CN109478508A - Foreign matter removal device - Google Patents
Foreign matter removal device Download PDFInfo
- Publication number
- CN109478508A CN109478508A CN201780044149.1A CN201780044149A CN109478508A CN 109478508 A CN109478508 A CN 109478508A CN 201780044149 A CN201780044149 A CN 201780044149A CN 109478508 A CN109478508 A CN 109478508A
- Authority
- CN
- China
- Prior art keywords
- foreign matter
- removal device
- matter removal
- substrate
- cleaning head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 claims abstract description 54
- 238000002347 injection Methods 0.000 claims abstract description 15
- 239000007924 injection Substances 0.000 claims abstract description 15
- 239000007921 spray Substances 0.000 claims description 6
- 238000005086 pumping Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 77
- 230000003749 cleanliness Effects 0.000 abstract description 10
- 239000004065 semiconductor Substances 0.000 description 14
- 238000007664 blowing Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A kind of foreign matter removal device (100), include: the cleaning head (20) of rectangular-shape, comprising to the surface of the substrate (13) transported in X direction with it is band-like injection air slit (23) and be adjacent to slit (23) and configure oblong-shaped pump orifice (24)；And driving portion (30), move cleaning head (20) in the Y direction along the surface of substrate (13)；The foreign matter removal device removes the foreign matter on the surface of substrate (13), and makes the front surface (21a) of cleaning head (20) from the Y-direction court direction tilt angle theta 1 opposite with conveyance direction.The cleanliness on transported plate-like members surface is improved as a result,.
Description
Technical field
The present invention relates to a kind of foreign matter removal device, in particular to the plate-like members surface such as a kind of substrate that will be transported
Foreign matter removal foreign matter removal device structure.
Background technique
In the manufacturing process of the electronic components such as integrated circuit (Integrated Circuit, IC), following apparatus is used
Etc. multiple devices: bare die engages (die bonding) device, semiconductor bare chip (die) bonding that will be cut out from chip (wafer)
In substrate；Wire bonding (wire bonding) device, the electrode and base of the semiconductor bare chip of substrate will be adhered to using lead
The electrode engagement of plate；And flip-chip (flip chip) mounting device, it is pre-formed on the electrode of semiconductor bare chip convex
Block inverts semiconductor bare chip and is fixed on substrate and connects the electrode of the electrode of semiconductor bare chip and substrate.In addition, most
It closely also uses to splice on the semiconductor bare chip upper layer of chip and closes the engagement device of semiconductor bare chip.
In this engagement device, substrate etc. is transported in one direction using carrying device on one side, on one side in the rule of substrate
Determine engagement position semiconductor bare chip, or conveying is fixed with the substrate of semiconductor bare chip on surface, and utilizes lead in specified position
The electrode of the electrode of semiconductor bare chip and substrate is connected.
In this device, if the foreign matters such as dust are attached to the surface of substrate etc., reduced there are the bonding force of bonding agent
Situation.In addition, there are semiconductor bare chip generations if dust is attached to the surface of the electrode of substrate or the electrode of semiconductor bare chip
The situation in crack etc..
Is blown by attached air and blows the foreign matter for being attached to substrate winged for substrate it is therefore proposed that having, and winged foreign matter suction will be blown
Recycle and carry out the device of foreign matter removal (referring for example to patent document 1).
Existing technical literature
Patent document
Patent document 1: Japanese Patent Laid-Open 2012-199458 bulletin
Summary of the invention
Problem to be solved by the invention
In addition, making cleaning nozzle (cleaning nozzle) on edge in foreign matter removal device documented by patent document 1
It is moved on the direction orthogonal with the conveyance direction of substrate on the mobile substrate of conveyance direction and removes the foreign matter of substrate surface.
That is, the foreign matter of substrate surface is removed when the substrate for being attached with foreign matter passes through the moving area of cleaning nozzle, thus cleaning
The conveyance direction downstream side of nozzle makes the surface of substrate become clean conditions.
