CN109484036A - Thermal head - Google Patents

Thermal head Download PDF

Info

Publication number
CN109484036A
CN109484036A CN201811063857.2A CN201811063857A CN109484036A CN 109484036 A CN109484036 A CN 109484036A CN 201811063857 A CN201811063857 A CN 201811063857A CN 109484036 A CN109484036 A CN 109484036A
Authority
CN
China
Prior art keywords
insulating substrate
public electrode
thermal head
region
electrode
Prior art date
Application number
CN201811063857.2A
Other languages
Chinese (zh)
Other versions
CN109484036B (en
Inventor
高田直希
山地范男
Original Assignee
青井电子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2017-176114 priority Critical
Priority to JP2017176114A priority patent/JP6781125B2/en
Application filed by 青井电子株式会社 filed Critical 青井电子株式会社
Publication of CN109484036A publication Critical patent/CN109484036A/en
Application granted granted Critical
Publication of CN109484036B publication Critical patent/CN109484036B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335Structure of thermal heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/315Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
    • B41J2/32Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
    • B41J2/335Structure of thermal heads
    • B41J2/33505Constructional details
    • B41J2/3351Electrode layers

Abstract

The present invention provides a kind of thermal head of adhesion strength for improving sealing resin.Thermal head has: public electrode, is formed on insulating substrate and applies driving voltage;Multiple absolute electrodes are formed on insulating substrate according to each tiny area of heater, and apply driving voltage to each tiny area;IC is driven, connect and is arranged on circuit substrate with insulating substrate, control respectively flows through the electric current of multiple absolute electrodes;Protective film, covering include the protection zone of public electrode and absolute electrode;And sealing resin; it covers the electric wire for being wired to driving IC and driving IC across insulating substrate and circuit substrate; on multiple absolute electrodes; along the setting of insulating substrate edge by electric wire come with the connection pad that connect of driving IC, protection zone includes following region: one end in public electrode in the region being covered with sealing resin and between the other end of the public electrode and region that contacts at least part at the edge of insulating substrate.

Description

Thermal head

Technical field

The present invention relates to a kind of thermal heads.

Background technique

In the past, it is known that the thermal head (for example, patent document 1) for being sealed bonding wire by sealing resin.

Patent document 1: Japanese Unexamined Patent Publication 2008-68405 bulletin.

Summary of the invention

In the prior art, there is a problem of the adhesion strength deficiency of sealing resin.

1st mode according to the present invention, thermal head have: public electrode is formed on insulating substrate and applies driving Voltage;Multiple absolute electrodes are formed on the insulating substrate according to the tiny area of heater, and described micro- each Zonule applies the driving voltage;IC is driven, the insulating substrate is connected and is arranged on circuit substrate, control is flowed respectively Cross the electric current of the multiple absolute electrode;Protective film, covering include the protection zone of the public electrode and the absolute electrode Domain;And sealing resin, across the insulating substrate and the circuit substrate and cover and the electric wire for driving IC wiring And the driving IC is arranged along the edge of the insulating substrate on the multiple absolute electrode through the electric wire Come the connection pad being connected with the driving IC, the protection zone includes following region: being covered with the sealing resin Region in, between one end of the public electrode and the other end of the public electrode and the institute with the insulating substrate State the region of at least part contact at edge.

In accordance with the invention it is possible to improve the adhesion strength of sealing resin.

Detailed description of the invention

Fig. 1 is the plan view for indicating the structure of thermal head involved in the 1st embodiment.

Fig. 2 is the figure for schematically showing the section line I-I of Fig. 1.

Fig. 3 is related to indicating the plan view of the structure of thermal head involved in the 2nd embodiment.

Fig. 4 is the figure for schematically showing the section line I-I of Fig. 3.

Fig. 5 is the plan view for indicating the structure of thermal head involved in a variation.

Fig. 6 is the plan view for indicating the structure of thermal head involved in a variation.

