CN109461673B - Silicon particle assembling die and assembling method thereof - Google Patents
Silicon particle assembling die and assembling method thereof Download PDFInfo
- Publication number
- CN109461673B CN109461673B CN201811200274.XA CN201811200274A CN109461673B CN 109461673 B CN109461673 B CN 109461673B CN 201811200274 A CN201811200274 A CN 201811200274A CN 109461673 B CN109461673 B CN 109461673B
- Authority
- CN
- China
- Prior art keywords
- welding
- plate
- die
- placing
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011856 silicon-based particle Substances 0.000 title claims abstract description 43
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000003466 welding Methods 0.000 claims abstract description 62
- 230000007246 mechanism Effects 0.000 claims abstract description 19
- 238000003825 pressing Methods 0.000 claims abstract description 18
- 230000000903 blocking effect Effects 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 7
- 238000005406 washing Methods 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 239000013067 intermediate product Substances 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000002184 metal Substances 0.000 description 3
- 238000005554 pickling Methods 0.000 description 3
- 238000007723 die pressing method Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Silicon Compounds (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention discloses a silicon particle assembling die which comprises an upper die and a fixed clamping plate which are arranged in parallel, wherein a die shell is arranged on the side surface of the fixed clamping plate. According to the invention, the position of the lead is convenient to fix and the lead is prevented from shaking to influence the welding effect by arranging the clamping mechanism on the fixed clamping plate; through the arrangement of the mould shell, a special mould for silicon particles is arranged, the disassembly is convenient, and the mould pressing effect is ensured; the assembling method for assembling the silicon particles through the assembling die is simple and convenient to operate, saves labor and ensures the quality of products in the middle-stage production process flow of the silicon particles.
Description
Technical Field
The invention belongs to the field of rectifier diodes, and particularly relates to a silicon particle assembling die and an assembling method thereof.
Background
A middle-section production process flow of the silicon particles mainly comprises three steps of welding, acid washing and mould pressing, wherein in the welding process, a soldering lug is required to be utilized to connect a chip and a metal lead to form an ohmic antenna, and a common welding mould can cause the metal lead to shake in actual production due to a gap between the metal lead and a jack, so that the welding effect is influenced; in the process of mould pressing, a mould pressing machine is required to reach a certain temperature and pressure, black glue is put into the mould pressing machine for mould pressing, in the process, a mould used for mould pressing directly influences the forming quality of the diode, and a common mould used for mould pressing is poor in adaptability and influences the mould pressing effect.
Disclosure of Invention
The invention aims to overcome the problems in the prior art and provides a silicon particle assembling die, which is convenient for fixing the position of a lead by arranging a clamping mechanism on a fixing clamp plate, and prevents the lead from shaking to influence the welding effect; through the arrangement of the mould shell, a special mould for silicon particles is arranged, the disassembly is convenient, and the mould pressing effect is ensured; the assembling method for assembling the silicon particles through the assembling die is simple and convenient to operate, saves labor and ensures the quality of products in the middle-stage production process flow of the silicon particles.
In order to achieve the technical purpose and achieve the technical effect, the invention is realized by the following technical scheme:
a silicon particle assembly mold comprises an upper mold and a fixed splint which are arranged in parallel, wherein a mold shell is arranged on the side surface of the fixed splint;
placing holes are uniformly distributed in the top surface of the upper die, leads are movably mounted in the placing holes, an object placing disc is movably mounted on the top surface of each lead, a welding sheet and a chip are sequentially mounted in the object placing disc, the lower bottom surface of each welding sheet is movably connected with each lead, and the top surface of each welding sheet is movably connected with each chip;
the fixed clamp plate comprises an upper clamp plate and a lower clamp plate which are arranged in parallel, a moving cavity is formed between the upper clamp plate and the lower clamp plate, a clamping mechanism is arranged in the moving cavity in a sliding mode, first connecting holes matched with leads are uniformly distributed in the top surface of the upper clamp plate, second connecting holes are uniformly distributed in the top surface of the lower clamp plate, the first connecting holes and the second connecting holes are coaxial, and the diameters of the first connecting holes and the second connecting holes are the same;
the clamping mechanism comprises a central connecting plate and rotating devices which are uniformly distributed at two ends of the central connecting plate, the rotating device comprises a rotating gear, one end of the central connecting plate close to the rotating device is uniformly provided with connecting teeth meshed with the rotating gear, the center of the top surface of the rotating gear is provided with a third connecting hole, the third connecting hole and the second connecting hole are coaxial, the radius of the third connecting hole is larger than that of the second connecting hole, a fastening mechanism is rotatably arranged on the inner surface of the third connecting hole, the fastening mechanisms are uniformly distributed in an annular array by taking the circle center of the third connecting hole as the center, each fastening mechanism comprises an elliptical fastening piece and positioning stop levers movably arranged at two ends of the elliptical fastening piece, an arc-shaped blocking piece is fixedly installed at one end, far away from the inner surface of the third connecting hole, of the oval fastener, and the positioning blocking rod is fixedly connected with the lower clamping plate;
the die shell comprises a top cover and a connecting cover movably arranged in the top cover, a closed shell is fixedly arranged on the top surface of the connecting cover and comprises a connecting cylinder body and arc-shaped stop blocks, the arc-shaped stop blocks are uniformly distributed in an annular array mode by taking the circle center of the connecting cylinder body as the center, and the lower bottom surface of the connecting cylinder body, the connecting cover top surface and the arc-shaped stop blocks are surrounded to form a filling chamber matched with a chip.
