CN109461374A - Display module and preparation method thereof - Google Patents

Display module and preparation method thereof Download PDF

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Publication number
CN109461374A
CN109461374A CN201811338637.6A CN201811338637A CN109461374A CN 109461374 A CN109461374 A CN 109461374A CN 201811338637 A CN201811338637 A CN 201811338637A CN 109461374 A CN109461374 A CN 109461374A
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CN
China
Prior art keywords
display panel
display
display module
heat dissipation
dissipation film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811338637.6A
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Chinese (zh)
Other versions
CN109461374B (en
Inventor
童宗新
刘洋
范荣坤
王高云
赵锦
任高波
汪洋
黄修雄
王鹏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mianyang Beijing Oriental Optoelectronic Technology Co Ltd
BOE Technology Group Co Ltd
Mianyang BOE Optoelectronics Technology Co Ltd
Original Assignee
Mianyang Beijing Oriental Optoelectronic Technology Co Ltd
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Mianyang Beijing Oriental Optoelectronic Technology Co Ltd, BOE Technology Group Co Ltd filed Critical Mianyang Beijing Oriental Optoelectronic Technology Co Ltd
Priority to CN201811338637.6A priority Critical patent/CN109461374B/en
Publication of CN109461374A publication Critical patent/CN109461374A/en
Application granted granted Critical
Publication of CN109461374B publication Critical patent/CN109461374B/en
Active legal-status Critical Current
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Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963Heat transfer by conduction from internal heat source to heat radiating structure

Abstract

The present invention provides a kind of display module and preparation method thereof, belongs to field of display technology, can at least partly solve the problems, such as that influence and existing display module of the protective film being scratched in existing display module to display module performance are thicker.A kind of display module of the invention, comprising: display panel, with opposite first surface and second surface;Display component, set on the first surface side of display panel;Heat dissipation film is attached directly on the second surface of display panel.