Description of symbols

100 ... thermal heads, 1 ... heater, 2 ... public electrodes, 3 ... absolute electrodes, 4 ... insulating substrates, 6,6a, 6b ... drive Dynamic device IC, 7a, 7b, 7c ... electric wire, 8 ... sealing resins, 9 ... circuit substrates, 12 ... protective films.

Specific embodiment

(the 1st embodiment)

Fig. 1 is the plan view for indicating the structure of thermal head involved in the 1st embodiment of the invention.Fig. 2 is schematic The figure in the section line I-I of earth's surface diagram 1.Thermal head 100 has the insulating substrate 4 and circuit base being fixed in support plate 5 Plate 9.Insulating substrate 4 and circuit substrate 9 are fixed in support plate 5 by adhesion coating 11.

Insulating substrate 4 is formed by the insulator of ceramics etc..In the present embodiment, insulating substrate 4 is configured in ceramics Lower glaze layer 4b is set on substrate 4a.Photoetching process is used on insulating substrate 4, such as to the conductor of gold etc., not by etching removal Public electrode base portion 21 and multiple absolute electrodes 3 is consequently formed in the part needed.In public electrode 2 and multiple independent electricals The top (the paper upward direction of Fig. 1) of pole 3, such as band-like heater 1 is formed by thick film screen printing.Insulating substrate 4 it is whole A part of region (being described in detail later) protective film 12 shown in the oblique line in Fig. 1 and Fig. 2 in body covers.Protection Film 12 by glass such as constituting.

On printing distributing board etc. i.e. circuit substrate 9, it is provided with driver IC 6a, driver IC 6b and connection terminal 10.Driver IC 6a, driver IC 6b are to be connected respectively with multiple absolute electrodes 3 and control the electric current for flowing through each heater 1 Energization, non-energized driving IC.In the following description, driver IC 6a and driver IC 6b are referred to as driver IC6.In addition, driver IC 6, which has, actually receives the input electrode weldering that signal is used to control driver IC 6 from connection terminal 10 Disk, but having carried out omitting on the diagram records.

Connection terminal 10 is for thermal head 100 to be connected to the interconnecting piece for carrying out the external equipment of print control etc..? Lower part in Fig. 1 of circuit substrate 9, the edge i.e. with 4 side opposite side of the insulating substrate of circuit substrate 9 are arranged and are matched for a column Set multiple connection terminals 10.One end of each absolute electrode 3 is connected to driver IC 6 by electric wire 7c.Electric wire 7c is by independence The metal wires such as the gold thread that electrode 3 is electrically connected with driver IC 6.

Public electrode 2 has public electrode base portion 21 and multiple public electrode extensions 20.21 shape of public electrode base portion As in 4 sides possessed by rectangular dielectric substrate 4, along while in face of 1 of circuit substrate 93 other than, packet Enclose heater 1.The one of the public electrode base portion 21 that multiple public electrode extensions 20 are extended in parallel from Fig. 1 with heater 1 A region starts, and extends along sub-scanning direction 42 (the paper up and down direction of Fig. 1).As described later, the extending direction of heater 1 It is main scanning direction.

One end 21a of public electrode base portion 21 passes through multiple electric wire 7a and the wiring diagram being arranged on circuit substrate 9 Case 13a electrical connection.Wiring pattern 13a is electrically connected with connection terminal 10.Another end 21b of public electrode base portion 21 passes through more A electric wire 7b is electrically connected with the wiring pattern 13b being arranged on circuit substrate 9.Wiring pattern 13b is another with connection terminal 10 Side electrical connection.

Multiple absolute electrodes 3 are respectively provided with interconnecting piece 32, absolute electrode extension 30 and connection pad 31.Absolute electrode Extension 30 is located between a pair of of public electrode extension 20 of public electrode 2 and extends along sub-scanning direction 42.Interconnecting piece 32 extend from the end of absolute electrode extension 30 to sub-scanning direction 42.