Furthermore, two arc-shaped mounting grooves which are symmetrically arranged are fixedly mounted at the edge of the top surface of the placing hole.
Furthermore, a connecting groove is formed in the edge of the side face of the upper clamping plate, and a stopping plate is slidably mounted in the connecting groove;
the edge of the top surface of the central connecting plate is provided with a jack matched with the stop plate;
and a pull buckle is fixedly arranged on the right side surface of the central connecting plate.
Furthermore, a rotary circular groove is formed in the lower bottom surface of the rotary gear, a rotary plate is rotatably mounted in the rotary circular groove, and the lower bottom surface of the rotary plate is fixedly connected with the lower clamping plate;
further, an assembling method of assembling a silicon particle using the assembling die, the assembling method comprising the steps of:
step 1: placing the upper end of the lead into the placing hole, placing the lower end of the lead into the center of the third connecting hole, and pulling the pull buckle to enable the arc-shaped blocking piece to be close to the lead so as to fix the position of the lead;
step 2: placing the object placing discs on the top surfaces of the leads in sequence to complete die assembly, so as to obtain a die assembly pipe;
and step 3: putting the die-closing pipe into a welding furnace for initial welding, setting welding protective gas as nitrogen, setting the initial welding temperature to be 280 ℃, setting the initial welding time to be 3min, after the initial welding is finished, performing middle-section welding, setting the middle-section welding temperature to be 320 ℃, setting the middle-section welding time to be 5min, after the middle-section welding is finished, performing final-section welding, setting the final-section welding temperature to be 260 ℃, setting the final-section welding time to be 5min, and after the final-section welding is finished, obtaining a welded pipe;
and 4, step 4: placing the welded pipe into an acid washing machine for acid washing to obtain an acid-washed pipe after the acid washing is finished;
and 5: putting the pickled pipe into an oven for drying to obtain a dried pipe;
step 6: placing the dried pipe into the mould shell, placing the upper end of the dried pipe into the filling chamber, pressing the connecting cover into the top cover after placing to obtain an intermediate product, and placing the intermediate product on a mould press for mould pressing to obtain formed silicon particles;
and 7: and (3) drying the formed silicon particles in an oven to obtain the silicon particles.
The invention has the beneficial effects that:
1. according to the invention, the upper die is arranged to facilitate the placement of the lead, the placement of the welding sheet and the chip is facilitated through the arrangement of the placement disc, and through the arrangement of the clamping mechanism on the fixed clamping plate, when the lead is inserted into the third connecting hole, the pull buckle is pulled to drive the rotating gear to rotate, so that the oval fastener is driven to move, the arc-shaped separation blade is close to the lead, the lead is clamped, and the position of the lead is fixed.