Description

Display module and preparation method thereof
Technical field
The invention belongs to field of display technology, and in particular to a kind of display module and preparation method thereof.
Background technique
Display module in the prior art generally comprise display panel, set on display panel one side display component (as partially Mating plate, adhesive layer, cover-plate glass etc.), set on display panel another side protective film (BPF, thickness can be 0.1mm) and patch Invest heat dissipation film (can by foam structure layer and steel structure layer be combined formed) of the protective film far from display panel one side.Wherein, it protects The effect of cuticula is the process (i.e. mould group technique) or other steps avoided in display panel in cutting technique, production display component Substrate is damaged in rapid, to guarantee product yield.
However, on the one hand, protective film may cutting, production display component, substrate turnover or other steps in quilt It scratches, the protective film being scratched may will affect the performance of display module;On the other hand, the double-layer structure of protective film and heat dissipation film So that entire display module thickness is bigger, and then it is unfavorable for forming slim display module.
Summary of the invention
The present invention at least partly solves influence of the protective film being scratched in existing display module to display module performance And the problem that existing display module is thicker, a kind of performance improvement and thin display module are provided.
Solving technical solution used by present invention problem is a kind of display module, comprising:
Display panel, with opposite first surface and second surface;
Display component, set on the first surface side of the display panel;
Heat dissipation film is attached directly on the second surface of the display panel.
It may further be preferable that the display module further include: optical finger print layer is set to the heat dissipation film far from the display The side of panel, for detecting fingerprint by optical signalling.
It may further be preferable that the heat dissipation film has opening, the opening is corresponding with the optical finger print layer.
It may further be preferable that the display panel is flexible display panels;The display panel has viewing area, connection Area and the bent area between the viewing area, bonding pad.
It may further be preferable that the heat dissipation film is only set on the display panel of the viewing area.
It may further be preferable that the display module further include: protective film is only set to the display panel of the bonding pad Second surface on.
It may further be preferable that the first surface is the display surface that display panel is used to be shown.
Solve the production method that technical solution used by present invention problem is a kind of display module, the display mould Group is above-mentioned display module, comprising:
Protective coatings are formed on the second surface of display panel motherboard, the display panel motherboard includes multiple displays Panel;
It is cut from display panel motherboard by cutting technique and obtains display panel, and by mould group technique in the display Display component is formed on the first surface of panel;
At least partly described Protective coatings are removed, so that the second surface of the display panel at least partly exposes;
Heat dissipation film is formed on at least partly second surface of exposure of the display panel.
It may further be preferable that the display module be above-mentioned display module, the display panel at least partly It is formed after heat dissipation film on the exposed second surface, further includes: in side of the heat dissipation film far from the display panel Form optical finger print layer.
It may further be preferable that the display module be above-mentioned display module, it is described the display panel at least Heat dissipation film is formed on the second surface of part exposure and is formed between the optical finger print layer further include: in the heat dissipation film Upper formation opening.
It may further be preferable that the display module is above-mentioned display module, at least partly described protection of removal Membrane material includes: the Protective coatings on the display panel of the removal viewing area, the bent area, so that connection The remaining Protective coatings in area form protective film.
Detailed description of the invention
Fig. 1 is a kind of side block diagram of display module of the embodiment of the present invention;
Fig. 2 a- Fig. 2 d is a kind of side view structure of each step of production method of display module of the embodiment of the present invention Figure;
Fig. 3 is a kind of production method flow diagram of display module of the embodiment of the present invention;
Wherein, appended drawing reference are as follows: 10 display panels;11 viewing areas;12 bent areas;13 bonding pads;20 display components;30 dissipate Hotting mask;31 openings;40 optical finger print layers;50 protective films.
Specific embodiment
Hereinafter reference will be made to the drawings, and the present invention will be described in more detail.In various figures, identical element is using similar attached Icon is remembered to indicate.For the sake of clarity, the various pieces in attached drawing are not necessarily to scale.In addition, may not show in figure Certain well known parts out.
Many specific details of the invention, such as structure, material, size, the processing work of component is described hereinafter Skill and technology, to be more clearly understood that the present invention.But it just as the skilled person will understand, can not press The present invention is realized according to these specific details.
Embodiment 1:
As shown in Figure 1, the present embodiment provides a kind of display modules, comprising:
Display panel 10, with opposite first surface and second surface;
Display component 20, set on the first surface side of display panel 10;
Heat dissipation film 30 is attached directly on the second surface of display panel 10.
Wherein, the display panel 10 of this implementation can be cut by a display panel motherboard, i.e. a display panel Motherboard can be cut into multiple display panels 10.Display panel 10 have display function, and display component 20 may include polaroid, Adhesive layer, cover-plate glass etc., for constituting complete display module together with display panel 10.
In order to avoid forming display panel 10 in cutting and during forming display component 20 on display panel 10 The second surface of display panel 10 is damaged, therefore can form one layer in the second surface of display panel 10 before process above Protective film 50.And display panel 10 is formed in cutting and is attached to during forming display component 20 on display panel 10 Protective film 50 on display panel 10 may be worn.After the display component 20 on display panel 10 is formed, it can will protect Film 50 removes, so that the second surface exposure of display panel 10, then attaches one layer on the second surface of display panel 10 and dissipate Hotting mask 30.Protective film 50 or heat dissipation film 30 can be pasted on the second surface of display panel 10 by optical cement.Heat dissipation film 30 for give display panel 10 radiate, avoid display panel 10 due to caused by working for a long time temperature it is excessively high, to protect Demonstrate,prove the performance of display module.
In the display module of the present embodiment, since after forming display component 20, protective film 50 does not have display module Substantive effect, therefore should remove protective film 50 before attaching heat dissipation film 30, so that heat dissipation film 30 is in display module Directly attach on display panel 10.With the display module of the prior art (protective film is not removed, heat dissipation film is directly attached to guarantor On cuticula) it compares, on the one hand, the protective film 50 being worn is in display module product and there is no (at least in viewing area 11 In and be not present), can influence to avoid the protective film 50 being damaged to 10 performance of display panel;On the other hand, due to not having There is protective film 50 (not having in viewing area 11 at least), therefore the thickness of display module can be reduced, to form slim display module.
Certainly, since heat dissipation film 30 at this time is on display panel 10, therefore it should also have one to display panel 10 Fixed protective effect prevents the scuffing of display panel 10 in use process.
Preferably, first surface is the display surface for being shown.
That is, the above heat dissipation film, which can be set to, deviates from light-emitting surface (display surface) side.
Preferably, the display module of the present embodiment further include: optical finger print layer 40 is set to heat dissipation film 30 far from display panel 10 side, for detecting fingerprint by optical signalling.