Connection pad 31 is arranged on the other end of interconnecting piece 32, the connection i.e. with 30 opposite side of absolute electrode extension The end in portion 32.That is, being provided with absolute electrode extension 30 in one end of interconnecting piece 32, the other end is provided with connection weldering Disk 31.In other words, connected by interconnecting piece 32 absolute electrode extension 30 with connect pad 31.

Multiple public electrode extensions 20 are formed as alternately opposite with multiple absolute electrode extensions 30 and engage.Heater 1 Multiple public electrode extensions 20 and multiple absolute electrode extensions 30 are formed across, are crossed in other words, and in public affairs Common electrode extension 20 and orientation, that is, main scanning direction 41 (the paper left and right directions of Fig. 1) of absolute electrode extension 30 prolong It stretches.

Multiple connection pads 31 along the edge part 4x (Fig. 1, Fig. 2) of 9 side of circuit substrate of insulating substrate 4, i.e. along master Scanning direction 41 is arranged as a column with preset space length.Driver IC 6 in the case where overlooking visual angle in elongated rectangular shape (generally Elongated quadrangular), and longitudinal direction is made to be aligned on the extending direction of the edge part 4x of 9 side of circuit substrate and be welded in circuit Substrate 9.In the upper surface of driver IC 6, along the edge part opposite with insulating substrate 4, i.e. along main scanning direction 41, formed Multiple IC electrode pads 60.Multiple connection pads 31 are arranged with interval identical with multiple IC electrode pads 60.1 connection weldering Disk 31 corresponds to 1 IC electrode pad 60.Each connection pad 31 is electrically connected by electric wire 7c with corresponding IC electrode pad 60 It connects.

Driver IC 6 is controlled from public electrode 2 via the electric current that heater 1 flows to each absolute electrode 3.By This, flows through electric current, and generate heat in the part, wherein the heater 1, which is located at, is formed as public in the tiny area of heater 1 Between electrode extension 20 and absolute electrode the extension 30 alternately opposite part engaged.By the way that the heat is supplied to heat-sensitive paper Deng print media printed.

In addition, for ease of drawing, less than actual quantity simplification figure shows absolute electrode 3 in Fig. 1.Therefore, also few It in actual quantity illustrates the number of public electrode extension 20, the number of absolute electrode extension 30, connect pad 31 Number and the number of IC electrode pad 60 etc..In addition, though connection pad 31 has spacing identical with IC electrode pad 60, But must not necessarily be configured in same row along main scanning direction 41, it is also possible to 2 column, 3 column.

A part of region protective film 12 shown in Fig. 1 bend of insulating substrate 4 covers.The area protected by protective film 12 Domain include in heater 1, the major part of at least public electrode extension 20 comprising public electrode 2 and absolute electrode 3 in addition to Connect the part (i.e. the major part of absolute electrode extension 30 and interconnecting piece 32) of pad 31.In other words, pass through protective film 12 To protect these components.

Sealing resin 8 by cured epoxy resinoid, insulating substrate 4, circuit substrate 9, heater 1 with until right angle The range of two marginal portions position in direction, to comprising driver IC 6, electric wire 7a, electric wire 7b, electric wire 7c, insulating substrate 4 It is sealed in the plane with the borderline region of circuit substrate 9.Sealing resin 8 prevent electric wire 7a, electric wire 7b, electric wire 7c etc. due to Contact, collision and breakage or disengaging from outside.Sealing resin 8 has the property that the table for being difficult to be fixed on insulating substrate 4 Face and it is formed in the public electrode 2 of insulating substrate 4 and the surface of absolute electrode 3, and is easier to be fixed on guarantor compared to them The surface of cuticula 12.Other than the adaptability of structural material, insulating substrate 4, public electrode 2 and absolute electrode 3, protective film Substantially 0.025 μm of 12 each surface roughness Ra, 0.025 μm, 0.079 μm, the table surface roughness Ra of protective film 12 and absolutely Edge substrate 4, public electrode 2 and absolute electrode 3 are compared, and are 3 times or more of value.As a result, it is possible to know even if as anchor Determine effect, protective film 12 also becomes easier to fix.

