluminum alloy base material surface, solidifies, dry
It is dry to obtain LED backplane, then high-power LED chip package is obtained to the outstanding illuminative high-power of heat dissipation performance in LED backplane
LED light source.
2. the outstanding illuminative high-power LED light source preparation method of heat dissipation performance according to claim 1, which is characterized in that
In S1, liquid nitrile rubber, styrene, butyl acrylate is added and stirs 12-30min, whipping temp is 80-90 DEG C.
3. the outstanding illuminative high-power LED light source preparation method of heat dissipation performance according to claim 1 or claim 2, feature exist
In, in S1, collagen, potassium sulfite, ammonium persulfate, deionized water, liquid nitrile rubber, styrene, butyl acrylate
Weight ratio is 10-30:0.2-0.6:0.02-0.08:80-120:40-80:3-8:1-5.
4. the outstanding illuminative high-power LED light source preparation method of any one of -3 heat dissipation performances according to claim 1, special
Sign is, in S2, first material, vinyl-terminated silicone fluid, glass fibre, calcined kaolin, powdered whiting, nano talc,
Porous konilite, aluminium borate whisker, blanc fixe, nano-titanium dioxide, dispersing agent, defoaming agent, wetting agent weight ratio be
100-160:2-8:12-18:4-10:10-18:4-12:1-6:2-8:1-4:2-6:0.4-1: 1-2:1-1.6.
5. the outstanding illuminative high-power LED light source preparation method of any one of -4 heat dissipation performances according to claim 1, special
Sign is, in S3, time of repose 10-20min.
6. the outstanding illuminative high-power LED light source preparation method of any one of -5 heat dissipation performances according to claim 1, special
Sign is, in S3, second material, the weight ratio of trimethylhexane diamine are 120-180:2-4.
7. a kind of illuminative high-power LED light source that heat dissipation performance is outstanding, which is characterized in that using any one of claim 1-6
The outstanding illuminative high-power LED light source preparation method of the heat dissipation performance is made.
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| CN103012692A (en) * | 2012-12-10 | 2013-04-03 | 浙江大学 | Method for preparing soybean protein copolymer emulsion |
| US20170096600A1 (en) * | 2013-05-02 | 2017-04-06 | William Marsh Rice University | Graphene quantum dot-polymer composites and methods of making the same |
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2018
- 2018-11-19 CN CN201811377078.XA patent/CN109486336A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102020897A (en) * | 2009-09-16 | 2011-04-20 | 北京有色金属研究总院 | Corrosion resistant paint for the inner surface of radiator and preparation method thereof |
| CN102051506A (en) * | 2010-11-03 | 2011-05-11 | 宁波江丰电子材料有限公司 | Aluminum alloy material and preparation method of aluminum alloy backboard for LED (Light-Emitting Diode) chip |
| CN103012692A (en) * | 2012-12-10 | 2013-04-03 | 浙江大学 | Method for preparing soybean protein copolymer emulsion |
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Application publication date: 20190319 |