Wherein, that is to say, that attach heat dissipation film 30 on display panel 10 and then formation optics refers on heat dissipation film 30 Lamina 40.Optical finger print layer 40 can be used for detecting and identifying the finger print information from display panel 10.Heat dissipation film 30 can be with It is made of transparent material, or is made of the material for the detection for not influencing 40 pairs of fingerprint of optical finger print layer, to ensure light Learn detection and the recognition performance of finger print layer 40.
In display module in the prior art, optical finger print layer is attached to the side of the display panel with protective film, by Abrasion before protective film in step has adverse effect the detection and recognition performance of optical finger print layer, in turn Cause the fingerprint recognition performance of display module poor.
And the display module in the present embodiment, due to there is no protective film 50, optical finger print layer at optical finger print layer 40 The influence for the protective film 50 that 40 detection and recognition performance are not damaged, so as to improve display module fingerprint recognition Performance.
Preferably, heat dissipation film 30 has opening 31, and opening 31 is corresponding with optical finger print layer 40.
Wherein, that is to say, that heat dissipation film 30 can also be formed by opaque material, as long as in this way by heat dissipation film 30 and light It learns the corresponding position of finger print layer 40 and forms opening 31, so that without others layer knot between optical finger print layer 40 and display panel 10 Structure, so that it may not influence optical finger print layer 40 and receive the finger print information from display panel 10.Specifically, heat dissipation film 30 can be by Foam structure layer and metal structure (such as copper) layer combine to be formed, and can be bonded on display panel 10 by adhesive layer.
Heat dissipation film 30 has opening 31 corresponding with optical finger print layer 40, can further guarantee optical finger print layer 40 Detection and recognition performance can also make to form the type of 30 material of heat dissipation film more.
Preferably, display panel 10 is flexible display panels;Display panel 10 has viewing area 11, bonding pad 13 and position Bent area 12 between viewing area 11, bonding pad 13.
Wherein, in order to enable in terms of display module front, the viewing area 11 of display module accounts for the area ratio of entire screen Increase to improve the experience sense at family, therefore need to bend 10 bent area 12 of display panel, so that bonding pad 13 is in display panel 10 second surface side, bent area 12 need to form certain radian (being unable to sensitive paper equally to bend).
Preferably, heat dissipation film 30 is only set on the display panel 10 of viewing area 11.
Wherein, since heat dissipation film 30 has certain thickness, the bending of display panel 10 can be impacted, and aobvious Show that heat dissipation film 30 is played the role of little in the bonding pad 13 and bent area 12 of panel 10, therefore heat dissipation film 30 can only be set In on the display panel 10 of viewing area 11, the bending of display panel 10 can be made to be more easier in this way, to reduce display panel The difficulty of 10 bending techniques, and then reduce the difficulty of the manufacture craft of entire display module.
Preferably, the display module of the present embodiment further include: protective film 50 is only set to the display panel 10 of bonding pad 13 On second surface.
Wherein, that is to say, that before removing protective film 50, protective film 50 first can be cut into two parts, a part of position On the display panel 10 of viewing area 11 and bent area 12, another part is located on the display panel 10 of bonding pad 13.Remove guarantor The part positioned at viewing area 11 and bent area 12 can be only removed when cuticula 50, and the protective film 50 of bonding pad 13 is allowed to retain to protect The display panel 10 of bonding pad 13 is injury-free in the process of bending.
According to the present embodiment, because 50 pairs of bendings of protective film have an impact, therefore it does not also retain in bent area 12 finally, but In the manufacturing process of display module, protective film 50 all first can be set in viewing area 11 and bent area 12, and after mould group technique again It is removed, so that protective film 50 can protect bent area 12 in mould group technique;And according to the prior art, it is protected due to not having to remove The step of cuticula, therefore its bent area is not provided with protective film at all, therefore is easy to be damaged in mould group technique.
Protective film 50 can be formed by PET plastic layer or other suitable materials, and can be bonded in by adhesive layer On display panel 10.
Protective film 50 is only positioned on the display panel 10 of bonding pad 13, on the one hand can be right to avoid the protective film 50 being damaged The detection recognition performance of optical finger print layer 40 and the adverse effect for bending technique, on the other hand can be with effective protection bonding pad 13 Display panel 10 second surface it is injury-free in the process of bending.
Embodiment 2:
Shown in a- Fig. 2 d and Fig. 3 as shown in Figure 1, Figure 2, the present embodiment provides a kind of production methods of display module, comprising:
S10, as shown in Figure 2 a, Protective coatings, display panel motherboard are formed on the second surface of display panel motherboard Including multiple display panels 10.
Display panel motherboard is made of multiple panels of multiple array arrangements, and each panel is a display panel 10.
Specifically, Protective coatings are the material layers for being used to form protective film, display can be pasted by optical cement On the second surface of panel 10, which can be the optical cement easily removed.
S20, as shown in Figure 2 b, cut from display panel motherboard by cutting technique and obtain display panel 10, and passed through Mould group technique forms display component 20 on the first surface of display panel 10.
Wherein, display component 20 may include polaroid, adhesive layer, cover-plate glass etc..
S30, as shown in Figure 2 c, removal at least partly Protective coatings, so that the second surface of display panel 10 at least portion Divide exposure.
Specifically, Protective coatings can be seamed between bent area 12 and bonding pad 13 in itself, or can be in protection membrane material The gap between bent area 12 and bonding pad 13 is cut out on material, so as to individually remove viewing area 11, bent area 12 it is aobvious Show the Protective coatings on panel 10, to form protective film 50.
S40, as shown in Figure 2 d, in at least partly exposed second surface of display panel 10 (as at least in viewing area 11) Upper formation heat dissipation film 30;And opening 31 is formed on heat dissipation film 30.
Heat dissipation film 30 can be pasted on the second surface of display panel 10 by optical cement.Heat dissipation film 30 can be by foam Structure sheaf and metal structure (such as copper) layer combine to be formed.
Wherein, the opening 31 on heat dissipation film 30 can be before attaching heat dissipation film 30 opening 31 just formed, can also be with It is the opening 31 formed after being attached to heat dissipation film 30 on display panel 10.
S50, as shown in Figure 1, heat dissipation film 30 far from display panel 10 side formed optical finger print layer 40.
The display module that the present embodiment is formed, (does not remove protective film directly for heat dissipation film with the display module of the prior art It is attached on protective film) it compares, on the one hand, the protective film 50 being worn is in display module and there is no (at least showing In area 11 and it is not present), it can influence to avoid the protective film 50 being damaged to 10 performance of display panel;On the other hand, by In no protective film 50 (not having in viewing area 11 at least), therefore the thickness of display module can be reduced, to form slim display Mould group.
Wherein, after forming optical finger print layer 40, it may also include and wiring board is bundled on bonding pad 13, and to bending The step of area 12 is bent, and bonding pad 13 is bent to the second face of display module, is not described in detail herein.
Wherein, which can be Electronic Paper, mobile phone, tablet computer, television set, display, laptop, number Any products or components having a display function such as photo frame, navigator.
It should be noted that herein, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that There is also other identical elements in process, method, article or equipment including element.
It is as described above according to the embodiment of the present invention, these embodiments details all there is no detailed descriptionthe, also not Limiting the invention is only the specific embodiment.Obviously, as described above, can make many modifications and variations.This explanation These embodiments are chosen and specifically described to book, is principle and practical application in order to better explain the present invention, thus belonging to making Technical field technical staff can be used using modification of the invention and on the basis of the present invention well.The present invention is only by right The limitation of claim and its full scope and equivalent.