But for the cleaning nozzle of the prior art documented by the patent document 1, there are following situations: transporting
It is configured on direction in the air blow-off outlet of a column, the air sprayed from the air blow-off outlet near conveyance direction downstream side will be attached
In substrate foreign matter to conveyance direction downstream it is side-blown fly.At this point, there are following situations: foreign matter is attached to again becomes cleaning for the time being
On the substrate in the conveyance direction downstream side of state, substrate surface can not be made to become sufficiently clean state.
Therefore, it is an object of the invention to improve the cleanliness on transported plate-like members surface.
Technical means to solve problem
Foreign matter removal device of the invention includes: the cleaning head of rectangular-shape, comprising to the plate transported in the horizontal direction
The surface of shape component is with the jet port of band-like injection air and is adjacent to jet port and the pump orifice of oblong-shaped that configures；With
And driving portion, move cleaning head on the direction orthogonal with conveyance direction along the surface of plate-like members, the foreign matter is gone
Except device removes the foreign matter on the surface of plate-like members, and it is characterized by: the longitudinal direction of cleaning head pump orifice side
Face is tilted from the orthogonal direction of conveyance direction towards the direction opposite with conveyance direction.
In foreign matter removal device of the invention, it is also preferred that jet port relative to plate-like members surface and tilt, and make
Air is sprayed to towards the direction of pump orifice.
In foreign matter removal device of the invention, it is also preferred that jet port is linear slit.
In foreign matter removal device of the invention, it is also preferred that jet port is to be configured to linear hole column.
In foreign matter removal device of the invention, it is also preferred that the longitudinal direction length of pump orifice is longer than the longitudinal direction of jet port
Length.
In foreign matter removal device of the invention, it is also preferred that driving portion is according to the orthogonal with conveyance direction of plate-like members
Direction width and the length that sets keeps the cleaning head mobile.
The effect of invention
The present invention can be improved the cleanliness on transported plate-like members surface.
Detailed description of the invention
Fig. 1 is the perspective view for indicating the foreign matter removal device of embodiments of the present invention.
Fig. 2 is the sectional view of the cleaning head of foreign matter removal device shown in FIG. 1.
Fig. 3 be indicate foreign matter removal device shown in FIG. 1 the ontology of cleaning head and the structure of lid and lid for ontology
Assembling illustrates perspective view.
Fig. 4 is viewed from above the figure of the lower surface configured with pump orifice and slit of cleaning head shown in FIG. 1, and is table
Show the explanatory diagram of the movement of the foreign matter removal device of embodiments of the present invention.
Fig. 5 is the sectional view of the cleaning head of the foreign matter removal device of another embodiment of the present invention.
Fig. 6 is viewed from above the figure of the lower surface configured with pump orifice and spray-hole of cleaning head shown in fig. 5, and is
Indicate the explanatory diagram of the movement of the foreign matter removal device of another embodiment of the present invention.
Fig. 7 is the sectional view of the cleaning head of the foreign matter removal device of another embodiment of the present invention.
Specific embodiment
Hereinafter, foreign matter removal device 100 of the one side referring to attached drawing one in face of embodiments of the present invention is illustrated.Such as figure
Shown in 1, foreign matter removal device 100 includes cleaning head 20 and moves cleaning head 20 on the direction orthogonal with conveyance direction
Driving portion 30.In Fig. 1, guided through guide rail 11,12 and the plate-like members i.e. conveying side of substrate 13 that transports in the horizontal direction
To for X-direction, direction for the same side with X-direction and orthogonal with X-direction is set as Y-direction, by relative to the face XY and vertical
Direction is set as Z-direction to be illustrated.