2. According to the assembling method for assembling the silicon particles by the assembling die, the position of the lead wire is kept fixed and does not shake in the welding process due to the arrangement of the fixing clamp plate, and the positions of the welded lead wire and the chip are fixed due to the arrangement of the die shell, so that the die pressing effect in the die pressing process is ensured.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
FIG. 1 is a schematic structural view of a silicon particle assembly mold of the present invention;
FIG. 2 is an exploded view of a partial structure of a silicon particle assembly mold of the present invention;
FIG. 3 is an exploded view of a partial structure of a silicon particle assembly mold of the present invention;
FIG. 4 is a schematic view of a partial structure of a silicon particle assembly mold according to the present invention;
FIG. 5 is an exploded view of a partial structure of a silicon particle assembly mold of the present invention;
FIG. 6 is a schematic view showing a partial structure of a silicon particle assembling mold according to the present invention;
FIG. 7 is a schematic view showing a partial structure of a silicon particle assembling mold according to the present invention;
FIG. 8 is a top view of a partial structure of a silicon particle assembly mold of the present invention;
FIG. 9 is an exploded view of a partial structure of a silicon particle assembling mold according to the present invention;
FIG. 10 is a partial structural view of a silicon particle assembling mold according to the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "opening," "upper," "lower," "thickness," "top," "middle," "length," "inner," "peripheral," and the like are used in an orientation or positional relationship that is merely for convenience in describing and simplifying the description, and do not indicate or imply that the referenced component or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be considered as limiting the present invention.
The first embodiment is as follows:
the silicon particle assembling die shown in fig. 1 comprises an upper die 1 and a fixed splint 2 which are arranged in parallel, and a die shell 3 is arranged on the side surface of the fixed splint 2.
As shown in fig. 2 to 3, the top surface of the upper mold 1 is uniformly provided with placing holes 11, leads 12 are movably mounted in the placing holes 11, an object placing plate 13 is movably mounted on the top surface of the leads 12, a welding sheet 131 and a chip 132 are sequentially mounted in the object placing plate 13, the lower bottom surface of the welding sheet 131 is movably connected with the leads 12, and the top surface of the welding sheet 131 is movably connected with the chip 132;
two arc-shaped mounting grooves 111 which are symmetrically arranged are fixedly mounted at the edge of the top surface of the placing hole 11.
As shown in fig. 4 to 7, the fixed clamp 2 includes an upper clamp 21 and a lower clamp 22 that are parallel to each other, a moving cavity 23 is formed between the upper clamp 21 and the lower clamp 22, a clamping mechanism 24 is slidably mounted in the moving cavity 23, first connection holes 211 that are matched with the leads 12 are uniformly distributed on the top surface of the upper clamp 21, second connection holes 221 are uniformly distributed on the top surface of the lower clamp 22, the first connection holes 211 and the second connection holes 221 are coaxial, and the diameter of the first connection holes 211 is the same as the diameter of the second connection holes 221;
the edge of the side surface of the upper clamping plate 21 is provided with a connecting groove 213, a stopping plate 212 is arranged in the connecting groove 213 in a sliding manner, the edge of the top surface of the central connecting plate 241 is provided with an inserting hole 2412 matched with the stopping plate 212, and the right side surface of the central connecting plate 241 is fixedly provided with a pull buckle 2413;
the clamping mechanism 24 comprises a central connecting plate 241 and rotating devices 242 evenly distributed at two ends of the central connecting plate 241, the rotating devices 242 comprise rotating gears 2421, one end of the central connecting plate 241 close to the rotating devices 242 is evenly distributed with connecting teeth 2411 engaged with the rotating gears 2421, the center of the top surface of the rotating gears 2421 is provided with a third connecting hole 2422, the third connecting hole 2422 and the second connecting hole 221 are coaxial, the radius of the third connecting hole 2422 is greater than that of the second connecting hole 221, fastening mechanisms 2423 are rotatably mounted on the inner surface of the third connecting hole 2422, the fastening mechanisms 2423 are uniformly distributed in an annular array with the circle center of the third connecting hole 2422 as the center, each fastening mechanism 2423 comprises an elliptical fastener 2424 and positioning stop levers 2425 movably mounted at two ends of the elliptical fastener 2424, an arc-shaped retaining sheet 2426 is fixedly mounted at one end of the elliptical fastener 2424, which is far away from the inner surface of the third connecting hole 2422, and the positioning stop levers 2425 are fixedly connected with the lower clamping plate 22.
As shown in fig. 8, a rotary circular groove 2427 is formed in the lower bottom surface of the rotary gear 2421, a rotary plate 2428 is rotatably mounted in the rotary circular groove 2427, and the lower bottom surface of the rotary plate 2428 is fixedly connected with the lower clamping plate 22.