Claims (11)

1. a kind of display module characterized by comprising
Display panel, with opposite first surface and second surface;
Display component, set on the first surface side of the display panel;
Heat dissipation film is attached directly on the second surface of the display panel.
2. display module according to claim 1, which is characterized in that further include:
Optical finger print layer, the side set on the heat dissipation film far from the display panel, for detecting fingerprint by optical signalling.
3. display module according to claim 2, which is characterized in that the heat dissipation film has opening, the opening and institute It is corresponding to state optical finger print layer.
4. display module according to claim 1, which is characterized in that the display panel is flexible display panels;
The display panel has viewing area, bonding pad and the bent area between the viewing area, bonding pad.
5. display module according to claim 4, which is characterized in that the heat dissipation film is only set to the described of the viewing area On display panel.
6. display module according to claim 4, which is characterized in that further include:
Protective film, only on the second surface of the display panel of the bonding pad.
7. display module as claimed in any of claims 1 to 6, which is characterized in that
The first surface is the display surface that display panel is used to be shown.
8. a kind of production method of display module, which is characterized in that the display module is any one of claim 1 to 7 The display module, which comprises
Protective coatings are formed on the second surface of display panel motherboard, the display panel motherboard includes multiple display surfaces Plate;
It is cut from display panel motherboard by cutting technique and obtains display panel, and by mould group technique in the display panel First surface on form display component;
At least partly described Protective coatings are removed, so that the second surface of the display panel at least partly exposes;
Heat dissipation film is formed on at least partly second surface of exposure of the display panel.
9. according to the method described in claim 8, it is characterized in that, the display module is display described in claim 2 or 3 Mould group, after forming heat dissipation film on at least partly second surface of exposure of the display panel, further includes:
Optical finger print layer is formed far from the side of the display panel in the heat dissipation film.
10. according to the method described in claim 9, it is characterized in that, the display module is display mould as claimed in claim 3 Group, it is described that heat dissipation film and the formation light are formed on at least partly second surface of exposure of the display panel It learns between finger print layer further include:
Opening is formed on the heat dissipation film.
11. according to the method described in claim 8, it is characterized in that, the display module is display mould as claimed in claim 6 Group, at least partly described Protective coatings of removal include:
The Protective coatings on the display panel of the viewing area, the bent area are removed, so that bonding pad is remaining Protective coatings formed protective film.
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CN111179746A (en) * 2020-02-21 2020-05-19 京东方科技集团股份有限公司 Display panel, preparation method thereof and display device
CN111292621B (en) * 2020-02-24 2021-12-24 京东方科技集团股份有限公司 Display device, support film for display device, and electronic apparatus
CN111292621A (en) * 2020-02-24 2020-06-16 京东方科技集团股份有限公司 Display device, support film for display device, and electronic apparatus
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CN114762023A (en) * 2020-10-10 2022-07-15 京东方科技集团股份有限公司 Display device and manufacturing method thereof
CN114762023B (en) * 2020-10-10 2023-11-21 京东方科技集团股份有限公司 Display device and manufacturing method of display device

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