As shown in Figure 1, cleaning head 20 is in the rear surface 21b of ontology 21 to be equipped with the rectangular shape of lid 22, and upper
Portion is equipped with the air intake 25 of the compressed air of supply foreign matter removal and is connected to the suction company of vacuum plant (not shown)
Adapter tube 26.In the lower surface of cleaning head 20, equipped with to the surface of substrate 13 with jet port, that is, slit 23 of band-like injection air and
The pump orifice 24 of adjacent and configuration oblong-shaped with slit 23.In addition, in the following description, the face of the longitudinal direction of ontology 21
And the side with pump orifice 24 is the front surface 21a of ontology 21, and the direction vertical with the front surface 21a of ontology 21 is set as P
Direction will be set as the direction Q with the direction P horizontal direction at right angle, by relative to the face PQ and the direction of vertical be set as Z-direction come into
Row explanation.The direction Q is direction parallel with the surface of ontology 21 when overlooking.In addition, the forward surface of front surface 21a is set as rear table
The face of short side direction is set as side to be illustrated by face 21b.
As shown in Figure 1, one of side of cleaning head 20 is connected to arm 28 via the connecting elements 27 of wedge shape.It utilizes
Driving portion 30 moves back and forth arm 28 in the Y direction.As shown in Fig. 2, substrate 13 surface and cleaning head 20 lower surface it
Between be spaced apart and have gap d, the lower surface of cleaning head 20 is moved in the upside of substrate 13 along the surface of substrate 13.As shown in Figure 1,
Connecting elements 27 has the inclination of angle, θ 1, the side of the cleaning head 20 of cuboid is fixed in a wherein face, in opposite side
Face be fixed with along Y-direction extend arm 28 face.Therefore, as shown in Figure 1, the front surface 21a of cleaning head 20 from Y-direction towards with
The opposite direction tilt angle theta 1 of conveyance direction.Herein, angle, θ 1 for example may be either 10 degree~15 degree or so, can also for 15 degree~
45 degree or so.Specifically 10 degree of angle, θ 1,11 degree, 12 degree, 13 degree, 14 degree, 15 degree can also be any two in these numerical value
Between range.In turn, the range of specifically 15 to 45 positive integer of angle, θ 1, can also for any two in these numerical value it
Between in the range of.
Next, one side faces the foreign matter removal device 100 of present embodiment referring to Fig. 2, Fig. 3 (a), Fig. 3 (b), one
The structure of cleaning head 20 is illustrated.As shown in Fig. 2, Fig. 3 (a), Fig. 3 (b), cleaning head 20 includes ontology 21 and is fixed on this
The lid 22 of the rear surface 21b of body 21.
As shown in Fig. 3 (a), rectangular pump orifice 24 has been excavated in the lower surface of ontology 21.In addition, after ontology 21
Surface 21b is formed with the recess portion 29a for constituting the injection headstock 29 that will be discussed below.The downside of recess portion 29a becomes towards pump orifice
24 inclined inclined surface 29b.
As shown in Fig. 3 (b), lid 22 has the convex of the planar portions other than the recess portion 29a for the rear surface 21b for being close contact in ontology 21
The edge 22a and wedge-shaped rake 22b parallel with the inclined surface 29b of ontology 21.As shown in Fig. 3 (b), if by the inclination of lid 22
Portion 22b alignment ontology inclined surface 29b simultaneously flange 22a is fixed at rear surface 21b, then as shown in Fig. 2, ontology 21 recess portion
The injection headstock 29 linearly extended along the direction Q is formed between 29a and the flange 22a of lid 22.In addition, in the inclination of ontology 21
The surface to substrate 13 is formed between face 29b and the rake 22b of lid 22 with the jet port i.e. slit 23 of band-like injection air.Such as
Shown in Fig. 2, slit 23 relative to substrate 13 surface and tilt angle theta 2.In addition, as shown in figure 4, the direction Q of pump orifice 24
Length is longer than the length in the direction Q of slit 23, and extends to compared with slit 23 more near the two sides of cleaning head 20.In addition,
Fig. 4 is viewed from above the figure of the lower surface configured with pump orifice 24 and slit 23 of cleaning head 20.