Such as flexible print cable (FPC) is connected to connection terminal 10 by solder etc..Such as added by being used on FPC Hot device etc., which applies heat, makes the fusings such as solder to be attached the connection of terminal 10 Yu FPC.At this point, heat transfer is to insulating substrate 4, circuit substrate 9, sealing resin 8 etc., these parts expand.Insulating substrate 4, circuit substrate 9, sealing resin 8 etc. have Different coefficient of thermal expansions, therefore due to heat, sealing resin 8 may be detached from from insulating substrate 4 and circuit substrate 9.

In the present embodiment, extend the protective film 12 for protecting heater 1, public electrode 2 and absolute electrode 3 as far as possible To the edge part 4x of 9 side of circuit substrate of insulating substrate 4.Specifically, in the region of following (1)~(3), by protective film 12 Line 12P shown in dotted line from Fig. 1 (the region line of existing protective film 12) extends to edge part 4x.

(1) the end 21a of public electrode 2 and corresponding to the region R1 between multiple connection pads 31 of driver IC 6a.

(2) the end 21b of public electrode 2 and corresponding to the region R2 between multiple connection pads 31 of driver IC 6b.

(3) corresponding to multiple connection pads 31 of driver IC 6a and the multiple connection pads 31 for corresponding to driver IC 6b Between region R3.

These regions R1~R3 is all located at an end 21a of public electrode 2 and another end 21b of public electrode 2 Between and contact with the edge part 4x of insulating substrate 4.

In this way, increasing the area that protective film 12 is contacted with sealing resin 8 as far as possible, therefore more reliably fixing seal resin 8, and become difficult to be detached from due to heat.

As time goes by, the boundary part between insulating substrate 4 and circuit substrate 9 may slowly penetrate into air Moisture.In addition, it is simultaneously swollen that foreign matter absorbs moisture if there are foreign matters in contact surface between sealing resin 8 and bonding plane It is swollen, lead to the adherency for hindering sealing resin 8, sealing resin 8 may be detached from from insulating substrate 4 and circuit substrate 9.

In the present embodiment, as described above, with end 21a, 21b of public electrode 2 and driver IC 6a, 6b phase In region R1~R3 that the surface of insulating substrate 4 between corresponding multiple connection pads 31 divides, protective film 12 extends to side Edge 4x.In this way, the area contacted by increasing protective film 12 as far as possible with sealing resin 8, will more reliably fix Sealing resin 8, and be difficult to be detached from due to moisture absorption.

According to above embodiment, available function and effect below.

(1) sealing resin 8 covered across insulating substrate 4 and circuit substrate 9 with the electric wire 7c of 6 wiring of driver IC with And driver IC 6.Protective film 12 covers public electrode 2 and absolute electrode 3, and covers the region covered by sealing resin 8 In between an end 21a of public electrode 2 and another end 21b of public electrode 2 and the side with insulating substrate 4 The region of at least part contact of edge 4x.It so, it is possible to further increase the adhesion strength of sealing resin 8, and can drop Low a possibility that causing sealing resin 8 to be detached from due to hot, moisture absorption.

(2) by the range that sealing resin 8 covers be in the plane insulating substrate 4, circuit substrate 9, heater 1 with until The range of two marginal portions of right angle orientation does not need to seal due to not extending to support plate 5 in support plate 5 The dispensing area of resin 8 can shorten the length of the main scanning direction 41 of thermal head 100 and can be realized miniaturization.

(the 2nd embodiment)

Fig. 3 is the plan view for indicating the structure of thermal head involved in the 2nd embodiment of the invention.Fig. 4 is schematic The figure in the section line I-I of earth's surface diagram 3.Hereinafter, for thermal head 100 and the 1st embodiment institute involved in present embodiment The difference for the thermal head 100 being related to is described.