As shown in fig. 9 to 10, the mold shell 3 includes a top cover 31 and a connecting cover 32 movably mounted inside the top cover 31, the top surface of the connecting cover 32 is fixedly mounted with a closed housing 33, the closed housing 33 includes a connecting column 331 and arc stoppers 332, the arc stoppers 332 are uniformly distributed in an annular array with the circle center of the connecting column 331 as the center, and the lower bottom surface of the connecting column 331, the top surface of the connecting cover 32 and the arc stoppers 332 surround to form a filling chamber 34 matched with the core plate 132.
In the embodiment, the upper mold 1 is arranged to facilitate placement of the lead 12, the placement of the bonding pad 131 and the chip 132 is facilitated by the placement of the tray 13, and by the arrangement of the clamping mechanism on the fixing clamp plate 2, when the lead 12 is inserted into the third connecting hole 2422, the pulling buckle 2413 is pulled to drive the rotating gear 2421 to rotate, so as to drive the oval fastener 2424 to move, so that the arc-shaped blocking piece 2426 is close to the lead 12, so as to clamp the lead 12, and thus fix the position of the lead 12.
Example two:
the invention provides an assembling method for assembling silicon particles by using the assembling die, which is characterized by comprising the following steps: the assembling method comprises the following steps:
step 1: placing the upper end of the lead 12 into the placing hole 11, placing the lower end of the lead 12 to the center of the third connecting hole 2422, pulling the pull buckle 2413 to enable the arc-shaped blocking sheet 2426 to be close to the lead 12, and fixing the position of the lead 12;
step 2: placing the object placing discs 13 on the top surfaces of the leads 12 in sequence to complete die assembly to obtain a die assembly pipe;
and step 3: placing the die assembly pipe into a welding furnace for initial welding, setting welding protective gas as nitrogen, setting the initial welding temperature to be 280 ℃, setting the initial welding time to be 3min, after the initial welding is finished, performing middle-section welding, setting the middle-section welding temperature to be 320 ℃, setting the middle-section welding time to be 5min, after the middle-section welding is finished, performing final-section welding, setting the final-section welding temperature to be 260 ℃, setting the final-section welding time to be 5min, and after the final-section welding is finished, obtaining a welded pipe;
and 4, step 4: placing the welded pipe into a pickling machine for pickling, and obtaining a pickled pipe after pickling;
and 5: putting the pickled pipe into an oven for drying to obtain a dried pipe;
step 6: placing the dried pipe into the mould shell 3, placing the upper end of the dried pipe into the filling chamber 34, pressing the connecting cover 32 into the top cover 31 after placing to obtain an intermediate product, and placing the intermediate product on a mould press for mould pressing to obtain formed silicon particles;
and 7: and (4) drying the formed silicon particles in an oven to obtain the silicon particles.
The electric components in the paper are all electrically connected with 220V mains supply, the model of the welding furnace is YH8600 diode rapid welding furnace, and the model of the molding press is SMD full-automatic molding press.
In this embodiment, by designing the assembly method for assembling silicon particles by using the assembly mold, the position of the lead 12 is kept fixed and does not shake during the welding process due to the arrangement of the fixing clamp plate 2, and the positions of the welded lead 12 and the chip 132 are fixed due to the arrangement of the mold shell 3, so that the mold pressing effect during the mold pressing process is ensured.
In the description herein, references to the description of "one embodiment," "an example," "a specific example" or the like are intended to mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed.