The movement of the foreign matter removal device 100 referring to Fig. 2, Fig. 4 mono- in face of constituting like that above is illustrated on one side.From figure
The compressed air that air intake 25 shown in 2 flows into enters in injection headstock 29, passes through slit 23 towards pumping from injection headstock 29
The direction of suction inlet 24, inclined downward to the surface of substrate 13 with band-like ejection.
The air that surface from slit 23 towards substrate 13 is sprayed inclined downward, as shown in the arrow 91 of Fig. 4, towards from narrow
Seam 23 is to before the inclined direction P in direction opposite with the conveyance direction and then surface of bumped substrate 13.In addition, substrate will be attached to
The foreign matter on 13 surface blows winged towards the direction P.Blow the rectangular pump orifice 24 that winged foreign matter is adjacent to the P direction side of slit 23
It sucks and is expelled in vacuum plant (not shown).When driving portion 30 keeps cleaning head 20 past in the Y direction with the width of substrate 13
When returning mobile, the foreign matter of the region B for the substrate shown in Fig. 4 13 that cleaning head 20 is passed through is removed.In addition, area shown in Fig. 4
The region A in the conveyance direction downstream side of domain B is that the foreign matter on the surface of substrate 13 removes the region terminated, the conveying side of region B
Region C to the upstream side is the region for not carrying out the foreign matter removal on the surface of substrate 13.
When carry out substrate 13 region B foreign matter removal when, from slit 23 spray air to from Y-direction towards and conveying side
The inclined direction P blowout in the opposite direction.That is, the direction of the region C removed from region B to the foreign matter for not carrying out substrate 13 is blown
Air out.Therefore, the air that foreign matter will not be sprayed blows winged to the direction of region A that foreign matter removal has terminated, and is able to suppress different
Object is attached to the surface of the substrate 13 for the region A that foreign matter removal has terminated again, so as to improve the cleanliness of substrate 13.
In addition, as shown in figure 4, the length in the direction Q of pump orifice 24 is longer than the length in the direction Q of slit 23, and extend to
Compared with slit 23 more near the two sides of cleaning head 20.Therefore, even if in foreign matter by from the air that slit 23 sprays to from the side Y
To when blowing winged towards the inclined direction of X-direction, also it can reliably aspirate using pump orifice 24 and blow winged foreign matter.Therefore, can
Foreign matter is inhibited to be attached to the surface of the substrate 13 for the region A that foreign matter removal has terminated again, so as to improve the cleaning of substrate 13
Degree.
In turn, when air is blown out from slit 23, air by the air of 22 side of lid of cleaning head 20 be involved in and to pump orifice
24 direction flowing.Therefore, the surface for the region A that the foreign matter removal for being located at the range for being adjacent to region B can have been terminated
Air is sucked to pump orifice 24, and foreign matter is inhibited to disperse from region B to region A.Thereby, it is possible to further suppress foreign matter to be attached to again
The surface of the substrate 13 for the region A that foreign matter removal has terminated, so as to improve the cleanliness of substrate 13.
In addition, the round-trip of the Y-direction of cleaning head 20 can both carry out simultaneously with the conveying of substrate 13, can also stop for the time being
The conveying of substrate 13 and the round-trip for carrying out cleaning head 20.In addition, can also be incited somebody to action when the width of the Y-direction of substrate 13 changes
The length of the round-trip of the Y-direction of cleaning head 20 is set as the length set according to the width of the Y-direction of substrate 13.As a result,
The foreign matter removal device 100 of present embodiment only changes the length of the round-trip of the Y-direction of cleaning head 20, is just able to carry out
The foreign matter of the substrate 13 of the width of multiple Y-directions removes.
Then, it is illustrated on one side referring to Fig. 5, Fig. 6 mono- in face of another embodiment of the present invention.To with above in reference to
The identical part in part illustrated by FIG. 1 to FIG. 4 marks the same symbol, and omits the description.As shown in Figure 5, Figure 6, this embodiment party
The slit 230 of the cleaning head 20 of foreign matter removal device 100 described above is configured to configure by the foreign matter removal device 20 of formula
Be in line shape spray-hole 42 column.
It is dug as shown in figure 5, the ontology 121 of the cleaning head 120 of the foreign matter removal device 200 of present embodiment has from downside
The pump orifice 24 opened and the injection headstock 41 excavated from upside.Suction connecting tube 26 is installed on the top of pump orifice 24, is being sprayed
The top for penetrating headstock 41 is equipped with air intake 25.In the part adjacent with pump orifice 24 of the lower surface of ontology 121, it is provided with and passes through
It wears to the spray-hole 42 of injection headstock 41.Spray-hole 42 is tilted in a manner of becoming θ 2 relative to the angle on the surface of substrate 13
Ground opens up.As shown in figure 4, spray-hole 42 constitutes the hole column for being adjacent to pump orifice 24 and forming a line on the direction Q.
The compressed air flowed into from air intake 25 shown in fig. 5 enters in injection headstock 41, passes through from injection headstock 41
Multiple spray-holes 42 are towards the direction of pump orifice 24, inclined downward to the surface of substrate 13 with band-like ejection.
The air sprayed inclined downward from spray-hole 42 to the surface of substrate 13, as shown in the arrow 92 of Fig. 6, towards from spray
Perforation 42 is to before the inclined direction P in direction opposite with the conveyance direction and then surface of bumped substrate 13.In addition, base will be attached to
The foreign matter on the surface of plate 13 blows winged towards the direction P.Blow the rectangular suction that winged foreign matter is adjacent to the P direction side of spray-hole 42
Mouth 24 is sucked and is expelled in vacuum plant (not shown).When driving portion 30 make cleaning head 20 with the width of substrate 13 in the Y direction
When upper round-trip, the foreign matter of the region B for the substrate shown in fig. 6 13 that cleaning head 20 is passed through is removed.In addition, shown in Fig. 6
The region A in conveyance direction downstream side of region B be that the foreign matter on surface of substrate 13 removes the region that has terminated, region B's removes
Sending the region C of direction upstream side is the region for not carrying out the foreign matter removal on the surface of substrate 13.
When carrying out the foreign matter removal on the surface of substrate 13 of region B, from the air that spray-hole 42 sprays to from Y-direction court
The inclined direction the P blowout in the direction opposite with conveyance direction.That is, the region C removed from region B to the foreign matter for not carrying out substrate 13
Direction blow out air.Therefore, the air that foreign matter will not be sprayed blows winged, energy to the direction for the region A that foreign matter removal has terminated
Foreign matter is inhibited to be attached to the surface of the substrate 13 for the region A that foreign matter removal has terminated again, enough so as to improve the clean of substrate 13
Cleanliness.
In addition, as shown in fig. 6, the length in the direction Q of pump orifice 24 be longer than spray-hole 42 hole column the direction Q length,
And it extends to compared with spray-hole 42 more near the two sides of cleaning head 120.Therefore, even if being sprayed in foreign matter from spray-hole 42
Air to when blowing winged towards the inclined direction of X-direction from Y-direction, also can reliably be aspirated using pump orifice 24 blow it is winged different
Object.Thereby, it is possible to inhibit foreign matter to be attached to the surface that foreign matter removes the substrate 13 of the region A terminated again, so as to improve
The cleanliness of substrate 13.
In turn, when air is blown out from spray-hole 42, air the air of the side rear surface 121b of cleaning head 120 is involved in and
It is flowed to the direction of pump orifice 24.Therefore, the foreign matter for being located at the range for being adjacent to region B can be removed the region A terminated
Surface air to pump orifice 24 suck, inhibit foreign matter disperse from region B to region A.Thereby, it is possible to further suppress foreign matter
It is attached to the surface of the substrate 13 for the region A that foreign matter removal has terminated, again so as to improve the cleanliness of substrate 13.