What the protective film 12 of 1 embodiment of Fig. 3 and the thermal head 100 to the of present embodiment shown in Fig. 4 was covered Region is bigger.Specifically, protective film 12 is covered with the edge part 4x of 9 side of circuit substrate of insulating substrate 4.That is, protecting Cuticula 12 covers the region R4 of the lower section of electric wire 7a, 7b, 7c.Region R4 is located at an end 21a and public affairs for public electrode 2 Between another end 21b of common electrode 2 and contact the edge part 4x of insulating substrate 4.

In this way, increasing what protective film 12 was contacted with sealing resin 8 for thermal head 100 involved in present embodiment Range, therefore the adhesion strength of sealing resin 8 is higher than the 1st embodiment.

As next it is such deform it is also within the scope of the invention, additionally it is possible to by one or more variation with it is above-mentioned Embodiment combination.

(variation 1)

The range that protective film 12 is covered can be different from the respective embodiments described above.

Fig. 5 is the plan view for indicating the structure of thermal head 100 involved in a variation.Thermal head 100 shown in fig. 5 Region R1~R3 shown in fig. 1 is not covered, but covers edge part 4x, the i.e. Fig. 3 institute of 9 side of circuit substrate of insulating substrate 4 The region R4 shown.Thus configured thermal head 100 also has the adhesion strength higher than previous sealing resin 8.

Fig. 6 is the plan view for indicating the structure of thermal head 100 involved in a variation.For temperature-sensitive shown in fig. 6 The arrangement spacing of first 100, IC electrode pad 60 is more wider than the respective embodiments described above.Therefore, the connection pad 31 of absolute electrode 3 Arrangement spacing also becomes more wider than the respective embodiments described above.In this case, be expressed as in Fig. 1 the area of region R1~R3 compared with It is small, therefore there is no the sufficient spaces for extensive protection film 12.

In a situation such as this, protective film 12 is difficult overlay area R1~R3, but can cover the electricity of insulating substrate 4 The region R4 of the edge part 4x of 9 side of base board.Thus configured thermal head 100 also has viscous higher than previous sealing resin 8 Intensity.

In addition to this, in Fig. 1, even if for the only structure of some in the R1~R3 of overlay area, only of protective film 12 Any 2 structure in the R1~R3 of overlay area etc., also can be realized same effect.In this way, being wrapped in the scope of the present invention Containing the various modes compared with the past that can improve adherence.

(variation 2)

The number of driver IC 6 can not be 2.For example, can set driver IC 6 is only 1, it also can be used 3 Above driver IC 6.It, can be by protecting in the region between each driver IC 6 when there are 3 or more driver ICs 6 Film 12 covers arbitrary region.Even if can also obtain effect same as the above embodiment in the case where such setting.

More than, various embodiments and variation are illustrated, but the present invention is not limited to this A little contents.Within the scope of the technical idea of the present invention it is contemplated that other modes be also contained in the scope of the present invention.

Claims (7)

1. a kind of thermal head, which is characterized in that have:
Public electrode is formed on insulating substrate and applies driving voltage;
Multiple absolute electrodes are formed on the insulating substrate according to each tiny area of heater, and to each The tiny area applies the driving voltage;
IC is driven, connect and is arranged on circuit substrate with the insulating substrate, control respectively flows through the multiple independent electrical The electric current of pole;
Protective film, covering include the protection zone of the public electrode and the absolute electrode;And
Sealing resin, covered across the insulating substrate and the circuit substrate be wired to it is described driving IC electric wire and The driving IC,
On the multiple absolute electrode, be arranged along the edge of the insulating substrate by the electric wire come with the driving The connection pad that IC is connected,
The protection zone include following region: in the region being covered with the sealing resin the one of the public electrode Hold the region contacted between the other end of the public electrode and at least part at the edge of the insulating substrate.
2. thermal head according to claim 1, which is characterized in that
The protection zone includes the insulation extended between one end and multiple connection pads of the public electrode The region of substrate.
3. thermal head according to claim 1 or 2, which is characterized in that
The protection zone include it is multiple it is described connection pads a part and it is multiple it is described connection pads another part it Between the region of the insulating substrate that extends.
4. thermal head described according to claim 1~any one of 3, which is characterized in that
The protection zone includes the area of the insulating substrate extended between one end and the edge of the public electrode Domain.
5. thermal head described according to claim 1~any one of 4, which is characterized in that
The protection zone includes the region of the insulating substrate extended between multiple connection pads and the edge.
6. thermal head described according to claim 1~any one of 5, which is characterized in that
The sealing resin is also carried out to by the both ends of the public electrode with the wiring pattern being arranged on the circuit substrate The electric wire of electrical connection is sealed.
7. thermal head described according to claim 1~any one of 6, which is characterized in that
Compared to the surface on the surface of the insulating substrate, the surface of the public electrode and the absolute electrode, the sealing The surface that resin is easier to be directed to the protective film is fixed.
CN201811063857.2A 2017-09-13 2018-09-12 Thermal head CN109484036B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2017-176114 2017-09-13
JP2017176114A JP6781125B2 (en) 2017-09-13 2017-09-13 Thermal head

Publications (2)

Publication Number Publication Date
CN109484036A true CN109484036A (en) 2019-03-19
CN109484036B CN109484036B (en) 2021-02-09

Family

ID=

Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0781111A (en) * 1993-06-28 1995-03-28 Shin Etsu Chem Co Ltd Method for resin sealing of thermal recording head
JPH07186428A (en) * 1993-12-28 1995-07-25 Rohm Co Ltd Thermal print head and its manufacture
JPH09207366A (en) * 1996-02-02 1997-08-12 Graphtec Corp Thermal head and its manufacture
JPH09314880A (en) * 1996-03-29 1997-12-09 Kyocera Corp Thermal head
JPH1120216A (en) * 1997-07-03 1999-01-26 Aoi Denshi Kk Thermal head, wire bonding method for thermal head, and manufacture of thermal head
JP2007054965A (en) * 2005-08-22 2007-03-08 Rohm Co Ltd Thermal print head
CN101143521A (en) * 2006-09-12 2008-03-19 阿尔卑斯电气株式会社 Thermal headand method of manufacturing the same
JP2009066854A (en) * 2007-09-12 2009-04-02 Toshiba Hokuto Electronics Corp Thermal print head and method for manufacturing the same
JP2012116131A (en) * 2010-12-02 2012-06-21 Alps Electric Co Ltd Thermal head and its manufacturing method
JP2012206302A (en) * 2011-03-29 2012-10-25 Toshiba Hokuto Electronics Corp Thermal head
JP5670132B2 (en) * 2010-09-16 2015-02-18 東芝ホクト電子株式会社 Thermal print head and thermal printer
CN104619504A (en) * 2012-09-28 2015-05-13 京瓷株式会社 Thermal head and thermal printer provided with same
WO2015159819A1 (en) * 2014-04-14 2015-10-22 ローム株式会社 Thermal print head and thermal printer
CN105026165A (en) * 2013-02-27 2015-11-04 京瓷株式会社 Thermal head and thermal printer
JP2015193110A (en) * 2014-03-31 2015-11-05 ローム株式会社 thermal print head
CN106414089A (en) * 2014-01-21 2017-02-15 罗姆股份有限公司 Thermal print head and thermal printer
CN107000446A (en) * 2014-12-25 2017-08-01 京瓷株式会社 Thermal head and thermal printer
CN107148353A (en) * 2014-10-30 2017-09-08 京瓷株式会社 Thermal head and thermal printer

Patent Citations (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0781111A (en) * 1993-06-28 1995-03-28 Shin Etsu Chem Co Ltd Method for resin sealing of thermal recording head
JPH07186428A (en) * 1993-12-28 1995-07-25 Rohm Co Ltd Thermal print head and its manufacture
JPH09207366A (en) * 1996-02-02 1997-08-12 Graphtec Corp Thermal head and its manufacture
JPH09314880A (en) * 1996-03-29 1997-12-09 Kyocera Corp Thermal head
JPH1120216A (en) * 1997-07-03 1999-01-26 Aoi Denshi Kk Thermal head, wire bonding method for thermal head, and manufacture of thermal head
JP2007054965A (en) * 2005-08-22 2007-03-08 Rohm Co Ltd Thermal print head
CN101143521A (en) * 2006-09-12 2008-03-19 阿尔卑斯电气株式会社 Thermal headand method of manufacturing the same
JP2008068405A (en) * 2006-09-12 2008-03-27 Alps Electric Co Ltd Thermal head and its manufacturing method
JP2009066854A (en) * 2007-09-12 2009-04-02 Toshiba Hokuto Electronics Corp Thermal print head and method for manufacturing the same
JP5670132B2 (en) * 2010-09-16 2015-02-18 東芝ホクト電子株式会社 Thermal print head and thermal printer
JP2012116131A (en) * 2010-12-02 2012-06-21 Alps Electric Co Ltd Thermal head and its manufacturing method
JP2012206302A (en) * 2011-03-29 2012-10-25 Toshiba Hokuto Electronics Corp Thermal head
CN104619504A (en) * 2012-09-28 2015-05-13 京瓷株式会社 Thermal head and thermal printer provided with same
CN105026165A (en) * 2013-02-27 2015-11-04 京瓷株式会社 Thermal head and thermal printer
CN106414089A (en) * 2014-01-21 2017-02-15 罗姆股份有限公司 Thermal print head and thermal printer
JP2015193110A (en) * 2014-03-31 2015-11-05 ローム株式会社 thermal print head
WO2015159819A1 (en) * 2014-04-14 2015-10-22 ローム株式会社 Thermal print head and thermal printer
CN107148353A (en) * 2014-10-30 2017-09-08 京瓷株式会社 Thermal head and thermal printer
CN107000446A (en) * 2014-12-25 2017-08-01 京瓷株式会社 Thermal head and thermal printer

Also Published As

Publication number Publication date
JP2019051628A (en) 2019-04-04
JP6781125B2 (en) 2020-11-04

Similar Documents

Publication Publication Date Title
US5519936A (en) Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
JP4044265B2 (en) Power module
TW422933B (en) Printed circuit board structures and liquid crystal display modules using same
US7872337B2 (en) Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate
US7208835B2 (en) Integrated circuit package and assembly thereof
JP4650822B2 (en) Flat panel display
EP1906719B1 (en) Electronic controller
US5633533A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
KR100627259B1 (en) Plasma display apparatus having tape carrier package
JP2538112Y2 (en) Mounting board
US6304251B1 (en) Coordinate input device with flat cable having two divided flat mounting parts composing divided conductor portions
TWI329757B (en) Flat display panel and assembly process thereof
US4687300A (en) Liquid crystal display device
KR20000068821A (en) Assembly Consisting of a Substrate for Power Components and a Cooling Element and Method for the Production Thereof
CN100356537C (en) Method of manufacturing semiconductor device
JP2012059759A (en) Electronic control unit
CN101097693B (en) Driving circuit and liquid crystal display module having the same
KR19990063681A (en) Multichip Module
JP2737647B2 (en) Anisotropic conductive adhesive and conductive connection structure using the same
JP2005310905A (en) Connection structure of electronic component
US4295711A (en) Liquid crystal display device
US20020097352A1 (en) Display unit and method for manufacturing a display unit
JP2007048812A (en) Semiconductor device
KR960012758B1 (en) Printing head and printer incorporating the same
US20110169792A1 (en) Display panel

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant