CN109461673A - A kind of silicon particle assembling die and its assembly method - Google Patents
A kind of silicon particle assembling die and its assembly method Download PDFInfo
- Publication number
- CN109461673A CN109461673A CN201811200274.XA CN201811200274A CN109461673A CN 109461673 A CN109461673 A CN 109461673A CN 201811200274 A CN201811200274 A CN 201811200274A CN 109461673 A CN109461673 A CN 109461673A
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- 239000011856 silicon-based particle Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 28
- 238000003466 welding Methods 0.000 claims abstract description 46
- 238000000465 moulding Methods 0.000 claims abstract description 24
- 238000009415 formwork Methods 0.000 claims abstract description 13
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- 238000005554 pickling Methods 0.000 claims description 16
- 238000001035 drying Methods 0.000 claims description 9
- 230000014759 maintenance of location Effects 0.000 claims description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 239000013067 intermediate product Substances 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000002360 explosive Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Silicon Compounds (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention discloses a kind of silicon particle assembling dies, and including two parallel upper molds and strap set up, the strap side is equipped with formwork.The present invention passes through the setting of strap upper clamping mechanism, is convenient for anchor leg position, prevents lead from shaking, influence welding effect；By the setting of formwork, silicon particle particular manufacturing craft, and convenient disassembly are set, guarantee molding effect；The assembly method that silicon particle is assembled by the assembling die that the present invention designs, it is easy to operate, manpower is saved, ensure that the quality of product in the middle section technological process of production of silicon particle.
Description
Technical field
The invention belongs to rectifier diode field more particularly to a kind of silicon particle assembling dies and its assembly method.
Background technique
Silicon particle, a kind of semiconductor devices that AC energy is changed into direct current energy, the middle section production technology of silicon particle
Process mainly includes that three welding, pickling and molding steps need to draw chip with metal using weld tabs in the welding process
Line connection, forms ohm feeler, common weld mold, since there are gaps between metal lead wire and jack, in actual production
In, it will cause the shaking of metal lead wire, influence welding effect；In mold process, need moulding press reach certain temperature and
Pressure is put into black glue and is molded, and in the process, is molded the Forming Quality that mold used directly affects diode, commonly uses
Molding mould therefor, bad adaptability, influence be molded effect.
Summary of the invention
It is an object of the invention to overcome problem above of the existing technology, a kind of silicon particle assembling die is provided, is led to
The setting of strap upper clamping mechanism is crossed, is convenient for anchor leg position, prevents lead from shaking, influence welding effect；Pass through mould
Silicon particle particular manufacturing craft, and convenient disassembly is arranged in the setting of shell, guarantees molding effect；What the present invention designed passes through the fit drawing die
The assembly method of tool assembly silicon particle, it is easy to operate, manpower is saved, ensure that product in the middle section technological process of production of silicon particle
Quality.
To realize above-mentioned technical purpose and the technique effect, the invention is realized by the following technical scheme:
A kind of silicon particle assembling die, including two parallel upper molds and strap set up, the strap
Side is equipped with formwork；
The upper mold top surface is evenly equipped with putting hole, and lead is movably installed in the putting hole, and the lead top surface is living
It is dynamic that tray is installed, welding piece and chip, the welding piece bottom surface and lead activity are sequentially installed in the tray
Connection, the welding piece top surface is connect with chip activity；
The strap includes two parallel upper clamp plates and lower clamp plate set up, between the upper clamp plate and lower clamp plate
Mobile cavity is formed, clamp system is slidably fitted in the mobile cavity, the top of the plywood is evenly equipped with to match with lead
The first connecting hole closed, the lower clamp plate top surface are evenly equipped with the second connecting hole, and first connecting hole and the second connecting hole are coaxial
The heart, and the diameter of the diameter of the first connecting hole and the second connecting hole is identical；
The clamp system includes center connecting plate and the rotating device for being evenly arranged on center connecting plate both ends, the rotation
Device includes rotate gear, and the center connecting plate is evenly equipped with the connection being meshed with rotate gear close to one end of rotating device
Tooth, rotate gear top surface center are provided with third connecting hole, and the third connecting hole and the second connecting hole are concentric, and third
The radius of connecting hole is greater than the radius of the second connecting hole, and the third connection internal surface of hole is rotatably equipped with retention mechanism, described
Retention mechanism is uniformly distributed as center annular array using the center of circle of third connecting hole, the retention mechanism include oval fastener and
It is movably arranged on the positioning bar at oval fastener both ends, the ellipse fastener connects the one of internal surface of hole far from third
End is fixedly installed with arc block plate, and the positioning bar is fixedly connected with lower clamp plate；
The formwork includes top cover and the connection cover that is movably arranged on inside top cover, and the connection hd top face is fixedly mounted
There is closing shell, the closing shell includes connection cylinder and block arc, the block arc are with the center of circle for connecting cylinder
Center annular array is uniformly distributed, the connection cylinder bottom surface with connect hd top face and block arc is surrounded and to be formed and chip matching
The filler chamber of conjunction.
Further, there are two the arc mounting grooves symmetrically set up for the putting hole top edge fixed installation.
Further, the upper clamp plate lateral edge is provided with link slot, and only trading halt is slidably fitted in the link slot；
The center connecting plate top edge is provided with the jack matched with only trading halt；
The center connecting plate right side is fixedly installed with pulling buckle.
Further, the rotate gear bottom surface is provided with rotation circular groove, is rotatably equipped with rotation in the rotation circular groove
Plate, the rotor plate bottom surface are fixedly connected with lower clamp plate；
Further, a kind of assembly method of silicon particle is assembled using the assembling die, which includes following step
It is rapid:
Step 1: by the lead upper ends to the putting hole, the lead lower end is placed to the third and is connected
At the center of hole, the pulling buckle is pulled, makes the arc block plate close to the lead, so that the position of the lead be consolidated
It is fixed；
Step 2: the tray being sequentially placed into the lead top surface, that is, completes molding, pipe must be molded；
Step 3: the molding pipe being put into soldering furnace and carries out initial weld, setting welding protective gas is nitrogen, setting
Initial weld temperature is 280 DEG C, and the initial weld time is 3min, after the completion of initial weld, carries out middle section welding, setting middle section is welded
Jointing temp is 320 DEG C, and middle section weld interval is that 5min carries out latter end welding after the completion of the welding of middle section, and latter end welding temperature is arranged
It is 260 DEG C, latter end weld interval is that 5min is managed after must welding after the completion of latter end welding；
Step 4: pipe after the welding being put into pickling machine and carries out pickling, after the completion of pickling, is managed after obtaining pickling；
Step 5: pipe after the pickling being put into baking oven and is dried, is managed after must drying；
Step 6: pipe after the drying being put into the formwork, pipe upper end is put into the filler chamber after drying, is placed
After the completion, the connection cover is pressed into the top cover, obtains intermediate products, the intermediate products is put on moulding press and carry out mould
Pressure, obtains molding silicon particle；
Step 7: the molding silicon particle being put into baking oven and is dried to get silicon particle.
The beneficial effects of the present invention are:
1, the present invention is by setting upper mold, convenient for placing lead, by the setting of tray, convenient for place welding piece and
Chip is pulled pulling buckle, drives rotation by the setting of strap upper clamping mechanism when in lead insertion third connecting hole
Gear rotation, to drive the movement of oval fastener, to make arc block plate close to lead, lead is clamped, thus will
The position of lead is fixed.
2, the present invention assembles the assembly method of silicon particle by designing the assembling die, due to being provided with strap, makes
In the welding process, the position of lead is kept fixed, and is not shaken, also, due to being provided with formwork, the lead after making welding
It is fixed with chip position, guarantees the molding effect in mold process, be arranged by both, keep the assembly method easy to operate,
Manpower is saved, ensure that the quality of product in the middle section technological process of production of silicon particle.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes part of this application, this hair
Bright illustrative embodiments and their description are used to explain the present invention, and are not constituted improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the structural schematic diagram of silicon particle assembling die of the present invention；
Fig. 2 is the partial structurtes explosive view of silicon particle assembling die of the present invention；
Fig. 3 is the partial structurtes explosive view of silicon particle assembling die of the present invention；
Fig. 4 is the partial structural diagram of silicon particle assembling die of the present invention；
Fig. 5 is the partial structurtes explosive view of silicon particle assembling die of the present invention；
Fig. 6 is the partial structural diagram of silicon particle assembling die of the present invention；
Fig. 7 is the partial structural diagram of silicon particle assembling die of the present invention；
Fig. 8 is the local structure top view of silicon particle assembling die of the present invention；
Fig. 9 is the partial structurtes explosive view of silicon particle assembling die of the present invention；
Figure 10 is the partial structural diagram of silicon particle assembling die of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " aperture ", "upper", "lower", " thickness ", "top", " in ",
Indicating positions or the positional relationship such as " length ", "inner", " surrounding ", are merely for convenience of description of the present invention and simplification of the description, without
It is that the component of indication or suggestion meaning or element must have a particular orientation, is constructed and operated in a specific orientation, therefore not
It can be interpreted as limitation of the present invention.
Embodiment one:
A kind of silicon particle assembling die as shown in Figure 1, including two parallel upper molds 1 and strap 2 set up,
2 side of strap is equipped with formwork 3.
As shown in Figure 2 to Figure 3,1 top surface of upper mold is evenly equipped with putting hole 11, and lead 12 is movably installed in putting hole 11,
12 top surface of lead is movably installed with tray 13, and welding piece 131 and chip 132, welding piece 131 are sequentially installed in tray 13
Bottom surface is flexibly connected with lead 12, and 131 top surface of welding piece is flexibly connected with chip 132；
There are two the arc mounting grooves 111 symmetrically set up for the fixed installation of 11 top edge of putting hole.
As shown in Figures 4 to 7, strap 2 includes two parallel upper clamp plates 21 and lower clamp plate 22 set up, upper clamp plate
Mobile cavity 23 is formed between 21 and lower clamp plate 22, is slidably fitted with clamp system 24,21 top surface of upper clamp plate in mobile cavity 23
It is evenly equipped with the first connecting hole 211 matched with lead 12,22 top surface of lower clamp plate is evenly equipped with the second connecting hole 221, the first connection
Hole 211 and the second connecting hole 221 are concentric, and the diameter of the diameter of the first connecting hole 211 and the second connecting hole 221 is identical；
21 lateral edge of upper clamp plate is provided with link slot 211, and only trading halt 212, center connection are slidably fitted in link slot 211
241 top edge of plate is provided with the jack 2412 matched with only trading halt 212, and 241 right side of center connecting plate is fixedly installed with drawing
Button 2413；
Clamp system 24 includes center connecting plate 241 and is evenly arranged on the rotating device 242 at 241 both ends of center connecting plate,
Rotating device 242 includes rotate gear 2421, and center connecting plate 241 is evenly equipped with close to one end of rotating device 242 and turning gear
The tooth connection 2411 that wheel 2421 is meshed, 2421 top surface center of rotate gear is provided with third connecting hole 2422, third connecting hole
2422 and second connecting hole 221 it is concentric, and the radius of third connecting hole 2422 be greater than the second connecting hole 221 radius, third
2422 inner surface of connecting hole is rotatably equipped with retention mechanism 2423, during retention mechanism 2423 with the center of circle of third connecting hole 2422 is
Heart annular array is uniformly distributed, and retention mechanism 2423 includes oval fastener 2424 and is movably arranged on oval fastener 2424
The positioning bar 2425 at both ends, oval fastener 2424 are fixedly installed with arc far from one end of 2422 inner surface of third connecting hole
Shape baffle 2426, positioning bar 2425 are fixedly connected with lower clamp plate 22.
As shown in figure 8,2421 bottom surface of rotate gear is provided with rotation circular groove 2427, rotates and be rotatably equipped in circular groove 2427
Rotor plate 2428,2428 bottom surface of rotor plate are fixedly connected with lower clamp plate 22.
As shown in Fig. 9 to Figure 10, formwork 3 includes top cover 31 and the connection cover 32 being movably arranged on inside top cover 31, even
It connects 32 top surface of lid and is fixedly installed with closing shell 33, closing shell 33 includes connection cylinder 331 and block arc 332, arc gear
Block 332 is uniformly distributed as center annular array to connect the center of circle of cylinder 331, connection 331 bottom surface of cylinder and 32 top surface of connection cover with
And block arc 332 surrounds the filler chamber 34 for being formed and being matched with chip 132.
In the present embodiment, by the way that upper mold 1 is arranged, convenient for placing lead 12, by the setting of tray 13, convenient for putting
Welding piece 131 and chip 132 are set, by the setting of 2 upper clamping mechanism of strap, when lead 12 is inserted into third connecting hole 2422
When interior, pulling buckle 2413 is pulled, drives rotate gear 2421 to rotate, so that the movement of oval fastener 2424 is driven, to make
Arc block plate 2426 clamps lead 12 close to lead 12, so that the position of lead 12 is fixed.
Embodiment two:
The present invention provides the assembly methods for using the assembling die to assemble a kind of silicon particle, it is characterised in that: the assembly
Method the following steps are included:
Step 1: by lead 12 upper ends to putting hole 11,12 lower end of lead is placed to 2422 center of third connecting hole
Place pulls pulling buckle 2413, makes arc block plate 2426 close to lead 12, so that the position of lead 12 is fixed；
Step 2: tray 13 being sequentially placed into 12 top surface of lead, that is, completes molding, pipe must be molded；
Step 3: molding pipe being put into soldering furnace and carries out initial weld, setting welding protective gas is nitrogen, and setting is initial
Welding temperature is 280 DEG C, and the initial weld time is 3min, after the completion of initial weld, carries out middle section welding, temperature is welded in setting middle section
Degree is 320 DEG C, and middle section weld interval is 5min, after the completion of the welding of middle section, carries out latter end welding, setting latter end welding temperature is
260 DEG C, latter end weld interval is that 5min is managed after must welding after the completion of latter end welding；
Step 4: pipe after welding being put into pickling machine and carries out pickling, after the completion of pickling, is managed after obtaining pickling；
Step 5: pipe after pickling being put into baking oven and is dried, is managed after must drying；
Step 6: pipe after drying being put into formwork 3, pipe upper end is put into filler chamber 34 after drying, will after the completion of placement
Connection cover 32 is pressed into top cover 31, obtains intermediate products, intermediate products are put on moulding press and are molded, obtain molding silicon particle；
Step 7: molding silicon particle being put into baking oven and is dried to get silicon particle.
The electric elements occurred in this article are electrically connected with 220V alternating current, soldering furnace model YH8600 diode fast welding
Connect furnace, the full-automatic moulding press of moulding press model SMD.
In the present embodiment, the assembly method that silicon particle is assembled by designing the assembling die, due to being provided with fixing clamp
Plate 2 makes in the welding process, and the position of lead 12 is kept fixed, and does not shake, also, due to being provided with formwork 3, makes to weld
Lead 12 and 132 position of chip after connecing are fixed, and guarantee the molding effect in mold process, are arranged by both, are made the dress
Method of completing the square is easy to operate, saves manpower, ensure that the quality of product in the middle section technological process of production of silicon particle.
In the description of this specification, the description of reference term " one embodiment ", " example ", " specific example " etc. means
Particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one implementation of the invention
In example or example.In the present specification, schematic expression of the above terms may not refer to the same embodiment or example.
Moreover, particular features, structures, materials, or characteristics described can be in any one or more of the embodiments or examples to close
Suitable mode combines.
The basic principles, main features and advantages of the present invention have been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.
Claims (5)
1. a kind of silicon particle assembling die, it is characterised in that: including two parallel upper molds (1) and strap set up
(2), strap (2) side is equipped with formwork (3)；
Upper mold (1) top surface is evenly equipped with putting hole (11), is movably installed with lead (12) in the putting hole (11), described
Lead (12) top surface is movably installed with tray (13), is sequentially installed with welding piece (131) and chip in the tray (13)
(132), welding piece (131) bottom surface is flexibly connected with lead (12), welding piece (131) top surface and chip (132)
It is flexibly connected；
The strap (2) includes two parallel upper clamp plates (21) and lower clamp plate (22) set up, the upper clamp plate (21)
It is formed between lower clamp plate (22) mobile cavity (23), is slidably fitted with clamp system (24), institute in the mobile cavity (23)
It states upper clamp plate (21) top surface and is evenly equipped with the first connecting hole (211) matched with lead (12), lower clamp plate (22) top surface is equal
It is furnished with the second connecting hole (221), first connecting hole (211) and the second connecting hole (221) are concentric, and the first connecting hole
(211) diameter of diameter and the second connecting hole (221) is identical；
The clamp system (24) includes center connecting plate (241) and the rotation dress for being evenly arranged on center connecting plate (241) both ends
It sets (242), the rotating device (242) includes rotate gear (2421), and the center connecting plate (241) is close to rotating device
(242) one end is evenly equipped with the tooth connection (2411) being meshed with rotate gear (2421), rotate gear (2421) top surface
Center is provided with third connecting hole (2422), and the third connecting hole (2422) and the second connecting hole (221) are concentric, and third connects
The radius for connecing hole (2422) is greater than the radius of the second connecting hole (221), third connecting hole (2422) the inner surface rotational installation
Have retention mechanism (2423), the retention mechanism (2423) is equal as center annular array using the center of circle of third connecting hole (2422)
Cloth, the retention mechanism (2423) include oval fastener (2424) and are movably arranged on oval fastener (2424) two
The positioning bar (2425) at end, the ellipse fastener (2424) are fixed far from one end of third connecting hole (2422) inner surface
It is equipped with arc block plate (2426), the positioning bar (2425) is fixedly connected with lower clamp plate (22)；
The formwork (3) includes top cover (31) and the connection cover (32) for being movably arranged on top cover (31) inside, the connection cover
(32) top surface is fixedly installed with closing shell (33), and the closing shell (33) includes connection cylinder (331) and block arc
(332), the block arc (332) is evenly distributed with using the center of circle for connecting cylinder (331) as center annular array, the connection cylinder
(331) bottom surface surrounds the filler chamber for being formed and being matched with chip (132) with connection cover (32) top surface and block arc (332)
(34)。
2. a kind of silicon particle assembling die according to claim 1, it is characterised in that: putting hole (11) top edge
The arc mounting groove (111) symmetrically set up there are two being fixedly mounted.
3. a kind of silicon particle assembling die according to claim 1, it is characterised in that: upper clamp plate (21) lateral edge
It is provided with link slot (211), is slidably fitted with only trading halt (212) in the link slot (211)；
Center connecting plate (241) top edge is provided with the jack (2412) matched with only trading halt (212)；
Center connecting plate (241) right side is fixedly installed with pulling buckle (2413).
4. a kind of silicon particle assembling die according to claim 1, it is characterised in that: rotate gear (2421) bottom
Face is provided with rotation circular groove (2427), is rotatably equipped with rotor plate (2428), the rotor plate in the rotation circular groove (2427)
(2428) bottom surface is fixedly connected with lower clamp plate (22).
5. a kind of assembly method of silicon particle, it is characterised in that: the assembly method the following steps are included:
Step 1: by the lead (12) upper ends to the putting hole (11), lead (12) lower end is placed to described
At third connecting hole (2422) center, the pulling buckle (2413) are pulled, make the arc block plate (2426) close to the lead
(12), so that the position of the lead (12) is fixed；
Step 2: the tray (13) being sequentially placed into the lead (12) top surface, that is, completes molding, pipe must be molded；
Step 3: the molding pipe being put into soldering furnace and carries out initial weld, setting welding protective gas is nitrogen, and setting is initial
Welding temperature is 280 DEG C, and the initial weld time is 3min, after the completion of initial weld, carries out middle section welding, temperature is welded in setting middle section
Degree is 320 DEG C, and middle section weld interval is 5min, after the completion of the welding of middle section, carries out latter end welding, setting latter end welding temperature is
260 DEG C, latter end weld interval is that 5min is managed after must welding after the completion of latter end welding；
Step 4: pipe after the welding being put into pickling machine and carries out pickling, after the completion of pickling, is managed after obtaining pickling；
Step 5: pipe after the pickling being put into baking oven and is dried, is managed after must drying；
Step 6: pipe after the drying being put into the formwork (3), pipe upper end is put into the filler chamber (34) after drying, is put
After the completion of setting, the connection cover (32) are pressed into the top cover (31), intermediate products is obtained, the intermediate products is put into molding
It is molded on machine, obtains molding silicon particle；
Step 7: the molding silicon particle being put into baking oven and is dried to get silicon particle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811200274.XA CN109461673B (en) | 2018-10-16 | 2018-10-16 | Silicon particle assembling die and assembling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811200274.XA CN109461673B (en) | 2018-10-16 | 2018-10-16 | Silicon particle assembling die and assembling method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109461673A true CN109461673A (en) | 2019-03-12 |
| CN109461673B CN109461673B (en) | 2021-09-14 |
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ID=65607614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811200274.XA Active CN109461673B (en) | 2018-10-16 | 2018-10-16 | Silicon particle assembling die and assembling method thereof |
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| Country | Link |
|---|---|
| CN (1) | CN109461673B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5323272A (en) * | 1976-08-16 | 1978-03-03 | Hitachi Ltd | Semiconductor device |
| CN201744807U (en) * | 2010-08-13 | 2011-02-16 | 常州银河电器有限公司 | Die-closing assisting device |
| CN102446803A (en) * | 2011-09-29 | 2012-05-09 | 北京时代民芯科技有限公司 | Wire bonding clamp |
| US20130119526A1 (en) * | 2011-09-21 | 2013-05-16 | Kabushiki Kaisha Toshiba | Lead frame, semiconductor manufacturing apparatus, and semiconductor device |
| CN104241122A (en) * | 2014-09-29 | 2014-12-24 | 广安市嘉乐电子科技有限公司 | Production method for sheet silicon-particle rectifier diodes |
-
2018
- 2018-10-16 CN CN201811200274.XA patent/CN109461673B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5323272A (en) * | 1976-08-16 | 1978-03-03 | Hitachi Ltd | Semiconductor device |
| CN201744807U (en) * | 2010-08-13 | 2011-02-16 | 常州银河电器有限公司 | Die-closing assisting device |
| US20130119526A1 (en) * | 2011-09-21 | 2013-05-16 | Kabushiki Kaisha Toshiba | Lead frame, semiconductor manufacturing apparatus, and semiconductor device |
| CN102446803A (en) * | 2011-09-29 | 2012-05-09 | 北京时代民芯科技有限公司 | Wire bonding clamp |
| CN104241122A (en) * | 2014-09-29 | 2014-12-24 | 广安市嘉乐电子科技有限公司 | Production method for sheet silicon-particle rectifier diodes |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109461673B (en) | 2021-09-14 |
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Denomination of invention: A silicon particle assembly mold and its assembly method Granted publication date: 20210914 Pledgee: Bank of China Limited Huangshan Branch Pledgor: HUANGSHAN CITY QIMEN COUNTY JINCHENG ELECTRIC CO.,LTD. Registration number: Y2024980023489 |
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