Next, one side is illustrated referring to Fig. 7 mono- in face of another embodiment of the present invention.Firstly, to referring to Fig.1
The identical part in part illustrated by~Fig. 6 marks the same symbol, and omits the description.As shown in fig. 7, the foreign matter of present embodiment
The spray-hole 42 of the cleaning head 120 of foreign matter removal device 200 explained above is configured to the spray-hole of vertical by removal device 300
43 column.
The foreign matter removal device 300 of present embodiment is also same as foreign matter removal device 200 disclosed above, from injection
The inclined direction the P blowout in the opposite direction of the air Xiang Chaoyu conveyance direction that hole 43 sprays.That is, from region B to not carrying out substrate
The direction blow out air of the region C of 13 foreign matter removal.Therefore, the air that foreign matter will not be sprayed has terminated to foreign matter removal
The direction of region A is blown winged, is able to suppress the surface that foreign matter is attached to the substrate 13 of region A that foreign matter removal has terminated again, thus
It can be improved the cleanliness of substrate 13.In addition, the length in the direction Q of pump orifice 24 is longer than the direction Q of the hole column of spray-hole 43
Length, and extend to compared with spray-hole 43 more near the two sides of cleaning head 120.Therefore, even if in foreign matter by from spray-hole
43 air sprayed also can reliably be aspirated and be blown using pump orifice 24 to when blowing winged towards the inclined direction of X-direction from Y-direction
Winged foreign matter.Thereby, it is possible to inhibit foreign matter to be attached to the surface that foreign matter removes the substrate 13 of the region A terminated again, so as to
Enough improve the cleanliness of substrate 13.
In each embodiment described above, substrate 13 is set as the example of transported plate-like members and is said
It is bright, but the foreign matter removal device 100,200,300 of present embodiment for example also can be in conveying semiconductor wafer or on substrate
It is applied whens being bonded to the lead frame etc. of semiconductor bare chip.In addition, the foreign matter removal device 100,200,300 of each embodiment is for example
The inside of the electronic component mounting equipments such as bare die engagement device, lead wire connecting apparatus, flip-chip mounting device can also be set into.
In turn, the foreign matter removal device 100,200,300 of present embodiment is such as also can be used in conveying glass, tabular structure film
The case where foreign matter on its surface is removed when part.
The explanation of symbol
11,12: guide rail
13: substrate
20,120: cleaning head
21,121: ontology
21a, 121a: front surface
21b, 121b: rear surface
22: lid
22a: flange
22b: rake
23: slit
24: pump orifice
25: air intake
26: suction connecting tube
27: connecting elements
28: arm
29,41: injection headstock
29a: recess portion
29b: inclined surface
30: driving portion
42,43: spray-hole
91,92: arrow
100,200,300: foreign matter removal device
A~C: region
Claims (9)
1. a kind of foreign matter removal device, comprising: the cleaning head of rectangular-shape, comprising to the plate-like members transported in the horizontal direction
Surface with the jet port of band-like injection air and be adjacent to the jet port and the pump orifice of oblong-shaped that configures；And
Driving portion moves the cleaning head on the direction orthogonal with conveyance direction along the surface of the plate-like members；
The foreign matter removal device removes the foreign matter on the surface of the plate-like members, and
The pumping slot side end face of the longitudinal direction of the cleaning head is opposite with conveyance direction from the direction court orthogonal with conveyance direction
Direction inclination.
2. foreign matter removal device according to claim 1, wherein
The jet port relative to the plate-like members surface and tilt, and make air to the direction towards the pump orifice
It sprays.
3. foreign matter removal device according to claim 1 or 2, wherein
The jet port is linear slit.
4. foreign matter removal device according to claim 1 or 2, wherein
The jet port is to be configured to linear hole column.
5. foreign matter removal device according to claim 1, wherein
The longitudinal direction length of the pump orifice is longer than the longitudinal direction length of the jet port.
6. foreign matter removal device according to claim 2, wherein
The longitudinal direction length of the pump orifice is longer than the longitudinal direction length of the jet port.
7. foreign matter removal device according to claim 3, wherein
The longitudinal direction length of the pump orifice is longer than the longitudinal direction length of the jet port.
8. foreign matter removal device according to claim 4, wherein
The longitudinal direction length of the pump orifice is longer than the longitudinal direction length of the jet port.
9. foreign matter removal device according to claim 1, wherein
The driving portion is the length set with the width according to the direction orthogonal with conveyance direction of the plate-like members
To keep the cleaning head mobile.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016106176 | 2016-05-27 | ||
| JP2016-106176 | 2016-05-27 | ||
| PCT/JP2017/019706 WO2017204333A1 (en) | 2016-05-27 | 2017-05-26 | Foreign matter removal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109478508A true CN109478508A (en) | 2019-03-15 |
Family
ID=60412752
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780044149.1A Pending CN109478508A (en) | 2016-05-27 | 2017-05-26 | Foreign matter removal device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6653016B2 (en) |
| KR (1) | KR102205607B1 (en) |
| CN (1) | CN109478508A (en) |
| TW (1) | TWI668061B (en) |
| WO (1) | WO2017204333A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114074094A (en) * | 2020-08-18 | 2022-02-22 | 捷进科技有限公司 | Chip mounting device, cleaning head and method for manufacturing semiconductor device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7065650B2 (en) * | 2018-03-12 | 2022-05-12 | ファスフォードテクノロジ株式会社 | Manufacturing method of die bonding equipment and semiconductor equipment |
| CN113877891B (en) * | 2020-07-01 | 2022-08-19 | 帆宣系统科技股份有限公司 | Sticky adsorption type foreign matter removing device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6292642U (en) * | 1985-11-29 | 1987-06-13 | ||
| JP2003229404A (en) * | 2001-11-12 | 2003-08-15 | Tokyo Electron Ltd | Substrate processing device |
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- 2017-05-26 WO PCT/JP2017/019706 patent/WO2017204333A1/en active Application Filing
- 2017-05-26 CN CN201780044149.1A patent/CN109478508A/en active Pending
- 2017-05-26 TW TW106117601A patent/TWI668061B/en active
- 2017-05-26 KR KR1020187037468A patent/KR102205607B1/en active IP Right Grant
- 2017-05-26 JP JP2018519632A patent/JP6653016B2/en active Active
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| JPS6292642U (en) * | 1985-11-29 | 1987-06-13 | ||
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| JP2004074104A (en) * | 2002-08-22 | 2004-03-11 | Hugle Electronics Inc | Conveying and dust removing apparatus |
| CN101171092A (en) * | 2005-07-06 | 2008-04-30 | 修谷鲁电子机器股份有限公司 | Use method of conveying and dust collecting device for substrate and conveying and dust collecting device for substrate |
| JP2013078701A (en) * | 2010-02-12 | 2013-05-02 | Sharp Corp | Substrate processing apparatus |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114074094A (en) * | 2020-08-18 | 2022-02-22 | 捷进科技有限公司 | Chip mounting device, cleaning head and method for manufacturing semiconductor device |
| US20220055077A1 (en) * | 2020-08-18 | 2022-02-24 | Fasford Technology Co., Ltd. | Die Bonding Apparatus, Cleaning Head and Manufacturing Method for Semiconductor Device |
| CN114074094B (en) * | 2020-08-18 | 2024-03-08 | 捷进科技有限公司 | Chip mounting apparatus, cleaning head, and method of manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6653016B2 (en) | 2020-02-26 |
| TWI668061B (en) | 2019-08-11 |
| TW201808477A (en) | 2018-03-16 |
| KR102205607B1 (en) | 2021-01-21 |
| KR20190013903A (en) | 2019-02-11 |
| WO2017204333A1 (en) | 2017-11-30 |
| JPWO2017204333A1 (en) | 2019-02-28 |
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