Claims (5)
1. A silicon particle assembly mold, characterized in that: comprises an upper die (1) and a fixed splint (2) which are arranged in parallel, wherein the side surface of the fixed splint (2) is provided with a mould shell (3);
placing holes (11) are uniformly distributed in the top surface of the upper die (1), a lead (12) is movably mounted in each placing hole (11), an object placing disc (13) is movably mounted on the top surface of each lead (12), a welding sheet (131) and a chip (132) are sequentially mounted in each object placing disc (13), the lower bottom surface of each welding sheet (131) is movably connected with each lead (12), and the top surface of each welding sheet (131) is movably connected with each chip (132);
the fixed clamp plate (2) comprises an upper clamp plate (21) and a lower clamp plate (22) which are arranged in parallel, a movable cavity (23) is formed between the upper clamp plate (21) and the lower clamp plate (22), a clamping mechanism (24) is arranged in the movable cavity (23) in a sliding mode, first connecting holes (211) matched with the leads (12) are uniformly distributed in the top surface of the upper clamp plate (21), second connecting holes (221) are uniformly distributed in the top surface of the lower clamp plate (22), the first connecting holes (211) and the second connecting holes (221) are coaxial, and the diameter of the first connecting holes (211) is the same as that of the second connecting holes (221);
the clamping mechanism (24) comprises a central connecting plate (241) and rotating devices (242) uniformly distributed at two ends of the central connecting plate (241), each rotating device (242) comprises a rotating gear (2421), one end, close to the rotating device (242), of the central connecting plate (241) is uniformly provided with connecting teeth (2411) meshed with the rotating gear (2421), the center of the top surface of the rotating gear (2421) is provided with a third connecting hole (2422), the third connecting hole (2422) and the second connecting hole (221) are coaxial, the radius of the third connecting hole (2422) is larger than that of the second connecting hole (221), a fastening mechanism (2423) is rotatably mounted on the inner surface of the third connecting hole (2422), the fastening mechanisms (2423) are uniformly distributed by taking the circle center of the third connecting hole (2422) as a central annular array, each fastening mechanism (2423) comprises an oval fastener (2424) and positioning stop levers (2425) movably mounted at two ends of the oval fastener (2424), one end of the oval fastener (2424) far away from the inner surface of the third connecting hole (2422) is fixedly provided with an arc-shaped blocking piece (2426), and the positioning blocking rod (2425) is fixedly connected with the lower clamping plate (22);
the die shell (3) comprises a top cover (31) and a connecting cover (32) movably mounted inside the top cover (31), wherein a closed shell (33) is fixedly mounted on the top surface of the connecting cover (32), the closed shell (33) comprises a connecting cylinder (331) and arc-shaped stoppers (332), the arc-shaped stoppers (332) are uniformly distributed in an annular array by taking the circle center of the connecting cylinder (331) as the center, and the lower bottom surface of the connecting cylinder (331), the top surface of the connecting cover (32) and the arc-shaped stoppers (332) surround to form a filling chamber (34) matched with the chip (132).
2. A silicon particle assembling die as defined in claim 1, wherein: two arc-shaped mounting grooves (111) which are symmetrically arranged are fixedly mounted on the edge of the top surface of the placing hole (11).
3. A silicon particle assembling die as defined in claim 1, wherein: the edge of the side surface of the upper clamping plate (21) is provided with a connecting groove (213), and a stopping plate (212) is arranged in the connecting groove (213) in a sliding manner;
the edge of the top surface of the central connecting plate (241) is provided with an insertion hole (2412) matched with the stop plate (212);
a pull button (2413) is fixedly arranged on the right side surface of the central connecting plate (241).
4. A silicon particle assembling die as defined in claim 1, wherein: the lower bottom surface of the rotating gear (2421) is provided with a rotating circular groove (2427), a rotating plate (2428) is rotatably mounted in the rotating circular groove (2427), and the lower bottom surface of the rotating plate (2428) is fixedly connected with the lower clamping plate (22).
5. A method for assembling silicon particles, using the silicon particle assembly mold according to claim 3, characterized in that: the assembling method comprises the following steps:
step 1: placing the upper end of the lead (12) into the placing hole (11), placing the lower end of the lead (12) to the center of the third connecting hole (2422), pulling the pull buckle (2413) to enable the arc-shaped blocking piece (2426) to be close to the lead (12), and fixing the position of the lead (12);
step 2: placing the object placing discs (13) on the top surfaces of the leads (12) in sequence to complete die assembly to obtain die assembly pipes;
and step 3: putting the die-closing pipe into a welding furnace for initial welding, setting welding protective gas as nitrogen, setting the initial welding temperature to be 280 ℃, setting the initial welding time to be 3min, after the initial welding is finished, performing middle-section welding, setting the middle-section welding temperature to be 320 ℃, setting the middle-section welding time to be 5min, after the middle-section welding is finished, performing final-section welding, setting the final-section welding temperature to be 260 ℃, setting the final-section welding time to be 5min, and after the final-section welding is finished, obtaining a welded pipe;
and 4, step 4: placing the welded pipe into an acid washing machine for acid washing to obtain an acid-washed pipe after the acid washing is finished;
and 5: putting the pickled pipe into an oven for drying to obtain a dried pipe;
step 6: putting the dried pipe into the mould shell (3), putting the upper end of the dried pipe into the filling chamber (34), pressing the connecting cover (32) into the top cover (31) after the pipe is placed, obtaining an intermediate product, and putting the intermediate product on a mould press for mould pressing to obtain formed silicon particles;
and 7: and (3) drying the formed silicon particles in an oven to obtain the silicon particles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811200274.XA CN109461673B (en) | 2018-10-16 | 2018-10-16 | Silicon particle assembling die and assembling method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811200274.XA CN109461673B (en) | 2018-10-16 | 2018-10-16 | Silicon particle assembling die and assembling method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109461673A CN109461673A (en) | 2019-03-12 |
| CN109461673B true CN109461673B (en) | 2021-09-14 |
Family
ID=65607614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811200274.XA Active CN109461673B (en) | 2018-10-16 | 2018-10-16 | Silicon particle assembling die and assembling method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109461673B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5323272A (en) * | 1976-08-16 | 1978-03-03 | Hitachi Ltd | Semiconductor device |
| CN201744807U (en) * | 2010-08-13 | 2011-02-16 | 常州银河电器有限公司 | Die-closing assisting device |
| JP5537522B2 (en) * | 2011-09-21 | 2014-07-02 | 株式会社東芝 | Lead frame, semiconductor manufacturing equipment, semiconductor equipment |
| CN102446803B (en) * | 2011-09-29 | 2014-10-15 | 北京时代民芯科技有限公司 | Wire bonding clamp |
| CN104241122B (en) * | 2014-09-29 | 2017-05-10 | 广安市嘉乐电子科技有限公司 | Production method for sheet silicon-particle rectifier diodes |
-
2018
- 2018-10-16 CN CN201811200274.XA patent/CN109461673B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109461673A (en) | 2019-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109461673B (en) | Silicon particle assembling die and assembling method thereof | |
| JP2010099196A (en) | Cooking utensil for induction range | |
| CN208589881U (en) | A kind of band casing stator core is freezed expander tooling | |
| CN204135506U (en) | Welding fixture for cable assembly | |
| CN207414695U (en) | A kind of clutch shifter axle assembly welding tooling | |
| CN101702555B (en) | Manufacturing method of servo motor solenoid coil | |
| CN208643878U (en) | A kind of inside is equipped with ceramic heat circle novel die | |
| CN209680919U (en) | A kind of stamping die for preventing upper/lower die from shifting | |
| CN207256698U (en) | A kind of wire connection terminal injection mold | |
| CN208215531U (en) | A kind of apparatus for baking applied to carrier band forming machine | |
| CN207643753U (en) | Fuse machine for type IMD film piece bending | |
| CN206401445U (en) | A kind of hot pressing layer assembly | |
| CN219191123U (en) | Lamp panel injection mold | |
| CN208890072U (en) | A kind of accurate combination assembly tooling of the polycyclic road brush assembly of electric of conducting ring | |
| CN107225356A (en) | The inner clamping type upper mounted plate of hot plate welding | |
| CN218343006U (en) | Waterproof ventilated membrane subassembly of crease-resistance anti-deformation and mould thereof | |
| CN205801689U (en) | A kind of vacuum packing machine sealing heating attachment means | |
| CN221466431U (en) | Integrative frock tool is toasted in inductance element production line assembly encapsulating | |
| CN110614304A (en) | Watch antenna bending device | |
| WO2018137620A1 (en) | Method for manufacturing composite-bottomed electromagnetic pot, dedicated device and electromagnetic pot | |
| CN221647361U (en) | Hot pressing jig for back adhesive bonding | |
| CN218983490U (en) | Tool suitable for efficient welding of connector and tube shell | |
| CN204348922U (en) | A kind of copper post that is riveted for busbar | |
| CN217169675U (en) | Pressure boost apparatus for producing of improvement PPR pipe hardness | |
| CN207255555U (en) | The inner clamping type upper mounted plate of hot plate welding |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A silicon particle assembly mold and its assembly method Granted publication date: 20210914 Pledgee: Bank of China Limited Huangshan Branch Pledgor: HUANGSHAN CITY QIMEN COUNTY JINCHENG ELECTRIC CO.,LTD. Registration number: Y2024980023489 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |